JPS578220A - Epoxy resin composition and resin-sealed semiconductor device - Google Patents
Epoxy resin composition and resin-sealed semiconductor deviceInfo
- Publication number
- JPS578220A JPS578220A JP8134480A JP8134480A JPS578220A JP S578220 A JPS578220 A JP S578220A JP 8134480 A JP8134480 A JP 8134480A JP 8134480 A JP8134480 A JP 8134480A JP S578220 A JPS578220 A JP S578220A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- epoxy
- curing agent
- phenolic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- -1 e.g Polymers 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 206010037660 Pyrexia Diseases 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- BYYQOWAAZOHHFN-UHFFFAOYSA-N dioctylphosphane Chemical compound CCCCCCCCPCCCCCCCC BYYQOWAAZOHHFN-UHFFFAOYSA-N 0.000 abstract 1
- 239000011256 inorganic filler Substances 0.000 abstract 1
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: Titled resin composition for sealing semiconductor devices which has excellent moisture resistance and hightemperature electrical properties, prepared by mixing a specified phenolic-hydroxyl group-containing curing agent and a specified phosphine type cure accelerator.
CONSTITUTION: The following components are mixed together: (A) an epoxy resin, e.g, novolak epoxy resin, chloride ion content ≤ about 10ppm, hydrolyzable chlorine content ≤ about 0.1wt%, epoxy eq. weight about 170W300, (B) an epoxy resin curing agent containing at least two phenolic-hydroxyl groups, e.g., novolak phenol resin, softening point about 60W100°C, (C) an organic prim. or sec. phosphine compound, as a cure accelerator, represented by the formula, wherein R1, R2 and R3 are each H or an organic group, e.g., phenylphosphine, dioctylphosphine, and, if necessary, (D) an inorganic filler, e.g., quartz glass powder.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8134480A JPS578220A (en) | 1980-06-18 | 1980-06-18 | Epoxy resin composition and resin-sealed semiconductor device |
| DE8181104126T DE3163054D1 (en) | 1980-06-05 | 1981-05-29 | Resin encapsulation type semiconductor device |
| EP81104126A EP0041662B1 (en) | 1980-06-05 | 1981-05-29 | Resin encapsulation type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8134480A JPS578220A (en) | 1980-06-18 | 1980-06-18 | Epoxy resin composition and resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS578220A true JPS578220A (en) | 1982-01-16 |
Family
ID=13743744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8134480A Pending JPS578220A (en) | 1980-06-05 | 1980-06-18 | Epoxy resin composition and resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS578220A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS59227146A (en) * | 1983-06-07 | 1984-12-20 | Sharp Corp | Resin-molded semiconductor device |
| JPS63179920A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Epoxy resin composition and resin-sealed type semiconductor device using said composition |
-
1980
- 1980-06-18 JP JP8134480A patent/JPS578220A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58194916A (en) * | 1982-05-10 | 1983-11-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JPS59227146A (en) * | 1983-06-07 | 1984-12-20 | Sharp Corp | Resin-molded semiconductor device |
| JPS63179920A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Epoxy resin composition and resin-sealed type semiconductor device using said composition |
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