JPH1191275A - Method of manufacturing non-contact type IC card and non-contact type IC card - Google Patents

Abstract

[Problem] A non-contact type IC card capable of suppressing warpage of a card and unevenness of the surface of the card, improving the appearance of the card, efficiently producing the card, and reducing the production cost. And a method for producing the same. An IC chip is provided on a surface of a substrate film.
And a step of fixing the coil 2 and an IC
A step of forming a chip hole 42a;
Core film 42 so that IC chip 1 is stored in 2a.
The substrate film 41 is laminated on one surface of the core film 42 via an adhesive, the protective film 43 is laminated on the other surface of the core film 42 via an adhesive, and the substrate film 41, the core film 42 and the protective film 43 are laminated. Forming a body, and laminating the laminate under pressure and low temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device (IC)
More particularly, the present invention relates to a method for manufacturing a non-contact type IC card and a non-contact type IC card.

[0002]

2. Description of the Related Art In recent years, IC cards equipped with semiconductor elements (IC chips) for recording and processing data have become widespread from the viewpoint of efficiency of information processing and security. Such IC cards include a contact type that connects an external terminal of the card and a terminal of an external processing device to transmit and receive data, an antenna coil that transmits and receives data by electromagnetic waves, and a semiconductor for data processing. A non-contact type in which an element is incorporated and reading and writing with an external processing device can be realized by a so-called wireless method, driving power of an IC circuit is supplied by electromagnetic induction, and a battery is not incorporated has been developed.

[0003] Conventional methods for manufacturing a non-contact type IC card having a built-in coil and IC chip include a coil for data transmission / reception and driving power supply, and a built-in electronic component such as an IC chip, which is made of a thermoplastic resin or a thermosetting resin. After molding a non-contact type IC module by sealing with a UV curable resin or an electron beam curable resin or the like, a PET (polyethylene terephthalate) in which a concave portion for a module or a hole for a module is punched or counterbored (NC) is provided. Such a method is widely used in which the film is sandwiched by a film such as the above, fused by a hot press or the like, or laminated by bonding with an adhesive or the like, and punched into a card size.

There is also known a method in which a coil for data transmission / reception and supply of driving power and a built-in electronic component such as an IC chip are housed in a thermoplastic resin and molded by a hot press.

[0005] At least an uneven surface of a substrate film on which a built-in electronic component such as a coil for data transmission / reception and driving power supply or an IC chip is fixed, and the oversheet are irradiated with ultraviolet light via an ultraviolet curable adhesive. A method of lamination molding is known.

[0006]

However, according to the above-mentioned conventional method of manufacturing a non-contact type IC card, a method of forming a non-contact type IC module, sandwiching the module with a film, and laminating the same is not suitable. There is a problem that the molding of the module is complicated, the production efficiency is low, and the module cannot be manufactured at low cost.

[0007] Further, in a method in which a built-in electronic component is housed in a thermoplastic resin and molded by hot press, there are problems that the card is warped and irregularities on the card surface are easily noticeable. Further, in order to improve the warpage and the unevenness of the surface, heating and cooling in a pressurized state are required, and there is a problem that a long time is required for a hot pressing step, resulting in low production efficiency.

In the method of bonding and molding a substrate film and an oversheet to which an internal electronic component is fixed with an ultraviolet-curing adhesive, high-speed lamination can be performed, so that the production efficiency is high. The resulting irregularities cannot be completely buffered, leaving irregularities on the finished surface of the card.

The present invention has been made in view of the above circumstances. Accordingly, the present invention suppresses the warpage of the card and the unevenness of the card surface, improves the aesthetic appearance of the card, and enables efficient production. Non-contact type I that can reduce cost
An object of the present invention is to provide a method for manufacturing a C card and a non-contact type IC card.

[0010]

In order to achieve the above object, a method for manufacturing a non-contact type IC card according to the present invention comprises the steps of: fixing an IC chip and a coil on a surface of a substrate film; Forming a chip hole;
The substrate film is laminated with an adhesive on one surface of the core film so as to accommodate the IC chip in the IC chip hole, and a protective film is laminated on the other surface of the core film with an adhesive. Laminating to form a laminate of the substrate film, the core film, and the protective film; and laminating the laminate under pressure and at a low temperature.

