JPS589360A - Manufacture of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To enable the automatizing of a chip component mounting process by a method wherein conductors and resistors are printed and fired on a thick film wiring substrate, chip components are positioned in prescribed regions, and then a laser beam is applied for the formation of grooves whereat dicing is performed for the substrate to be separated into chips. CONSTITUTION:Conductors and resistors are printed and fired on a slitless ceramic substrate to be separated into a multiplicity of units for the formation of a slitless thick film wiring substrate 6 to be sectioned into a multiplicity of units. On the substrate 6, by means of a mounting machine, a multiplicity of chip type transistors 3a-3f and chip type capacitors 4a-4f are fixed. Next, by means of a laser scribing machine, separating grooves 9 are provided. Separation may be effected by further applying laser or applying bending force leading to separation. The laser beam diameter should be no more than 10mum so that chips are not affected by the beam. This setup reduces the number of manufacturing processes and realizes low price hybrid integrated circuits.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a hybrid integrated circuit characterized by the method of dividing a multi-chip thick film wiring board after mounting AH chip components thereon.

Conventionally, in the case of small-volume thick film hybrid integrated circuits, this was done to reduce the number of printing steps for one hybrid integrated circuit.

You can do it in the following way. That is, as shown in FIG.
Mic board. Next, conductors, resistors, etc. are printed on the front side of the multi-chip ceramic substrate, followed by firing and trimming.

Thereafter, the multi-chip thick film wiring board is divided to obtain a large number of thick film wiring boards.

5 in FIG. 2 shows one thick film wiring board after division. After dividing and obtaining a large number of thick film wiring boards, 01 pieces 1
A hybrid integrated circuit is completed by attaching a chip lid capacitor 3To or a Tegg reduction capacitor 4 to each chip.Recently, companies have begun to automate the attachment of chip-type components to the board in order to reduce the number of man-hours. The trend of KT.

As a result, mounting of chip-type components onto a board has come to be carried out by an automatic chip component mounting machine (hereinafter referred to as a mounting machine). When attaching chip components to a board using a mounting machine, it is more efficient to use a large board and mount a large number of chip components on it.
Great effect in reducing man-hours. Therefore, when applying to a multi-chip thick film wiring board, it is natural to mount chip components before dividing the board to improve efficiency. However, #i
When using a multi-piece C** board with 9 slits 2 and trying to divide the board into 1 pieces with a board dividing device after mounting chip components, the current 1 & board dividing device has a large mechanical part near the slits. Since the method is to divide by applying an impact force, the chip parts do not get in the way, and the vibration during division causes failures in the chip parts, making it difficult to divide the chip parts easily and accurately.

For this reason, as in the prior art described above, thick film placement is first performed and the nine-multiple wiring board is divided. Even if it is used, there are six drawbacks such as efficiency and the inability to automate the installation of tip parts.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit which eliminates the above-mentioned nine drawbacks of the prior art and enables efficient automation of chip component mounting.

The present invention will be described in detail below with reference to the drawings.

First, 3rd I! As shown in Figure 1, conductors and resistors are printed on a multi-cavity top 2-mic board without slits.
By firing, a thick film wiring board 26 with many slits (without slits) is made.Next, as shown in FIG. Depending on the installed machine,
Chip type To2/Jista.

3&~31, and step ll:! Mount and fix the capacitors 4&~4f. After that, a laser scriber device is used to
, a laser beam is irradiated onto the substrate, and a cutting groove 9 is formed by irradiating the laser beam.

FIG. 5 shows an enlarged cross-sectional view of a part of the thick film wiring board 6 without slits during this step.

In the figure, 4' is a chip type capacitor, 7 is an electrode butter y, 8 is solder, 9 is a nine cutting groove made by focused laser beam irradiation, 1G is a ceramic substrate, and 0 cutting groove 9 is a laser beam irradiation. Easy to use, can be easily made to any depth. It goes without saying that the deeper the cutting groove 9 is, the easier it will be to divide the warp building board using subsequent cutting tools. In this embodiment, the cutting grooves 9 are deepened so as to be laterally divided when a slight strain or slanted portion is applied to the ceramic substrate 10. It goes without saying that the ceramic substrate may be irradiated with laser light until the laser light penetrates the ceramic substrate 10. The tatami mat may be irradiated with IV-the light until it reaches a depth K that allows it to be easily divided in the subsequent dividing step. After the slit-less multi-piece thick film wiring board 6 is divided, a hybrid integrated circuit is completed through another process. According to this embodiment, a laser scriber device is used, so it is extremely easy. It is possible to create grooves in the ceramic substrate. Also, the diameter of the laser emitted from the laser scriber device is approximately 10/J! E1m! Because it can be made extremely thin,
Even if a multi-chip thick film wiring board with chip components mounted thereon is irradiated with light, the chip components will not get in the way. Furthermore, since almost no mechanical vibration is applied to the board, there is no risk of failure of the mounted chip components.

As described above, according to the present invention, a multi-chip thick film wiring board can be divided even after chip components are mounted, so that a chip component mounting machine can be applied to a multi-chip thick film wiring board. This makes it possible to automate the chip component mounting process with high efficiency. Further, according to the present invention, the number of man-hours for manufacturing a hybrid integrated circuit can be reduced, and manufacturing costs can be reduced, which is a significant effect.

[Brief explanation of the drawing]

Figure 1 is a plan view of a conventional multi-chip thick film wiring board;
The figure is a plan view of one thick film wiring board on which chip components are mounted, FIG. 3 is a plan view of a multi-chip thick film wiring board conveniently used in an embodiment of the present invention, and FIG. FIG. 5 is a plan view of a multi-IIL thick film wiring board for explaining one embodiment of the present invention, and FIG. 5 is an enlarged cross-sectional view of a part of FIG. 4. 31~3f...Chip type transistor, 4a~4
f, 4'... Chiff type capacitor, 6... Multi-chip thick film wiring board without slit, 9... Cutting groove, 10... Ceramic board. Fang 1 Kasuga 3 Figure

Claims (1)

[Claims] (1) - to? (A multi-chip thick film wiring board that can be divided into at least two parts is formed by printing conductors and resistors on the board and firing them, and then the chip parts on the wiring board are mounted on the II board.) After mounting the chip components at the desired location and fixing the chip components, a laser beam is applied to the thick film wiring board to which a large number of the chip components are attached.
A method for manufacturing a hybrid integrated circuit, comprising: forming cutting grooves in the wiring board by irradiating the wiring board, and dividing the wiring board into individual parts.