JPS6352463B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor device, and particularly relates to the measurement and selection of electronic circuits after encapsulation.

1 to 3 show the manufacturing process of a conventional resin-sealed semiconductor device.

As shown in FIGS. 1A and 1B, the conventional semiconductor device has a package part 2 in which a predetermined semiconductor device is connected at the center of a stamped plate processing part of a lead frame 1, and a tie bar 3 controls the strength of the leads 4. For holding, it is connected between each lead and to the lead frame outer frame 5. In this semiconductor device, the tie bars 3 are cut as shown in FIGS. 2A and 2B, and the ends of the leads 4 are cut and the leads 4 are bent as shown in FIGS. 3A and 3B.

After performing this lead bending process, there were two methods for measuring and selecting the electronic circuit functions of the semiconductor device: manually and automatically.

Next, as shown in FIGS. 4A and 4B, the semiconductor device 7 whose leads have been bent into the measurement socket 6 is
and perform manual measurement and selection of predetermined electronic circuit functions. As shown in FIGS. 5A and 5B, the work before and after the measurement and selection of predetermined electronic circuit functions of semiconductor devices is performed by an operator who inserts the semiconductor device 7 with the lead bending process into the measurement socket 6 with tweezers or by hand. to insert and remove. If the operator inserts or removes the semiconductor device 7 with bent leads from the measurement socket 6 at an angle even slightly, the leads 4 may come into contact with the wall 8 inside the measurement socket, as shown in FIG. The disadvantage was that the lead 4 was bent.

In addition, the measurement socket 6 has strong spring properties in order to minimize the contact resistance with the semiconductor device 7 whose leads have been bent. Lead 4 is tightened with strong force when it is inserted into or removed from socket 6. Therefore, when the operator inserts and removes the semiconductor device 7, which has been subjected to the lead bending process, from the measurement socket 6, a large amount of force is required, which is a difficult task for the operator.

Further, electronic circuit measurement and selection of semiconductor devices using automatic equipment has been carried out using a contact pin method as shown in FIGS. 6A and B and FIGS. 7A and B. In this contact pin method, the semiconductor device 7 that has been subjected to the lead bending process is not inserted or removed, but electronic circuit measurement and selection is performed using a simple opening/closing contact method using the contact pins 9 on both sides, so that bending of the leads is eliminated.

In addition, even with the socket method, semiconductor devices with bent leads are mechanically inserted and removed in a vertical direction, so there is no need to bend the leads as shown in Figure 5, but as shown below. As stated,
Conventional automatic devices have had the disadvantage that lead bending occurs in the supply section and the storage section.

As shown in FIGS. 8A and 8B, a magazine 10 for a semiconductor device whose leads have been bent is made by pressing a thin aluminum plate. This magazine 10 was used in the supply section and storage section of conventional automatic equipment, but because it uses a thin aluminum plate of 0.7 to 0.8 mm to reduce weight, the outlet and inlet will be deformed. A lot happened. Therefore, when the deformed magazine 10 is set in an automatic device and the semiconductor device 7 on which the leads have been bent passes, the leads may sometimes be bent. Another disadvantage is that the claws that mechanically feed the semiconductor device 7 which has been subjected to a difficult lead bending process forcefully bend the leads 4. In addition, the semiconductor device 7, which has bent leads and has been subjected to the bending process, has the disadvantage that it requires a large amount of time and labor because the lead bends must be corrected by routine work.

In addition, there was a drawback that the lead bending rate was extremely high at 40%, and even if correction was done manually, the degree of correction differed between workers and the quality varied. And Figures 9 and 10
As shown in the figure, leads that are severely bent should be discarded as they are fragile and cannot be repaired.

Semiconductor devices 11 and 12 subjected to this unavoidable bending process have the disadvantage of resulting in a large loss, for example, as much as 3%.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a method for manufacturing a semiconductor device in which lead bending does not occur.

