JPH1141172A - Optical bus and signal processor - Google Patents
Optical bus and signal processorInfo
- Publication number
- JPH1141172A JPH1141172A JP9195871A JP19587197A JPH1141172A JP H1141172 A JPH1141172 A JP H1141172A JP 9195871 A JP9195871 A JP 9195871A JP 19587197 A JP19587197 A JP 19587197A JP H1141172 A JPH1141172 A JP H1141172A
- Authority
- JP
- Japan
- Prior art keywords
- signal light
- light
- optical bus
- signal
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Landscapes
- Optical Communication System (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光信号の伝播を担
う光バス、およびその光バスを用いたデータの送受を含
む信号処理を行なう信号処理装置に関する。[0001] 1. Field of the Invention [0002] The present invention relates to an optical bus for transmitting an optical signal and a signal processing apparatus for performing signal processing including transmission and reception of data using the optical bus.
【０００２】[0002]
【従来の技術】超大規模集積回路（ＶＬＳＩ）の開発に
より、データ処理システムで使用する回路基板（ドータ
ーボード）の回路機能が大幅に増大してきている。回路
機能が増大するにつれて各回路基板に対する信号接続数
が増大するため、各回路基板（ドーターボード）間をバ
ス構造で接続するデータバスボード（マザーボード）に
は多数の接続コネクタと接続線を必要とする並列アーキ
テクチャが採用されてきている。接続線の多層化と微細
化による並列化を進めることにより並列バスの動作速度
の向上が図られてきたが、接続配線間容量や接続配線抵
抗に起因する信号遅延により、システムの処理速度が並
列バスの動作速度によって制限されることもある。ま
た、並列バス接続配線の高密度化による電磁ノイズ（Ｅ
ＭＩ：Ｅｌｅｃｔｒｏｍａｇｎｅｔｉｃ Ｉｎｔｅｒｆ
ｅｒｅｎｃｅ）の問題もシステムの処理速度向上に対す
る大きな制約となる。2. Description of the Related Art With the development of very large scale integrated circuits (VLSI), circuit functions of circuit boards (daughter boards) used in data processing systems have been greatly increased. As the number of signal connections to each circuit board increases as circuit functions increase, a data bus board (mother board) that connects each circuit board (daughter board) with a bus structure requires a large number of connectors and connection lines. Parallel architecture has been adopted. The operation speed of the parallel bus has been improved by increasing the number of connection lines and increasing the parallelism by miniaturization.However, the processing speed of the system has been reduced due to the signal delay caused by the capacitance between connection lines and the connection line resistance. It may be limited by the operating speed of the bus. In addition, electromagnetic noise (E
MI: Electromagnetic Interf
issue also becomes a major constraint on improving the processing speed of the system.
【０００３】このような問題を解決し並列バスの動作速
度の向上を図るために、光インターコネクションと呼ば
れる、システム内光接続技術を用いることが検討されて
いる。光インターコネクション技術の概要は、『内田禎
二、第９回 回路実装学術講演大会 １５Ｃ０１，ｐ
ｐ．２０１〜２０２』や『Ｈ．Ｔｏｍｉｍｕｒｏ ｅｔ
ａｌ．，“Ｐａｃｋａｇｉｎｇ Ｔｅｃｈｎｏｌｏｇｙ
ｆｏｒ Ｏｐｔｉｃａｌ Ｉｎｔｅｒｃｏｎｎｅｃｔ
ｓ”，ＩＥＥＥ Ｔｏｋｙｏ Ｎｏ．３３ ｐｐ．８１
〜８６，１９９４』、『和田修、エレクトロニクス１９
９３年４月号、ｐｐ．５２〜５５』に記載されているよ
うに、システムの構成内容により様々な形態の技術が提
案されている。In order to solve such a problem and improve the operation speed of the parallel bus, use of an in-system optical connection technique called optical interconnection has been studied. For an overview of optical interconnection technology, see "Tadaji Uchida, 9th Circuit Packaging Academic Conference, 15C01, p.
p. 201 to 202 ”and“ H. Tomimiuro et
al. , “Packaging Technology”
for Optical Interconnect
s ", IEEE Tokyo No. 33, pp. 81
-86, 1994], Osamu Wada, Electronics 19
April 93, pp. 52-55 ", various forms of technology have been proposed depending on the configuration of the system.