According to the method of manufacturing a non-contact type IC card of the present invention, first, an IC chip and a coil are fixed on a surface of a substrate film, and an IC chip hole is formed in a core film. Next, a substrate film is laminated on one surface of the core film via an adhesive so as to accommodate the IC chip in the IC chip hole, and a protective film is laminated on the other surface of the core film via the adhesive. , Substrate film,
After forming the laminate of the core film and the protective film, the laminate is laminated under pressure and at a low temperature. By laminating under pressure and low temperature, it is possible to suppress the warpage of the card and the occurrence of irregularities on the surface of the card and improve the aesthetic appearance of the card, and a complicated process of forming a non-contact type IC module, Since a time-consuming heat press step is not required, efficient production is possible, and a non-contact type IC card can be manufactured with a reduced manufacturing cost.

In the method for manufacturing a non-contact type IC card according to the present invention, preferably, in the step of laminating the laminate under pressure and at a low temperature, the laminate is pressed with a pressing tool having a temperature of at least 50 ° C. or less. , And pressurize. By laminating the laminate by pressing the laminate with a pressing tool of 50 ° C. or less, the warpage of the card and the occurrence of unevenness on the card surface can be suppressed and the laminate can be easily performed.

In the method for manufacturing a non-contact type IC card according to the present invention, preferably, the step of laminating the laminate under pressure and at a low temperature comprises: This is a step of solidifying the hot melt adhesive by cooling. Since the hot-melt adhesive is solidified by cooling, it does not need to be heated as in a hot pressing step, and can be laminated at a low temperature.

In the above method of manufacturing a non-contact type IC card according to the present invention, preferably, the step of laminating the laminate under pressure and at a low temperature comprises: This is a step of solidifying the ultraviolet-curable adhesive by irradiating it with ultraviolet rays. Since the ultraviolet-curable adhesive is solidified by irradiation with ultraviolet light, it does not need to be heated as in a hot pressing step, and can be laminated at a low temperature.

In the method of manufacturing a non-contact type IC card according to the present invention, preferably, the step of forming the laminate includes at least one of one surface of the core film and an adhesive surface of the substrate film. Applying the adhesive to the surface of the core film, applying the adhesive to at least one of the other surface of the core film and the adhesive surface of the protective film, the substrate film, the core film And laminating the protective film. This makes it possible to easily laminate the substrate film on one surface of the core film via the adhesive and to laminate the protective film on the other surface of the core film via the adhesive.

In the above method of manufacturing a non-contact type IC card according to the present invention, preferably, the substrate film, the core film and the protective film are each a roll sheet film, Is a step of forming a sheet-like laminate of the substrate film, the core film and the protective film, the step of laminating the laminate under pressure and at a low temperature, the step of laminating the sheet-like laminate The step of laminating under pressure and at low temperature, and after the step of laminating the sheet-like laminate under pressure and at low temperature, further comprising a step of sheet-cutting the sheet-like laminate, wherein the substrate film From the step of fixing the IC chip and the coil on the surface of the above, to the step of sheet-cutting the sheet-like laminate are continuously performed. This enables more efficient production.

Furthermore, in order to achieve the above object, a non-contact type IC card according to the present invention comprises a substrate film having an IC chip and a coil fixed on one surface of a core film having an IC chip hole formed thereon. Is laminated via an adhesive so that the IC chip is housed in the IC chip hole, and a protective film is further laminated on the other surface of the core film via an adhesive to form a laminate. Non-contact IC formed by laminating under pressure and low temperature
Card.

According to the non-contact type IC card of the present invention, since it is formed by laminating under pressure and low temperature,
It is possible to make a card with improved card appearance by suppressing the occurrence of card warpage and card surface irregularities, and requires a complicated process of molding a non-contact type IC module and a time-consuming hot press process. Therefore, it is a non-contact type IC card that can be efficiently produced.

The non-contact type IC card according to the present invention is preferably arranged such that when the laminate is laminated under pressure and at a low temperature, the laminate is sandwiched by a press having a temperature of at least 50 ° C. It is a non-contact type IC card formed by pressing and laminating. A non-contact type IC card which can be easily laminated by suppressing the warpage of the card and the unevenness of the card surface since the laminate is formed by pressing and laminating the laminate with a press tool of 50 ° C. or less. .

In the above-mentioned non-contact type IC card of the present invention, preferably, the adhesive is a hot melt type adhesive, and when the laminate is laminated under pressure and low temperature,
A non-contact type IC card formed by laminating and solidifying the hot melt adhesive by cooling. Since the hot-melt adhesive is solidified by cooling, it does not need to be heated as in a hot pressing step, and is a non-contact type IC card that can be manufactured by lamination at a low temperature.

