JPS6158185A - Method of producing hybrid ic carrying safety unit - Google Patents
Method of producing hybrid ic carrying safety unitInfo
- Publication number
- JPS6158185A JPS6158185A JP17847684A JP17847684A JPS6158185A JP S6158185 A JPS6158185 A JP S6158185A JP 17847684 A JP17847684 A JP 17847684A JP 17847684 A JP17847684 A JP 17847684A JP S6158185 A JPS6158185 A JP S6158185A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- terminal
- manufacturing
- reflow
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 6
- 230000001012 protector Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Emergency Protection Circuit Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は位置決め性の良い簡便な混成ＩＣ搭載保安器（
Ｈｙｂｒｉｄ Ｉｎｔｅｒｇｒａｔｅｄ Ｓｕｒｇｅ
Ｐｒｏｔｅｃｔｏｒ、以下ＨＩＳＰという）の製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention provides a simple hybrid IC-equipped safety device with good positioning performance (
Hybrid Intergrated Surge
The present invention relates to a method for manufacturing a protector (hereinafter referred to as HISP).
（従来の技術）
従来のＨＩ ＳＰの製造方法について第３図、第４図及
び第５図を用いて説明する。第３図は従来の製造方法に
よるＨＩ ＳＰの平面図、第１１図、第５図はそれぞれ
ＨＩ ＳＰの正面図を示す。図において１は厚膜電気回
路を形成したアルミナ基板、２はバリスタ、３は溶断抵
抗器、４は避雷管、５は入出力及び接地用端子（以下端
子と略す。）、５−１．５−２は従来の端子の側面形状
を示し、５−１はアルミナ基板１をはさみ込む場合、５
−２は端子５にダボを形成した場合である。６はアルミ
ナ基板１とバリスタ２、溶断抵抗器３、避雷管４、端子
５をリフロー装置を使用して半田接続する際の治具であ
る。(Prior Art) A conventional method for manufacturing an HI SP will be described with reference to FIGS. 3, 4, and 5. FIG. 3 is a plan view of the HI SP manufactured by the conventional manufacturing method, and FIGS. 11 and 5 are front views of the HI SP. In the figure, 1 is an alumina substrate on which a thick film electric circuit is formed, 2 is a varistor, 3 is a fusing resistor, 4 is a detonator, 5 is an input/output and grounding terminal (hereinafter abbreviated as terminal), 5-1.5 -2 shows the side shape of the conventional terminal, and 5-1 shows the side shape of the conventional terminal.
-2 is a case where a dowel is formed in the terminal 5. Reference numeral 6 denotes a jig for soldering the alumina substrate 1, varistor 2, fusing resistor 3, detonator 4, and terminal 5 using a reflow device.
このような構成において、その半田接続方法は治具６に
アルミナ基板１をセットし、基板１上にバリスタ２、溶
断抵抗器３、避雷管４及び端子５−１又は５−２を搭載
し、その後、リフロー装置で半田接続する。In such a configuration, the solder connection method is to set the alumina substrate 1 on the jig 6, mount the varistor 2, fusing resistor 3, detonator 4, and terminal 5-1 or 5-2 on the substrate 1, After that, solder connections are made using a reflow machine.
（発明が解決しようとする問題点）
しかしながら、第３図〜第５図に示すＨ工ＳＰ形状であ
る場合、アルミナ基板１と端子５との寸法精度を保持す
るため、治具６が必要不可欠となる。(Problem to be solved by the invention) However, in the case of the H-work SP shape shown in FIGS. 3 to 5, the jig 6 is indispensable in order to maintain the dimensional accuracy of the alumina substrate 1 and the terminal 5. becomes.
この治具６を使用する為、リフロー条件が安定しないも
のになる。まず、治具の温度管理を充分しなければなら
ない。アルミナ基板１上の厚膜材料にはＡｇ−！−スト
を用いており、す７０一温度を高くし過ぎたシ、時間を
長く伸ばすことにより銀拡散が進行し膜強度が劣化し、
使用できないものになることは周知のことである。又、
治具６の熱容量、熱伝導性の問題があり、す７０一時間
を治具無しに比べ長くせざる得ない。Since this jig 6 is used, the reflow conditions become unstable. First, the temperature of the jig must be adequately controlled. The thick film material on the alumina substrate 1 has Ag-! - If the temperature is too high or the time is extended for a long time, silver diffusion will progress and the film strength will deteriorate.
It is well known that it becomes unusable. or,
There are problems with the heat capacity and thermal conductivity of the jig 6, and the time required for the jig 6 must be longer than that without the jig.
