JPS61112661A - Conductive path wiring board for thermal head and method for manufacturing the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention provides 3! for supplying driving power to a heating resistor of a thermal head device. The present invention relates to an S circuit wiring board and a method for manufacturing the same.

[Prior art]

The configuration of the thermal head device is, for example, as shown in FIG. Ruru glass board 1 board 1
1 and a base 10.11 on which an integrated circuit chip 12Δ including a driver circuit is mounted.
It is equipped with

Here, the glass 1 boxy base 11 is a glass cloth base material impregnated with Evo 1 resin, but there is also a base C made of lath epoxy material, and a specific wiring pattern for supplying driving power to the resistor 10A is used. A conductive path 11Δ is provided on one side of the base. In this case, the conductive paths e and r are a data outgoing path (“data out path”) and a data incoming path (“data out path”), respectively.
data-in path"), but for example, data-in path e-2
The end of °e-3 does not extend to the periphery of the base.

In order to form such a conductive path, it is necessary to form the conductive path by etching and then perform solder plating, but this is inconvenient because the electrodes or terminals for electrolytic plating cannot be taken out properly. In this case, before forming the conductive path, the entire copper foil can be electrolytically + soldered and then etched, but the two layers of solder and copper cannot be etched (-J). The process becomes complicated and expensive.

For this reason, conventionally, after etching, solder was applied with a roller, or the whole was immersed in a bath of molten solder. However, in this case, it is difficult to control the solder thickness, and bonding performance varies, which is not desirable.

〔the purpose〕

The present invention was made in an attempt to eliminate the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide a conductive path wiring board for a thermal head and a method for manufacturing the same, in which electrolytic solder plating on the conductive path is easy. shall be.

(composition〕 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 shows an embodiment of the present invention, in which a ceramic base 2 has a resistor 20'A for recording heat generation.
0, a glass epoxy base 21 having a conductive path 21A for supplying driving power to the resistor 2OA, and a tape carrier mounted with an IC chip 22A that electrically and actively connects these bases 20 and 21. 22.

The ceramic base 20 is a base made of a reramic material, and has a resistor 2OA on its surface for recording heat generation.
are formed continuously or intermittently in rows. A predetermined number of electric currents 1420B are drawn out from each resistor 2OA. The structure of the resistor 20A, the connection with the electric conductor M20B, etc. are well known, so detailed explanations thereof will be omitted.

As described above, the glass box base 21 is a base made of glass epoxy material, and according to the present invention, it is used as a base for the resistor 2OA. In order to supply IJJ power, a conductive path 21A having a specific wiring pattern is provided on only one side of the base.

Here, each conductive path of the wiring pattern is indicated by a to h, and for example, a-cj is a signal path that provides the first to fourth strobe pulses, e, l and 7-s, clock and other signal paths. , 0 is a data introduction path (“data in path”), and h is a data derivation path (“data out path”). Pulses are sequentially applied to signal paths a to d for applying strobe pulses over time, and each grouped electrode group is driven by the corresponding pulse. Data in path Q
For example, image information detected by an image sensor (not shown) is sent as a serial digital signal for each pixel. This digital signal is sent through each driver integrated circuit to the 'C low antibody 2OA and the next driver integrated circuit.

That is, in order to serially arrange image information signals via the IC chip of the leftmost tape carrier 22-1 at the rear of the illustrated tape carrier 22, this signal is sent to the data out path h1. This data out path h1 serves as a data in path to the next tape carrier 22-2. The same connection is made below, and the rightmost tape: 1 spear?
Tape carrier 22- (n-
The data out path h from 1> is the data in path to the tape carrier n-1 22-n of the 1st grade stone.As can be seen, each conductive path Q, h is connected to each tape carrier. 7
It forms a wiring pattern that connects the shift registers in 22 IC chips in series, thus forming adjacent conductive paths. Moreover, these conductive paths are formed on the outer portion of the base body 21.

Further, the ends of each of the wiring patterns a to Q of the conductive path 21A extend to the end 21a of the base 21, and this end 2
The width of the entire conductive path 21A is increased near 1a. End 2
1a, each conductive path 21A has a wide portion 21b formed to form a terminal. Further, the conductive path forming the data-in path and the data-out path h1 to ho has a conductive path extending from the intermediate portion to the end portion 21G of the base 21, and the end of the conductive path is a wide portion 21d forming a terminal. is formed. This wide portion 21d can be used as a test terminal. Also, each line A of the tape carrier 22-1
, B...G are connection points 1'C with wiring patterns a, b,...Q provided on the glass epoxy base 21, respectively.
- Connected.

Such a base body 21 can be manufactured and sized as follows. First, as shown in Figure 3, the part 2 that should originally become the base.
In addition to C, a region 30 is provided outside of C with an extra portion. The above-mentioned pattern 2 is placed on these areas 21°30.
1△ and electrolytic plating electrode 31 electrically connected thereto
C is formed by etching. By doing so, all the patterns 21A are connected to the common keyaki plate 31 for electrolytic plating, so that electrolytic plating can be easily formed on the patterns 21A. After the electrolytic plating is completed, the desired conductive path wiring board is obtained by cutting off the region 30.

〔effect〕

As described above, according to the conductive path wiring board of the thermal head according to the present invention, since the conductive path is formed in a wide width at the end of the base, it is possible to commonly form the conductive path for electrolytic plating. Further, according to the method for manufacturing a conductive path wiring board for a thermal head according to the present invention, it is possible to form a wide area in advance and
Since the common electrode for electrolytic plating and the wiring pattern connected thereto are electrolytically plated on the substrate, unnecessary portions are cut and removed, making high-quality electrolytic plating economically possible.

[Brief explanation of drawings]

Fig. 1 is a block diagram of a conventional thermal head device, Fig. 2 is a block diagram of an embodiment of the present invention, and Fig. 3 is an explanatory diagram showing the state of manufacturing a wiring board according to the embodiment of Fig. 2. . 10.20...ceramic substrate (first substrate), 11
．． 21...Glass epoxy base (second base), 10
A, 20Δ...Resistor, IIA, 21A...Conducting path, 12.22...Tape Kyrelia, 21 a, 21
c・15 parts, 21b, 21d,, wide part. Applicant Tanukito Sato - Yuuki 1 Kasumi 1A

Claims (1)

[Claims] 1. A plurality of conductive paths for supplying driving power to a resistor for recording heat generation formed on a first substrate, and a drive for driving the resistor in the middle of the conductive path. In a conductive path wiring board for a thermal head having an integrated circuit including a circuit on a second substrate, each of the conductive paths is electrolytically plated, and at least one end thereof extends to an end of the second substrate. 1. A conductive path wiring board for a thermal head, characterized in that the end portion of the conductive path is formed wider than the wiring pattern on the inner side thereof. 2. In a method for manufacturing a conductive path wiring board for a thermal head that is provided with a plurality of conductive paths for supplying driving power to the resistor of the thermal head, the wiring board is formed larger than the completed state, and the conductive paths are forming a common electrode that connects the conductive paths in common in a large outer area together with a wiring pattern forming a large outer area, electrolytically plating the conductive paths using this common electrode, and forming an outer area having the common electrode. A method of manufacturing a conductive path wiring board, characterized in that the conductive path wiring board is cut and removed. 3. The method for manufacturing a conductive path wiring board according to claim 2, wherein the electrolytic plating is electrolytic solder plating.