JPS61201389A - Card-shaped electronic device - Google Patents

Abstract

PURPOSE:To prevent an accident due to breakage, etc., by arranging one integrated circuit chip in an equipment body at one edge part, and remaining integrated circuit chips in the equipment body at the other edge part facing said one end part. CONSTITUTION:A substrate 4 and a main chip 5 and a subchip 6 which are fitted to the substrate 4 are stored in the IC card 1; the main chip is arranged at the side edge part of one end part 1a of the card body nearby openings 11a... and the subchip 6 is arranged in the card body at the edge part of the other end part 1 facing said one end part. Consequently, even when the IC card 1 is bent, the integrated circuit chips are arranged where the resulting movement is least, so the breaking of a wiring pattern and breakage of chips themselves are minimized.

Description

Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to a card-shaped electronic device, and more particularly to a card-shaped electronic device having two or more integrated circuit chips and in which verification information is stored in one of the integrated circuit chips. Regarding electronic equipment.

[Technical background of the invention]

2. Description of the Related Art Conventionally, To cards have been known that have a built-in memory chip that stores verification information.

This IO cart is used as a credit card, and its purpose is to verify the owner when making a purchase. Therefore, one chip was sufficient as long as the verification code, owner group, etc. were stored.

In recent years, however, in addition to the encryption and verification functions that were previously provided in terminals and host combinators, IC cards have also become capable of storing transaction information such as the transaction amount, transaction date, and transaction approval number. Consideration is being given to storing data so that the owner can check transaction details at will, thereby providing convenience to the owner and preventing unauthorized use.

For this reason, in order to increase the capacity of the memory section and to take into account various different requests from credit card companies regarding the storage format of transaction information, it has become necessary to use separate chips for the central processing section and the memory section.

However, if the integrated circuit chip is simply housed in the IO card body, problems arise such that the integrated circuit chip is damaged or disconnected from the wiring pattern due to the flexibility of the IC card.

[Purpose of the invention]

The present invention has been made in view of the above situation, and its purpose is to prevent damage to each integrated circuit chip even when the main body of the device is bent, even though the device has two or more integrated circuit chips. An object of the present invention is to provide a card-shaped electronic device that can protect the device from damage and prevent disconnection of the connection portion with the wiring pattern.

[Summary of the invention]

The card-shaped electronic device of the present invention has two or more integrated circuit chips and has verification information stored in at least one of the integrated circuit chips. At least one of the integrated circuit chips is provided at one edge of the device body, and at least one of the integrated circuit chips is disposed inside the device body near the duct portion, and the remaining integrated circuit chips are placed at the other end opposite to the edge of the device body. According to this configuration, all the integrated circuit chips are placed inside the device body near the side edges, and the integrated circuit chips are sewn into the center part of the device body, which flexes greatly when the device body is bent. Since it is placed at the edge, it is very effective against damage to the device itself and disconnection from the wiring pattern.Example: Hereinafter, the card-shaped electronic device of the present invention will be described using an IC card as an example. Figure 1C1, which will be explained with the drawings, is an exploded perspective view of the IC card, Figure 2 is a view of the overall appearance from $jr, and Figure 3 is a sectional view taken along the line m-lTl in Figure 2.

In Figure 2, the IC card indicated by reference number 1 is constructed entirely in the form of a foldable card, and the owner code and owner name are displayed on the front surface (lower side in the drawing). An embossment 2 is formed, and a magnetic stripe 3 having owner information such as a password and account number is provided on the back side (upper side in the drawing). The embossing 2 and the magnetic stripe 3 are each provided along one side edge of the IC card 1 in the opposing longitudinal direction, and a plurality of openings 11α are provided at one end of the approximately central portion of the back surface. It is perforated. This opening 11! A probe connected to an external device is inserted through this opening 11α as described later.
. . . This is for contacting the conductive part arranged on the bottom surface.0 Also, inside the IC card 1, there is a board 4.
Along with this, the main chip 5 attached to this board 4
and a subchip 6 are housed therein. main chip 5
is in the vicinity of the opening 11α, 11tli of one end 1a of the card body 1;
It is disposed inside the main body at the side edge of the other end 1h opposite to h.

Next, details of this IC card 1 will be explained with reference to FIGS. 1 and 3.

