JPS62219930A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To reduce the number of use of an insulating material, to increase a thermal efficiency and thereby to improve productivity, by a construction wherein either of a holder of a capillary and a stem having a bonding face and positioned on a heating stand is provided with an electroconductive contactor which contacts with either of the holder and the stem. CONSTITUTION:Differently from conventional ones, a holder 28 is provided with an electroconductive contactor 29 on the opposite sides of a capillary 22 so that the fore end of the contactor faces the upper surface of a stem 12 operating as an opposite part. When the entire holder 28 is lowered by a driving arm 24, first the contactor 29, out of the capillary 22 and the contactor 29 provided in the holder 28, contacts, at the fore end, with the upper surface of the stem 12. By this contact, the potential balance between the holder 28 side and the stem 12 side is gained at a position near a chip 11. Therefore, no surge voltage is impressed on the chip 11 even when the chip 11 comes in contact with a bonding face 12a on the stem 12 with the continuation of the lowering of the holder 28. In this state, the stem 12 is heated by a heating stand 27, a low-melting metal evaporated on the bonding face 12a is melted, so as to weld the chip 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a bonding device for bonding a chip to a stem used in a semiconductor laser or the like.

(Prior Art) In manufacturing a semiconductor laser device, there is a step of bonding a chip onto a stem, and this step is carried out using the apparatus shown in FIG.

In FIG. 3, a chip 11 is bonded onto the stem 12. A heating table 13 holds the stem 12 above and heats it. A heating element 14 is integrally connected to the heating table 13 via an insulating plate 15. 16
is a terminal block, and a heating element 14 is attached to the upper part, and a flat braided copper wire 17 for supplying power to the heating element 14 is connected to the side surface. Then, it is installed on a support stand 19 via an insulating block 1B. 20 is the ground wire, heating table 13
This is connected to the ground. A capillary 22 is held vertically by a holder 23 and holds the chip 11 by suction at its tip. A drive arm 24 of a vertical drive device (not shown) moves the holder 23 up and down.

The chip 11 is vacuum-adsorbed by a capillary 22 from a depth tray (not shown) and transported to a bonding position where the stem 12 is located. The relative positions of the chip 11 and the stem 12 are determined by an image processing device (not shown) at 1:sm degrees. After that, the capillary 23 is driven vertically by vJ5i.
The chip 11 is lowered at the A position to bring the chip 11 into contact with the upper surface of the stem 12, that is, the bonding surface 12a. A low melting point metal (for example, indium) is deposited on the bonding surface 12a of the stem 12, and after bringing the dip 11 into contact with the bonding surface 12a, the heating element 14 is energized to raise the temperature of the heating table 13, thereby depositing the low melting point metal. It is melted and the chip 11 in contact with its upper surface is adhered. Thereafter, the temperature of the stem 12 is lowered by cutting off the power to the heating element 14, and the bonding between the dip 11 and the stem 12 is completed.

Here, the semiconductor laser chip 11 has a surge voltage of 0.
．． If more than 3 to 0.5 V is applied, the electrical characteristics will be poor.

In order to prevent such defects, an insulating plate 15 is interposed between the heating element 14, which has a high noise component (especially spike noise), and the heating table 13 is grounded to A/D via a ground wire 20 to connect it to the chip 11. This prevents the application of surge voltage.

In addition, the capillary 22 side also has a holder 23 and a drive arm 24.
An insulating material 25 is interposed between them to electrically insulate the chip 11 from the vertical drive device, thereby preventing surge voltage from being applied to the chip 11 during bonding.

(Problem that the invention attempts to solve) According to the above-mentioned device, there are the following problems.

In order to insulate the bonding part from each part, the usage of insulating material increases, resulting in 8flJ. Heating element 14 and heating table 13
Since these are separated and connected via an insulating plate 15 whose processing accuracy cannot be expected, it is difficult to stabilize the position of the stem 12 supported on the heating table 13. The heating element 14 is a consumable item and must be replaced, but since the parts are not replaceable, it takes a lot of time and effort to locate it. Further, since the insulating plate 15 is provided between the heating element 14 and the heating table 13, it takes a long time for the stem 12 to reach a predetermined temperature. This is the same when the temperature drops after bonding,
It takes a long time to reach a sufficiently low temperature, making it difficult to improve productivity. In addition, because of the insulating plate 15, in order to raise the stem 12 to a predetermined temperature, the heating element 14 must be brought to an even higher temperature, which increases the heat level ratio and significantly reduces the lifespan of the heating element 14. do.

An object of the present invention is to provide a bonding device that uses fewer insulating materials, is inexpensive, has high thermal efficiency, and can improve productivity.

[Structure of the invention]

(Means for Solving the Problems) The bonding apparatus of the present invention is characterized in that the chip adsorbed on the capillary is attached to either one of a holder for holding a capillary and a stem on a heating table having a bonding surface. A conductive contactor is provided which comes into contact with either the holder or the stem prior to contact with the other.

