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JPH118165A - Manufacture of solid electrolytic capacitor - Google Patents

Manufacture of solid electrolytic capacitor

Info

Publication number
JPH118165A
JPH118165A JP16229997A JP16229997A JPH118165A JP H118165 A JPH118165 A JP H118165A JP 16229997 A JP16229997 A JP 16229997A JP 16229997 A JP16229997 A JP 16229997A JP H118165 A JPH118165 A JP H118165A
Authority
JP
Japan
Prior art keywords
capacitor element
solid electrolytic
electrolytic capacitor
capacitor
outer shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16229997A
Other languages
Japanese (ja)
Other versions
JP3515327B2 (en
Inventor
Takeshi Takamatsu
武史 高松
Hidenori Kamikawa
秀徳 上川
Yoichi Kojima
洋一 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electronic Components Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electronic Components Co Ltd, Sanyo Electric Co Ltd filed Critical Sanyo Electronic Components Co Ltd
Priority to JP16229997A priority Critical patent/JP3515327B2/en
Priority to US09/098,302 priority patent/US6139592A/en
Publication of JPH118165A publication Critical patent/JPH118165A/en
Application granted granted Critical
Publication of JP3515327B2 publication Critical patent/JP3515327B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To lessen a solid electrolytic capacitor in fraction defective by a method wherein the effect of an aging treatment on a reduction in a leakage current is improved. SOLUTION: A dielectric oxide film is formed on an anode of valve metal such as Al, Ta, or the like, and a cathode layer of solid-state conductive organic material such as conductive high-molecular material, organic semiconductor, or the like is formed on the dielectric oxide film for the formation of a capacitor element 1, and a casing is provided to the capacitor element 1 through projection molding or the like for the manufacture of a solid electrolytic capacitor. As this point, the casing is provided to the capacitor element 1 after the element 1 is subjected to aging, and then the capacitor 1 with the casing is subjected to aging again.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、高周波特性に優れ
た高性能固体電解コンデンサの製造方法に関するもので
あり、特に、製造過程におけるエージング工程に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a high-performance solid electrolytic capacitor having excellent high-frequency characteristics, and more particularly to an aging step in a manufacturing process.

【0002】[0002]

【従来の技術】一般に、電解コンデンサは、Al(アル
ミニウム)、Ta(タンタル)等の弁金属(valve meta
l)からなる陽極体の表面に、電解酸化処理にて誘電体
酸化皮膜を形成し、該誘電体酸化皮膜上に、電解液、M
nO2(二酸化マンガン)、導電性有機材料等の導電性材
料からなる陰極層を形成したものである。ここで、弁金
属とは、前記電解酸化処理により、極めて緻密で耐久性
を有する誘電体酸化皮膜を形成する金属を言い、Alや
Taの他にも、Ti(チタン)、Nb(ニオブ)等が該当
する。前記誘電体酸化皮膜の膜厚が非常に薄いことか
ら、電解コンデンサは、他の紙コンデンサやフィルムコ
ンデンサ等に比べて、小型で大容量のコンデンサを作る
ことができる。前記電解コンデンサは、陰極層として、
MnO2、導電性有機材料等、固体の導電性材料を用いた
ものを固体電解コンデンサと称し、さらに、固体の導電
性有機材料を用いたものを有機固体電解コンデンサと称
する。
2. Description of the Related Art Generally, an electrolytic capacitor is made of a valve metal such as Al (aluminum) or Ta (tantalum).
l) forming a dielectric oxide film on the surface of the anode body comprising electrolytic solution by electrolytic oxidation treatment;
A cathode layer made of a conductive material such as nO 2 (manganese dioxide) or a conductive organic material is formed. Here, the valve metal is a metal that forms a very dense and durable dielectric oxide film by the electrolytic oxidation treatment. In addition to Al and Ta, Ti (titanium), Nb (niobium), etc. Is applicable. Since the thickness of the dielectric oxide film is very small, the electrolytic capacitor can produce a small-sized and large-capacity capacitor as compared with other paper capacitors and film capacitors. The electrolytic capacitor, as a cathode layer,
A capacitor using a solid conductive material such as MnO 2 or a conductive organic material is called a solid electrolytic capacitor, and a capacitor using a solid conductive organic material is called an organic solid electrolytic capacitor.

