JPS62156290A - Mask device for spotting - Google Patents
Mask device for spottingInfo
- Publication number
- JPS62156290A JPS62156290A JP29822485A JP29822485A JPS62156290A JP S62156290 A JPS62156290 A JP S62156290A JP 29822485 A JP29822485 A JP 29822485A JP 29822485 A JP29822485 A JP 29822485A JP S62156290 A JPS62156290 A JP S62156290A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- metallic sheet
- plated
- jig
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims description 28
- 230000001174 ascending effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はリードフレームなどのスポットメッキ方法に
用いるマスク装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mask device used in a spot plating method for lead frames and the like.
リードフレームなどのスポットメッキ方法は、複数のメ
ッキ孔を存するメッキ面マスクゴムの上に帯状のリード
フレームを、その裏面を上にして載せ、上方にはエアシ
リンダなどにより昇降せしめられる上マスク治具を設置
し、この上マスク治具の下面に裏面マスク用ゴムを張り
、上マスク冶具を下降させてメッキ面マスクゴムと上マ
スク冶具の裏面マスク用ゴムでリードフレームなどを挟
んでスポットメッキを行う。In the spot plating method for lead frames, etc., a strip-shaped lead frame is placed with its back side up on a plated mask rubber that has multiple plating holes, and an upper mask jig that can be raised and lowered by an air cylinder is placed above. Place the back mask rubber on the lower surface of the upper mask jig, lower the upper mask jig, and perform spot plating by sandwiching the lead frame etc. between the plating surface mask rubber and the back mask rubber of the upper mask jig.
こうしてメッキが終ると上マスク冶具を上昇させ、リー
ドフレームなどを移動させてメッキ前の部分をメッキ面
マスクゴム上として停止させたのち、上記同様にスポッ
トメッキを行なう。When the plating is completed, the upper mask jig is raised, the lead frame and the like are moved, and the part before plating is stopped on the mask rubber of the plating surface, after which spot plating is performed in the same manner as described above.
上記のようなメッキ方法において、リードフレームなど
の帯状の被メッキ金属板が移動するさいに、金属板のた
るみによりそのメッキ面がメッキ面マスクゴムに接触し
て摺動するため、メッキ面に疵がつき、活性化されたス
トライクメッキ面が消失し、本メッキとの密着性が失わ
れる場合や、ストライク面そのものがなくなり、下地が
露出してストライク効果がなくなるなどの問題が生じる
。In the above plating method, when a band-shaped metal plate to be plated such as a lead frame moves, the plated surface contacts the plated surface mask rubber due to slack in the metal plate and slides, resulting in scratches on the plated surface. This causes problems such as the activated strike plating surface disappearing and the adhesion with the main plating being lost, or the strike surface itself disappearing and the base being exposed and the strike effect being lost.
上記の問題点を解決するために、この発明は上マスク冶
具に、その上昇時に被メッキ金属板を持ち上げて、その
被メッキ金属板をメッキ面マスクゴムから離す持ち上げ
手段を設けたものである。In order to solve the above problems, the present invention provides the upper mask jig with a lifting means that lifts the metal plate to be plated when the upper mask jig is raised and separates the metal plate from the plating surface mask rubber.
この発明は上記の構成であるから、被メッキ金属板が停
止した条件で、上マスク冶具が下降し、その下面の裏面
マスクゴムで金属板をメッキ面マスクゴム上に押し付け
る。Since the present invention has the above-mentioned configuration, under the condition that the metal plate to be plated is stopped, the upper mask jig is lowered, and the back mask rubber on the lower surface of the upper mask jig presses the metal plate onto the plated mask rubber.
こうしてメッキが終了して上マスク治具を上昇させると
、これとともに上昇した持ち上げ手段が被メッキ金属板
を持ち上げてメッキ面マスクゴムから離し、被メッキ金
属板が移動するさいに、被メッキ金属板がメッキ面マス
クゴムに接触しないようにする。When plating is completed and the upper mask jig is raised, the lifting means that has been raised together lifts the metal plate to be plated and separates it from the plating surface mask rubber, and as the metal plate to be plated moves, the metal plate to be plated Avoid contact with the plated mask rubber.