In the above-mentioned non-contact type IC card of the present invention, preferably, the adhesive is an ultraviolet-curable adhesive, and when the laminate is laminated under pressure and at a low temperature, the ultraviolet-curable adhesive is used. It is a non-contact type IC card formed by solidifying and laminating an adhesive by ultraviolet irradiation. The ultraviolet-curable adhesive is a non-contact IC card which can be manufactured by laminating at a low temperature without the need of heating as in a hot pressing step since it is solidified by irradiation with ultraviolet rays.

The non-contact type IC card of the present invention is preferably arranged such that, when forming the laminate, at least one of the one surface of the core film and the adhesive surface of the substrate film. The adhesive is applied, the adhesive is applied to at least one of the other surface of the core film and the adhesive surface of the protective film, and the substrate film, the core film and the protective film are laminated. This is a non-contact type IC card formed by the above method. Thereby, a non-contact type IC which can be manufactured by easily laminating a substrate film on one surface of a core film via an adhesive and laminating a protective film on the other surface of the core film via an adhesive. Can be a card.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1A is a plan view of a non-contact type IC card according to the present embodiment. IC in card base material 4
A chip 1 and a coil 2 for data transmission / reception and driving power supply are buried and electrically connected by a bump 1a. The IC chip 1 and the bump 1a are sealed by a sealing resin 3.

FIG. 1B is a sectional view taken along the line AA ′ in FIG. 1A. The coil 2 is formed on the upper layer of the substrate film 41, and the IC chip 1 is
The IC chip is mounted by connecting the bumps 1a formed on the IC chip, and the periphery of the IC chip is sealed with a sealing resin 3. An adhesive layer 5 is formed on the entire surface of the substrate film 41 so as to cover the coil 2, and an IC chip hole for inserting an IC chip formed by punching or the like is provided in the upper layer. Core film 42 is an IC
The IC chips are stacked so as to be accommodated in the chip holes. Furthermore, an adhesive layer 5 and a protective film 4
3 are stacked. The card substrate 4 is formed from the substrate film 41, the core film 42, and the protective film 43. A gap is formed between the inner wall surface of the hole for the IC chip and the surface of the sealing resin 3.

FIG. 1C is similar to FIG.
FIG. 3A is a cross-sectional view taken along line AA ′ in FIG. 3A, showing a form in which a gap between an inner wall surface of an IC chip hole and the surface of a sealing resin 3 is also filled with an adhesive layer 5.

Next, a method for manufacturing the non-contact type IC card according to the present embodiment will be described with reference to FIG. As the substrate film 41, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), acrylonitrile-butadiene-
Styrene copolymer (ABS), polypropylene (PP)
Such a material can be used. The surface of the substrate film 41 may be subjected to any easy adhesion treatment such as a primer treatment or a corona treatment in order to enhance the adhesiveness with an adhesive in a later step. After that, the coil 2 is formed on the upper layer. The method of forming the coil 2 includes attaching a winding,
Methods such as etching, vapor deposition, and paste printing can be used. The coil material, resistance value, number of turns, etc.
It can be set according to specifications such as an IC chip, a reader / writer, or a communication distance.

Next, for example, the above-mentioned electrode at the coil end and I
The IC chip 1 is mounted so as to be electrically connected to the bump 1a formed on the C chip 1. As the IC chip, for example, a chip having a thickness of 10 to 500 μm can be used. In addition, the method of connecting the electrode at the coil end to the IC chip 1 includes wire bonding, anisotropic conductive film (A) in addition to bump bonding by solder plating or the like.
CF), a connection method using a conductive paste, or the like. In particular, A which also has a mold function of an IC chip
Connection by CF is suitable for thinning the card and is preferable. Further, an insulating layer such as solder resist printing may be provided so that the coil 2 and the IC chip 1 are not unnecessarily electrically connected at unintended positions.

Next, the IC chip 1 is sealed with a sealing resin 3. As the sealing resin 3, for example, a thermosetting epoxy resin or a UV-curable epoxy resin can be used.
As a sealing method, for example, a method such as transfer molding, printing, and potting can be used. In the case of printing, potting, or the like, a dam or a frame for preventing the sealing resin from flowing out may be provided on the substrate film in order to maintain the sealing resin shape. In addition, a chip mold function can be provided by using the ACF. In such a case, the sealing with the sealing resin may not be performed.

As the IC chip 1, COB (Ch
It can be formed into a mold on an ip On Board) mold. For example, after mounting an IC chip on a glass-epoxy board, the terminals are connected to the terminals with bonding wires, etc., and the IC chip and bonding wires are sealed with a sealing resin such as epoxy resin to form a module. It is.

