JPH118177A - Resist supply apparatus and resist coating method - Google Patents

Abstract

(57) [Problem] To provide an apparatus for supplying a resist whose viscosity is adjusted according to a film thickness. SOLUTION: The resist supply device 1 is provided with a viscosity adjusting means 2 for adjusting the viscosity of the resist stock solution, a pipe line 6a connected to the viscosity adjusting means 2 for supplying a resist adjusted to an appropriate viscosity, and a nozzle 3. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist supply device and a resist coating method, and more particularly to a resist supply device and a resist coating method used when manufacturing a semiconductor device.

[0002]

2. Description of the Related Art In order to manufacture a semiconductor device, a layer such as an insulating layer or a conductive layer, which needs to be processed, is formed on a semiconductor substrate, and a photoresist is applied on this layer and patterned. Layers that need to be processed are etched using the patterned resist as a mask.

[0003]

When a resist is applied onto an insulating layer, a resist coater coater is used. In this apparatus, a resist having a uniform film thickness is formed by rotating a semiconductor substrate on a semiconductor substrate sucked by a vacuum chuck, with the resist having a viscosity adjusted by a manufacturing company.

Therefore, when a resist having a certain film thickness is applied in one step and a resist having another film thickness is formed in the next step, the resist is manufactured so as to adjust the viscosity according to each film thickness. A request from the company is received, and a plurality of resist stock solutions are delivered from the manufacturing company. Therefore, there is a problem that a resist stock solution having a necessary viscosity is not readily available.

The present invention has been made in order to solve the above-mentioned problems, and has as its object to provide an apparatus capable of supplying a resist having a required viscosity and a method of applying the resist.

[0006]

According to the present invention, there is provided a resist supply apparatus which is connected to a viscosity adjusting means for adjusting the viscosity of a resist stock solution and supplies a resist adjusted to an appropriate viscosity onto a wafer. Resist supply means for performing the above.

[0007] In the resist supply apparatus configured as described above, the viscosity adjusting means can adjust the viscosity of the resist stock solution in accordance with the thickness of the resist to be applied. Can be supplied.

The viscosity adjusting means includes mixing means for mixing a plurality of solutions having different viscosities, and viscosity measuring means for measuring the viscosity of the mixed solution mixed by the mixing means, wherein the viscosity is measured by the viscosity measuring means. It is preferable to adjust the mixing ratio of the plurality of solutions supplied to the mixing means according to the viscosity. In this case, since the mixing ratio of the solution can be optimized according to the viscosity of the mixed solution, the viscosity of the resist can be adjusted more precisely.

Further, it is preferable that a plurality of solutions having different viscosities contain the same component. In this case, since a plurality of solutions contain the same component, it becomes easy to mix these solutions,
Moreover, the quality of the mixed solution tends to be uniform.

Preferably, the viscosity adjusting means adjusts the viscosity of the resist by adjusting the amount of the powdery resist dissolved in the solvent. In this case, the viscosity of the resist can be easily adjusted by determining the amount of the powdery resist according to the viscosity of the resist. Further, since the powdery resist is easily dissolved in the solvent, a uniform quality resist can be supplied by mixing.

The viscosity adjusting means preferably adjusts the viscosity of the resist by evaporating a solvent from the resist stock solution. In this case, by adjusting the evaporation amount of the solvent according to the viscosity of the resist, a resist having a desired viscosity can be easily provided.

The resist coating method according to the present invention adjusts the viscosity of a stock resist solution in a tank according to the designed thickness of the resist applied on the wafer, and transfers the adjusted viscosity resist solution from the tank onto the wafer. To apply a resist having a predetermined thickness on the wafer.

According to such a method, in order to adjust the viscosity of the resist stock solution in the tank in accordance with the resist film thickness, a resist stock solution having a desired viscosity is prepared by one apparatus, and a resist having a predetermined film thickness is applied. Can be applied.

