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JPH118196A5 - - Google Patents

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Publication number
JPH118196A5
JPH118196A5 JP1997173151A JP17315197A JPH118196A5 JP H118196 A5 JPH118196 A5 JP H118196A5 JP 1997173151 A JP1997173151 A JP 1997173151A JP 17315197 A JP17315197 A JP 17315197A JP H118196 A5 JPH118196 A5 JP H118196A5
Authority
JP
Japan
Prior art keywords
thin film
semiconductor thin
less
atoms
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997173151A
Other languages
Japanese (ja)
Other versions
JPH118196A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP17315197A priority Critical patent/JPH118196A/en
Priority claimed from JP17315197A external-priority patent/JPH118196A/en
Publication of JPH118196A publication Critical patent/JPH118196A/en
Publication of JPH118196A5 publication Critical patent/JPH118196A5/ja
Withdrawn legal-status Critical Current

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Claims (8)

珪素を主成分とし、ニッケル、コバルト、鉄、パラジウム、白金、銅又は金の元素を含む、複数の棒状または偏平棒状結晶の集合体からなる半導体薄膜であって、面方位は{A semiconductor thin film consisting of an aggregate of multiple rod-shaped or flat rod-shaped crystals, whose main component is silicon and contains elements of nickel, cobalt, iron, palladium, platinum, copper, or gold, and whose plane orientation is { 111111 }配向であり、且つ、膜中に存在する炭素、窒素及び硫黄の濃度は} orientation, and the concentrations of carbon, nitrogen, and sulfur present in the film are 55 ×× 1010 1818 atoms/cmatoms/cm 33 未満またはLess than or 0.01atomic% 0.01 atomic% 未満であり、且つ、膜中に存在する酸素の濃度はand the concentration of oxygen present in the film is less than 1.51.5 ×× 1010 1919 atoms/cmatoms/cm 33 未満またはLess than or 0.03atomic% 0.03 atomic% 未満であることを特徴とする半導体薄膜。A semiconductor thin film characterized in that: 珪素を主成分とし、ニッケル、コバルト、鉄、パラジウム、白金、銅又は金の元素を含む、複数の棒状または偏平棒状結晶の集合体からなる半導体薄膜であって、{A semiconductor thin film consisting of an aggregate of a plurality of rod-shaped or flat rod-shaped crystals, the main component of which is silicon and contains elements of nickel, cobalt, iron, palladium, platinum, copper or gold, 111111 }配向比率が} orientation ratio is 0.90.9 以上であり、且つ、膜中に存在する炭素、窒素及び硫黄の濃度はThe concentrations of carbon, nitrogen and sulfur present in the film are 55 ×× 1010 1818 atoms/cmatoms/cm 33 未満またはLess than or 0.01atomic% 0.01 atomic% 未満であり、且つ、膜中に存在する酸素の濃度はand the concentration of oxygen present in the film is less than 1.51.5 ×× 1010 1919 atoms/cmatoms/cm 33 未満またはLess than or 0.03atomic% 0.03 atomic% 未満であることを特徴とする半導体薄膜。A semiconductor thin film characterized in that: 請求項1又は2において、前記半導体薄膜にはハロゲン元素が3. The semiconductor thin film according to claim 1, wherein the semiconductor thin film contains a halogen element. 11 ×× 1010 1515 ~ 11 ×× 1010 2020 atoms/cmatoms/cm 33 の濃度で含まれていることを特徴とする半導体薄膜。A semiconductor thin film characterized in that it contains at a concentration of 前記複数の棒状または偏平棒状結晶は互いに平行に特定の方向性をもって並んでいることを特徴とする請求項The plurality of rod-shaped or flat rod-shaped crystals are arranged parallel to each other in a specific direction. 11 乃至3のいずれか一に記載の半導体薄膜。4. The semiconductor thin film according to any one of claims 1 to 3. 