【0003】近年の電子機器の発展に伴い、高周波領域
において内部インピーダンスの低い高周波特性に優れた
小型かつ大容量のコンデンサが必要とされている。コン
デンサの内部インピーダンスは、コンデンサの容量や、
主に陰極層の材料に起因するESR(equivalent serie
s resistance:等価直列抵抗)や、主にリード線に起因
する自己インダクタンス、等からなる。電解コンデンサ
の陰極層に使用される導電性材料のうち、TCNQ
(7,7,8,8−テトラシアノキノジメタン)錯塩、
ポリピロール等の導電性有機材料は、電解液やMnO2
比べて電気伝導率が高い。従って、導電性有機材料を用
いた有機固体電解コンデンサは、前記ESRが低いか
ら、高周波特性に優れた小型かつ大容量のコンデンサと
して、様々な電子機器に使用されている。また、導電性
有機材料の中でも、ポリピロール等の導電性高分子材料
は、TCNQ錯塩等の有機半導体に比べて電気伝導率が
高い。従って、ポリピロール等の導電性高分子材料を用
いた有機固体電解コンデンサは、前記ESRがいっそう
低く、高周波特性に非常に優れた小型かつ大容量のコン
デンサとなる。
With the recent development of electronic equipment, there is a need for a small and large-capacity capacitor having a low internal impedance and excellent high-frequency characteristics in a high-frequency region. The internal impedance of the capacitor
ESR (equivalent serie) mainly caused by the material of the cathode layer
s resistance (equivalent series resistance) and self-inductance mainly caused by the lead wire. Among the conductive materials used for the cathode layer of the electrolytic capacitor, TCNQ
(7,7,8,8-tetracyanoquinodimethane) complex salt,
A conductive organic material such as polypyrrole has a higher electric conductivity than an electrolytic solution or MnO 2 . Therefore, an organic solid electrolytic capacitor using a conductive organic material is used in various electronic devices as a small and large-capacity capacitor excellent in high-frequency characteristics because of its low ESR. Further, among conductive organic materials, a conductive polymer material such as polypyrrole has higher electric conductivity than an organic semiconductor such as a TCNQ complex salt. Therefore, an organic solid electrolytic capacitor using a conductive polymer material such as polypyrrole has a smaller ESR and is a small and large-capacity capacitor having extremely excellent high frequency characteristics.

【0004】以下に、一般的な固体電解コンデンサの製
造方法を説明する。まず、前記陽極体に陽極リード線を
取り付け、電解酸化処理にて陽極体の表面に誘電体酸化
皮膜を形成し、該誘電体酸化皮膜上に、固体導電性材料
からなる陰極層を形成し、該陰極層上にカーボン及び銀
ペースト層を形成することにより、コンデンサ素子が完
成する。該コンデンサ素子の陽極のリード線とカーボン
及び銀ペースト層とにそれぞれ金属端子板を取り付け、
射出成形等により、コンデンサ素子と、金属端子板の一
部とを樹脂にて被覆して、外殻を形成することにより、
固体電解コンデンサの組立てが完成する。
[0004] A method of manufacturing a general solid electrolytic capacitor will be described below. First, an anode lead wire is attached to the anode body, a dielectric oxide film is formed on the surface of the anode body by electrolytic oxidation treatment, and a cathode layer made of a solid conductive material is formed on the dielectric oxide film, By forming a carbon and silver paste layer on the cathode layer, a capacitor element is completed. Metal terminal plates are attached to the anode lead wire and the carbon and silver paste layers of the capacitor element, respectively.
By coating the capacitor element and part of the metal terminal plate with resin by injection molding, etc., and forming the outer shell,
The assembly of the solid electrolytic capacitor is completed.

