JPS61142635A - Vapor cooling acceleration apparatus - Google Patents
Vapor cooling acceleration apparatusInfo
- Publication number
- JPS61142635A JPS61142635A JP26440184A JP26440184A JPS61142635A JP S61142635 A JPS61142635 A JP S61142635A JP 26440184 A JP26440184 A JP 26440184A JP 26440184 A JP26440184 A JP 26440184A JP S61142635 A JPS61142635 A JP S61142635A
- Authority
- JP
- Japan
- Prior art keywords
- boiling
- cooling
- receiving surface
- heat receiving
- cooling water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Microwave Tubes (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
一本発明は核融合機器に用いられるクライオスト “ロ
ンなどの高負荷受熱面を沸騰冷却する沸騰冷却促進装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a boiling cooling acceleration device for boiling and cooling a high-load heat receiving surface such as a cryostron used in a nuclear fusion device.
重電機器、核融合機器等(例えばクライストロンなど)
において近年高出力、小型化の傾向は著しく、これらの
機器の高負荷受熱面の沸騰冷却においても受熱面熱負荷
が通常の水の核沸騰最大流束値(抜出ポイント)である
1、5〜2.OXIO’ W/dの数倍に達することが
ある。このように高負荷受熱面の沸騰冷却においては、
抜出ポイントを越えた熱流束域になると、受熱面での沸
騰形態は蒸気の層で覆われる膜洲騰となり、そのため沸
騰面温度が500℃〜100’O”Cにも達し、沸騰面
及びこの沸騰面に連らなる受熱面が夫々の溶解を引き起
こし、ひいては機器を損傷する事態を生じることになる
。Heavy electrical equipment, nuclear fusion equipment, etc. (e.g. klystron, etc.)
In recent years, there has been a remarkable trend towards high output and miniaturization, and even in boiling cooling of the high-load heat receiving surface of these devices, the heat load on the heat receiving surface is the maximum flux value (extraction point) of normal water nucleate boiling1,5 ~2. It can reach several times OXIO' W/d. In this way, in boiling cooling of a high-load heat-receiving surface,
In the heat flux region beyond the extraction point, the form of boiling at the heat receiving surface becomes a film swell covered with a layer of steam, and therefore the boiling surface temperature reaches 500°C to 100'O"C, causing the boiling surface and The heat-receiving surface connected to this boiling surface causes melting of the respective components, which in turn causes damage to the equipment.
本発明は冷却液の抜水ポイント以上となる高負荷受熱面
の沸騰形態を冷却液の強制対流により擬似核沸騰とし、
沸騰面温度を所定の温度以下に抑制するようにして機器
の損傷を防止することを目的とする。The present invention converts the boiling form of the high-load heat-receiving surface, which is above the coolant drainage point, into pseudo-nucleate boiling by forced convection of the coolant.
The purpose is to prevent damage to equipment by suppressing the boiling surface temperature below a predetermined temperature.