【０００４】[0004]
【発明が解決しようとする課題】従来提案された様々な
形態の光インターコネクション技術のうち、特開平２−
４１０４２号公報には、高速、高感度の発光／受光デバ
イスを用いた光データ伝送方式をデータバスに適用した
例が開示されており、そこには、各回路基板の表裏両面
に発光／受光デバイスを配置し、システムフレームに組
み込まれた隣接する回路基板上の発光／受光デバイス間
を空間的に光で結合した、各回路基板相互間のループ伝
送用の直列光データバスが提案されている。この方式で
は、ある１枚の回路基板から送り出された信号光が、隣
接する回路基板で光／電気変換され、さらにその回路基
板で今度は電気／光変換されて、次に隣接する回路基板
に信号光を送り出すというように、各回路基板が順次直
列に配列され各回路基板上で光／電気変換および電気／
光変換を繰り返しながらシステムフレームに組み込まれ
たすべての回路基板間に伝達される。このため、信号伝
達速度は各回路基板上に配置された受光／発光デバイス
の光／電気変換速度および電気／光変換速度に依存する
と同時にその制約を受ける。また、各回路基板相互間の
データ伝送には、各回路基板上に配置された受光／発光
デバイスによる、自由空間を介在させた光結合を用いて
いるため、隣接する回路基板表裏両面に配置されている
発光／受光デバイスの光学的位置合わせが行なわれすべ
ての回路基板が光学的に結合していることが必要とな
る。さらに、各回路基板が自由空間を介して結合されて
いるため、隣接する光データ伝送路間の干渉（クロスト
ーク）が発生しデータの伝送不良が予想される。また、
システムフレーム内の環境、例えば埃などにより信号光
が拡散することによりデータの伝送不良が発生すること
も予想される。さらに、各回路基板が直列に配置されて
いるため、いずれかのボードが取り外された場合にはそ
こで接続が途切れてしまうので、それを補うための余分
な回路基板が必要となる。すなわち、回路基板を自由に
着脱することができず、回路基板の数が固定されてしま
うという問題がある。SUMMARY OF THE INVENTION Among the various types of optical interconnection technologies that have been proposed in the past,
No. 41042 discloses an example in which an optical data transmission method using a high-speed, high-sensitivity light-emitting / light-receiving device is applied to a data bus, in which a light-emitting / light-receiving device is provided on both front and back surfaces of each circuit board. A serial optical data bus for loop transmission between circuit boards has been proposed in which light emitting / receiving devices on adjacent circuit boards incorporated in a system frame are spatially coupled by light. In this method, signal light sent from a certain circuit board is subjected to optical / electrical conversion on an adjacent circuit board, and then electrical / optical conversion on this circuit board, and then to an adjacent circuit board. Each circuit board is sequentially arranged in series such as sending out a signal light, and optical / electric conversion and electric / electrical conversion are performed on each circuit board.
The light is transmitted between all the circuit boards incorporated in the system frame while repeating the light conversion. For this reason, the signal transmission speed depends on the optical / electrical conversion speed and the electrical / optical conversion speed of the light receiving / light emitting device arranged on each circuit board, and at the same time is restricted. In addition, since data transmission between each circuit board uses optical coupling via a free space by a light receiving / light emitting device arranged on each circuit board, it is arranged on both front and back sides of an adjacent circuit board. It is necessary that the light emitting / receiving devices are optically aligned and all the circuit boards are optically coupled. Further, since the respective circuit boards are connected via a free space, interference (crosstalk) between adjacent optical data transmission lines occurs, and poor data transmission is expected. Also,
It is also anticipated that data transmission failure will occur due to the diffusion of the signal light due to the environment in the system frame, such as dust. Furthermore, since the circuit boards are arranged in series, if any one of the boards is removed, the connection will be interrupted there. Therefore, an extra circuit board is required to compensate for the disconnection. That is, there is a problem that the circuit board cannot be freely attached and detached, and the number of circuit boards is fixed.