第1図、第2図に示す実施例において、1はフレーム、
2はこのフレーム1上に張ったメッキ面マスクゴムで適
当な間隔でメッキ孔3が設けである。また、このマスク
ゴム2は実施例ではll7のシリコンゴムを用いている
が、これに限定するものではない。In the embodiments shown in FIGS. 1 and 2, 1 is a frame;
2 is a plated mask rubber stretched over this frame 1, and plated holes 3 are provided at appropriate intervals. Further, although silicone rubber of 117 is used as the mask rubber 2 in the embodiment, it is not limited to this.
4は帯状の被メッキ金属板でメッキ面を下にしており、
実施例の場合はリードフレームである。4 is a band-shaped plated metal plate with the plated side facing down.
In the case of the embodiment, it is a lead frame.
この場合、図示省略しであるリールから繰出されて巻取
リールに巻取られることにより一定のピッチで間欠的に
移動するものである。In this case, it is fed out from a reel (not shown) and taken up on a take-up reel, thereby moving intermittently at a constant pitch.
5は上マスク治具で、図示省略しであるエアシリンダな
どで昇降するものであり、この治具5の下面に裏面マス
クゴム6を張る。この裏面マスクゴムはスポンジゴムの
みの場合、シリコンゴムのみの場合、厚いスポンジゴム
の層の下に薄いスポンジコムの層を張り、その下に薄い
シリコンゴムの層を仮止めしたものなどがある。Reference numeral 5 denotes an upper mask jig, which is raised and lowered by an air cylinder or the like (not shown), and a back mask rubber 6 is stretched on the lower surface of this jig 5. This back mask rubber may be made of sponge rubber only, silicone rubber only, or a thin sponge comb layer placed under a thick sponge rubber layer, and a thin silicone rubber layer temporarily attached below that.
上記の上マスク治具5の両側に持ち上げ手段7を設ける
。この持ち上げ手段は図示例では細い金属丸棒をL形に
屈曲し、その下辺に細いローラ8を軽く回転するように
取付けたものであり、この持ち上げ手段7のローラは、
上マスク治具5の下降時にはフレーム1の両端外側に下
降する。Lifting means 7 are provided on both sides of the upper mask jig 5. In the illustrated example, this lifting means is a thin metal round rod bent into an L shape, and a thin roller 8 is attached to the lower side of the rod so as to rotate lightly.
When the upper mask jig 5 is lowered, it is lowered to the outside of both ends of the frame 1.
上記の装置において、被メッキ金属板4がメッキ面マス
クゴム2上において停止した条件で、上マスク治具5を
下降させてシリコンゴムの層8を適宜の圧力で被メッキ
金属板4上に圧着させた状態で公知の方法によりスポッ
トメッキを行なう。In the above apparatus, under the condition that the metal plate 4 to be plated is stopped on the plating surface mask rubber 2, the upper mask jig 5 is lowered and the silicone rubber layer 8 is crimped onto the metal plate 4 to be plated with an appropriate pressure. In this state, spot plating is performed by a known method.
このとき、持ち上げ手段のローラ8はフレーム1の両端
外側下部寄りに下っている。At this time, the rollers 8 of the lifting means are lowered toward the outer lower part of both ends of the frame 1.
こうしてスポットメッキを行なったのち、上マスク治具
5を上昇させると、治具5とともに上昇した持ち上げ手
段7のローラ8が被メッキ金属板4を持ち上げる。After performing spot plating in this manner, when the upper mask jig 5 is raised, the rollers 8 of the lifting means 7 that have been raised together with the jig 5 lift the metal plate 4 to be plated.
従って金属板4がゆるんでいてもメッキ面マスクゴム2
からは十分に離れる。Therefore, even if the metal plate 4 is loose, the plated surface mask rubber 2
Stay far enough away.
この状態で被メッキ金属板4を移動させ、同金属板のメ
ッキ前の部分を下部マスクゴム2上に移動させて停止さ
せたのち、前記同様の作業を繰り返す。In this state, the metal plate 4 to be plated is moved, and the part of the metal plate before plating is moved onto the lower mask rubber 2 and stopped, and then the same operations as described above are repeated.