Preferably, the viscosity is adjusted by adjusting the mixing ratio of a plurality of solutions having different viscosities. In this case, by changing the mixing ratio, a resist having a viscosity corresponding to the film thickness can be adjusted.

It is preferable to adjust the viscosity by adjusting the amount of the powdery resist dissolved in the solvent stored in the tank. In this case, a resist having a desired viscosity can be easily adjusted only by adjusting the amount of the powdery resist.

It is preferable to adjust the viscosity by evaporating the solvent of the solution stored in the tank. In this case, a resist having a desired viscosity can be easily adjusted by adjusting the amount of evaporation of the solvent.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) Referring to FIG. 1, a resist supply apparatus 1 includes a nozzle 3, a viscosity measuring means 4, and a mixing means 5. The viscosity measuring means 4 and the mixing means 5 constitute the viscosity adjusting means 2. Nozzle 3 and viscosity measuring means 4
, The mixing means 5, and the storage means 7, 8 are connected to each other by pipes 6a, 6b, 6c, 6d having pumps and valves, respectively. The nozzle 3 and the conduit 6a constitute a supply unit.

The storage means 7 and 8 store solutions having different viscosities, respectively. This solution preferably consists of the same components and differs only in viscosity.

As an example of the mixing means 5, FIG.
Examples shown in (J) are given. In (A), a mixed solution 82 is placed in a container 81, and the container 81 is vibrated vertically and horizontally. In (B), the mixed solution 82 is stirred with a stirring rod 83 such as a propeller. In (C), a pipe 84 is immersed in the mixed solution 82 and bubbles are generated in the mixed solution 82 by passing an inert gas through the pipe, followed by stirring. In (D), springs 85 are provided above and below the container 81,
The mixed solution 82 is mixed by vibrating the container 81 up and down.
In (E), the container 81 is rotated about a rotation shaft 86 provided on the container 81 to mix the mixed solution 82. In (F), the mixed solution 82 is mixed by rotating the container 81 provided with the fins 87 therein. In (G), the mixed solution 82 is mixed by convection by warming the container 81 with the hot water pipe 88. (H) shows a stirrer 8 made of a magnet.
9 and the mixed solution 82 are mixed by the magnetic stirrer 90. In (I), the mixed solution 82 is mixed by an ultrasonic wave indicated by an arrow 91. In (J), the spray valve 92,
93 forms a mixed solution 82. In (K), the gaseous solutions 98a and 98b are guided to the mixer 96 and cooled by the cold water 97 to form the mixed solution 82.

As a form of the apparatus, as shown in FIG. 3A, all components may be provided in one storage container 1a. Further, as shown in FIG. 3B, the nozzle 3, the viscosity measuring means 4, and the pipe 6a are provided in one storage container 1b, and the mixing means 5, the storing means 7, 8, and the pipes 6c, 6d are separately provided. And two storage containers 1b and 1c may be connected by a conduit 6b.

In order to supply the resist using such an apparatus, the solution in the storage means 7 and 8 is sent to the mixing means 5 via the pipes 6c and 6d. These solutions are mixed in the mixing means 5 to become a resist stock solution, which is sent to the viscosity measuring means 4 via the conduit 6b.

If the viscosity of the resist stock solution measured by the viscosity measuring means 4 is a predetermined value, the resist stock solution is supplied to the wafer 9 fixed on the spinner 10 through the pipe 6a and the nozzle 3. By rotating the wafer 9 using the spinner 10, a resist is applied on the wafer 9.

If the viscosity of the resist stock solution measured by the viscosity measuring means 4 is not a predetermined value, the storing means 7 and 8
By adjusting the ratio of the solution supplied to the mixing means 5 from the above, the viscosity of the resist stock solution becomes a predetermined value. Adjustment of this mixture ratio may be an artificial operation,
Further, the operation may be performed by a machine. When the viscosity of the resist stock solution reaches a predetermined value by adjusting the mixing ratio, the resist stock solution is supplied onto the wafer 9.