【０００５】これらのほかに、自由空間を利用した回路
基板相互間のデータ伝送技術として、特開昭６１−１９
６２１０号公報には、平行な２面を有する、光源に対置
されたプレートを具備し、プレート表面に配置された回
折格子および反射素子により構成された光路を介して回
路基板間を光学的に結合する方式が開示されている。こ
の方式では、１点から発せられた光を固定された１点に
しか伝送することができず、電気バスのように全ての回
路ボード間を網羅的に接続することができないという問
題がある。また、自由空間を利用しているので複雑な光
学系が必要となり、位置合わせ等も難しいため、光学素
子の位置ずれに起因する、隣接する光伝送路間の干渉
（クロストーク）が発生し、データの伝送不良が予想さ
れる。さらに、回路基板間の接続情報はプレート表面に
配置された回折格子および反射素子により決定されるた
め、回路基板を自由に抜き差しすることができず拡張性
が低いというような様々な問題がある。In addition to these techniques, Japanese Patent Application Laid-Open No. 61-19 / 1986 discloses a technique for transmitting data between circuit boards using free space.
Japanese Patent No. 6210 has a plate having two parallel surfaces and opposed to a light source, and optically couples between circuit boards via an optical path constituted by a diffraction grating and a reflective element arranged on the plate surface. Is disclosed. In this method, light emitted from one point can be transmitted to only one fixed point, and there is a problem that all circuit boards cannot be exhaustively connected like an electric bus. In addition, since a free space is used, a complicated optical system is required, and it is difficult to perform positioning. For example, interference (crosstalk) between adjacent optical transmission lines due to a displacement of an optical element occurs. Poor data transmission is expected. Furthermore, since the connection information between circuit boards is determined by the diffraction grating and the reflective element arranged on the plate surface, there are various problems such that the circuit board cannot be freely inserted and removed and the expandability is low.
【０００６】本発明は、上記事情に鑑み、埃等に対する
耐性が高く、温度変化等の環境変化にも強く、システム
の拡張性に応じて回路基板の自由な着脱が容易に可能な
光バス、およびその光バスを採用した信号処理装置を提
供することを目的とする。SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides an optical bus which has high resistance to dust and the like, is resistant to environmental changes such as temperature changes, and can easily attach and detach a circuit board according to the expandability of the system. And a signal processing device employing the optical bus.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成する手段
として、入射した信号光を拡散して伝播する光バスを採
用することが考えられるが、このような光バスを単純に
作製すると、信号光の入射位置によって、ある１つの出
射位置から出射される信号光の強度が大きくばらつき、
ダイナミックレンジの広い信号光を検出する必要を生じ
る恐れがある。そのため、その広いダイナミックレンジ
に適合した回路設計を行う必要があるが、広いダイナミ
ックレンジに適合した回路設計は大変であり、Ｓ／Ｎの
低下や、コストアップを招くという問題がある。As means for achieving the above object, it is conceivable to employ an optical bus which diffuses and propagates the incident signal light. Depending on the light incident position, the intensity of the signal light emitted from a certain output position greatly varies,
There is a possibility that it is necessary to detect signal light having a wide dynamic range. Therefore, it is necessary to design a circuit suitable for the wide dynamic range. However, it is difficult to design a circuit suitable for the wide dynamic range, and there is a problem of lowering the S / N and increasing the cost.