(Function) In the present invention, before the chip contacts the bonding surface, the potential balance between the holder side and the stem side is maintained by bringing the holder and the stem into contact with each other using a conductive contact. The shell is placed close to the tip to prevent surge voltage from being applied to the tip even if the tip comes into contact with the stem.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

In FIGS. 1 and 2, the stem 12 is held on a heating stand 21 as in the conventional case, but unlike the conventional case, this heating stand 27 also serves as a heating element, and is mounted on the terminal block 16. . The terminal block 16 itself is the same as the conventional one, and a flat braided copper wire 11 that supplies heating power to a heating stand 27 is connected to the side surface of the terminal block 16. be done.

The chip 11 is the same as the conventional one (it is held by suction at the lower end of the capillary 22. Also, the capillary 22 is basically held in a vertical position by a holder 28 similar to the conventional one, but
This holder 28 is different from the conventional one on both sides of the sharp holder 22). ? A 1f contact 29 is provided so that its tip faces the upper surface of the stem 12 serving as the other party. When the holder 28 is lowered, the tip of the contactor 29 touches the stem 12 before the chip 11 suctioned and held by the capillary 22 comes into contact with the bonding surface 12a of the stem 12.
dimensioned to touch the top surface of the Further, in order to enable contact with the bonding surface 12a of the chip 11 after this, the contactor 29 is configured to be able to move forward and backward in the length direction.

Further, the holder 28 is connected to the drive arm 24 of the vertical drive device via an insulating material 25, as in the conventional case.

Reference numeral 31 denotes a flexible same-potential wire, which is connected between the heating table 27 and the holder 28, and is commonly grounded by a ground wire 32.

Note that 34 in the figure is a vacuum hose, which is connected to the capillary 22 and communicates with a vacuum pump (not shown). Further, the screw 35 is used to fix the capillary 22 to the holder 28.

In the above configuration, the chip 11 is taken out from a chip tray (not shown) while being held in vacuum by the capillary 22,
The stem 12 is transported to a bonding position. The relative positions of the chip 11 and the stem 12 are determined at iXM degrees by an image processing device (not shown). Thereafter, the entire holder 28 is lowered by the drive arm 24. By this operation, among the capillary 22 and the contact 29 provided in the holder 28, the tip of the contact 29 first reaches the stem 12.
in contact with the top surface of the

Due to this contact, the potential balance between the holder 28 side and the stem 12 side becomes balanced at a position close to the tip 11.

Therefore, as the holder 28 continues to descend, even if the chip 11 comes into contact with the bonding surface 12a on the stem 12, no surge voltage is applied to the depth 11. In this state, the stem 12 is heated by the heating table 27,
The low melting point metal deposited on the bonding surface 12a is ra
It is melted and the depth 11 is welded. Thereafter, the power supply to the heating table 27 is cut off and the heating stage 27 is allowed to dry out, thereby completing the bonding between the depth 11 and the stem 12.

In addition, since the heating table 27 is unified as one with a heat generation function, thermal efficiency is greatly improved compared to the conventional heating table 13 and heating element 14 that are separated and an insulating plate 15 interposed between them. do. Therefore, the stem 12 can be raised to a predetermined temperature in a short time without excessive heat generation, and the stem 12 can be lowered to the predetermined temperature in a short time after welding the depth 11. I can do it. As a result of these efforts, productivity has increased from 2 times to 2.4 times the conventional level.
This is improved by about twice as much, and since excessive heat generation is not required, the life of the heating table 27 is also extended. Furthermore, since the heating table 27, which is a combination of the conventional heating table 13 and the heating element 14, is used, the structure is simplified and the farm is safe.

In the above embodiment, the conductive contact 29 is attached to the holder 2.
Although it is provided on the 8 side, it may be provided on the opposite stem side so that the tip comes into contact with the lower surface of the holder 28 when the holder 28 is lowered.

Furthermore, although the chip 11 to be bonded is for a semiconductor laser, it may also be used for bonding a chip that is relatively susceptible to surge voltage, such as a C-MOS.

〔Effect of the invention〕

As described above, according to the present invention, thermal efficiency is increased, productivity is improved as a result, and the structure is also RFJ type A.
Can be configured at low cost.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of a bonding device according to the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a side view of a conventional device. 11...Chip, 12...Stem, 12a...Bonding, 22...Capillary, 27...Heating stand, 28
・Holder, 29 ・Contactor, 31 ・Isopotential wire, 32
・Common ground wire.

Claims (2)

[Claims] (1) In an apparatus for bonding by bringing a chip adsorbed by a capillary held in a holder into contact with the bonding surface of a stem mounted on a heating table, the chip is attached to either the holder or the stem. 1. A bonding device comprising: a conductive contact that contacts the other of the holder and the stem prior to contacting the bonding surface of the bonding device. (2) The bonding apparatus according to claim 1, wherein the holder and the heating table are commonly grounded via a same potential line.