1 is an upper LFR film on which the above-mentioned magnetic stripe 3 is formed. This upper surface film is a film made of transparent vinyl chloride, polyester, etc., with decorative printing applied to the inner surface (lower side in the drawing).As shown in FIG. 1, this upper surface film 11 has two Eight openings 11α in columns×4 rows are formed. Each opening 11
The size of α is (L' 2 mtx ”)
．． 711Im), and the size and each position are determined by the ISO standard.0 On the lower surface of the upper film 11, a substrate 4 made of bismaleimide-triazine, glass epoxy resin, etc. is arranged. Openings 4α and 4h for accommodating the main chip 5 and subchip 6 are recessed in the substrate 4. Further, duct portions 7-1 to 7-8 are provided corresponding to each opening 11α of the upper film 11. Each of the contact portions 7-1 to 7-8 is formed larger than each opening 11α of the upper] kJ film, so that even if the alignment of the upper film is somewhat inaccurate, the substrate surface around each contact portion will fit within the opening 11α. Care has been taken to prevent external exposure from... These contact portions 7-1 to 7-8 each have a power supply Vop terminal (7-7-8) according to the I80 standard.
1), reset terminal (7-2), clock terminal <7
-3), a GND terminal (7-5), a VCC terminal (7-6) to which a voltage is applied when writing transaction information (described later), and an address data input/output terminal (7-7). Further, it is assumed that contact portions 7-4 and 7-8 are provided for future use and are not used here. Each contact part 7-1-7-3 and 7-5-7-7 is extended to the peripheral part of each said opening 4(alpha), 4b by conductor foil 7(alpha).... The external terminals of the main chip 5 and subchip 6 on which an LSI (Large Scale Integrated Circuit) is formed will be connected to this conductive foil 7α.
After forming an integrated circuit on and providing gold bumps 5b...
A lead 5C made of tin-plated steel foil is attached to the gold bump 5b on the pellet 5α cut out by dicing.
Place it facing each of... and do inner lead pounding. At this time, the leads 5C... are adhered onto a tape carrier (not shown). This lead 5C...
Cut and separate lead 5C from the tape carrier.
The outer end of each of the conductor foils 7α around the opening 4α...
・Place it on top and bond the outer lead. after that,
A molding resin 5d is molded onto the main surface of the main chip 5. As a result, the main chip 5 is attached to the side edge side of the one end 12b of the upper resin sheet 12, and the subchip 6 is attached to the substrate 4 in exactly the same manner as the main chip 5. In this case, pellet 6α.

Gold bump 6b..., lead 6C and mold resin 6
, rt is Perez l-5 with main chip 5 respectively! ,
Gold bumps 5b... correspond to leads 5C and mold resin number d. However, in this case, subchip 5
are attached to the side edge side of the other end 12C opposite to the one end 12A of the upper resin sheet 12. The contact parts 7-1 to 7-4 are attached to the back side of the substrate 4 through the through holes 8... Lead 5C of main chip 5 is routed.
... is connected (not shown).

In this way, the substrate 4 to which the main chip 5 and the subchip 6 are attached is housed in the upper resin sheet 12 in which an opening 2α having substantially the same size as the outer shape of the substrate 4 is formed. The upper resin sheet 12 is made of hard vinyl chloride resin or polyester resin, and has approximately the same thickness as the substrate 4. Therefore, the substrate 4 is housed in the opening 12α of the upper resin sheet 12 in a substantially tight manner, and each contact portion 7
-1 to 7-8 are almost unable to move in that state.

However, the main chip 5 and subchip 6 are
The lower portions of the pellets 5α and 6α protrude below the back surface of the upper resin sheet 12.

The lower surface of the upper resin sheet 12 has openings 13α and 13b that are much smaller than the opening 12α of the upper resin sheet 12.
The lower resin sheet 3 with perforations is stacked closely together.

The openings 13α and 13b accommodate the portions of the main chip 5 and the subchip 6 that protrude downward from the upper resin sheet 12, respectively, and have the same size as the pellets 5α and 6α. is a transparent back film that is closely attached to the back surface of the lower resin sheet 13. This back film 14 has an owner code and owner name 14α printed on its inner surface (upper side in the drawing), and decorative printing is applied to the entire surface in a color different from that of the owner code and owner name 14α (not shown). has been done.

Next, to explain the case of assembling the IO cart °1 having the structure shown in the above embodiment, first, the main chip 5 and the sub chip 6 are mounted on the substrate 4 on which the contact portions 7-1 to 7-8 and the conductor foil 7α are formed.
Install it. This installation method is as described above.
Next, the lower film 14, the lower resin sheet 13, and the upper resin sheet 12 are successively laminated tightly, and the substrate 4 with the main chip 5 and the subchip 6 attached thereto is housed in the opening 12α of the upper resin sheet 12. In this state, the openings 13α and 13b of the lower resin sheet 13 are provided at positions facing the pellets 5α and 6α,
Portions projecting downward from the upper resin sheet 13 are accommodated in the openings 13α and 13b, respectively. The top film 11 is laminated from above, and the entire surface is hot pressed. Top film 11. upper resin sheet 12,
When the lower resin sheet 13 and the lower film 14 are formed of vinyl chloride resin, the vinyl chloride resin is melted and softened by hot pressing, and the respective laminated surfaces are joined.

Further, when the sheet and film are made of polyester, an adhesive may be interposed between the bonding surfaces and the sheets and film may be bonded by pressing.

Thereafter, the upper film 1lill is embossed to form a protruding second mark 14α containing the user code, user name, etc., thereby forming the IC card shown in FIG. 942. That is, in the IC card of this embodiment, the main chip 5 is arranged at the side edge of one end 1α of the IC card 1, and the subchip 6 is arranged inside the card at the side edge of the other end 1b opposite to the one end 1α. It will be done.

Next, the circuit configurations of the main chip 5 and subchip 6 will be explained with reference to FIG.