【０００８】そこで、本発明の光バスは、上記目的を達
成するとともに、さらに、信号光の入射位置や出射位置
による、出射される信号光の強度の変化を少なくする光
バスであって、信号光が入射される信号光入射部と、信
号光が出射される信号光出射部と、上記信号光入射部か
ら入射した信号光を信号光出射部に伝播する光バス本体
とを有する光バスであって、上記信号光入射部が、入射
された信号光を光バス本体内に向けて拡散する光拡散手
段を備えるとともに、上記信号光出射部が、光バス本体
内を伝播してきた信号光を拡散してこの信号光出射部か
ら出射する光拡散手段を備えたことを特徴とする。Therefore, an optical bus according to the present invention is an optical bus which achieves the above object and further reduces a change in the intensity of the emitted signal light due to the incident position and the emission position of the signal light. An optical bus having a signal light incident portion on which light is incident, a signal light emitting portion from which the signal light is emitted, and an optical bus main body for transmitting the signal light incident from the signal light incident portion to the signal light emitting portion. The signal light incident portion includes light diffusion means for diffusing the incident signal light toward the inside of the optical bus main body, and the signal light emitting portion transmits the signal light propagating in the optical bus main body. A light diffusing means for diffusing and emitting the signal light from the signal light emitting section is provided.
【０００９】また、本発明の信号処理装置は、 （１）基体 （２）信号光を出射する信号光出射端および該信号光出
射端から出射される信号光に担持される信号を生成する
回路が搭載された第１の回路基板 （３）信号光を入射する信号光入射端および該信号光入
射端から入射した信号光が担持する信号に基づいて信号
処理を行なう回路が搭載された第２の回路基板 （４）上記基体に固定された、信号光が入射される信号
光入射部と、信号光が出射される信号光出射部と、上記
信号光入射部から入射した信号光を信号光出射部に伝搬
する光バス本体とを有し、上記信号光入射部が、入射さ
れた信号光を光バス本体内に向けて拡散する光拡散手段
を備え、上記信号光出射部が、光バス本体内を伝播して
きた信号光を拡散してこの信号光出射部から出射する光
拡散手段を備えてなる光バス （５）上記第１の回路基板および上記第２の回路基板
を、上記第１の回路基板に搭載された信号光出射端が上
記信号光入射部において上記光バスと結合されるととも
に、上記第２の回路基板に搭載された信号光入射端が上
記信号光出射部において上記光バスと結合される状態に
上記基体上に固定する基体固定部 を備えたことを特徴とする。Further, the signal processing device of the present invention comprises: (1) a base; (2) a signal light emitting end for emitting signal light; and a circuit for generating a signal carried by the signal light emitted from the signal light emitting end. (3) A signal light incident end for receiving signal light and a second circuit on which a circuit for performing signal processing based on a signal carried by the signal light incident from the signal light incident end is mounted. (4) A signal light incident portion on which the signal light is incident, a signal light emitting portion from which the signal light is emitted, and a signal light incident from the signal light incident portion are fixed to the base. An optical bus main body propagating to the light emitting unit, wherein the signal light incident unit includes light diffusing means for diffusing the incident signal light into the optical bus main unit, and the signal light emitting unit includes an optical bus main unit. The signal light that has propagated inside the body is diffused and An optical bus including light diffusing means for emitting light; (5) the first circuit board and the second circuit board are mounted on the first circuit board by a signal light emitting end at the signal light incident portion; A base fixing portion coupled to the optical bus and fixing the signal light incident end mounted on the second circuit board to the base at the signal light emitting portion so as to be coupled to the optical bus; It is characterized by having.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施形態について
説明する。図１は、本発明の第１実施形態の光バスを示
す平面図である。この光バス１０は、信号光が入射され
る信号光入射部１１と、信号光が出射される信号光出射
部１４と、信号光入射部１１から入射した信号光を信号
光出射部１４に伝播する、光バス１０本体をなす光伝送