In such a resist supply device 1 and a resist coating method using this device, two kinds of solutions having different viscosities are mixed to prepare a resist stock solution having a predetermined viscosity. Can be prepared, and the film thickness of the resist can be set to an optimum value.

The resist supply device 1 described above can be variously modified. For example, three or more storage units may be provided, or the solution may be moved to the mixing unit 5 by gravity without providing a pump between the storage units 7 and 8 and the mixing unit 5.

(Embodiment 2) The resist supply device 41 shown in FIG. 4 is different from the resist supply device 1 shown in FIG. 1 in that the storage means 47 stores a powdery resist and the storage means 48 stores an organic solvent. And different.

In order to supply the resist using this apparatus, first, the powdery resist in the storage means 47 is supplied to the pipe 6c.
And the organic solvent in the storage means 48 is sent to the mixing means 5 through the conduit 6d. In the mixing means 5, as shown in FIG. 2 (L), the organic solvent 95 and the powdery resist 94 are mixed. As a mixing method, a method as shown in FIGS. 2A to 2I can be used. The resist stock solution prepared by mixing is sent to the viscosity measuring means 4 via the conduit 6b, and the viscosity is measured.

If the viscosity is a predetermined value, the resist stock solution is supplied to the wafer 9 on the spinner 10 through the pipe 6a and the nozzle 3. By rotating the wafer 9 by the spinner 10, a resist having a predetermined thickness is formed on the wafer 9.

If the viscosity of the resist stock solution is not a predetermined value, the amount of the powdered resist supplied from the storage means 47 is changed to make the viscosity of the resist stock solution a predetermined value, and then the resist stock solution is supplied onto the wafer 9. Is done.

In such a resist supply device 41 and a resist coating method using the same, a resist stock solution having a predetermined viscosity can be prepared by changing the amount of the powdery resist. A thick resist can be easily supplied.

(Embodiment 3) A resist supply device 61 shown in FIG. 5 includes a storage means 67 for storing a resist stock solution,
It differs from the resist supply device 1 shown in FIG. 1 in that it has an evaporation means 65 for evaporating the solvent from the resist stock solution. In addition,
The viscosity measuring means 4 and the evaporating means 65 constitute the viscosity adjusting means 62.

In order to supply the resist using this apparatus, the resist stock solution in the storage means 67 is sent to the evaporation means 65 via the pipe 6c. In the evaporating means 65, the viscosity of the resist stock solution changes as the resist stock solution is heated and decompressed. The viscosity of the resist stock solution is measured by a viscosity measuring means 4, and if the viscosity is a predetermined value, the line 6a and the nozzle 3
The resist stock solution is supplied to the wafer 9 via. By rotating the wafer 9 using the spinner 10, a resist having a predetermined thickness is formed on the wafer 9.

If the viscosity measured by the viscosity measuring means 4 is not the predetermined value, the amount of the solvent to be evaporated by the evaporating means 65 is changed to make the viscosity of the resist stock solution a predetermined value, and then the resist stock solution is deposited on the wafer 9. Supplied to

In such a resist supply device 61 and a resist coating method using the same, a resist stock solution having a desired viscosity can be prepared by changing the amount of the solvent to be evaporated by the evaporation means 65. A resist having an appropriate thickness can be supplied.

Although the embodiments of the present invention have been described above, it should be understood that the embodiments disclosed herein are illustrative in all aspects and not restrictive.
The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[0037]

According to the present invention, there is provided a resist supply apparatus comprising:
It is provided with a viscosity adjusting means for adjusting the viscosity of the resist stock solution, and a resist supply means connected to the viscosity adjusting means and supplying on a resist wafer adjusted to an appropriate viscosity, so that a resist having a desired viscosity can be supplied. it can.

The viscosity adjusting means includes a mixing means for mixing a plurality of solutions having different viscosities, and a viscosity measuring means for measuring the viscosity of the mixed solution mixed by the mixing means. Since the mixing ratio of the plurality of solutions supplied to the mixing means is adjusted according to the viscosity, the viscosity of the resist can be adjusted more accurately.

