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JPS6481300A - Pattern inspection of printed-circuit board - Google Patents

Pattern inspection of printed-circuit board

Info

Publication number
JPS6481300A
JPS6481300A JP23765387A JP23765387A JPS6481300A JP S6481300 A JPS6481300 A JP S6481300A JP 23765387 A JP23765387 A JP 23765387A JP 23765387 A JP23765387 A JP 23765387A JP S6481300 A JPS6481300 A JP S6481300A
Authority
JP
Japan
Prior art keywords
copper foil
foil pattern
pattern
base material
immersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23765387A
Other languages
Japanese (ja)
Inventor
Seigo Yamawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23765387A priority Critical patent/JPS6481300A/en
Publication of JPS6481300A publication Critical patent/JPS6481300A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To easily remove a blackened part after the inspection operation of a pattern by a method wherein a blackening operation is executed by immersing a base material in previously heated water and by oxidizing the surface of a copper foil pattern so that the pattern can be inspected with good accuracy. CONSTITUTION:An intermediate layer 1 where a copper foil pattern has been formed on both faces of a base material composed of a polyimide layer is immersed in a solution 2 of hydrochloric acid. Then, this intermediate layer 1 is washed by water, after that, it is immersed for five minutes in warm water 3 heated by using a heater 4; the surface of the copper foil pattern is oxidized and blackened. By this setup, a color of the surface of the copper foil pattern can be distinguished from the color of the polyimide resin as the base material; after that, when this copper foil pattern is illuminated with a beam, a reflected beam of the copper foil pattern can be distinguished from a reflected beam of the base material; a defective state on the surface of the copper foil pattern can be inspected easily. If this layer is immersed for several tens of seconds in an aqueous solution of 10wt.% of hydrochloric acid, a blackened part of copper oxide can be removed.
JP23765387A 1987-09-22 1987-09-22 Pattern inspection of printed-circuit board Pending JPS6481300A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23765387A JPS6481300A (en) 1987-09-22 1987-09-22 Pattern inspection of printed-circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23765387A JPS6481300A (en) 1987-09-22 1987-09-22 Pattern inspection of printed-circuit board

Publications (1)

Publication Number Publication Date
JPS6481300A true JPS6481300A (en) 1989-03-27

Family

ID=17018511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23765387A Pending JPS6481300A (en) 1987-09-22 1987-09-22 Pattern inspection of printed-circuit board

Country Status (1)

Country Link
JP (1) JPS6481300A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

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