層１６とを有している。信号光入射部１１は、入射した
信号光を光伝送層１６に向けて拡散する第１の光拡散層
１２を備えており、この光拡散層１２は光伝送層１６の
端面に接着されている。また、信号光出射部１４は、光
伝送層１６内を伝播してきた信号光を拡散してこの信号
光出射部１４から出射する第２の光拡散層１５を備えて
おり、この光拡散層１５は、光伝送層１６の、光拡散層
１２が接着された端面とは反対側の端面に接着されてい
る。Embodiments of the present invention will be described below. FIG. 1 is a plan view showing an optical bus according to the first embodiment of the present invention. The optical bus 10 has a signal light incident portion 11 into which the signal light is incident, a signal light emitting portion 14 from which the signal light is emitted, and a signal light incident from the signal light incident portion 11 propagates to the signal light emitting portion 14. And an optical transmission layer 16 forming the main body of the optical bus 10. The signal light incident portion 11 includes a first light diffusion layer 12 that diffuses the incident signal light toward the light transmission layer 16, and the light diffusion layer 12 is adhered to an end face of the light transmission layer 16. . The signal light emitting section 14 includes a second light diffusing layer 15 that diffuses the signal light propagating in the light transmission layer 16 and emits the signal light from the signal light emitting section 14. Is bonded to the end surface of the light transmission layer 16 opposite to the end surface to which the light diffusion layer 12 is bonded.
【００１１】また、この光バス１０の信号光入射部１１
側の端面１３に沿って、複数の発光素子（図１では３つ
の発光素子１７，１８，１９を示す）が配列され、この
光バス１０の信号光出射部１４側の端面２３に沿って、
複数の受光素子（この図では３つの受光素子２０，２
１，２２を示す）が配列されており、発光素子、受光素
子は、空気を介在させて、それぞれ光バス１０の信号光
入射部１１、信号光出射部１４と光学的に結合してい
る。各発光素子から信号光が出射されると、この信号光
は信号光入射部１１に入射し、信号光入射部１１が備え
ている光拡散層１２で光伝送層１６内に向けて拡散され
て光伝送層１６内を伝播し、信号光出射部１４が有する
光拡散層１５で拡散してこの信号光出射部１４から出射
し、各受光素子で受光される。The signal light incident portion 11 of the optical bus 10
A plurality of light-emitting elements (three light-emitting elements 17, 18, and 19 are shown in FIG. 1) are arranged along the end face 13 on the side of the optical bus 10, and along the end face 23 of the optical bus 10 on the signal light emitting part 14 side,
A plurality of light receiving elements (three light receiving elements 20, 2 in this figure)
1 and 22) are arranged, and the light emitting element and the light receiving element are optically coupled to the signal light incident part 11 and the signal light emitting part 14 of the optical bus 10 with air interposed therebetween. When the signal light is emitted from each light emitting element, the signal light enters the signal light incident portion 11 and is diffused into the light transmission layer 16 by the light diffusion layer 12 provided in the signal light incident portion 11. The light propagates through the light transmission layer 16, is diffused by the light diffusion layer 15 of the signal light emitting unit 14, is emitted from the signal light emitting unit 14, and is received by each light receiving element.
【００１２】この光バス１０の光伝送層１６は、厚さ１
ｍｍ、一辺の長さ１５０ｍｍの正方形状に成形されたＰ
ＭＭＡ（ポリメチルメタクリレート）で作製されてい
る。また、光伝送層１６の端面に接着された光拡散層１
２，１５には、シリカ系の顔料が混入された厚さ１０μ
ｍのアクリル系樹脂層をポリエステルフィルム上に形成
して作製された光拡散フィルムを用いており、この光拡
散フィルムの拡散特性は完全拡散分布にほぼ等しい。発
光素子は、発振波長６８０ｎｍ、出力強度３ｍＷのレー
ザダイオードであり、受光素子は受光径０．７ｍｍのＳ
ｉフォトダイオードである。The optical transmission layer 16 of the optical bus 10 has a thickness of 1
mm, P formed into a square shape with a side length of 150 mm
It is made of MMA (polymethyl methacrylate). The light diffusion layer 1 bonded to the end face of the light transmission layer 16
2 and 15 have a thickness of 10 μm mixed with a silica pigment.