【0005】[0005]

【発明が解決しようとする課題】一般に、電解コンデン
サは、製造過程において誘電体酸化皮膜の損傷により増
大した漏れ電流を低減するために、製品の組立完成後に
エージング処理が行なわれる。エージング処理は、コン
デンサの使用最高温度(または、それより高い温度)の
環境中において、コンデンサに直流電圧を印加すること
により行なわれ、このエージング処理により誘電体酸化
皮膜の損傷が修復されて、漏れ電流が低減される。しか
しながら、陰極層に、MnO2、導電性有機材料等の固体
導電性材料を使用する場合は、電解液を使用する場合に
比べて、エージング処理による誘電体酸化皮膜の修復が
困難であるため、漏れ電流を低減させる効果が低い。こ
のため、漏れ電流値が要求スペックを満たさない不良品
の発生率を抑えることができなかった。
In general, an electrolytic capacitor is subjected to an aging process after a product is completely assembled in order to reduce a leakage current which is increased due to a damage of a dielectric oxide film in a manufacturing process. The aging process is performed by applying a DC voltage to the capacitor in an environment at the maximum operating temperature of the capacitor (or a higher temperature), and the aging process repairs the damage of the dielectric oxide film and causes leakage. The current is reduced. However, when a solid conductive material such as MnO 2 or a conductive organic material is used for the cathode layer, it is more difficult to repair the dielectric oxide film by aging treatment than when using an electrolytic solution. The effect of reducing the leakage current is low. For this reason, the occurrence rate of defective products whose leakage current value does not satisfy the required specifications could not be suppressed.

【0006】[0006]

【発明の目的】本願発明者は、有機固体電解コンデンサ
に関して種々の実験を行なった結果、外殻を形成する前
にエージング処理を行なうと、漏れ電流を著しく低減で
きることを見出し、以下の解決手段を案出した。本発明
は、漏れ電流の低い有機固体電解コンデンサを製造する
方法を提供することを目的とする。
The inventors of the present invention have conducted various experiments on an organic solid electrolytic capacitor. As a result, they have found that leakage current can be significantly reduced by performing aging treatment before forming an outer shell. Devised. An object of the present invention is to provide a method for manufacturing an organic solid electrolytic capacitor having low leakage current.

【0007】[0007]

【課題を解決するための手段】本発明の有機固体電解コ
ンデンサの製造方法は、エージング処理を行なった後
に、外殻を形成し、外殻の形成とコンデンサの組立てを
完成した後に、再度エージング処理を行なうことを特徴
とする。
According to a method of manufacturing an organic solid electrolytic capacitor of the present invention, an aging process is performed, an outer shell is formed, and after the formation of the outer shell and assembly of the capacitor are completed, the aging process is performed again. Is performed.

【0008】[0008]

【発明の実施の形態】まず、本発明の実施形態および実
施例について説明する。本実施形態の固体電解コンデン
サ素子は、Al、Ta等の弁金属からなる陽極体に陽極リ
ード線を取り付け、陽極体と、陽極リード線の一部との
表面に、電解酸化処理にて誘電体酸化皮膜を形成し、導
電性高分子、有機半導体等の導電性有機材料からなる陰
極層を形成し、該陰極層上にカーボン及び銀ペースト層
を形成したものである。本実施形態では、該コンデンサ
素子にエージング処理を行なった後に、コンデンサ素子
の陽極リード線と、カーボン及び銀ペースト層とに金属
端子板をそれぞれ取り付け、射出成形等により、コンデ
ンサ素子と、金属端子板の一部とを樹脂にて被覆して、
外殻を形成し、それから、再度エージング処理を行なう
ことにより、固体電解コンデンサが完成する。陽極体に
は、箔や焼結体等が使用されるが、以下の実施例および
比較例では、弁金属としてTaを用いたTa焼結体が使用
される。また、陰極層を形成する導電性有機材料には、
ポリピロール、ポリアニリン、ポリチオフェン等の導電
性高分子や、TCNQ錯塩等の有機半導体が使用される
が、以下の実施例では、ポリピロールが使用される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS First, embodiments and examples of the present invention will be described. In the solid electrolytic capacitor element of the present embodiment, an anode lead wire is attached to an anode body made of a valve metal such as Al or Ta, and a surface of the anode body and a part of the anode lead wire is subjected to a dielectric oxidation treatment by electrolytic oxidation. An oxide film is formed, a cathode layer made of a conductive organic material such as a conductive polymer or an organic semiconductor is formed, and a carbon and silver paste layer is formed on the cathode layer. In this embodiment, after the capacitor element is subjected to an aging treatment, a metal terminal plate is attached to each of the anode lead wire of the capacitor element and the carbon and silver paste layers, and the capacitor element and the metal terminal plate are formed by injection molding or the like. And a part of it is covered with resin,
The solid electrolytic capacitor is completed by forming the outer shell and then performing the aging process again. A foil, a sintered body, or the like is used for the anode body. In the following examples and comparative examples, a Ta sintered body using Ta as a valve metal is used. The conductive organic material forming the cathode layer includes:
Conductive polymers such as polypyrrole, polyaniline, and polythiophene, and organic semiconductors such as TCNQ complex salts are used. In the following examples, polypyrrole is used.