As the core film 42, polyethylene terephthalate (PET), polyvinyl chloride (PV)
C), polycarbonate (PC), acrylonitrile-
Materials such as butadiene-styrene copolymer (ABS) and polypropylene (PP) can be used. In order to enhance the adhesiveness with the adhesive in the post-process, the core film 4
The surface of No. 2 can be subjected to any easy adhesion treatment such as primer treatment or corona treatment. The thickness of the core film 42 depends on the resin-sealed IC chip 1 or C
It is preferable that the thickness is substantially the same as the thickness of the protrusion of the OB module.

The core film 42 has a resin-sealed I
An IC chip hole 42a is formed at a position corresponding to the protrusion of the C chip 1 or COB type module. As a method for forming the IC chip hole 42a, a punching process, a counterbore (NC) process, or the like can be used.

As the protective film 43, polyethylene terephthalate (PET), polyvinyl chloride (PV)
C), polycarbonate (PC), acrylonitrile-
Materials such as butadiene-styrene copolymer (ABS) and polypropylene (PP) can be used. In order to enhance the adhesiveness with the adhesive in a later step, a protective film 4
The surface of No. 3 can be subjected to any easy adhesion treatment such as primer treatment or corona treatment.

The above substrate film 41 and core film 4
2. The material and thickness of each film of the protective film 43 can be arbitrarily selected. However, if the substrate film 41 and the protective film 43 as the outer layers have the same material and the same thickness, the warpage when a card is formed. Is preferred because it is less likely to occur. Each of the films may be in the form of a sheet or a roll sheet. However, the use of a roll sheet film is preferable because production efficiency can be improved and production can be performed. It is also preferable to provide a hole such as a perforation (perforation) at the end of each film in order to ensure positional accuracy, and this is particularly effective when a roll sheet film is used.

Next, reference will be made to FIG. The above substrate film 41, core film 42, protective film 43
Are laminated between the films via an adhesive 5. As the adhesive 5, an adhesive that solidifies at a low temperature is used in order to perform lamination at a low temperature in a later step. For example, a hot melt adhesive or an ultraviolet curable adhesive can be used. The films are adhered to each other with an adhesive 5 to fill the gaps between the films. In some cases, I
It has the function of protecting the C chip.

The hot-melt adhesives described above have the advantages of being capable of forming a layer by cooling and solidifying and being capable of high-speed lamination by imparting adhesiveness, and being excellent in environmental safety because they are solvent-free. For example, a resin adhesive (polyurethane,
Adhesion of vinyl acetate type, polyvinyl alcohol type, acrylic type, etc., rubber adhesive (chloroprene rubber type, nitrile rubber type, styrene butadiene rubber type, butyl rubber type, natural rubber type, etc.), cellulose type, glue, starch type etc. Agents can be used. In addition, a reactive hot-melt adhesive can also be used. For example, block copolymers such as SIS and SBS having a moisture-curing system using an alkoxysilyl group or an isocyanate group, or a polycondensation reactive group using an ultraviolet ray or an electron beam. And
A hot-melt type adhesive utilizing a crosslinking reaction of an acrylic acid-modified polyester by ultraviolet rays or electron beams can be used.

The components of the hot melt adhesive include, for example, the above-mentioned EVA, EEA (ethylene / ethyl acrylate copolymer), polyester, and SBS.
(Rubber-based styrene / butadiene / styrene copolymer), tackifiers such as terpene resin and esterified rosin, viscosity modifiers such as petroleum wax and chlorinated paraffin, phenols, amines, and sulfur , Phosphorus compounds and other antioxidants, calcium carbonate,
It contains fillers such as titanium, talc, and polyethylene wax.

Since the above-mentioned ultraviolet-curable adhesive imparts adhesiveness by solidification by irradiation with ultraviolet light, heating and cooling are not required, and high-speed lamination is possible. For example,
Any of radical polymerization, cationic polymerization, and anionic polymerization of polyester acrylate, urethane acrylate, epoxy acrylate and the like can be used. Adhesives to the substrate film surface, especially those having an adverse effect on electronic components due to the generation of acid, such as a cationic polymerization system, are not preferred, but in this case, a protective layer is formed so as not to have an adverse effect and used. can do.

The adhesive 5 is coated on each film surface by coating or the like, and each film is laminated. The coating surface may be performed on any surface of the adhesive surface,
Since the surface of the substrate film after mounting the IC chip is difficult to contact coat due to unevenness due to electronic components such as the IC chip, the substrate film / It is preferable to coat an adhesive between the core films on the side of the core film and between the core film and the protective film on the side of the protective film.