A light diffusion film produced by forming an acrylic resin layer of m on a polyester film is used, and the diffusion characteristics of this light diffusion film are almost equal to the perfect diffusion distribution. The light emitting element is a laser diode having an oscillation wavelength of 680 nm and an output intensity of 3 mW, and the light receiving element is a S diode having a light receiving diameter of 0.7 mm.
i photodiode.
【００１３】このように構成された光バス１０は、信号
光出射部１４が光拡散層１５を備えている。ここで、信
号光出射部に光拡散層を備えていない光バスについて考
えると、この光バスの信号光出射部側の端面に臨界角よ
りも大きい入射角で信号光が伝播する場合、この信号光
はこの端面で全反射するため、信号光出射部から信号光
は出射されず、つまり受光素子で信号光は受光されない
が、図１に示す光バス１０においては、上記のように信
号光出射部１４が光拡散層１５を備えているため、光伝
送層１６から信号光出射部１４に伝播する信号光が臨界
角よりも大きい入射角で信号光出射部１４に伝播して
も、この信号光は信号光出射部１４が有する光拡散層１
５で拡散されてこの信号光出射部１４から出射される。
従って、いずれの受光素子でも信号光が受光される。In the optical bus 10 thus configured, the signal light emitting section 14 includes the light diffusion layer 15. Here, considering an optical bus having no light diffusion layer in the signal light emitting portion, if the signal light propagates to the end face of the optical bus on the signal light emitting portion side at an incident angle larger than the critical angle, this signal Since the light is totally reflected at this end face, the signal light is not emitted from the signal light emitting portion, that is, the signal light is not received by the light receiving element. However, in the optical bus 10 shown in FIG. Since the unit 14 includes the light diffusion layer 15, even if the signal light propagating from the optical transmission layer 16 to the signal light emitting unit 14 propagates to the signal light emitting unit 14 at an incident angle larger than the critical angle, this signal The light is the light diffusion layer 1 of the signal light emitting unit 14.
5 and is emitted from the signal light emitting unit 14.
Therefore, any of the light receiving elements receives the signal light.
【００１４】また、この光バス１０は、上記のように信
号光出射部１４が光拡散層１５を備えているため、光伝
送層１６から信号光出射部１４に入射した信号光は、光
バスの厚さ方向や受光素子の配列方向に広がりながら拡
散する。ここで、信号光出射部に光拡散層を備えていな
い光バスについて考えると、この光バスの信号光出射部
側の端面に臨界角よりも小さい入射角で伝播する信号光
のうち、この信号光出射部に対してほぼ垂直に伝播する
信号光は、信号光出射部での反射成分がほとんどないた
め、この信号光の大部分は信号光出射部から出射されて
受光素子で受光されるが、図１に示す光バス１０におい
ては、信号光が信号光出射部１４に対しほぼ垂直に伝播
しても、この信号光は、光バス１０の厚さ方向や受光素
子の配列方向に広がりながら拡散するため、信号光出射
部に光拡散層を備えていない光バスと比較すると、受光
素子で受光される信号光の強度は小さくなる。Further, in the optical bus 10, since the signal light emitting section 14 includes the light diffusion layer 15 as described above, the signal light incident on the signal light emitting section 14 from the optical transmission layer 16 is transmitted to the optical bus. While spreading in the thickness direction of the light-receiving element and the arrangement direction of the light-receiving elements. Here, considering an optical bus that does not include a light diffusion layer in the signal light emitting portion, of the signal light propagating at an incident angle smaller than the critical angle to the end face of the optical bus on the signal light emitting portion side, Since the signal light propagating almost perpendicularly to the light emitting portion has almost no reflection component at the signal light emitting portion, most of the signal light is emitted from the signal light emitting portion and received by the light receiving element. In the optical bus 10 shown in FIG. 1, even if the signal light propagates almost perpendicularly to the signal light emitting portion 14, the signal light spreads in the thickness direction of the optical bus 10 and the arrangement direction of the light receiving elements. Since the light is diffused, the intensity of the signal light received by the light receiving element is smaller than that of the optical bus having no light diffusion layer in the signal light emitting unit.