【0009】[0009]

【実施例】以下、本発明の実施例と比較例を説明する。EXAMPLES Examples of the present invention and comparative examples will be described below.

【0010】(実施例)陽極リード線を取り付けたTa
焼結体を、リン酸水溶液中で電解酸化を行ない、Ta焼
結体と、陽極リード線の一部との表面に誘電体酸化皮膜
を形成した。次に、周知の化学重合法、電解重合法等を
用いて、該誘電体酸化皮膜上にポリピロールからなる陰
極層を形成した。そして、前記陰極層上に、カーボン及
び銀ペースト層を形成して、コンデンサ素子を完成させ
た。
(Example) Ta having an anode lead wire attached
The sintered body was subjected to electrolytic oxidation in a phosphoric acid aqueous solution to form a dielectric oxide film on the surface of the Ta sintered body and a part of the anode lead wire. Next, a cathode layer made of polypyrrole was formed on the dielectric oxide film using a known chemical polymerization method, electrolytic polymerization method, or the like. Then, a carbon and silver paste layer was formed on the cathode layer to complete a capacitor element.

【0011】次に、板状のカーボンフェルト(3)をホッ
トプレートにて加熱し、表面温度を125℃に調節してか
ら、図1に示すように、カーボンフェルト(3)と前記コ
ンデンサ素子(1)のカーボン及び銀ペースト層(11)とが
接触するように、カーボンフェルト(3)上に前記コンデ
ンサ素子(1)を載置し、電源(6)の正極をコンデンサ素
子(1)の陽極リード線(10)に、負極をカーボンフェルト
(3)にそれぞれ接続して、定格電圧を2時間印加するこ
とにより、外殻形成前のエージング処理を行なった。こ
のエージング処理により、漏れ電流は、図3の実線で示
すように、著しく減少した。なお、前記カーボンフェル
ト(3)は、熱伝導および電気抵抗の観点から、厚さが5
〜20mm、嵩密度が0.1〜0.2g/cm3、且つ体積比抵抗が7
Ωcm以下であることが望ましい。本実施例では、厚さが
7mm、嵩密度が0.12g/cm3、且つ体積比抵抗が6.3Ωcmで
あるカーボンフェルト(3)を使用した。次に、前記エー
ジング処理を行なったコンデンサ素子(1)の陽極リード
線(10)及びカーボン及び銀ペースト層(11)に、それぞれ
金属端子板を溶着或いは接着して接続し、コンデンサ素
子(1)と、該金属端子板の一部とにエポキシ樹脂を射出
成形して、外殻を形成し、温度125℃で定格電圧を2時
間印加して完成エージング処理を行なった。このときの
漏れ電流は、図3の実線で示すように、外殻形成前のエ
ージング処理によって到達した漏れ電流よりも若干減少
した。そして、外殻から露出した金属端子板を外殻に沿
って折り曲げることにより、チップ状の固体電解コンデ
ンサを完成させた。
Next, the plate-like carbon felt (3) is heated on a hot plate to adjust the surface temperature to 125 ° C., and then, as shown in FIG. The capacitor element (1) is placed on the carbon felt (3) so that the carbon and silver paste layers (11) of (1) are in contact with each other, and the positive electrode of the power supply (6) is connected to the anode of the capacitor element (1). Connect the negative electrode to the lead wire (10) with carbon felt
Each was connected to (3) and a rated voltage was applied for 2 hours to perform aging treatment before forming the outer shell. As a result of this aging treatment, the leakage current was significantly reduced as shown by the solid line in FIG. The carbon felt (3) has a thickness of 5 from the viewpoint of heat conduction and electric resistance.
~ 20mm, bulk density 0.1 ~ 0.2g / cm 3 and volume resistivity 7
It is desirable that it be Ωcm or less. In this embodiment, a carbon felt (3) having a thickness of 7 mm, a bulk density of 0.12 g / cm 3 and a volume resistivity of 6.3 Ωcm was used. Next, a metal terminal plate is welded or bonded to the anode lead wire (10) and the carbon and silver paste layers (11) of the capacitor element (1) subjected to the aging treatment, respectively. Then, an epoxy resin was injection-molded to a part of the metal terminal plate to form an outer shell, and a rated voltage was applied at a temperature of 125 ° C. for 2 hours to complete aging treatment. As shown by the solid line in FIG. 3, the leakage current at this time was slightly smaller than the leakage current reached by the aging process before the outer shell was formed. Then, the metal terminal plate exposed from the outer shell was bent along the outer shell to complete a chip-shaped solid electrolytic capacitor.