In the coating of the adhesive 5, the surface to be coated is preferably coated in a planar manner. As the applicator, any of a die coating method, a ribbon coating method, a gravure printing method, a rotary screen method, and the like can be used.

When using a hot melt type adhesive,
At room temperature, block, flake, or solid hot-melt adhesive such as pellets is hot-melted above the softening point,
Coat the film with an applicator. When an ultraviolet-curable adhesive is used, it can be coated as it is because it does not solidify even at room temperature.

Next, as shown in FIG. 2B, the substrate film 41 and the core film 4 coated with the above-mentioned adhesive are formed.
2. Lamination process of protective film 43 (temporary lamination process)
In, for example, sandwiched between two rubber rolls (in some cases, a heat roll, a slightly heated roll, and the like), the gap between the rolls and the rubber strength are appropriately adjusted, set, and laminated.
Lamination is performed by extruding air so that no air remains in the bonding surface. The gap between the inner wall surface of the hole for the IC chip and the surface of the sealing resin for sealing the IC chip may be buried by adjusting the coating amount of the adhesive.
At this time, alignment can be performed using a hole for ensuring positional accuracy. The lamination may be performed by laminating three films at one time or by laminating two films. For example, in order to sufficiently fill the gap around the IC chip with an adhesive, first, a core film and a substrate film are laminated, and then the IC film is laminated from the laminated core film side.
The adhesive around the chip may be filled with an adhesive or the like, and a protective film may be laminated thereon. Alternatively, the core film may be first laminated with the protective film, the adhesive around the IC chip may be filled with an adhesive or the like, and the substrate film may be laminated. The thickness of the two adhesive layers is preferably such that the irregularities of the coil of the substrate film are embedded.
Further, it is preferable that the two adhesive layers have the same thickness because the influence on the warpage is reduced.

When using a hot melt type adhesive,
It is preferable to perform cold lamination immediately after the application to rapidly solidify after the application. However, the outside air circulation temperature may be adjusted to delay the solidification, or a laminating step (temporary laminating step) before the cold laminating step. In, the temperature may be adjusted by providing a heat adjusting mechanism.

Next, as shown in FIG. 2B, the substrate film 41, the core film 42, and the protective film 43 are formed.
Is pressed by a press tool such as a press plate 10,
Laminating (cold laminating) processing at low temperature.
The adhesive before cold laminating has fluidity,
The adhesive is solidified under pressure and at a low temperature, and the pressure is released. By performing cold lamination, the production efficiency of the laminate is increased, and the production of a card that is excellent in surface properties and does not require a heat load during lamination can be performed. Further, since a cooling step such as a conventional heat laminating step is not required, production efficiency is high.

In the laminating (cold laminating) step under the above-mentioned pressure and low temperature, the applied pressure has no adverse effect on the electronic parts, and can be appropriately set in accordance with the appearance, surface properties, card thickness and the like. it can. Lamination at a low temperature is performed by pressing and releasing after laminating to a temperature at which the substrate does not warp due to thermal expansion or contraction or the like and does not have a reduced surface property. The temperature of a pressing tool such as a roller or a press plate for applying pressure is 50. C. or lower, more preferably room temperature or lower. For example, a water-cooled metal plate can be used. In order to impart smoothness to the card surface, the laminate is preferably sandwiched by a press plate or sandwiched by a large-diameter roller.
Pinching by a press plate is preferred. When cold lamination is performed by sandwiching a press plate using a roll sheet film, a spacer mechanism for adjusting timing between the temporary lamination (lamination) step and the cold lamination step can be provided.

When an ultraviolet-curable adhesive is used, in the cold laminating step, a substrate film, a core film, and a protective film are laminated with a film or a plate (glass plate) that transmits ultraviolet light in order to impart surface smoothness. The body is pressurized and irradiated with ultraviolet light to solidify the ultraviolet curable adhesive. At this time, it is preferable to press and hold the laminate from both sides and uniformly irradiate ultraviolet rays from both sides so that warpage does not occur due to curing. In addition, in order to make it possible to cure even in a part where ultraviolet rays are not irradiated (not reached), a material of a secondary curing type (ultraviolet irradiation and heat curing, moisture curing, etc.) is used, or a material such as a cationic polymerization system is used. Alternatively, a curing mechanism that cures the non-ultraviolet irradiated portion may be used.

