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JPS585119U - dummy module - Google Patents

dummy module

Info

Publication number
JPS585119U
JPS585119U JP9612081U JP9612081U JPS585119U JP S585119 U JPS585119 U JP S585119U JP 9612081 U JP9612081 U JP 9612081U JP 9612081 U JP9612081 U JP 9612081U JP S585119 U JPS585119 U JP S585119U
Authority
JP
Japan
Prior art keywords
modules
slots
dummy module
module
standard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9612081U
Other languages
Japanese (ja)
Inventor
雅良 島田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9612081U priority Critical patent/JPS585119U/en
Publication of JPS585119U publication Critical patent/JPS585119U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　　ｂは標準筐体におけるモジュールの実装
状態を示す図で、第１図ａは上面図、第１図すは前面図
、第２図ａ、　ｂは本考案−実施例のダミーモジュール
を示す外観図で、第２図ａは側面図、第２図すは上面図
である。 １・・・・・・標準筐体、２・・・・・・スロット、３
・・・・・・冷却ファン、４・・・・・・モジュール、
５・・・・・・ダミーモジュ−／Ｌ／、５ａ…・・・前
面パネル、５ｂ・拳・・・・モジュールに相当する板体
。Figures 1a and 1b are diagrams showing the mounting state of the module in a standard case. FIG. 2A is a side view and FIG. 2A is a top view of the module. 1...Standard housing, 2...Slot, 3
......Cooling fan, 4...Module,
5...Dummy module/L/, 5a...Front panel, 5b/fist...Plate body corresponding to the module.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 規格により定められた均一寸法の複数個のスロットを具
えこのスロットに挿入実装された各種機能のモジュール
を下部の冷却ファンからの冷却エアーにより冷却する標
準筐体に用いられ、前記モジュールと同一寸法形状の前
面パネルおよびモジュール部に相当する板体からなり、
モジュールの無い空スロットのすべてに挿入装着される
ことを特徴とするダミーモジュール。　　　−Used in a standard case that has multiple slots with uniform dimensions determined by the standard, and which cools modules with various functions inserted into these slots using cooling air from a cooling fan at the bottom, and has the same dimensions and shape as the modules. It consists of a plate body corresponding to the front panel and module part of
A dummy module that is inserted into all empty slots without modules. −
JP9612081U 1981-06-30 1981-06-30 dummy module Pending JPS585119U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9612081U JPS585119U (en) 1981-06-30 1981-06-30 dummy module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9612081U JPS585119U (en) 1981-06-30 1981-06-30 dummy module

Publications (1)

Publication Number Publication Date
JPS585119U true JPS585119U (en) 1983-01-13

Family

ID=29891001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9612081U Pending JPS585119U (en) 1981-06-30 1981-06-30 dummy module

Country Status (1)

Country Link
JP (1) JPS585119U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010049540A (en) * 2008-08-22 2010-03-04 Nec Corp Data center facility, server room and energy saving technique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131773A (en) * 1978-04-04 1979-10-13 Nippon Electric Co Method of installing front plate for electronic package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131773A (en) * 1978-04-04 1979-10-13 Nippon Electric Co Method of installing front plate for electronic package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010049540A (en) * 2008-08-22 2010-03-04 Nec Corp Data center facility, server room and energy saving technique

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