さらに、半田接続後、治具６からＨＩＳＰを取シ外す際
、簡単に取り外すことができない。理由は半田リフロ一
時の７ラツクスが治具６１ｆＣ回夛込み治具６と基板１
及び治具６と端子５が接着してしまうからである。また
、簡単に取）外す為にフラックスの洗浄を行なうと治具
の温度が下がってしまい、再度リフローする際に工数が
かかる等の問題が残る。Furthermore, when the HISP is removed from the jig 6 after soldering, it cannot be easily removed. The reason is that 7 lux during solder reflow is jig 61fC, which includes jig 6 and board 1.
This is also because the jig 6 and the terminal 5 will be glued together. Furthermore, if the flux is cleaned for easy removal, the temperature of the jig will drop, leaving problems such as the need for additional man-hours when reflowing the jig.
以上、従来ＨＩ ＳＰの製造方法の欠点について下記に
要約する。The drawbacks of the conventional HISP manufacturing method are summarized below.
１）治具の使用によシリフロー条件が不安定となり、厚
膜部分の信頼性が得られない。1) The use of a jig makes the silicone flow conditions unstable, making it impossible to obtain reliability in thick film parts.
２）製品のセット及び取り外し忙工数が多くかか！ｌｌ
ｌ量産に不向きである。2) It takes a lot of man-hours to set up and remove the product! ll
l Not suitable for mass production.
３）治具の製作及び管理が必要となる０（問題点を解決
するだめの手段）
本発明は基板及び入出力用端子に位置決め用の穴又はダ
ブと切込み部を有するダミー部を設け、治具を用いず直
接リフロー装置に載せて半田接続し、ダミー部はその後
カットするようにしたものである。3) Manufacture and management of jigs are required (Another means to solve the problem) The present invention provides a dummy part having a hole or dove for positioning and a notch in the board and the input/output terminal. The dummy parts are directly placed on a reflow machine and soldered without using any tools, and the dummy parts are then cut.
（実施例）
第１図は本発明製造方法の一実施例を示すＨＩＳＰの平
面図、第２図は同じくその正面図である。なお、第３図
〜第５図と同一の部品には同一の参照符号を付した。図
において１１−１は端子位置決め用の穴ａを有し、リフ
ロー半田付は後、切込部Ｃでカットされるダミーのアル
ミナ基板、１ノはこのアルミナ基板１１−１を合わせ持
つと同時に厚膜電気回路を形成したアルミナ基板、１２
−１はアルミナ基板１ノの位置決め用の〆Ｍｂを有し、
リフロー半田付は後、切込みｄでカットされる端子ダミ
ー部、１２はこの端子ダミー部１２−１を合わせ持つ入
出力及び接地用端子である。なお第１図は１枚の基板１
１−１から製品であるＨＩＳＰの３個採シを可能にした
例である。(Example) FIG. 1 is a plan view of a HISP showing an example of the manufacturing method of the present invention, and FIG. 2 is a front view thereof. Note that the same parts as in FIGS. 3 to 5 are given the same reference numerals. In the figure, 11-1 has a hole a for positioning the terminal, and 1 is a dummy alumina board that will be cut at the notch C after reflow soldering. Alumina substrate with membrane electrical circuit formed, 12
-1 has a finish Mb for positioning the alumina substrate 1,
After reflow soldering, a terminal dummy part is cut with a notch d, and 12 is an input/output and grounding terminal having this terminal dummy part 12-1. Note that Figure 1 shows one board 1.
This is an example in which it is possible to collect three HISP products from 1-1.
次に１その製造方法は該アルミナ基板１１上にバリスタ
２、溶断抵抗器３、避雷管４を順次搭載する。次に位置
決め用ダｙｌ−”ｂを有する端子１２を位置決め用穴ａ
を有するアルミナ基板１１に搭載する。その後、治具を
用いず直接リフロー装置に載せ半田接続する。次に洗浄
を行ない、基板１１−１及び端子１２−１のダミー部を
切込みｃ、ｄを利用してカットし、完成する。Next, in the first manufacturing method, a varistor 2, a fusing resistor 3, and a detonator 4 are sequentially mounted on the alumina substrate 11. Next, insert the terminal 12 having the positioning die yl-"b into the positioning hole a.
It is mounted on an alumina substrate 11 having a. Thereafter, it is directly placed on a reflow device and soldered without using a jig. Next, cleaning is performed, and the dummy portions of the substrate 11-1 and the terminals 12-1 are cut using cuts c and d to complete the process.
ここで治具を用いないで良い理由は、第１・図、第２図
に示される通シ、端子１２をアルミナ基板１ノに搭載可
能にしたこと及びリフロ一時の位置ずれをダ？ｂと穴ａ
の組み合わせＫよシ防止したことによるものである。な
おダ？ｂと穴ａはどちらに設けてもよい。The reason why it is not necessary to use a jig here is that the terminals 12 can be mounted on the alumina substrate 1 through the holes shown in Figs. b and hole a
This is due to the combination K being prevented. Naoda? B and hole a may be provided in either direction.