When the above-mentioned ultraviolet-curable adhesive is used, the material of the film and the ultraviolet-ray reaction initiator can be appropriately selected so as to enable curing by irradiation with ultraviolet light. For example, a material having ultraviolet transmittance is used for part or all of each of the substrate film, the core film, and the protective film so as not to hinder the ultraviolet curing reaction caused by the ultraviolet irradiation. For example, by using an ultraviolet-permeable material for the protective film, the protective film laminated with the core film can be irradiated with ultraviolet light from the upper surface and cured. In addition, by using an ultraviolet-permeable material for the three films, curing by ultraviolet irradiation from one direction becomes possible, and it is possible to cold-laminate by ultraviolet irradiation after integrally laminating the three films. Become. When an ultraviolet-curable adhesive is not used, any of these films such as white and transparent films can be used. When an adhesive that cures with long-wavelength light is used, a non-transparent material can be used.

In the subsequent step of the laminating step, when a roll sheet-like film is used, a pulse sensor,
Alternatively, there is a step of cutting the sheet using a marking sensor or the like. In this case, the pulse can use holes at both ends of the substrate. As the mark, a pattern formed for printing on a film or a position formed when a transparent base material is used when an ultraviolet curable adhesive is used and a coil is formed can be used. After the sheet is cut, it is formed into a card size by punching or the like.

The card may be printed before or after lamination, but when using an ultraviolet-curable adhesive, a transparent base material that transmits ultraviolet light is used and printed after lamination to cover the built-in electronic components. You may make it. In addition, laminating the substrate film and the protective film after printing them in advance is more preferable than printing after laminating, because less expensive IC chips due to poor printing are wasted and manufacturing costs can be reduced. .

When an ultraviolet-curable adhesive is used, printing is usually performed after lamination so as not to impair the ultraviolet transmittance. When all the films are made of a transparent material, process printing is performed after printing white or aluminum paste printing and white lamination on the entire surface on both surfaces.

The IC card may be a non-contact type or a hybrid type in which a contact type IC module is mounted. In addition, functions such as recording information by providing a magnetic stripe or the like, printing a face photograph by sublimation transfer printing or the like, hologram, embossing, and the like can be provided.

According to the method of manufacturing a non-contact type IC card of the present embodiment, the appearance of the card can be improved by suppressing the warpage of the card and the occurrence of unevenness on the surface of the card. Complicated processes for molding IC modules,
Since a time-consuming hot press step is not required, efficient production is possible, and the production cost is reduced and the non-contact type I
C cards can be manufactured.

First Embodiment FIG. 3 shows an apparatus for continuously performing the steps from the step of fixing an IC chip and a coil on the surface of a substrate film to the step of sheet cutting a sheet-like laminate. Substrate film 4
1, the core film 42 and the protective film 43 are each a roll sheet film. First, in step A, a coil is formed on the substrate film 41 by etching or the like. A bump is formed at the end of the coil. Next, in step B, the IC chip is pressed and fixed by, for example, a hot press so as to be bonded to the coil on the substrate film 41. Next, in step C, a sealing resin is applied so as to cover the IC chip, and the IC chip is sealed.

Next, in step D, the core film 42
A punch hole is formed to accommodate the IC chip portion.
Next, in step E, the adhesive 5 is bonded to the adhesive surface of the core film 42 with the substrate film 41 and the adhesive surface of the protective film 43 with the core film 42 using a hot-melt adhesive or an ultraviolet-curing adhesive. Coating. Next, in step F, the three films of the substrate form 41, the core film 42, and the protective film 43 are laminated (temporarily laminated) using a rubber roll or the like so that air does not enter.

Next, lamination (cold lamination) is performed by using the press plate 10 in the process G via the spacer mechanism by applying pressure and reducing the temperature. Next, after the press-bonding is released, in a step H, the sheet is cut, and after a process such as a pattern printing, a card size punching is performed to create a card.

According to the above-described apparatus of the present embodiment, the steps from the step of fixing the IC chip and the coil on the surface of the substrate film to the step of cutting the sheet-like laminate are continuously performed, thereby increasing the efficiency. A non-contact type IC card can be produced effectively.

Second Example Preparation of Sample 1 (Invention) An aluminum coil was formed by etching on a substrate film of white PET having a thickness of 75 μm and a width of 600 mm, and nickel stud bumps (30 μm thick) were formed at the ends. And an IC chip (2 mm square, 180 μm thickness, 30 μm
(with a nickel-plated bump having a thickness of m) was pressed by a hot press so as to be joined to the coil on the substrate film.

Next, an ultraviolet-curing sealing resin (World Lock A-310, manufactured by Kyoritsu Chemical Sangyo) is applied by potting so as to cover the IC chip, and is irradiated with ultraviolet light to a thickness of 250 μm (from the top of the substrate film). Thickness).