上記の目的を達成するため、本発明は内周側よ接触する
ように上記受熱面に設けられた複数のフィンとにより形
成された流路と、この流路に冷却水を供給する装置とを
有することを特徴としている。In order to achieve the above object, the present invention includes a flow path formed by a plurality of fins provided on the heat receiving surface so as to be in contact with each other from the inner circumferential side, and a device for supplying cooling water to this flow path. It is characterized by having
以下本発明の一実施例について第1図乃至!J3図を参
照して説明する。第1図において、1は例えばクライス
トロンなどの重電機器、核融合機器の発生熱負荷を内面
側より受ける受熱面であり、この受熱面lの放熱側には
同一方向に多条の溝を持つフィン状の沸騰面2が形成さ
れている。またこの受熱面1の特に高熱負荷を受ける高
負荷受熱面1mの外周側にその内壁3が接するように上
部に流出口4下部に流入口5を有する冷却液槽6が設置
されている。また第2図及び第3図に示すよう;;、7
は流路であり、この流路7は、沸騰面2を形成した高負
荷受熱面1mと前記内壁3とを接触させることにより形
成される。また前記冷却液槽6の下部には前記流路7に
連通する下部冷却液槽8が設置され、前記冷却液槽6の
上部(二は前記流路7に連通ずる上部冷却液槽9が夫々
設置されている。さらにこの上部冷却液槽9の上部には
主流出口10が設けられ、また前記下部冷却液槽8の下
部には主流入口11が夫々設けられている。一方上記機
器の外部にはポンプ12が設けられ、このポンプ12と
前記主流入口11及び流入口5はそれぞれ流量制御弁1
3a、13b (例えば電磁弁)を介して接続管14が
接続される。また前記主流出口10及び流出口4は夫々
流出管18を介して気液分離装置15.凝縮器16、放
熱器17及び前記ポンプ12とに接続される。An embodiment of the present invention will be described below with reference to FIGS. This will be explained with reference to Figure J3. In Figure 1, 1 is a heat receiving surface that receives the heat load generated by heavy electrical equipment such as klystrons and nuclear fusion equipment from the inner side, and the heat radiating side of this heat receiving surface 1 has multiple grooves in the same direction. A fin-shaped boiling surface 2 is formed. Further, a cooling liquid tank 6 having an outlet 4 at the upper part and an inlet 5 at the lower part is installed so that the inner wall 3 of the heat receiving surface 1 is in contact with the outer peripheral side of the high load heat receiving surface 1m which receives particularly high heat loads. Also, as shown in Figures 2 and 3;
is a flow path, and this flow path 7 is formed by bringing the high-load heat receiving surface 1m on which the boiling surface 2 is formed into contact with the inner wall 3. Further, a lower cooling liquid tank 8 communicating with the flow path 7 is installed in the lower part of the cooling liquid tank 6, and an upper cooling liquid tank 9 communicating with the flow path 7 is installed in the upper part of the cooling liquid tank 6 (2). Furthermore, a main stream outlet 10 is provided at the upper part of the upper cooling liquid tank 9, and a main stream inlet 11 is provided at the lower part of the lower cooling liquid tank 8. is provided with a pump 12, and this pump 12, the main stream inlet 11 and the inlet 5 are connected to a flow control valve 1, respectively.
A connecting pipe 14 is connected via 3a, 13b (for example, a solenoid valve). The main stream outlet 10 and the outlet 4 are connected to the gas-liquid separation device 15 through an outlet pipe 18, respectively. It is connected to a condenser 16, a radiator 17, and the pump 12.
次に作用を説明する。前記ポンプ12から流出された冷
却水は下部冷却槽8に流入しその後面積の狭い流路7に
流入する。この流路7において、冷却水は高負荷を受け
た高負荷受熱面(1a)上り熱を受は上昇し、その一部
は気化し水蒸気となる。さら&:高負荷受熱面1mと前
記内壁3とは接触しているため熱伝導により高負荷受熱
面1gからの熱がこの内壁3(=も伝わるため、冷却水
はこの内壁3からも一部熱を受けること(=なる。また
、流路7内においては、冷却水は面積の減小及び冷却水
の気化鑑:よる体積膨張:=より高速の強制対流気液2
相流となり、擬似核沸騰の状態で上部冷却液槽9に流入
する。上部冷却液槽9において、冷却水は前記受熱面1
を低速の強制対流条件で沸騰冷却状態となる。なおこの
上部冷却液槽9では冷却水は熱負荷が低いため膜沸騰と
はならず核沸騰状態で流れる。さらに上部冷却液槽9の
主流出口10から流出する気液2相の冷却水は気液分離
装置15にて水蒸気と沸騰水とに分離され、さらにこの
水蒸気は凝縮器16で液化されその後放熱器17へ導か
れ、また沸騰水は直接放熱器17へ導びかれ、この放熱
器17で放熱後再びポンプ12へ導びかれる。一方流入
口5より流量制御弁13を介して冷却液槽6に流入した
冷却水は流路7を形成する内壁3を冷却後、流出口4よ
り流出管18を介して上記同様気液分離装置15、凝縮
器16、放熱器17及びポンプ12へと流電
出する。このように高熱負荷を蒋ける部分に流路7を設
け・1この、流路77内で発生する気泡を吹飛ばすほど
の高速の強制対流条件にするとともにこの流路な外周側
よりさらに冷却水を冷却する構造としたので、冷却水は
膜沸騰状態が発生せず擬似核沸騰状持されたまま高熱流
束域まで到達できるようになる。したがって@4図に示
すように、プール沸騰Bで見られた極大値A(抜出ポイ
ント)が強制対流沸131c、Dでは見られず、沸騰面
温度が飛躍的に上昇する現象は発生しない。なお、Cは
低流量における強制対流沸騰、Dは高流量における強制