The method for manufacturing a semiconductor device of the present invention includes a semiconductor device in which a plurality of leads are led out from first and second sides facing parallel to each other of a sealing resin, and these leads are bent. In the manufacturing method, in a lead frame having a plurality of sets of a plurality of thin metal strips connected to an outer frame, the tips of the metal strips of each set are encapsulated with a resin together with a semiconductor element, and among the metal strips of each set, Said first and second
The side part is the third part of the sealing resin in a planar shape and perpendicular direction.
and parts led out from the first and second side parts, excluding a predetermined part led out from the fourth side part, are cut and separated from the outer frame, and the lead frames are separated for each set. The separated metal bands of each set are surrounded by the outer frame, and only the predetermined ones are connected to the outer frame, so that the entire set forms the same plane; The metal strips, each of which is a lead of a semiconductor device and whose entirety forms the same plane, are pressed into contact from above and below by a flat semiconductor device measurement socket having a measurement contact and a lead holding block. The electrical characteristics of the semiconductor element are measured using the same method, and each set, whose entire surface is on the same plane, is stacked in a long magazine with a U-shaped cross section so that the leads are horizontal, depending on the contents of the electronic circuit measurement. Then, the predetermined metal band connected to the outer frame is cut from the roots of the third and fourth sides of the sealing resin, thereby removing the sealing resin from the first and second sides. It is characterized in that the metal strips that will become the plurality of leads are taken out from the outer frame in a state in which they are led out from the side of the metal strip, and then the metal strips that will become the plurality of leads are subjected to a bending process.

In the method for manufacturing a semiconductor device according to the present invention, the process continues until the final process with the outer frame of the lead frame still attached, so that no external force is applied directly to the leads, and the leads are prevented from bending. There is an effect.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 11A and 11B, the semiconductor device in the electronic circuit measurement and selection process according to an embodiment of the present invention is cut from the state shown in FIG. It is obtained by separating each semiconductor device individually.
The lead frame made of Kobar material is 0.15~
It is obtained by punching a 0.25mm thin metal plate.

A semiconductor device (hereinafter referred to as a flat semiconductor device) 14, which is separated into individual semiconductor devices and whose lead bodies are on the same plane as the lead frame, is stored in a magazine for flat semiconductor devices. As shown in FIGS. 12A and 12B, the flat semiconductor devices 14 are stacked and stored inside the magazine 15 for flat semiconductor devices. As shown in FIGS. 13A and 13B, the flat semiconductor device magazine 15 is made of a stainless steel plate with a thickness of 1 mm, and is bent at an angle of 90 degrees and attached to both sides to prevent external damage. It has the strength to resist deformation even under impact. Here, as shown in FIGS. 14A and 14B, the work before and after the necessary electronic circuit measurement and selection of flat semiconductor devices is performed when the lead holding block 16 is connected to the measurement socket 17 for flat semiconductor devices.
It is stopped in the upper direction. The flat semiconductor device 14 mechanically fed from the magazine 15 for flat semiconductor devices shown in FIG. 12 is positioned and stopped on the upper surface of the measurement socket 17 for flat semiconductor devices. As shown in FIGS. 15A and 15B, the flat semiconductor device 14 is mounted on a lead holding block 1 in order to measure and select required electronic circuits.
6 descends to press the flat semiconductor device 14 into the measurement socket 17 for flat semiconductor devices and bring the leads 4 into contact.

When the required electronic circuit measurements are completed, the lead holding block 16 rises to the state shown in FIG. 15 and stops, after which the electronic circuits are classified according to the content of the electronic circuit measurements and stored in the flat semiconductor device magazine 15. Thereafter, in the final step, the leads are bent to form the final shape as shown in FIG.

Compared to the conventional semiconductor device magazine 10 that undergoes lead bending processing, by using the stronger flat semiconductor device magazine 15, leads do not bend when passing through the magazine entrance/exit. There is an advantage.

Further, even during the necessary electronic circuit measurement and selection of flat semiconductor devices, the leads 4 are only pressed down without being inserted or removed, so there is an advantage that lead bending does not occur.

