JPS58203009A - Resin sealing mold of thermoset resin - Google Patents

Abstract

PURPOSE:To prevent sticking of a flash to a frame which obstructs a soldering process, etc., by providing each pair of the push plates which hold the frame and of the leaf springs which press the push plates at the upper and lower sides in a resin sealing mold. CONSTITUTION:A frame 1 is set in the groove 8 of a mold 2 so as to protrude its part into a molding room 7, one pair of push plates 11 are retreated by closing the mold 2 and one pair of corresponding leaf springs 12 are bent via one pair of retreating push plates 11. The frame is held by pressing one pair of corresponding push plates 11 with the elastic force of the leaf springs. Because one pair of push plates 11 correspond to several molding rooms 7 corresponding to an individual molding room 7, there is no clearance between a pair of push plates 11 and the frame 1. Then, a thermoset resin is put in from an opening part, poured into the molding room 7 via a passage 6 and the resin is pressed, heated and hardened.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin sealing mold for thermosetting resin, which is improved to prevent excessive resin from adhering to a frame, which becomes a clump and becomes an obstacle in the soldering process. There are things.

Conventionally, as shown in FIG. 1, an opening (8) that also functions as a guiding path for a pressure rod (6) for press-fitting a thermosetting resin (4), and a molding chamber ( Resin sealing of thermosetting resin having a groove (8) for setting the transfer path (6) and 7 frame (1) so that a part thereof protrudes into the molding chamber (7). A mold (2) is known.

To manufacture a resin-sealed frame using the mold (2), for example, a metal frame (1) on which a conductor element (not shown) is assembled is made such that a part of it protrudes into the molding chamber (γ). After setting the thermosetting resin (4) in the groove (8), put the thermosetting resin (4) through the opening (8), and then press the resin (4) with the pressure rod (5).
4) is injected into the molding chamber (7) via the transfer path (6), and the injected resin is heated and cured under pressure. The frame is sealed with hardening resin and can be replaced.

However, in the conventional mold, the frame (1) and the metal parts that occur due to variations in the frame (1), plate thickness (7), and variations in the processing of the mold (2) that cannot be avoided with the current state of technology. Since the resin enters the gap in mold (2) L, it is possible to prevent burrs from adhering to the vicinity of the resin sealing part (9) of the frame (1) obtained as shown in Fig. 2. I couldn't do that.

In addition to problems such as a reduction in the yield of the resin when it is expunged as bread, and a decrease in work efficiency due to the time required to remove the paris from the finished product, there is also the problem that the paris is firmly attached to the surface of the frame. Since it adheres, it is extremely difficult to remove it, which is a serious drawback in that it makes the subsequent soldering process difficult.

The present invention has been made with the aim of eliminating the above-mentioned drawbacks, and in FIG. 1, the molding chamber (7) is
Although we have shown a mold with only one molding chamber, in view of the fact that some actual molds have thousands or even hundreds of molding chambers, and even thousands of molding chambers, it is also possible to use molds with many molding chambers. It also aims to be able to be applied effectively.

The present invention will be explained with reference to FIGS. 6 and 4 showing one embodiment thereof. In Figures 3 and 4, a pair of (11
) are presser plates installed above and below the molding chamber closest to the molding chamber in order to reduce the area of the molding chamber. This pair of presser plates (1υ is 7
The one shown in Figure 3 is a pair of holding plates (10 are provided facing each other) to prevent the frame from bending or deforming due to the holding force. .In addition, a pair of (b) are each holding plates (￥
This is a leaf spring for pressing the presser plate (11
) is installed so that its pressing force is applied in the direction of pressing down on the frame.

It is desirable to provide a pair of presser plates (1υ) for each molding chamber (7), but a pair of presser plates common to several molding chambers (7) may be used.

In the production of a frame partially sealed with a thermosetting resin using the mold of the present invention, first the frame (1) is shown in FIG.
are set in the groove (8) of the mold (2) so that a part of it protrudes into the molding chamber (7), then the mold is closed as shown in FIG. retreat,
A pair of leaf springs (B) corresponding to each other are bent via a pair of retreating presser plates (U), and their elastic force presses a corresponding pair of presser plates (11), thereby tightening the frame. hold down. Since the pair of presser plates (B) correspond to individual molding chambers (7) or several molding chambers (A), variations in the processing of the mold (2) and the shape of the frame (1) can be avoided. Even if there are variations in plate thickness, use a pair of presser feet 1. Plate (II)
will press the front and back of frame (1) with precision,
There is no gap between the pair of presser plates (U) and the frame (1). Next, as in the case of conventional molds, the thermosetting resin is poured into the opening (not shown), pressed by a machining tool (not shown), and passed through the transfer path (6) into the molding chamber. This can be carried out by injecting the resin (4) into the resin (4) and heating it under pressure to harden the resin (4).

In this way, a semiconductor device with less Paris can be manufactured.

The resulting resin-sealed frame is shown in FIG. The length of bar lj (10) is unified, its length &)
is the molding chamber (7) of the pair of presser plates (11) in Fig. 3.
It is determined by the distance from the edge of the molding chamber (7) to the end of the molding chamber (7) on the side of the pair of presser plates (11). If the length a) is practically about 0.2 to jmn, there will be no substantial problem in the subsequent soldering process.

The above description has mainly been made assuming the frame of a six-lead transistor, but the present invention is of course applicable to diodes, integrated circuits, etc., and can also be applied to molds using thermosetting resin. It can also be applied to things other than semiconductors.

[Brief explanation of drawings]

FIG. 1 is a sectional view of the main parts of a conventional mold for resin sealing, FIG. 2 is a plan view of a resin-sealed frame obtained with the conventional mold, and FIG. 6 and FIG. 4 are according to the present invention. FIG. 5 is a cross-sectional view of the main parts of the resin-sealing mold of the present invention, and FIG. 5 is a plan view of a resin-sealed frame obtained by the mold of the present invention. (Main symbols in the drawing) (1) = Frame (2): Resin sealing mold (4): Thermosetting resin (7): Molding chamber (11): Holding plate 1 leaf spring agent Shin Kuzuno - (1 other person) p Age 1 Figure 23 Figure 2 10

Claims (1)

[Claims] (1) In a resin sealing mold for molding thermosetting resin, a presser plate for pressing the frame and a presser plate for pressing the presser plate are placed near the molding chamber where a part of the frame is resin-sealed. A resin sealing mold made of thermosetting resin, which is patented in that it has a pair of upper and lower leaf springs.