対流沸騰による沸騰特性曲線を夫々示している。Next, the effect will be explained. The cooling water discharged from the pump 12 flows into the lower cooling tank 8 and then into the narrow channel 7. In this flow path 7, the cooling water rises to the high-load heat-receiving surface (1a) receiving heat, and a part of it vaporizes and becomes water vapor. Further &: Since the high load heat receiving surface 1m is in contact with the inner wall 3, heat from the high load heat receiving surface 1g is also transferred to this inner wall 3 due to heat conduction, so some of the cooling water is also transferred from this inner wall 3. In addition, in the flow path 7, the cooling water undergoes a reduction in area and volume expansion due to vaporization of the cooling water: = faster forced convection gas-liquid 2
The liquid becomes a phase flow and flows into the upper cooling liquid tank 9 in a state of pseudo nucleate boiling. In the upper cooling liquid tank 9, cooling water is supplied to the heat receiving surface 1.
A boiling cooling state occurs under low-speed forced convection conditions. In this upper cooling liquid tank 9, since the cooling water has a low heat load, it does not flow in a film boiling state but in a nucleate boiling state. Further, the gas-liquid two-phase cooling water flowing out from the main stream outlet 10 of the upper cooling liquid tank 9 is separated into steam and boiling water in the gas-liquid separator 15, and further, this steam is liquefied in the condenser 16, and then the radiator 17, and the boiling water is directly led to the radiator 17, where the heat is radiated and then the boiling water is led to the pump 12 again. On the other hand, the cooling water flowing into the cooling liquid tank 6 from the inlet 5 via the flow rate control valve 13 cools the inner wall 3 forming the flow path 7, and then flows from the outlet 4 via the outlet pipe 18 to the gas-liquid separation device as described above. 15, the condenser 16, the radiator 17, and the pump 12. In this way, the flow path 7 is provided in a part where a high heat load can be applied.1 This creates a high-speed forced convection condition that blows away the air bubbles generated in the flow path 77, and further cools the cooling water from the outer circumference of this flow path. Since the structure is designed to cool the cooling water, film boiling does not occur and the cooling water can reach the high heat flux region while maintaining a pseudo nucleate boiling state. Therefore, as shown in Figure @4, the maximum value A (extraction point) observed at pool boiling B is not observed at forced convection boiling 131c and D, and a phenomenon in which the boiling surface temperature rises dramatically does not occur. Note that C indicates a boiling characteristic curve due to forced convection boiling at a low flow rate, and D indicates a boiling characteristic curve due to forced convection boiling at a high flow rate.
このように抜出ポイントの発生がなくなるのでこの実施
例によれば熱流束が増大しても沸騰面温度は連続的に上
昇し、従来到達し得なかった低温度差による高熱負荷の
処理が可能となる。また上記実施例においては、冷却水
の流路な高負荷受熱部にのみ設置したので下流に向かう
(二従って増加するボイドの発生に伴う流路内圧力損失
の増大による悪影響をも防止できる。Since no extraction points occur in this way, according to this embodiment, even if the heat flux increases, the boiling surface temperature will rise continuously, making it possible to handle high heat loads with a low temperature difference that could not be achieved conventionally. becomes. In addition, in the above embodiment, since the cooling water is installed only in the high-load heat receiving section, which is the cooling water flow path, it is possible to prevent the adverse effects caused by the increase in pressure loss in the flow path due to the occurrence of increasing voids.