【0012】なお、図2に示すように、外殻形成前のエ
ージング処理を、カーボンフェルト(3)に代えて、金属
槽(5)に粒状カーボン(4)を敷き詰めて、該粒状カーボ
ン(4)とコンデンサ素子(1)のカーボン及び銀ペースト
層(11)とが十分に接触するように、コンデンサ素子(1)
の下部を粒状カーボン(4)に埋設し、電源(6)の正極を
コンデンサ素子(1)の陽極リード線(10)に、負極を金属
槽(5)にそれぞれ接続して、定格電圧を2時間印加する
ことにより、外殻形成前のエージング処理を行なったと
ころ、上記と同様の結果が得られた。
As shown in FIG. 2, instead of the carbon felt (3), the aging treatment before forming the outer shell is performed by laying granular carbon (4) in a metal tank (5). ) And the carbon and silver paste layers (11) of the capacitor element (1) should be in sufficient contact with each other.
Of the power supply (6) is connected to the anode lead wire (10) of the capacitor element (1), and the negative electrode is connected to the metal tank (5). When the aging treatment was performed before the outer shell was formed by applying the time, the same result as described above was obtained.

【0013】(比較例)上記実施例の比較例として、外
殻形成前のカーボンフェルト(3)によるエージング処理
のみを省略し、その他は実施例と同様にして固体電解コ
ンデンサを完成させた。このときの完成エージング処理
における漏れ電流は、図3の一点鎖線で示すように、若
干減少するのみであり、完成エージング処理によって到
達した漏れ電流は、実施例の漏れ電流よりも遙かに大き
い結果となった。上記実施例および比較例における検査
結果を表1に示す。
Comparative Example As a comparative example of the above embodiment, a solid electrolytic capacitor was completed in the same manner as in the embodiment except that only the aging treatment with the carbon felt (3) before forming the outer shell was omitted. The leakage current in the completed aging process at this time only slightly decreases as shown by the dashed line in FIG. 3, and the leakage current reached by the completed aging process is much larger than the leakage current of the embodiment. It became. Table 1 shows the inspection results in the above Examples and Comparative Examples.

