JPS59218793A - Method of mounting dip type ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] <a>Technical field of invention The present invention relates to a method for mounting a DIP type IC.

(b) Technical background DIP type IC (dual 1nline packa)
ge I G) allows lead terminals to be easily formed from the hoop material through the lead frame, and can be efficiently inserted into through-holes on printed boards, making it ideal for high-density mounting on printed boards. Are suitable.

As shown in the perspective view of FIG. 1, in the DIP type IC 3, a large number of lead terminals 4 are arranged in parallel to the bottom surface on each of the opposing end surfaces of the cage, and the tips are bent downward at a right angle. Through holes 2 are arranged in parallel on the printed board 1 at positions where the DIP type ICs 3 are mounted, corresponding to the respective lead terminals 4. Lead terminal 4 to this through ball 2
Insert and connect the desired pattern of printed board I and DIP type I.
The DIP type IC 3 is mounted on the printed circuit board 1 by connecting the lead of C.

(C) Conventional technology and problems FIG. 2 is a sectional view showing a conventional mounting method.

Conventionally, as shown in the figure, the tip end 4a of the lead terminal 4 is pressed into a thin shape in the form of a lead frame so that it can be loosely inserted into the through hole 2. In this way, the IP type IC 3 is selectively inserted into the through hole 2 of the printed board 1 using, for example, an automatic IC insertion machine, and then the printed board 1 is dipped with solder to connect the through hole and the tip of the lead terminal 4. are bonded with solder 5.

Such a conventional mounting method not only requires a soldering process, but also has the trouble of remelting the solder and removing the DIP type IC3 each time the DIP type TC3 is replaced.

In order to avoid the trouble of remelting the solder, another method has been used in which an IC socket is mounted on a printed board in advance. However, in order to mount an IC socket on a printed board, the terminals of the IC socket must be inserted into through-holes on the printed board and soldered.

As mentioned above, both of the conventional mounting methods require a soldering process, which is troublesome.

(d) Object of the Invention In view of the above-mentioned conventional problems, an object of the present invention is to provide a method for mounting a DIP type IC that does not require soldering.

(e) Structure of the Invention In order to achieve this object, the present invention provides a structure in which each lead of a DIP type IC to be temporarily mounted by printing has a radially resilient part in a portion to be inserted into a through hole. Each of the lead terminals is press-fitted into the corresponding through-hole of the printed circuit board, and the elasticity of the details makes the through-ball fit into the electrical connection with low contact resistance. It is designed to prevent it from falling out easily.

(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments.

FIG. 3 is a perspective view of (a) the beam terminal portion of one embodiment of the present invention, (b) is a cross-sectional view perpendicular to the axis when the through ball is inserted, and FIG. (A) of the embodiment is a cross-sectional view perpendicular to the axis of the lead terminal, and (B) is a cross-sectional view perpendicular to the axis when the lead terminal is inserted into a through hole.

In FIG. 3, the tongue-shaped lead terminal 6 of the DIP type IC 3 is inserted into the through-hole 2 of the printed board, and the part is press-worked to form a substantially semicircular recess 7 parallel to the axis when viewed perpendicular to the axis. This is provided. Therefore, both sides of the four parts 7 form a narrow strip parallel to the axis when viewed from the front, and when viewed in cross-section orthogonal to the axis, form a thin detail 8 having an outer peripheral surface that is desirably larger than the inner diameter of the through hole 2. . Note that the tip end of the lead terminal 6 is narrow enough to be loosely inserted into the through hole 2.

When the DTP IC 3 is pressed with the lead terminal 6 constructed in this manner aligned with the through hole 2 of the printed circuit board, the fin portion 8 is compressed in the radial direction and inserted into the through hole 2. And the detail 8 is elastic and through ball 2
Crimp the inner circumferential surface of the

Therefore, the contact resistance between the lead terminal 6 and the through hole 2 is small, and the through ball 2 does not easily come off. Therefore, there is no need to solder the tip of the lead terminal 6 and the through hole 2.

When replacing the Naori IP type IC3, use an appropriate extraction tool to remove the DIP as in the case of conventional IC sockets.
The IC3 can be easily removed by simply pulling it upward.

In addition, the structure of the fin part is shown in Figure 4 (as per the phrase).The tongue-shaped lead terminal is inserted into the through ball 2 of the printed board and the part is pressed, parallel to the axis, and one side when viewed perpendicular to the axis. A detail 11 of the shape may be formed when viewed orthogonally to the axis by providing two recesses 9 at both ends and a large recess 1o on the other side.Such a detail 11 is inserted into the through hole 2. When it is pressed, the details 11 at both ends are bent and pressed against the inner circumferential surface of the through ball 2, as shown in (b).

(g) Detailed Description of the Invention As described, the present invention is a method for mounting a DIP type IC on a printed board by crimping a resilient detail into a through hole, the method comprising inserting a DIP type IC onto a printed board. This has excellent practical effects, such as the fact that there is no need to solder the lead terminals and through holes.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a DIP type IC, FIG. 2 is a sectional view showing a conventional mounting method, and FIG. 3 is a (
Figure 4 is a perspective view of the lead terminal, Figure 4 is a cross-sectional view perpendicular to the axis of the lead terminal inserted into the through ball, and Figure 4 is a cross-sectional view perpendicular to the axis of the lead terminal. and
(B) is a cross-sectional view perpendicular to the axis of the device inserted into the through hole. In the figure, 1 is a printed board, 2 is a through hole, 3 is a DIP type IC 14, 6 is a lead terminal, 7, 9.10 is a recess, 8.
11 shows details. Article f Intoxication Mine 2 Intoxication ￥ 3 Diagram Otsu (a) With Kazuyuki: 4. Jiaojiang

Claims (1)

[Claims] Each lead terminal of a DIP type IC mounted on a printed board has a fin portion that is elastic in the radial direction in the portion that is inserted into the through hole, and the lead terminal is connected to the printed board. A method for mounting a DIP type rc, characterized by press-fitting it into the corresponding through-hole and fitting it into the through-hole by the elasticity of the M fin part.