本発明によれば高負荷冷却を極めて低い温度上昇値で処
理できるとともに、抜出ポイントの発生を抑制し、機器
の損傷を防止することができる。According to the present invention, high-load cooling can be handled with extremely low temperature rise values, and the occurrence of extraction points can be suppressed to prevent damage to equipment.
第1図は本発明の一実施例を示す系統図、第2図は第1
図の要部斜視図、第3図は第2図のI−■断面図、第4
図は熱流束と加熱面温度−飽和温度の関係を示す沸騰特
性曲線線図である。
1a・・・萬負荷受熱面、 2・・・沸騰面(フィン
)、3・・・内壁、 6・・・冷却液槽、
7・・・流路。
代理人 弁理士 則 近 憲 佑(ばか1名)第1mlFig. 1 is a system diagram showing one embodiment of the present invention, and Fig. 2 is a system diagram showing an embodiment of the present invention.
Figure 3 is a perspective view of the main part of the figure, Figure 3 is a sectional view taken along I-■ in Figure 2, Figure 4
The figure is a boiling characteristic curve diagram showing the relationship between heat flux and heating surface temperature-saturation temperature. 1a... ten thousand load heat receiving surface, 2... boiling surface (fin), 3... inner wall, 6... cooling liquid tank,
7...Flow path. Agent Patent Attorney Kensuke Chika (1 idiot) 1st ml
Claims (1)
側に配置された冷却液槽と、この冷却槽の内壁およびこ
の内壁に接触するように上記受熱面に設けられた複数の
フィンとにより形成された流路と、この流路に冷却水を
供給する装置とを有することを特徴とする沸騰冷却促進
装置。A heat receiving surface that receives a high load from the inner circumferential side, a cooling liquid tank arranged on the outer circumferential side of this heat receiving surface, an inner wall of this cooling tank, and a plurality of fins provided on the heat receiving surface so as to be in contact with this inner wall. What is claimed is: 1. A boiling cooling promotion device comprising: a flow path formed by the above, and a device for supplying cooling water to the flow path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26440184A JPS61142635A (en) | 1984-12-17 | 1984-12-17 | Vapor cooling acceleration apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26440184A JPS61142635A (en) | 1984-12-17 | 1984-12-17 | Vapor cooling acceleration apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61142635A true JPS61142635A (en) | 1986-06-30 |
Family
ID=17402646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26440184A Pending JPS61142635A (en) | 1984-12-17 | 1984-12-17 | Vapor cooling acceleration apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142635A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8893513B2 (en) | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
| US8991194B2 (en) | 2012-05-07 | 2015-03-31 | Phononic Devices, Inc. | Parallel thermoelectric heat exchange systems |
| US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
-
1984
- 1984-12-17 JP JP26440184A patent/JPS61142635A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8893513B2 (en) | 2012-05-07 | 2014-11-25 | Phononic Device, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
| US8991194B2 (en) | 2012-05-07 | 2015-03-31 | Phononic Devices, Inc. | Parallel thermoelectric heat exchange systems |
| US9103572B2 (en) | 2012-05-07 | 2015-08-11 | Phononic Devices, Inc. | Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system |
| US9234682B2 (en) | 2012-05-07 | 2016-01-12 | Phononic Devices, Inc. | Two-phase heat exchanger mounting |
| US9310111B2 (en) | 2012-05-07 | 2016-04-12 | Phononic Devices, Inc. | Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system |
| US9341394B2 (en) | 2012-05-07 | 2016-05-17 | Phononic Devices, Inc. | Thermoelectric heat exchange system comprising cascaded cold side heat sinks |
| US10012417B2 (en) | 2012-05-07 | 2018-07-03 | Phononic, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
| US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
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