このように位置決め用穴又はダブを有するダミー部を基
板に設けたため、治具の必要がなくなシ、１回だけのり
フローによシ安定した半田接続が可能で、従来の欠点を
ことごとく除去できる。なお、実施例ではＨＩＳＰの製
造方法について述べたがＡｇペースト材料を用いる厚膜
基板においても端子が基板に搭載できれば応用できるこ
とは当然である。Since a dummy part with a positioning hole or dove is provided on the board in this way, there is no need for a jig, and a stable solder connection is possible with only one glue flow, eliminating all the drawbacks of the conventional method. . In addition, although the manufacturing method of HISP was described in the embodiment, it goes without saying that the present invention can also be applied to thick film substrates using Ag paste material as long as terminals can be mounted on the substrate.
（発明の効果）
以上詳細に説明したように、本発明によれば治具を用い
ず、１回のみのりフローによシ半田接続ができるように
したから、次のような効果がある。(Effects of the Invention) As described in detail above, according to the present invention, solder connection can be performed only once with a single soldering flow without using a jig, so that the following effects can be obtained.
１）リフロー条件が安定し厚膜部分の接合において高い
信頼性が得られる。1) Reflow conditions are stable and high reliability can be obtained in bonding thick film parts.
２）治具を使用しない為、量産に適する。2) Suitable for mass production as no jigs are used.
３）多数個採シの基板、端子にすることが可能となシエ
数削減が計れる。3) It is possible to reduce the number of boards and terminals by making multiple boards and terminals.
４）位置決め性が良好で、リフロ一時の位置ズレがなく
、品質の安定したものができる。4) Good positioning performance, no positional deviation during reflow, and stable quality products can be produced.
第１図は本発、明製造方法の一実施例を示す混成ｒｃ搭
載保安器の平面図、第２図は同じくその正面図、第３図
は従来の製造方法を示す混成ｒｃ搭載保安器の平面図、
第４図、第５図はそれぞれその正面図である。
２・・・バリスタ、３・・・溶断抵抗器、４・・・避雷
器、１１・・・アルミナ基板、１１−１・・・ダミーの
あるアルミナ基板、１２・・・端子、１２−１・・・ダ
ミーの端子、１２−１・・・ダミーの端子、ａ・・・穴
、ｂ・・・ダボ、ｃ、ｄ・・・切込み。
特許出願人 沖電気工業株式会社
沖セラミック工業株式会社
第１図
第 ２ 囚Fig. 1 is a plan view of a hybrid RC-mounted protector showing an embodiment of the manufacturing method of the present invention, Fig. 2 is a front view thereof, and Fig. 3 is a plan view of a hybrid RC-mounted protector showing a conventional manufacturing method. Plan view,
FIGS. 4 and 5 are front views thereof, respectively. 2... Varistor, 3... Fusing resistor, 4... Lightning arrester, 11... Alumina board, 11-1... Alumina board with dummy, 12... Terminal, 12-1... - Dummy terminal, 12-1...Dummy terminal, a...hole, b...dowel, c, d...notch. Patent applicant: Oki Electric Industry Co., Ltd. Oki Ceramic Industry Co., Ltd. Figure 1, Figure 2
Claims (1)
ＩＣ搭載保安器の製造方法において、基板及び入出力用
端子に位置決め用穴又はダボと切込み部を有するダミー
部を設けると共に入出力用端子を位置決め用の穴又はダ
ボを用いて基板に投載し、リフローで半田付け後、ダミ
ー部を取除くことを特徴とする混成ＩＣ搭載保安器の製
造方法。In a method for manufacturing a hybrid IC-equipped protector that protects a switch from induced lightning surges and power line collisions, a dummy part having a positioning hole or a dowel and a notch is provided on the board and input/output terminals, and the input/output terminals are used for positioning. A method for manufacturing a hybrid IC-mounted safety device, characterized in that it is mounted on a board using a hole or a dowel, and after soldering by reflow, a dummy part is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17847684A JPS6158185A (en) | 1984-08-29 | 1984-08-29 | Method of producing hybrid ic carrying safety unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17847684A JPS6158185A (en) | 1984-08-29 | 1984-08-29 | Method of producing hybrid ic carrying safety unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6158185A true JPS6158185A (en) | 1986-03-25 |
| JPH0417015B2 JPH0417015B2 (en) | 1992-03-25 |
Family
ID=16049159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17847684A Granted JPS6158185A (en) | 1984-08-29 | 1984-08-29 | Method of producing hybrid ic carrying safety unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6158185A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008247186A (en) * | 2007-03-30 | 2008-10-16 | Honda Motor Co Ltd | Movable step for motorcycle |
-
1984
- 1984-08-29 JP JP17847684A patent/JPS6158185A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008247186A (en) * | 2007-03-30 | 2008-10-16 | Honda Motor Co Ltd | Movable step for motorcycle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0417015B2 (en) | 1992-03-25 |
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