【0014】[0014]

【表1】 [Table 1]

【0015】表1において、ショート不良品は、エージ
ング処理において、陽極体と陰極層間に流れる電流が数
mAとなるものであり、誘電体酸化皮膜が不可逆的に破
損しているため、製品として完成する前に除外される。
従って、ショート不良品は、漏れ電流良品、漏れ電流不
良品、および漏れ電流の平均値の対象には含まれない。
なお、ショート不良品は、実施例および比較例ともに同
程度発生する。漏れ電流良品は、完成したコンデンサに
対して電圧を10秒間印加した後の漏れ電流が、要求さ
れるスペックを満たしているものであり、漏れ電流不良
品は、前記漏れ電流が要求されるスペックを満たさない
ものである。また、漏れ電流の平均値は、漏れ電流良品
と漏れ電流不良品の両方を対象とした平均値である。表
1から、漏れ電流の平均値は、実施例の方が比較例より
も著しく小さく、また、漏れ電流の良品数は、実施例の
方が比較例よりも著しく多いことが分かる。
[0015] In Table 1, short-circuit defective products are those in which the current flowing between the anode body and the cathode layer becomes several mA during the aging treatment, and the dielectric oxide film is irreversibly damaged. Be excluded before you.
Therefore, the short-circuit defective product is not included in the target of the good leakage current product, the defective leakage current product, and the average value of the leakage current.
It should be noted that short-circuit defective products are generated to the same extent in both the examples and comparative examples. A good leakage current product is one in which the leakage current after applying a voltage to the completed capacitor for 10 seconds satisfies the required specifications, and a defective leakage current product has the specifications in which the leakage current is required. It is not satisfied. Further, the average value of the leakage current is an average value for both good leakage current products and defective leakage current products. From Table 1, it can be seen that the average value of the leakage current is significantly smaller in the example than in the comparative example, and the number of non-defective products of the leakage current is significantly greater in the example than in the comparative example.

【0016】[0016]

【作用】一般に、エージング処理により漏れ電流が小さ
くなるメカニズムは、損傷した誘電体酸化皮膜は耐電圧
が低いから、エージング処理において電圧を印加する
と、耐電圧の低い領域に電流が集中して、該電流により
酸化されて、誘電体酸化皮膜が修復されるものである。
しかしながら、導電性高分子、有機半導体等の有機導電
性材料を陰極層に用いた有機固体電解コンデンサの場合
は、該電流により発生するジュール熱によって有機導電
性材料が絶縁化されることにより、漏れ電流が小さくな
ると考えられている。上記実施例と比較例の結果から、
外殻形成前のエージング処理においては、大気中の何ら
かの物質と反応することにより、前記有機導電性材料の
絶縁化が促進されて、漏れ電流が大きく減少するのでは
ないかと考えられる。
Generally, the mechanism by which the leakage current is reduced by the aging process is that the damaged dielectric oxide film has a low withstand voltage, so that when a voltage is applied during the aging process, the current concentrates in a region with a low withstand voltage. It is oxidized by an electric current to repair the dielectric oxide film.
However, in the case of an organic solid electrolytic capacitor using an organic conductive material such as a conductive polymer or an organic semiconductor for the cathode layer, the organic conductive material is insulated by Joule heat generated by the current, thereby causing leakage. It is believed that the current will be smaller. From the results of the above examples and comparative examples,
In the aging treatment before the formation of the outer shell, it is considered that by reacting with some substance in the atmosphere, the insulation of the organic conductive material is promoted, and the leakage current is greatly reduced.

【0017】[0017]

【発明の効果】従って、本発明によると、漏れ電流を著
しく低減できるから、漏れ電流値が要求スペックを満た
さない不良品の発生率を抑えることができ、その結果、
製品の歩留りを上げることができる。
As described above, according to the present invention, since the leakage current can be significantly reduced, the occurrence rate of defective products whose leakage current value does not satisfy the required specifications can be suppressed.
Product yield can be increased.