Next, a core film (white PET, Toray E
-22, 250 μm thick, 600 mm width) After forming a punch hole to accommodate the IC chip portion, a hot-melt type adhesive (Aronmelt PP) is applied to the bonding surface with the substrate film.
(ET2110, Toagosei) was melted at a melting temperature of 160 ° C., and then coated to a thickness of 80 μm by a die coating method.

Next, a protective film (white PET, Toray E
An adhesive was coated on the bonding surface with the core film (−22, 75 μm thick, 600 mm width) in the same manner as described above.

Next, three films of a substrate form, a core film, and a protective film were laminated (temporary lamination) using a rubber roll at 80 ° C. so that air did not enter.

Next, the adhesive was solidified (cold) by a water-cooled metal plate (600 × 1000 × 300 mm ³ ) while holding the laminate at a pressure of 5 kgf / cm ² for 5 seconds via a spacer mechanism. Laminate), press-bond open, then sheet cut, pattern print, card size punching 500
A μm thick card was made.

Preparation of Sample 2 (Invention) An aluminum coil was formed by etching on a substrate film made of transparent PET having a thickness of 75 μm and a width of 600 mm, and nickel stud bumps (30 μm thickness) were formed at the end portions. (2mm square, 180μm thickness, 30μ
(with a nickel-plated bump having a thickness of m) was pressed by a hot press so as to be joined to the coil on the substrate film.

Next, an ultraviolet-curing sealing resin (World Lock A-310, manufactured by Kyoritsu Chemical Sangyo) is applied by potting so as to cover the IC chip, and is irradiated with ultraviolet light to a thickness of 250 μm (from the top of the substrate film). Thickness).

Next, a core film (white PET, Toray E
After forming a punch hole to accommodate the IC chip portion at −22, 250 μm thickness, 600 mm width), a UV curable adhesive (TB3080, Three Bond) is 80 μm thick by a gravure printing method on the bonding surface with the substrate film. Coated.

Next, a protective film (transparent PET, 75 μm)
An adhesive was coated on the bonding surface with the core film having a thickness of m and a width of 600 mm) in the same manner as described above.

Next, three films of a substrate form, a core film, and a protective film were laminated (temporary lamination) using a room-temperature rubber roll so that air did not enter.

Next, through a spacer mechanism, the laminated body is laid on a glass plate (600 × 330 × 300 mm ³ ) for 5 k.
While holding the gf / cm ² pressure for 5 seconds,
40mW / CM metal halide The adhesive is solidified (cold lamination) by UV irradiation, and after pressure release, an additional 10
The resin was cured by irradiating ultraviolet rays for 2 seconds, and a card having a thickness of 500 μm was prepared by sheet cutting, pattern printing, and card size punching.

Preparation of Sample 3 (Comparative Example) In the preparation of Sample 2, the substrate form, core film,
After laminating the three protective films with a room-temperature rubber roll so that air did not enter (temporary lamination), the adhesive was solidified by irradiating ultraviolet rays without holding the press. Other steps are the same as those of the sample 2.

Evaluation Results Sample 1 (the present invention) and Sample 2 (the present invention)
The function as a non-contact type IC card worked well. The surface properties of the card were smooth on both the substrate film side and the protective film side, and the appearance was good. The adhesive strength was 6 kgf / 25 mm for sample 1 and 3 kgf / 25 m for sample 2.
m, which was good without practically peeling of the substrate.

Since Sample 3 (Comparative Example) was not pressed during the solidification of the adhesive, it had irregularities on the surface around the IC chip, poor surface properties, and poor appearance.

As described above, according to the method for manufacturing a non-contact type IC card of this embodiment, the surface properties of the card are the same on both the substrate film side and the protective film side, the appearance is good, and the adhesive strength is good. A good non-contact type IC card could be manufactured which was sufficiently strong and practically did not peel off the base material.

The present invention is not limited to the above embodiment.
For example, although a non-contact IC card is described in the embodiment, a hybrid IC card further including a contact IC module may be used. In addition, various changes can be made without departing from the spirit of the present invention.

[0074]

According to the method for manufacturing a non-contact type IC card of the present invention, the appearance of the card can be improved by suppressing the warpage of the card and the occurrence of irregularities on the surface of the card, and the card can be efficiently produced and the production cost can be reduced. And a non-contact type IC card can be manufactured.

Further, according to the non-contact type IC card of the present invention, the appearance of the card can be improved by suppressing the warpage of the card and the unevenness of the card surface, the production can be performed efficiently, and the production cost can be reduced. A non-contact type IC card can be provided.