珪素を主成分とし、ニッケル、コバルト、鉄、パラジウム、白金、銅又は金の元素を含む、複数の棒状または偏平棒状結晶の集合体からなる半導体薄膜で構成される半導体装置であって、前記半導体薄膜の面方位は{A semiconductor device comprising a semiconductor thin film consisting of an aggregate of a plurality of rod-shaped or flat rod-shaped crystals, the semiconductor thin film being mainly composed of silicon and containing elements of nickel, cobalt, iron, palladium, platinum, copper or gold, wherein the plane orientation of the semiconductor thin film is { 111111 }配向であり、且つ、膜中に存在する炭素、窒素及び硫黄の濃度は} orientation, and the concentrations of carbon, nitrogen, and sulfur present in the film are 55 ×× 1010 1818 atoms/cmatoms/cm 33 未満またはLess than or 0.01atomic% 0.01 atomic% 未満であり、且つ、膜中に存在する酸素の濃度はand the concentration of oxygen present in the film is less than 1.51.5 ×× 1010 1919 atoms/cmatoms/cm 33 未満またはLess than or 0.03atomic% 0.03 atomic% 未満であることを特徴とする半導体装置。A semiconductor device characterized in that: 珪素を主成分とし、ニッケル、コバルト、鉄、パラジウム、白金、銅又は金の元素を含む、複数の棒状または偏平棒状結晶の集合体からなる半導体薄膜で構成される半導体装置であって、前記半導体薄膜の{A semiconductor device comprising a semiconductor thin film consisting of an aggregate of a plurality of rod-shaped or flat rod-shaped crystals, the semiconductor thin film being mainly composed of silicon and containing elements of nickel, cobalt, iron, palladium, platinum, copper or gold, wherein 111111 }配向比率が} orientation ratio is 0.90.9 以上であり、且つ、膜中に存在する炭素、窒素及び硫黄の濃度はThe concentrations of carbon, nitrogen and sulfur present in the film are 55 ×× 1010 1818 atoms/cmatoms/cm 33 未満またはLess than or 0.01atomic% 0.01 atomic% 未満であり、且つ、膜中に存在する酸素の濃度はand the concentration of oxygen present in the film is less than 1.51.5 ×× 1010 1919 atoms/cmatoms/cm 33 未満またはLess than or 0.03atomic% 0.03 atomic% 未満であることを特徴とする半導体装置。A semiconductor device characterized in that: 請求項5又は6において、前記半導体薄膜にはハロゲン元素が7. The semiconductor thin film according to claim 5, wherein the semiconductor thin film contains a halogen element. 11 ×× 1010 1515 ~ 11 ×× 1010 2020 atoms/cmatoms/cm 33 の濃度で含まれていることを特徴とする半導体装置。A semiconductor device characterized in that it contains 前記複数の棒状または偏平棒状結晶は互いに平行に特定の方向性をもって並んでいることを特徴とする請求項5乃至7のいずれか一に記載の半導体装置。8. The semiconductor device according to claim 5, wherein the plurality of rod-shaped or flat rod-shaped crystals are arranged parallel to one another in a specific direction.
JP17315197A 1997-06-13 1997-06-13 Semiconductor thin film and semiconductor device Withdrawn JPH118196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17315197A JPH118196A (en) 1997-06-13 1997-06-13 Semiconductor thin film and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17315197A JPH118196A (en) 1997-06-13 1997-06-13 Semiconductor thin film and semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007055158A Division JP4801608B2 (en) 2007-03-06 2007-03-06 Method for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPH118196A JPH118196A (en) 1999-01-12
JPH118196A5 true JPH118196A5 (en) 2005-04-14

Family

ID=15955057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17315197A Withdrawn JPH118196A (en) 1997-06-13 1997-06-13 Semiconductor thin film and semiconductor device

Country Status (1)

Country Link
JP (1) JPH118196A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208771A (en) 1999-01-11 2000-07-28 Hitachi Ltd Semiconductor device, liquid crystal display device, and manufacturing method thereof
JP4495805B2 (en) 1999-09-29 2010-07-07 株式会社東芝 Crystalline semiconductor thin film and manufacturing method thereof, and thin film transistor and manufacturing method thereof
JP5147196B2 (en) * 2005-06-01 2013-02-20 株式会社半導体エネルギー研究所 Element substrate
WO2009130822A1 (en) * 2008-04-25 2009-10-29 シャープ株式会社 Multilayer wiring, semiconductor device, substrate for display and display

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