【0018】上記実施形態の説明は、本発明を説明する
ためのものであって、特許請求の範囲に記載の発明を限
定し、或いは範囲を減縮する様に解すべきではない。
又、本発明の各部構成は上記実施形態に限らず、特許請
求の範囲に記載の技術的範囲内で種々の変形が可能であ
ることは勿論である。例えば、本実施例では、外殻形成
前のエージング処理を行なった後にコンデンサ素子に金
属端子板を取り付けたが、該エージング処理は、コンデ
ンサ素子が外気に触れる状態で行なえばよいから、コン
デンサ素子に金属端子板を取り付けてからエージング処
理を行なってもよい。
The description of the above embodiments is for the purpose of describing the present invention, and should not be construed as limiting the invention described in the claims or reducing the scope thereof.
Further, the configuration of each part of the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made within the technical scope described in the claims. For example, in the present embodiment, the metal terminal plate is attached to the capacitor element after performing the aging process before forming the outer shell, but the aging process may be performed in a state where the capacitor element is exposed to the outside air. The aging process may be performed after attaching the metal terminal plate.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施例における、外殻形成前のエージ
ング処理を示す斜視図である。
FIG. 1 is a perspective view showing an aging process before forming an outer shell in an embodiment of the present invention.

【図2】本発明の別の実施例における、外殻形成前のエ
ージング処理を示す斜視図である。
FIG. 2 is a perspective view showing an aging process before forming an outer shell in another embodiment of the present invention.

【図3】実施例及び比較例における、エージング処理に
よる漏れ電流の変化を定性的に示すグラフである。
FIG. 3 is a graph qualitatively showing a change in leakage current due to aging processing in Examples and Comparative Examples.

【符号の説明】[Explanation of symbols]

(1) コンデンサ素子 (3) カーボンフェルト (4) 粒状カーボン (10) 陽極リード線 (11) カーボン及び銀ペースト層 (1) Capacitor element (3) Carbon felt (4) Granular carbon (10) Anode lead wire (11) Carbon and silver paste layer

