JPS594020A - Treating device for semiconductor device - Google Patents

Abstract

PURPOSE:To shorten a waiting time of a wafer, and to improve the yield by previously setting up two means, i.e. the injection of a purging gas and the dropping of chemicals to a handling arm treating an article in the treating device which cleans the surface of the article by injecting the purging gas and drops chemicals to the surface while turning the article. CONSTITUTION:The handling arm 17 is encased in a spin cup 1 with an exhaust pipe 6 downward discharging air, in which N2 gas is mixed, and the arm 17 is given two functions of an N2 gas purge and the dropping of chemicals. That is, edge sections projecting to the lower sides of the handling arm 17 are spanned with the semiconductor wafer 3, and a nozzle 14 for the N2 gas purge is set up previously to the side wall of the arm. A chemical vessel 18 is fitted to the upper surface of the arm, and a dispenser 15 for dropping chemicals from the vessel is projected into the arm 17. Accordingly, the surface of the wafer is washed and chemicals are dropped at the same time, and efficiency of manufacture is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a processing apparatus for semiconductor devices, and more particularly to a handling arm (III transport means) in which a gas injection nozzle and a chemical liquid dispenser (chemical liquid dropping means) are integrally formed.

(2) Background of the Technology In manufacturing semiconductor devices, for example, a photoresist agent is applied onto a wafer (1) using a spin cord (rotary coating) method. FIG. 1 shows a schematic cross-sectional view of an apparatus for this purpose. In the figure, 1 is a spin cup in which processing is performed, 2 is a stage on which a wafer 3 is placed, and 4 is a spin cup on which a wafer 3 is placed. An N gas purge nozzle that injects nitrogen gas (N2 gas) to scatter dust, etc., 5 is a dispenser (chemical solution dropping means), and 6 is an exhaust pipe that discharges the air mixed with N2 gas in the spin cup in the direction of the arrow. are shown respectively. Nitrogen gas and chemical solutions are appropriately supplied from a supply source (not shown), and the spin cup 1 is placed in a clean room where clean air is constantly flowing.

In the wafer processing, (1) the surface of the wafer 3 is cleaned by an N gas barge using a nozzle 4, (2) a chemical solution is dropped by a dispenser 5, and (2) the stage 2 is rotated at high speed to perform a spin code.

To bring the wafer 3 into the spin cup I, a handling arm is used, which is shown schematically in cross section in FIG.

In the figures below, the same parts as those already shown in (2) are designated by the same reference numerals, and 7 indicates a handling arm.

A wafer 3 is placed on the handling arm 7 at another position (not shown) as shown by a solid line, and then the handling arm 7 is conveyed onto the spin cut 1 and placed as shown in the drawing. Note that the wafer is also placed and transferred to the handling arm within the clean room. Next, the stage 2 rises as shown by the arrow in the figure, lifts the wafer 3 to the position shown by the dotted line, and separates the wafer 3 from the handling arm 7. The handling arm then returns from its position above the spin cut 1 to its original position, where the next wafer is placed. After the handling arm 7 has left the position shown, the stage 2 is lowered to the position shown in solid line in FIG.
Subsequently, the second step described above with reference to FIG. 1 is carried out.

(3) Prior Art and Problems As mentioned above, the wafer to be processed next is simply placed in the handling arm 7 and waiting to be transferred to the spin cup 1. Wafer (3) From the viewpoint of improving processing efficiency, leaving the handling arm idle without any processing is a waste of time and an impediment to improving the yield of semiconductor device manufacturing.

(4) Purpose of the Invention An object of the present invention is to provide a handling arm that can effectively utilize the waiting time from when a new wafer is placed on the handling arm until it is transported to a spin cup for processing in wafer processing. There is something to do.

(5) Structure and object of the invention According to the present invention, during the above waiting time,
This is achieved by providing a handling arm that can perform N2 gas purge and chemical droplet, which are two steps in preparation for wafer processing.

(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 3 shows a cross section of a handling arm 17 according to an embodiment of the present invention, and in the same figure, 14 is a nozzle for purging N gas (4), 15 is a dispenser for dropping a chemical liquid, and 18 is a chemical liquid container. .

During the time until the wafer 3 is placed on the illustrated handling arm 17 and moved toward the spin cup position, that is, during the waiting time, )h gas purge and then chemical liquid dropping are performed. In the spin cup, it is only necessary to place the wafer on the stage and perform the spin code. Therefore, when using the handling arm of the present invention, the spin cup only needs to have stage 2;
There is no need to prepare a nozzle for N2 gas purge and a dispenser for dropping chemical liquid.

The arrangement of the dispenser 15 provided on the handling arm 17 is designed so that the wafer 3 does not hit the dispenser 15 when the wafer 3 is lifted and separated from the handling arm 17 as described above. In addition, the time for dropping the chemical solution is determined based on the movement time of the handling (5) arm and the wafer so that it can be spread over the wafer without any problems when the wafer is transferred onto the stage after the drop and the spin code starts. Calculate and set the time to place it on the stage.

Note that although the above explanation takes as an example the case where a photoresist film is applied to a wafer, the scope of application of the present invention is not limited to that case, but also extends to handling arms for other articles such as masks. It is a foot.

(7) Effects of the Invention As explained in detail above, by using the handling arm of the present invention, the waiting time for wafers in conventional wafer processing can be effectively utilized, which is highly effective in improving the yield of semiconductor device manufacturing. It is.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a spin cup, FIG. 2 is a sectional view of a conventional handling arm, and FIG. 3 is a sectional view of a handling arm according to the present invention. 1--Spin cup, 2-stage, 3--wafer, 4.14--nozzle, 5.15-dispenser, 6-exhaust port, (6) 7.17-handling arm, 1B--chemical container patent Applicant Fujitsu Ltd. Figure 1 @ Figure 2 Figure 3 101-

Claims (1)

[Claims] The surface of the article is cleaned by spraying a purge gas, and then a chemical solution is dropped onto the surface, and the article is rotated to apply the chemical solution onto the surface of the article. 1. A semiconductor device processing apparatus, comprising means for injecting a purge gas and dropping a chemical liquid onto an article placed on the handling arm at a stage before the processing.