Further, since a plurality of solutions having different viscosities contain the same component, the solutions can be easily mixed and the quality of the mixed solution can be easily uniform.

Further, since the viscosity adjusting means adjusts the viscosity of the resist by adjusting the amount of the powdered resist dissolved in the solvent, it is easy to determine the amount of the powdered resist in accordance with the viscosity of the resist. In addition, the viscosity of the resist can be adjusted. Further, since the powdery resist is easily dissolved in the solvent, a uniform quality resist can be supplied by mixing.

The viscosity adjusting means adjusts the viscosity of the resist by evaporating the solvent from the undiluted resist solution. By adjusting the amount of evaporation of the solvent in accordance with the viscosity of the resist, the viscosity adjusting means can adjust the resist having the desired viscosity. Can be easily provided.

The resist coating method according to the present invention adjusts the viscosity of the resist stock solution in the layer according to the designed thickness of the resist to be coated on the wafer, and transfers the viscosity-adjusted resist solution from the layer onto the wafer. Then, a resist having a predetermined thickness is applied on the wafer, so that a resist having a predetermined thickness can be applied.

Since the viscosity is adjusted by adjusting the mixing ratio of a plurality of solutions having different viscosities, a resist having a viscosity corresponding to the film thickness can be adjusted.

Further, since the viscosity is adjusted by adjusting the amount of the powdery resist dissolved in the solvent stored in the layer, a resist having a desired viscosity can be easily obtained only by adjusting the amount of the powdery resist. Can be adjusted.

Since the viscosity is adjusted by evaporating the solvent of the solution stored in the layer, a resist having a desired viscosity can be easily adjusted by adjusting the evaporation amount of the solvent.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a resist supply device according to a first embodiment of the present invention.

FIG. 2 is a schematic view showing a mixing unit in FIG.

FIG. 3 is a schematic diagram showing an example of the resist supply device shown in FIG.

FIG. 4 is a schematic diagram of a resist supply device according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram of a resist supply device according to a third embodiment of the present invention.

[Explanation of symbols]

1, 41, 61 resist supply device, 2, 62 viscosity adjusting means, 3 nozzles, 4 viscosity measuring means, 5 mixing means, 7, 8, 47, 48, 67 storage means, 65 evaporating means.

Claims (9)

[Claims] 1. A resist supply device, comprising: a viscosity adjusting means for adjusting the viscosity of a resist stock solution; and a resist supply means connected to the viscosity adjusting means for supplying a resist adjusted to an appropriate viscosity onto a wafer. 2. The viscosity adjusting means includes a mixing means for mixing a plurality of solutions having different viscosities, and a viscosity measuring means for measuring the viscosity of the mixed solution mixed by the mixing means. 2. The resist supply device according to claim 1, wherein a mixing ratio of the plurality of solutions supplied to the mixing unit is adjusted according to the viscosity measured by the method. 3. The resist supply apparatus according to claim 2, wherein the plurality of solutions having different viscosities contain the same component. 4. The resist supply apparatus according to claim 1, wherein said viscosity adjusting means adjusts the viscosity of the resist by adjusting an amount of a powdery resist dissolved in a solvent. 5. The resist supply device according to claim 1, wherein the viscosity adjusting means adjusts the viscosity of the resist by evaporating a solvent from the resist stock solution. 6. Adjusting the viscosity of the resist stock solution in a tank according to the designed thickness of the resist applied on the wafer, guiding the viscosity adjusted resist solution onto the wafer from the tank,
A resist coating method for coating a resist having a predetermined thickness on a wafer. 7. The resist coating method according to claim 6, wherein the viscosity is adjusted by adjusting a mixing ratio of a plurality of solutions having different viscosities. 8. The resist coating method according to claim 6, wherein the viscosity is adjusted by adjusting the amount of the powdery resist dissolved in the solvent stored in the tank. 9. The resist coating method according to claim 6, wherein the viscosity is adjusted by evaporating a solvent of the solution stored in the tank.