JPS62232935A - Chip removal device - Google Patents

Abstract

PURPOSE:To enable a chip to be peeled off from a sheet while preventing dislocation of other chips located therearound, by operating an ejector pin for pushing up one side of the chip and an ejector pin for pushing up the other side of the chip at different timing from each other. CONSTITUTION:A wafer chip 11 is transported to below a suction collet 2. A push-up section 20 is moved toward and contacted with an expand sheet 12 so that the expand sheet 12 is sucked. One of ejector pins 22 or the left-side pin as viewed on the drawings is elevated so as to pass through the expand sheet 12 and raise up the wafer chip 11 obliquely, whereby a space is defined between the wafer chip 11 and the expander sheet 12. Then, upon elevation of the other ejector pin 22, the suction collet 2 is lowered to suck the wafer chip 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip removal device suitable for, for example, a multi-die bonder that bonds various types of semiconductor chips to a predetermined substrate or package.

[Prior Art] As a conventional chip extraction device, there is one used in a multi-die bonder as shown in FIG. 4, for example.

In this figure, (1) is a wafer table on which a wafer chip is placed, (is a suction collet for taking out a wafer chip, (3) is a die picker, (4) is a pre-alignment section, (5) is a bonding head, (6) is a stamping head, (7) is an epoxy table, (8) is a substrate table, and (9) is a substrate.This substrate is sent to the substrate table (8) by lane OQ as indicated by arrow FA. It has become.

To explain the above-mentioned apparatus, first, a wafer chip is placed on the wafer table (1), and a substrate (9) with no bonding is placed on the substrate table (8) from the lane OQ. It is placed.

Next, the wafer table (1) is placed on the wafer table (1) by the suction collet (2).
) is sucked up and placed in the die picker (3).
is transported onto the pre-alignment section (4). Then, in this pre-alignment section (4), orientation of the wafer chips is performed.

Furthermore, the stamping head (6) is attached to the epoxy table (
7) Apply and move the glue on top and apply the glue to the bonding part of the substrate (9) on the substrate table (8). At the same time, the bonding head (5) moves to take out the wafer chip on the pre-alignment section (4),
Wafer chips are bonded to the bonding portion of the substrate (9) on the substrate table (8).

When the above operations are completed, the bonded substrate (9) is discharged, and the same operation is performed on the next substrate.

Next, the chip ejecting device of the above-mentioned devices will be explained with reference to FIG.

In FIG. 5, when the wafer chip (!υ is glued to the expandable sheet Q21 and conveyed under the force of the suction collet (wafer chip C11)) is at a predetermined position, the wafer chip (!υ) is pushed up from below by a four-piece tree. At the same time, the pin α [phase] rises and the expanded sheet (goods) is attracted downward.As a result, the wafer chip (In) is peeled off from the expanded sheet (goods), and the adsorption collet (2)
It will be adsorbed to.

[Problems to be Solved by the Invention] By the way, the above-described chip ejecting device has the inconvenience that vibrations generated when peeling a wafer chip from an expanded sheet are transmitted to the sheet, causing misalignment of chips around the sheet. There is. In addition, due to such vibration,
There is also a risk that the chip being sucked may be misaligned or fall.

Furthermore, since the adhesive of the expanded sheet is strong, there is also the disadvantage that the chips are difficult to peel off from the sheet.

The present invention has been made in view of these points, and an object thereof is to provide a chip retrieval device that can successfully peel and adsorb sea urchin beetle from an expanded sheet without causing any positional shift to the surrounding wafer chips. ,
That is the purpose.

[Means for Solving the Problems] The present invention uses different ejector pins that push up one side of the wafer chip stuck on an expandable sheet and ejector pins that push up the other side of the chip. It is characterized in that it is peeled off from the expanded sheet and adsorbed to the suction collet by operating at the right timing and thrusting up.

[Operation] According to the present invention, the wafer chip is first pushed up on one side. As a result, a gap is formed between the chip and the expanded sheet. Next, the other side of the chip is pushed up, and with little vibration, the chip is peeled off from the expanded sheet and adsorbed by the adsorption collet.

[Embodiments] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that the same reference numerals are used for the same parts as in the prior art described above.

FIG. 3 shows an embodiment of the invention. In this figure, the suction collet (2) and the wafer chip (1
The raised part ridge is placed through an expandable sheet (goods) to which N) is glued. Inside this raised part,
Four ejector pins (2) are provided, and the two on the left side of the figure and the two on the right side of the figure operate at different timings.

Next, the operation of the above embodiment will be explained. First, the target wafer chip (11) is transported below the suction collet (2).Next, the protruding part wing moves toward and contacts the expandable sheet (support), and the expandable sheet (support) is suctioned. It will be done.

Next, the left ejector pin (manufactured by Co., Ltd.) rises first, breaks through the expandable sheet (Corporation), and lifts the wafer chip (11) diagonally. By this operation, a gap is formed between the wafer chip (If) and the expanded sheet α (see FIG. 1).

Next, at the same time as the remaining ejector pins rise, the suction collet (2) descends, and the wafer depth (11) is suctioned. This operation causes the wafer chip (lυ
is peeled off from the expanded sheet a and adsorbed onto the suction cored (2) (see Figure 2).

As described above, according to this embodiment, since the ejector bin pushes up the wafer chip (11) in two movements, the wafer chip (II) is easily ejected from the expandable sheet, and the surrounding It has no negative effect on the chip.

It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, the number of ejector bins does not necessarily need to be four.

[Effects of the Invention] As explained above, according to the present invention, since the operation by the ejector bin is performed twice, the chip can be successfully peeled off from the sheet without causing any positional shift to the surrounding chips. It has the effect of being able to be adsorbed.

[Brief explanation of drawings]

1 and 2 are explanatory diagrams showing the operation of an embodiment of the present invention, FIG. 3 is an explanatory diagram showing the configuration of the embodiment, FIG. 4 is a perspective view showing an example of a multi-die bonder, and FIG. 5 is an explanatory diagram showing the structure of the embodiment. FIG. 2 is an explanatory diagram showing an example of a conventional chip ejecting device. In the figure, (2) is a suction collet, CI+) is a wafer chip, (J7) is an expanded sheet, a holder is a raised part, and a container is an ejector bin. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] A chip ejecting device that peels off a wafer chip stuck on an expandable sheet by pushing up a plurality of ejector pins and adsorbing it to a suction collet, the chip includes an ejector pin that pushes up one side of the chip, and the other side of the chip. A chip ejecting device characterized in that an ejector pin that pushes up the side of the chip operates at different timings.