[Brief description of the drawings]

FIGS. 1A and 1B are plan views and FIGS. 1B and 1C are cross-sectional views of a non-contact type IC card according to an embodiment of the present invention.

FIGS. 2A and 2B are perspective views showing a method of manufacturing a non-contact type IC card according to an embodiment of the present invention, and FIG.
Shows up to the step of forming each film, (b) shows up to the cold laminating step, and (c) shows the state after lamination.

FIG. 3 is a perspective view for explaining an apparatus for continuously performing a process from a step of fixing an IC chip and a coil on a surface of a substrate film to a step of sheet-cutting a sheet-like laminate.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC chip, 1a ... Bump, 2 ... Coil, 3 ... Sealing resin, 4 ... Card board, 41 ... Board film, 42 ... Core film, 42a ... IC chip hole, 43 ... Protective film, 5 ... Adhesive Layer, 10 ... Press plate.

Claims (11)

[Claims] A step of fixing an IC chip and a coil on a surface of a substrate film; a step of forming an IC chip hole in a core film; and a step of accommodating the IC chip in the IC chip hole. Laminating the substrate film via an adhesive on one surface of the film, laminating a protective film via an adhesive on the other surface of the core film, laminating the substrate film, the core film and the protective film A method of manufacturing a non-contact type IC card, comprising: forming a body; and laminating the laminate under pressure and at a low temperature. 2. The method of manufacturing a non-contact type IC card according to claim 1, wherein in the step of laminating the laminate under pressure and at a low temperature, the laminate is sandwiched and pressed by a press having a temperature of at least 50 ° C. or less. Method. 3. The method according to claim 1, wherein the adhesive is a hot melt adhesive, and the step of laminating the laminate under pressure and at a low temperature is a step of solidifying the hot melt adhesive by cooling. 3. The method for manufacturing a non-contact type IC card according to any one of 2. 4. The method according to claim 1, wherein the adhesive is an ultraviolet-curable adhesive, and the step of laminating the laminate under pressure and at a low temperature is a step of solidifying the laminated body by irradiating the ultraviolet-curable adhesive with ultraviolet light. 3. The method for manufacturing a non-contact type IC card according to any one of 1 and 2. 5. The step of forming the laminate includes the step of applying the adhesive to at least one of the one surface of the core film and the adhesive surface of the substrate film, and the other of the core film. The step of applying the adhesive to at least one of the surface of the protective film and the adhesive surface of the protective film, and the step of laminating the substrate film, the core film and the protective film. A method for manufacturing the non-contact type IC card according to any one of the above. 6. The substrate film, the core film, and the protective film, wherein the substrate film, the core film, and the protective film are each a roll sheet film, and the step of forming the laminate includes the substrate film, the core film, and the protective film. A step of forming the sheet-like laminate of the above, wherein the step of laminating the laminate under pressure and at low temperature is a step of laminating the sheet-like laminate under pressure and low temperature, After the step of laminating under pressure and at a low temperature, further comprising a step of sheet-cutting the sheet-like laminate, and after the step of fixing an IC chip and a coil on the surface of the substrate film, The method for producing a non-contact type IC card according to claim 5, wherein the steps up to the step of sheet-cutting the laminate are continuously performed. 7. A substrate film on which an IC chip and a coil are fixed on one surface of a core film having an IC chip hole formed thereon is bonded so that the IC chip is housed in the IC chip hole. A non-contact type IC card formed by laminating a laminate formed by laminating a protective film on the other surface of the core film via an adhesive, and laminating the laminate under pressure and low temperature. 8. The non-woven fabric according to claim 7, wherein when the laminate is laminated under pressure and at a low temperature, the laminate is sandwiched by a press tool having a temperature of at least 50 ° C. and laminated by pressurization. Contact type IC card. 9. The method according to claim 1, wherein the adhesive is a hot-melt adhesive, and when the laminate is laminated under pressure and low temperature, the laminate is formed by solidifying by cooling the hot-melt adhesive. Item 9. A non-contact type IC card according to any one of Items 7 and 8. 10. The adhesive is an ultraviolet-curable adhesive, and when the laminate is laminated under pressure and at a low temperature, the laminated body is solidified by irradiation with ultraviolet light to the ultraviolet-curable adhesive to form a laminate. The non-contact type IC card according to claim 7. 11. When forming the laminate, the adhesive is applied to at least one of one surface of the core film and the bonding surface of the substrate film, and the other surface of the core film is formed. Apply the adhesive to at least one of the adhesive surfaces of the protective film and
The non-contact type IC card according to any one of claims 7 to 10, wherein the non-contact type IC card is formed by laminating the substrate film, the core film, and the protection film.