───────────────────────────────────────────────────── フロントページの続き (72)発明者 小島 洋一 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yoichi Kojima 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 Al、Ta等の弁金属からなる陽極体の表
面に誘電体酸化皮膜を形成し、該誘電体酸化皮膜上に、
導電性高分子、有機半導体等の固体導電性有機材料から
なる陰極層を形成して、コンデンサ素子を完成させ、該
コンデンサ素子に対し、射出成形等により外殻を形成す
る固体電解コンデンサの製造方法に於て、 コンデンサ素子は、エージング処理が行なわれた後に、
外殻が形成され、外殻形成後に再度エージング処理が行
なわれることを特徴とする固体電解コンデンサの製造方
法。
1. A dielectric oxide film is formed on the surface of an anode body made of a valve metal such as Al or Ta, and the dielectric oxide film is formed on the dielectric oxide film.
A method for manufacturing a solid electrolytic capacitor in which a capacitor element is completed by forming a cathode layer made of a solid conductive organic material such as a conductive polymer and an organic semiconductor, and forming an outer shell on the capacitor element by injection molding or the like. In the above, after the aging process is performed,
A method for manufacturing a solid electrolytic capacitor, wherein an outer shell is formed and an aging process is performed again after the outer shell is formed.
【請求項2】 Al、Ta等の弁金属からなる焼結体であ
る陽極体に、陽極リード線(10)を取り付け、該陽極体の
表面に誘電体酸化皮膜を形成し、該誘電体酸化皮膜上
に、導電性高分子、有機半導体等の固体導電性有機材料
からなる陰極層を形成し、該陰極層上にカーボン及び銀
ペースト層(11)を形成することにより、コンデンサ素子
(1)を完成させ、該コンデンサ素子(1)に対し、射出成
形等により外殻を形成する固体電解コンデンサの製造方
法に於て、 コンデンサ素子(1)は、エージング処理が行なわれた後
に、外殻が形成され、外殻形成後に再度エージング処理
が行なわれ、 最初のエージング処理は、完成したコンデンサ素子(1)
をカーボンフェルト(3)上又は粒状カーボン(4)内に載
置し、コンデンサ素子(1)の陽極リード線(10)をアノー
ド電極とし、コンデンサ素子(1)のカーボン及び銀ペー
スト層(11)に接触するカーボンフェルト(3)又は粒状カ
ーボン(4)をカソード電極として電圧を印加することに
より行なわれる固体電解コンデンサの製造方法。
2. An anode lead wire (10) is attached to an anode body, which is a sintered body made of a valve metal such as Al or Ta, and a dielectric oxide film is formed on the surface of the anode body. By forming a cathode layer made of a solid conductive organic material such as a conductive polymer and an organic semiconductor on the film, and forming a carbon and silver paste layer (11) on the cathode layer, a capacitor element is formed.
(1) is completed, and the capacitor element (1) is subjected to an aging process in a method for manufacturing a solid electrolytic capacitor in which an outer shell is formed by injection molding or the like. The outer shell is formed, and the aging process is performed again after the outer shell is formed. The first aging process is the completed capacitor element (1).
Is placed on a carbon felt (3) or in granular carbon (4), the anode lead wire (10) of the capacitor element (1) is used as an anode electrode, and the carbon and silver paste layers (11) of the capacitor element (1) are used. A method for producing a solid electrolytic capacitor, which is performed by applying a voltage using carbon felt (3) or granular carbon (4) in contact with a cathode as a cathode electrode.
【請求項3】 最初のエージング処理は、周囲の温度を
125℃とするか、或いは、コンデンサ素子(1)と、カー
ボンフェルト(3)又は粒状カーボン(4)との接触面を、
加熱により125℃に維持することによって行なわれる、
請求項2に記載の固体電解コンデンサの製造方法。
3. The first aging process is to reduce the ambient temperature.
125 ° C or the contact surface between the capacitor element (1) and the carbon felt (3) or granular carbon (4)
Done by maintaining at 125 ° C by heating,
A method for manufacturing a solid electrolytic capacitor according to claim 2.
【請求項4】 カーボンフェルト(3)は、厚さが5乃至
20mm、嵩密度が0.1乃至0.2g/cm3、且つ体積比抵抗が7
Ωcm以下である、請求項2又は請求項3に記載の固体電
解コンデンサの製造方法。
4. The carbon felt (3) has a thickness of 5 to 5.
20mm, bulk density 0.1 ~ 0.2g / cm 3 and volume resistivity 7
The method for producing a solid electrolytic capacitor according to claim 2, wherein the value is Ωcm or less. 5.
JP16229997A 1997-06-19 1997-06-19 Method for manufacturing solid electrolytic capacitor Expired - Lifetime JP3515327B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16229997A JP3515327B2 (en) 1997-06-19 1997-06-19 Method for manufacturing solid electrolytic capacitor
US09/098,302 US6139592A (en) 1997-06-19 1998-06-18 Process and apparatus for producing organic solid electrolyte capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16229997A JP3515327B2 (en) 1997-06-19 1997-06-19 Method for manufacturing solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPH118165A true JPH118165A (en) 1999-01-12
JP3515327B2 JP3515327B2 (en) 2004-04-05

Family

ID=15751867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16229997A Expired - Lifetime JP3515327B2 (en) 1997-06-19 1997-06-19 Method for manufacturing solid electrolytic capacitor

Country Status (1)

Country Link
JP (1) JP3515327B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012658A (en) * 2005-06-28 2007-01-18 Rohm Co Ltd Method of manufacturing solid-state electrolytic capacitor
JP2007012836A (en) * 2005-06-30 2007-01-18 Rohm Co Ltd Method of manufacturing solid-state electrolytic capacitor
WO2016047868A1 (en) * 2014-09-23 2016-03-31 가톨릭대학교 산학협력단 Electrode comprising organic semiconductor material, method for manufacturing electrode, and supercapacitor comprising electrode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012658A (en) * 2005-06-28 2007-01-18 Rohm Co Ltd Method of manufacturing solid-state electrolytic capacitor
JP2007012836A (en) * 2005-06-30 2007-01-18 Rohm Co Ltd Method of manufacturing solid-state electrolytic capacitor
WO2016047868A1 (en) * 2014-09-23 2016-03-31 가톨릭대학교 산학협력단 Electrode comprising organic semiconductor material, method for manufacturing electrode, and supercapacitor comprising electrode
US10304637B2 (en) 2014-09-23 2019-05-28 University-Industry Cooperation Group Of Kyung Hee University Electrode comprising organic semiconductor material, method for manufacturing electrode, and supercapacitor comprising electrode

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