In this way, since there is no lead bending in the manufacturing method of semiconductor devices using flat semiconductor devices, there is no need for workers and time to correct lead bending. However, this prevents the leads from getting mixed into other semiconductor devices whose leads are not bent.
Quality will improve. Further, since there is no lead bending, it is impossible to correct lead bending, so there is an advantage that there is no need to discard the lead.

[Brief explanation of drawings]

Figures 1A and B show the prior art and are a plan view and a front view before cutting the leads, Figures 2A and B are a plan view and front view of a conventional tie bar after cutting it, and Figures 3A and B is a plan view and a front view of the conventional lead tip cut and lead bending process;
FIGS. 4A and 4B are plan and front views showing a conventional manual method for measuring and sorting electronic circuits of semiconductor devices, and FIGS. 5A and B show a conventional method for manually measuring and sorting electronic circuits for semiconductor devices. 6A and B and 7A and B are respectively plan views and front views showing the contact pin method of the conventional automatic device, and FIGS. 8A and B are the conventional FIGS. 9 and 10 are a plan view and a front view of a magazine for a semiconductor device, and FIGS. 9 and 10 are a side view and a front view of a conventional semiconductor device with greatly curved leads. 11A and 11B are plan views and front views of tie bar cutting, lead tip cutting, and separation for each semiconductor device according to an embodiment of the present invention, and FIGS. 12A and 12B are flat views of an embodiment of the present invention. 13A and 13B are a sectional view and a front view of a flat semiconductor device magazine containing a semiconductor device in the form of a flat semiconductor device, and FIG. 14A is a plan view and a front view of a magazine for a flat semiconductor device according to an embodiment of the present invention. 15A and 15B are side views and front views of a method for measuring and selecting electronic circuits in a semiconductor measuring device according to an embodiment of the present invention, and 15A and B are side views during measuring and selecting electronic circuits in a semiconductor measuring device according to an embodiment of the present invention. and a front view. In the figure, 1...lead frame, 2...package section, 3...tie bar, 4...lead, 5...lead frame outer frame, 6...measuring socket, 7...
Semiconductor device with lead bending process, 8... wall inside measurement socket, 9... contact pin, 1
0...Magazine for semiconductor devices that have undergone lead bending processing, 11, 12...Semiconductor devices that have undergone lead bending processing that must be discarded, 13...
Outer frame of the lead frame, 14... flat semiconductor device, 15... magazine for flat semiconductor device, 16... lead holding block, 17... measurement socket for flat semiconductor device.

Claims (1)

[Claims] 1. In a method for manufacturing a semiconductor device in which a plurality of leads are led out only from the first and second side portions of the sealing resin that face each other parallel to each other, and these leads are bent, A lead frame having a plurality of sets of a plurality of thin metal strips is encapsulated with resin together with a semiconductor element, and the first and second side portions of each set of the metal strips are encapsulated with a resin. means the outer frame that has a planar shape and that extends from the first and second sides of the sealing resin in the right angle direction, except for certain parts that extend from the third and fourth sides of the sealing resin. At the same time, the lead frame is separated into each group, and the metal strips of each separated group are surrounded by the outer frame, and only the predetermined ones are connected to the outer frame. A measurement socket for a flat semiconductor device having a measurement contact is connected to the metal strip, which is formed so as to form the same plane as a whole, and the metal strips, which are the leads of the semiconductor device, form the same plane in their entirety. The electrical characteristics of the semiconductor element are measured by pressing and contacting the semiconductor element from above and below with a lead holding block, and the leads are held horizontally so that each set forms the same plane as a whole for each electronic circuit measurement content. After the magazines are stacked and stored in long magazines with a U-shaped cross section, the predetermined metal strip connected to the outer frame is inserted into the third layer of the sealing resin.
Then, the sealing resin is removed from the outer frame with metal bands serving as a plurality of leads being led out from the first and second sides by cutting from the root of the fourth side, and then, A method of manufacturing a semiconductor device, characterized in that the metal strips serving as the plurality of leads are bent.