The processing card 1 in the above-described embodiment has a data memory portion as a separate chip in order to increase the amount of information stored inside the IC card.

That is, the main chip 5 includes the 0PU51 and the memory section 5.
2. It has a restoration circuit 53 and a comparison circuit 54, and the subchip 6 is an EP-ROM (erasable and programmable read-only memory).
61. Then, the contact portion 7- of the substrate 4
r~Fu8 input/output (Ilo) terminal, reset (R
8T) terminal, clock (OLK) terminal and GND
The terminal is connected to the main chip 5, the Vcc terminal is connected to the subchip 6, and the vDt+ terminal is connected to the main chip 5 and the subchip 6.

EP-ROMfil is yi! It has a memory area shown in Figure J5. To explain this, BP-ROM
61 is provided with an identification data area 70 for storing owner information and an application data area 80 for storing transaction history data using an IC card. Identification data area 70
A manufacturer writing section 71 written by the IC card manufacturer, an issuer writing section 72 written by the issuer, and an owner writing section 7 written by the IC card owner.
3 is set. The manufacturer writing section 71 has an OA (Card Authenticator) memory area 71α and an MPRK (Manufacturer Private Key Code) memory area 71b. The OA memory area 71α is an OA code consisting of, for example, 64 bits, which is different for each card in order to identify each IC card.

This OA code is sent to a card terminal (not shown) and is used to calculate 5AN (Sales Aburu Pal Number).

The issuer writing unit 72 also includes an IPRK (Issier Private Key Code) memory area 72α,
OHN (card holder number) memory area 72b
and gD (exvaluation date) memory area 720, and the owner writing unit 73 further has a PIN (private identification number) memory area 73α. and,
The application data area 80 contains information on transactions made using the IC card, such as transaction amount, transaction date, and 8A.
This is an area where N, etc. are recorded each time a transaction is made. The above 2sAN uses time (date) information, transaction amount, etc. in addition to the OA code mentioned above, and is calculated by a predetermined algorithm on the terminal side, and the calculation result is sent to the 0 card side and recorded. It is.

Therefore, to explain the operation of the circuit shown in FIG.
It is stored in the PIN memory area 73α of P-ROMfil. The identification code is the restoration circuit 5 of the main chip 5.
3, the code is decoded and temporarily stored in the buffer of the decryption circuit 53. Here, when the identification code coded by the owner is input from the terminal, this identification code is input to the memory section 52 of the main chip 5, and is stored in the restoration circuit 53 by the comparison circuit 54. The identification code is compared with the identification code stored in the memory section. If both match, a match signal is sent from the comparison circuit 54 to the CPU 51 and sent to the terminal. After this, an IC chip that applies a high potential to the vCC terminal and writes transaction information in the gP-ROM 61 of the subchip 6 connects the main chip 5 to the subchip 6.
Since it is a separate chip for the IC chip, only the subchip 6 needs to be changed to accommodate the various transaction information recording formats required by credit card companies, and the main chip 5 can be used in common. This has the effect that manufacturing equipment can be operated efficiently.

Note that in the above embodiment, the subchip is a BP-ROM.
Although the explanation has been made in the case of EgP-ROM, it is possible to perform exactly the same operation as EgP-ROM.

In addition, although the above description has been made of the case where the IC card has a single function, the present invention is not limited to this.
For example, it can be applied to a complex card-like electronic device that has not only a credit function but also a calculation function such as a small electronic needle X machine, a clock function, and the like.

〔Effect of the invention〕

As is clear from the above explanation, the card-shaped electronic 41 of the present invention
! ! The device has at least one of two or more circuit chips.
One integrated circuit chip is placed inside the main body of the device at the 141st part, and the remaining integrated circuit chips are placed inside the main body of the main unit at the other end opposite to the one end (ff), so that the main body of the device is not bent. Even if the integrated circuit chips are damaged, the deformation load applied to each integrated circuit chip can be reduced to a large degree, ensuring that each integrated circuit chip is protected from damage and the interconnections between each integrated circuit chip and the wiring pattern are disconnected. This has the effect of improving the reliability of the equipment.

[Brief explanation of the drawing]

All drawings are card-shaped electronic +1 of the present invention! FIG. 1 is an exploded perspective view of the IC card, FIG. 2 is a perspective view of its external appearance, FIG. The figure is a block circuit diagram of the main chip and subchip, and Figure 5 is the BP-ROM.
FIG. 2 is a diagram showing an example of a storage area of FIG. 1, -P...IC card, 4.4'-...board, 5
...Main chip, ...6...Sub chip, 7-1 to 7-8...Conduct part, 11...Top surface film, 12...Upper phase 11 effect sheet, 13...Lower part resin sheet.

Claims (1)

[Claims] In a card-shaped electronic device having two or more integrated circuit chips and in which verification information is stored in at least one of the integrated circuit chips, a plurality of contact portions connected to an external device are provided on one edge of the device body. At least one of the integrated circuit chips is arranged inside the device body near the contact portion, and the remaining integrated circuit chips are placed inside the device body near the other end side edge opposite to the one end side edge of the device body. A card-shaped electronic device characterized by the following: