JPH1187610A - Semiconductor device - Google Patents

Abstract

(57) [Problem] To provide a power module in which a power board and an external electrode of a case are connected without using wire bonding or soldering, and are easily disassembled and reused. SOLUTION: A case 1 having external electrodes 2, a power board support plate 7 for supporting a power board 6 as a chip board, and a semiconductor chip of the power board 6 supported by the power board support plate 7 on one surface. Relay electrode 9 in contact with
And a wiring relay electrode substrate 8 having a second relay electrode 10 in contact with the exposed portion 2A in the case of the external electrode 2 on the other surface, so that the power substrate 6 and the external electrode 2 are contacted only by contact pressure. It is connected, and can be easily disassembled simply by removing the fixing screw 11, and it is easy to collect and reuse a good power board 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a power module which is easy to assemble and disassemble and is advantageous for recycling.

[0002]

2. Description of the Related Art In a conventional power module, a power chip such as an IGBT chip or a diode chip as a semiconductor chip on an insulating substrate constituting a power substrate as a chip substrate is soldered to an external electrode in a case.
Alternatively, they are wire-bonded and then sealed with a mold resin. In addition, the case and a portion serving as a heat sink are fixed with an adhesive or the like.

[0003]

Since the conventional power module is configured as described above, that is, the power board and the electrode built in the case are connected by wire bonding or soldering, and Since the connecting portion is molded with a molding resin, and since the case and the heat radiating plate are fixed by an adhesive or the like, disassembly is not easy.

[0004] For this reason, when even one of a plurality of built-in power chips on a power board is broken as a power module, all the other built-in power chips become unusable, and a normal power chip is used. However, there is a problem in that it is impossible to reuse the material, and even if it becomes completely unusable, it is difficult to separate the components by type.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a power board and an electrode incorporated in a case are joined without wire bonding or soldering, so that the power board and the electrode are easily disassembled and normal. It is an object of the present invention to provide a semiconductor device such as a power module that can easily recycle a power chip.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device comprising: a chip substrate supporting portion for supporting a chip substrate having a semiconductor chip; an external electrode supporting portion for supporting external electrodes; Disposed between the portion and the external electrode support portion, a wiring pattern is formed, and on one surface a relay electrode pressed against a semiconductor chip of the chip substrate supported by the chip substrate support portion, On the other surface, a wiring relay electrode substrate having a relay electrode pressed against the external electrode supported by the external electrode support is provided.

A semiconductor device according to a second aspect of the present invention is the semiconductor device according to the first aspect, wherein at least one of the relay electrode provided on the wiring relay electrode substrate and the external electrode supported by the external electrode support portion has elasticity. It had.

A semiconductor device according to a third aspect of the present invention is the semiconductor device according to the first or second aspect, wherein the external electrode support, the wiring relay electrode substrate, and the chip substrate support are integrally screwed with a common screw. It is a tightened connection.

A semiconductor device according to a fourth aspect of the present invention is the semiconductor device according to any one of the first to third aspects, wherein the external electrode support, the interconnecting relay electrode substrate, and the chip substrate support are provided with the same. They are integrally screwed and connected via an elastic body provided in any of them.

A semiconductor device according to a fifth aspect of the present invention is the semiconductor device according to any one of the first to fourth aspects, wherein the chip substrate support has a concave portion into which the chip substrate is fitted.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 is a diagram showing a cross section of a power module as a semiconductor device according to an embodiment of the first to fifth inventions, and FIG. 2 is a developed view of the power module shown in FIG.

1 and 2, reference numeral 1 denotes a case having an open surface, 2 denotes an external electrode, and 2A denotes a case 1 of the external electrode 2.
The exposed portion protrudes inward, and is hereinafter referred to as an internal electrode for convenience of description. The external electrode 2 is embedded and fixed in a sealing surface 1B facing the opening surface 1A in the case 1 as an external electrode support. 3 is IGB as a semiconductor chip
T chip, 4 is a diode chip, 5 is an insulating substrate on which a power chip such as an IGBT chip 3 and a diode chip 4 is mounted, fixed and insulated, and 6 is composed of an IGBT chip 3, a diode chip 4, an insulating substrate 5 and the like. A power substrate as a chip substrate. In addition, as shown in FIG. 2, the insulating substrate 5 includes a copper foil 5A, an insulating material 5B, and a heat-radiating copper material 5C.

Reference numeral 7 denotes a power board supporting plate which supports and fixes the power board 6 and serves as a power board supporting portion which is a lid of the opening surface 1A of the case 1. The power board supporting plate 7 has a recess 7A on the inner side surface. The power board 6 is fitted and positioned and fixed. In the figure, the recessed portion 7A has an open stepped portion, from which the heat-dissipating copper material 5C of the power board 6 is viewed.

Reference numeral 8 denotes a wiring relay electrode substrate, 9 denotes a first relay electrode provided on one surface of the wiring relay electrode substrate 8 for relaying connection with a power substrate, and 10 denotes a wiring relay electrode substrate 8.
A second relay electrode provided on the other surface of the wiring relay, for relaying connection with the case electrode, and is connected to the first relay electrode 9, the second relay electrode 10 and the like inside the wiring relay electrode substrate 8. A wiring layer as a formed wiring pattern is buried and formed.
The first relay electrode 9 and the second relay electrode 10 are made of a spring material such as phosphor bronze, and have elasticity in a direction perpendicular to respective surfaces of the wiring relay electrode substrate 8.

The wiring relay electrode substrate 8 is located inside the case 1, and one surface provided with the first relay electrode 9 faces the power board support plate 7 and the other provided with the second relay electrode 10. Faces the inside of the sealing surface 1B of the case 1. Then, the first relay electrode 9 comes into contact with the IGBT chip 3, the diode chip 4, and the like of the power board 6 fixed to the power board support plate 7 at a predetermined contact pressure, and the second relay electrode 10 contacts the case 1. It is in contact with internal electrode 2A at a predetermined contact pressure.

Reference numeral 11 denotes a fixing screw, and 1C denotes a fixing screw screw hole provided in the case 1. Both the power board support plate 7 and the wiring relay electrode substrate 8 are fixed to the case 1 with the fixing screws 11. You. Reference numeral 12 denotes a fixing spring of the wiring relay electrode substrate, and reference numeral 13 denotes a fixing spring of the power board support plate, which are fixing springs as elastic bodies fixed to predetermined positions of the case 1, respectively.

Next, a method of assembling the power module shown in FIG. 1 will be described with reference to FIG. In FIG. 2, the relay electrode substrate 8 for wiring is inserted from the opening surface 1A of the case 1 with the surface provided with the second relay electrode 10 on the back side, and the sealing surface 1B of the second relay electrode 10 and the case 1 is inserted. Is inserted so as to be in contact with the internal electrode 2A provided on the inner surface side of.

Next, a power board 6 composed of a power chip such as the IGBT chip 3 and the diode chip 4 and an insulating board 5 is inserted into the recess 7A of the power board support plate 7, and the power board support plate 7 is inserted. Case 1
, Both the power board support plate 7 and the wiring relay electrode board 8 are fixed to the case 1 with the fixing screws 11. That is, both the power substrate support plate 7 and the wiring relay electrode substrate 8 are screwed into the fixing screw screw holes 1C provided in the case 1 by the fixing screws 11 and fixed to the case 1.

IGBT chip 3 as a power chip,
The diode chip 4 and the like are buried in the wiring relay electrode substrate 8 via the first relay electrode 9 formed on the wiring relay electrode substrate 8 and wired in the wiring layer formed. It is electrically connected to the external electrode 2 via the relay electrode 10 and the internal electrode 2A of the case 1. By providing the wiring relay electrode substrate 8, all of the connection portions can be made to be in contact with each other. No wire bonding is required.

The first relay electrode 9 and the second relay electrode 10 provided on the wiring relay electrode substrate 8 are formed of a phosphor bronze plate or the like, as described above, and have elasticity in a direction perpendicular to the substrate surface. The contact pressure between the first relay electrode 9 and the IGBT chip 3, the diode chip 4, etc., and the second relay electrode 1
The contact pressure of the contact portion between 0 and the internal electrode 2A can be set to a predetermined pressure, and even if there is some unevenness between a plurality of electrodes arranged on the same plane, the contact of all the electrodes can be prevented. Can be assured. Note that a similar function can be obtained by providing the internal electrode 2A with a spring function instead of the second relay electrode 10.

Further, both the power board support plate 7 and the wiring relay electrode board 8 are fixed to the case 1 by screwing with the common fixing screw 11, so that assembly and disassembly are further facilitated.

The case 1 is provided with a fixing spring 12 for the wiring relay electrode substrate and a fixing spring 13 for the power substrate support plate, and the power substrate support plate 7 and the power substrate support plate 7 are fixed via these fixing springs 12 and 13. Since both of the wiring relay electrode substrates 8 are screwed and fixed to the case 1 with the common fixing screws 11, the holding of the power board support plate 7 and the wiring relay electrode substrate 8 is ensured. 1, the power board supporting plate 7, the wiring relay electrode substrate 8 and the like easily come off, and the disassembling operation becomes extremely easy.

The power board support plate 7 has a power board 6
A concave portion 7A having substantially the same shape as that of the insulating substrate and having such a size as to have a small gap when the power substrate 6 is inserted is formed. By inserting the power substrate 6 into the concave portion 7A, 6 can be easily and accurately positioned, and the first relay electrode 9 formed on the wiring relay electrode substrate 8 can be brought into accurate contact with the IGBT chip 3, the diode chip 4 or the like as a power chip.

In the above-described embodiment shown in FIGS. 1 and 2, the casing is constituted by the case 1 as the external electrode support and the power board support plate 7 as the power board support, and the wiring relay is provided. Although the electrode substrate 8 is inserted, the power substrate supporting portion may be used as a case, and the external electrode supporting portion may be used as a lid to form a housing. 6, the same effect can be obtained by forming a housing by embedding and fixing the external electrode 2 in a lid as an external electrode supporting portion, and inserting the wiring relay electrode substrate 8 in this case. .