この発明は上記のように、上マスク治具に、その上昇時
に被メッキ金属板を持ち上げる持ち上げ手段を設けたも
ので、上マスク治具が上昇したとき被メッキ金属板が持
ち上げられて下部のメッキ面マスクゴムから十分に離さ
れるので従来のメッキ装置のように被メッキ金属板の移
動のさいに、金属板がメッキ面マスクゴムと接触するこ
とによって生ずる種々の障害がなくなるという特有の効
果がある。In this invention, as described above, the upper mask jig is provided with lifting means for lifting the metal plate to be plated when the upper mask jig rises, and when the upper mask jig rises, the metal plate to be plated is lifted and the lower part is plated Since it is sufficiently separated from the surface mask rubber, it has the unique effect of eliminating various problems caused by the metal plate coming into contact with the plating surface mask rubber when moving the metal plate to be plated, unlike in conventional plating equipment.
第1図はこの発明を実施したスポットメッキ装置の要部
を示す斜視図、第2図は同上の縦断正面図である。
2・・・・・・メッキ面マスクゴム、3・・・・・・メ
ッキ孔、4・・・・・・被メッキ金属板、5・・・・・
・上マスク治具、6・・・・・・裏面マスクゴム、7・
・・・・・持ち上げ手段、8・・・・・・ローラ。FIG. 1 is a perspective view showing the main parts of a spot plating apparatus embodying the present invention, and FIG. 2 is a longitudinal sectional front view of the same. 2... Plated surface mask rubber, 3... Plated hole, 4... Metal plate to be plated, 5...
・Top mask jig, 6... Back mask rubber, 7.
...Lifting means, 8...Rollers.
Claims (1)
ドフレームなどの被メッキ金属板を裏面を上にして載せ
、この被メッキ金属板上に設置した上マスク治具の下面
に、下降時に前記被メッキ金属板の裏面をカバーする裏
面マスクゴムを張ったスポットメッキ装置において、前
記上マスク治具に、その上昇時に被メッキ金属板を持ち
上げて、その被メッキ金属板をメッキ面マスクゴムから
離す持ち上げ手段を設けたことを特徴とするスポットメ
ッキ用マスク装置。A metal plate to be plated, such as a lead frame, is placed with the back side facing up on a plating surface mask rubber having multiple plating holes, and when lowered, the metal plate to be plated is placed on the lower surface of the upper mask jig set on the metal plate to be plated. In a spot plating apparatus in which a back mask rubber is applied to cover the back surface of a metal plate, the upper mask jig is provided with a lifting means for lifting the metal plate to be plated and separating the plated metal plate from the plated mask rubber when the upper mask jig is raised. A spot plating mask device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29822485A JPS62156290A (en) | 1985-12-27 | 1985-12-27 | Mask device for spotting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29822485A JPS62156290A (en) | 1985-12-27 | 1985-12-27 | Mask device for spotting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62156290A true JPS62156290A (en) | 1987-07-11 |
Family
ID=17856834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29822485A Pending JPS62156290A (en) | 1985-12-27 | 1985-12-27 | Mask device for spotting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62156290A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6656275B2 (en) * | 2000-04-27 | 2003-12-02 | Shinko Electric Industries Co., Ltd. | Partial plating system |
| CN107354491A (en) * | 2017-07-03 | 2017-11-17 | 富加宜连接器(东莞)有限公司 | A uniform coating method |
-
1985
- 1985-12-27 JP JP29822485A patent/JPS62156290A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6656275B2 (en) * | 2000-04-27 | 2003-12-02 | Shinko Electric Industries Co., Ltd. | Partial plating system |
| CN107354491A (en) * | 2017-07-03 | 2017-11-17 | 富加宜连接器(东莞)有限公司 | A uniform coating method |
| CN107354491B (en) * | 2017-07-03 | 2019-03-22 | 富加宜连接器(东莞)有限公司 | Uniform film coating method |
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