JPS60105262A - thick film integrated circuit - Google Patents

Abstract

PURPOSE:To prevent the change of thickness of screen printing on the formation of a thick-film resistor through a dielectric by forming a dielectric layer in a region, in which a squeegee is not deformed by a thickness gap through the dielectric layer, while being adjoined to a circuit element running parallel with the direction of movement of the aqueegee on screen printing. CONSTITUTION:Patterns for dielectric layers are formed where adjacent to a circuit element such as a resistor, and these patterns are shaped in region in which a squeegee is not deformed. The dielectric layers such as dielectric layers 10 are formed on regions in which the deflection of the nose of the squeegee for screen printing is not changed while being adjoined to both side surfaces of a resistance film in order to display an effect by a minimum area required in a pattern for a dielectric layer 1 positioned at the lowe position of the resistor, and the deviation of the change of thickness of the resistor is minimized. Accordingly, the change of film thickness by the inequality of thickness of the dielectric layers shaped as the boundary layers of the circuit element in each layer in the formation of films through screen printing of a thick-film integrated circuit onto a circuit part can be prevented, and the usage of the material is mininized and the deviation of the quality of end products is inhibited easily at a minimum.

Description

[Detailed description of the invention] Industrial applications The present invention relates to thick film integrated circuits.

Conventional configurations and their problems In recent years, thick film integrated circuits have been used in all fields of industrial and consumer equipment, with the aim of achieving high integration (multilayer structure) and high precision (fine patterns). As a result, manufacturing technology is becoming more sophisticated. Therefore, the finish of the film and its variations in circuit formation become a problem.

As shown in FIGS. 1 and 2, the conventional circuit forming method includes a dielectric layer 1 (area surrounded by a broken line in the figure), a conductor 3. Resistance 4.5°6.
7. The overcoat 9 is formed by sequentially repeating the manufacturing steps of printing, drying, and baking. The dielectric layer 1 is formed on the circuit component 2 because the circuit component 2 is, for example, a capacitor made of barium titanate or a component made of a multilayer structure of a thick film circuit, so that the circuit elements in each layer do not interfere with each other. This is because it is provided as a boundary layer to prevent this from occurring. Therefore, when forming the dielectric layer 1, it is desirable to form the dielectric layer 1 in as small an area as possible as the number of layers increases, as this will save material.

Screen printing is the most common printing method used to form thick film circuits, and the problem with forming thick film resistors in particular is how to minimize variations in the quality of the final product due to the large number of process variables. It is. Among these, changes in film thickness due to non-uniformity of the substrate are particularly important. This will be explained with reference to FIG. Unevenness of the substrate is caused by warping, twisting, thickness,
Although this may be due to the state of film formation on the substrate or other factors, FIG. 3 shows that the film 19 changes simply due to a change in the thickness of the substrate.

When the substrate becomes thicker than the standard 1-height substrate 1o shown in FIG. 3a, the squeegee 11 deforms and the tip of the squeegee 11 bends as shown in FIG. , as a result, the film thickness is printed as ). And, it becomes lower resistance ([. It is clear that the pattern structure is essential.

FIGS. 4 and 5 show the pattern of the dielectric layer 2 in FIG. 1 and the 1-substance at each location.9 The printed surface changes when the squeegee moves in the direction of the arrow in the figure. Show that there is. If such a change occurs, the film thickness will change due to changes in the thickness of the printed surface, even if the printing conditions are optimally set for resistors 4, 5, 6, 7, etc. shown in Figure 1. It is clear from the reasons explained above/ζ. Especially resistance 6,7
A longitudinal turn of the resistor is formed parallel to the squeegee direction, and there are no extraction electrodes on both sides of the resistor like resistors 4 and 6, so changes in the thickness dimension of the dielectric layer 2 and its effects are It's large.

OBJECTS OF THE INVENTION It is an object of the present invention to provide a thick film integrated circuit that can prevent thickness changes due to screen printing in forming a thick film resistor through a dielectric, and minimize the area used for the dielectric. purpose.

Structure of the Invention In order to achieve the above object, the present invention is characterized in that dielectric layer patterns are formed in positions close to circuit elements such as resistors, and they are formed in areas where squeegee deformation does not occur. It is something to do.

Description of examples The present invention will be described in detail below based on drawings of embodiments.

Figures 6 and 7 show an embodiment of the present invention.
Dielectric layer 1 which is the bottom binding of resistors 6 and 7 shown in FIG.
The pattern is placed close to both sides of the resistive film of resistors 6 and 7 and at the tip of the screen-printed squeegee so as to minimize the area required and achieve the desired effect! Ten dielectric layers are formed in the area where no change in deflection occurs in H11, and the deviation in thickness change in resistors 4, 5, and 6.7 is minimized.

Effects of the Invention As described above, according to the present invention, the film thickness is reduced due to non-uniform thickness of the dielectric layer formed as a boundary layer between circuit elements in each layer when a thick film integrated circuit is formed on a circuit component by screen printing. Effects such as being able to prevent changes in the quality of the finished product and making it easy to minimize deviations in the quality of the final product by minimizing the amount of material used are obtained. As a result, as thick film integrated circuits are becoming more and more highly integrated, they are extremely cost-effective and have the advantage of being able to provide products of uniform quality without using complicated screen printing techniques and skills.

[Brief explanation of drawings]

Figure 1 is a plan view of a conventional thick film integrated circuit, and Figure 2 is its A.
3A and 3B are explanatory diagrams showing the substrate thickness and squeegee condition, FIG. 4 is a plan view of the dielectric layer pattern in the same circuit, and FIGS.
Fig. 6 is a plan view of the dielectric layer pattern according to the present invention, and Fig. 7 a, b, and c are cross-sectional views showing the thickness of each part of the dielectric layer. FIG. 3 is a cross-sectional view showing the thickness state. 1... Dielectric layer, 2... Circuit component, 3... 1
Body, 4.5, 6.7...Resistance, 8...Circuit component extraction electrode, 9...Overcoat, 10...
-Dielectric layer. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure G Figure 2 Figure 3-b Figure 4 Figure 5 (L /A IA' b IBIB' Figure 7 α2A2A'b282B'G2G'2C'

Claims (1)

[Claims] A thick film integrated circuit that is constructed by screen printing conductor connection circuit patterns and circuit elements such as resistive capacitors in one or more layers on a dielectric layer formed in advance on a base material, and the squeegee movement during screen printing. A thick film integrated circuit characterized in that the dielectric layer is entirely constructed in a region close to a circuit element parallel to the direction and where squeegee deformation does not occur due to a thickness gap through the dielectric layer.