Further, both the power board supporting portion and the external electrode supporting portion are used as lids, and the power board supporting portion and the external Even if the electrode support portion is provided and integrally screwed, the same effect as that of the embodiment shown in FIGS. 1 and 2 can be obtained.

Instead of using the frame as described above, a power board support portion and an external electrode support portion may be provided on both sides of the wiring relay electrode substrate 8 and screwed together. In this case, a gap is formed between the power board support portion and the external electrode support portion and the wiring relay electrode substrate, but the packing may be sandwiched or sealed with a sealing material, or the wiring relay electrode substrate may be used. By forming a thicker peripheral portion, or a peripheral portion of the power substrate support portion and the external electrode support portion facing the wiring relay electrode substrate, the semiconductor chip, the relay electrode, and the like can be wrapped and sealed. The same effects as those of the embodiment shown in FIGS.

As described above, in the power module according to the above-described embodiment, the connection portion is formed by contact pressure, not by soldering, so that it is not necessary to enclose with a resin which has been required conventionally, and assembly and disassembly can be performed. Very easy,
Recycling of good power chips has become easier. That is,
Even if some of the power chips on the power board become unusable, they can be easily disassembled simply by removing the screws, and the usable good power chips can be collected and reused, enabling effective use of resources. It became. In addition, it is easy to separate and collect each member having different specifications.

In the above embodiment, the power module equipped with the power board provided with the IGBT chip 3 and the diode chip 4 has been described as an example. However, the power module provided with the IGBT chip 3 and the diode chip 4 is limited. Instead, a similar effect can be obtained in a semiconductor device on which other semiconductor chips, control parts, and the like are mounted.

[0029]

According to the first aspect of the invention, since the wiring relay electrode substrate is provided and the connection portion is formed by contact pressure without soldering, resin encapsulation becomes unnecessary, and assembly and disassembly become extremely easy. Thus, there is an effect that a semiconductor device capable of recovering and reusing usable semiconductor chips and effectively utilizing resources can be obtained.

According to the second aspect of the present invention, since the side of the wiring relay electrode substrate that contacts the relay electrode or the external electrode has elasticity, the power chip and the relay electrode, and the relay electrode and the external electrode can be connected to each other. Are reliably brought into contact with each other at a predetermined contact pressure, so that an object having high contact reliability can be obtained.

According to the third aspect of the present invention, the power substrate support, the wiring relay electrode substrate, and the external electrode support are screwed together with a common screw. The effect is obtained.

According to the fourth aspect of the present invention, since the power board supporting portion, the wiring relay electrode substrate, and the external electrode supporting portion are integrally screwed and connected via the elastic body provided therein, they are easily disassembled. In addition, there is an effect that an extremely easy disassembling operation can be obtained.

According to the fifth aspect of the present invention, since the power board supporting portion is provided with the concave portion into which the power board is fitted, the power board can be easily and reliably positioned, and the power board can be easily assembled and disassembled. Has the effect.

[Brief description of the drawings]

FIG. 1 is a sectional view of a power module according to an embodiment of the first to fifth inventions.

FIG. 2 is a development view of the power module according to the embodiment of the first to fifth inventions.

[Explanation of symbols]

1 case, 1C screw holes for fixing screws, 2 external electrodes,
2A internal electrode, 3IGBT chip, 4 diode chip, 5 insulating substrate, 5A copper foil, 5B insulating material, 5C
Copper material for heat dissipation, 6 power board, 7 power board support plate, 7A recess, 8 relay electrode board for wiring, 9 first relay electrode, 10 second relay electrode, 11 fixing screw, 1
2,13 Fixing spring

Claims (5)

[Claims] 1. A chip substrate supporting portion for supporting a chip substrate provided with a semiconductor chip, an external electrode supporting portion for supporting external electrodes, and provided between the chip substrate supporting portion and the external electrode supporting portion, A wiring pattern was formed, and a relay electrode pressed against a semiconductor chip of the chip substrate supported by the chip substrate support was supported on one surface, and the external electrode was supported by the external electrode support on the other surface. A semiconductor device comprising: a wiring relay electrode substrate having a relay electrode pressed against an external electrode. 2. The semiconductor device according to claim 1, wherein at least one of the relay electrode provided on the wiring relay electrode substrate and the external electrode supported by the external electrode support has elasticity. 3. The semiconductor device according to claim 1, wherein the external electrode support, the wiring relay electrode substrate, and the chip substrate support are integrally screwed and connected with a common screw. Semiconductor device. 4. The semiconductor device according to claim 1, wherein the external electrode support, the wiring relay electrode substrate, and the chip substrate support are connected via an elastic body provided in any of these. A semiconductor device characterized by being integrally screwed and connected. 5. The semiconductor device according to claim 1, wherein the chip substrate support has a recess into which the chip substrate is fitted.