【００１５】従って、図１に示す光バス１０は、ある１
つの発光素子から信号光を出射した場合、各受光素子で
受光される信号光の強度のばらつきが抑制され、これに
より、この光バス１０に、異なる発光素子（例えば、発
光素子１７と、発光素子１９）から信号光を入射して
も、発光素子による、ある１つの受光素子で受光される
信号光の強度のばらつきが抑制される。Therefore, the optical bus 10 shown in FIG.
When the signal light is emitted from the two light emitting elements, the variation in the intensity of the signal light received by each light receiving element is suppressed, whereby different light emitting elements (for example, light emitting element 17 and light emitting element Even if the signal light is incident from 19), the variation in the intensity of the signal light received by one light receiving element due to the light emitting element is suppressed.
【００１６】尚、図１に示す光バス１０が有する光拡散
層１２，１５は、シリカ系の顔料が混入されたアクリル
系樹脂層をポリエステルフィルム上に形成して作製され
ているが、顔料および樹脂層は、互いの屈折率が異なっ
ていれば、顔料の材料と樹脂層の材料との組合せは任意
であり、顔料としては、シリカ以外にルチル、亜鉛華な
どが適用でき、樹脂層としてはアクリル以外にもエポキ
シなどが適用できる。The light diffusion layers 12 and 15 of the optical bus 10 shown in FIG. 1 are formed by forming an acrylic resin layer mixed with a silica pigment on a polyester film. As long as the resin layer has a different refractive index, the combination of the material of the pigment and the material of the resin layer is arbitrary.As the pigment, rutile, zinc white, etc. can be applied in addition to silica. Epoxy or the like can be applied in addition to acrylic.
【００１７】また、光拡散層１２，１５には、光拡散フ
ィルムが用いられているが、光拡散作用を示すものであ
れば光拡散フィルム以外でもよく、例えば、ランダム配
向状態で固化した液晶性高分子層を用いたり、光バスの
信号光出射部側の端面をサンドブラスト法などによって
粗面化してもよい。また、図１に示す光バス１０は、光
伝送層１６を伝播し光拡散層１５で拡散する信号光のう
ちの、この光拡散層１５を透過する信号光を受光素子で
受光しており、光伝送層１６を伝播する信号光が効率よ
く受光素子で受光されるためには、光拡散層１５は、光
拡散層１５を透過する信号光の強度が、光拡散層１５で
反射し光伝送層１６内部に向かう信号光の強度より大き
い強度を示すように信号光を拡散させるものが好まし
い。Light diffusing films are used for the light diffusing layers 12 and 15, but other light diffusing films may be used as long as they exhibit a light diffusing action. A polymer layer may be used, or the end surface of the optical bus on the signal light emitting portion side may be roughened by sandblasting or the like. The optical bus 10 shown in FIG. 1 receives the signal light transmitted through the light diffusion layer 15 of the signal light transmitted through the light transmission layer 16 and diffused by the light diffusion layer 15 by a light receiving element. In order for the signal light propagating through the light transmission layer 16 to be efficiently received by the light receiving element, the light diffusion layer 15 reflects the intensity of the signal light transmitted through the light diffusion layer 15 at the light diffusion layer 15 and transmits light. It is preferable that the signal light is diffused so as to exhibit an intensity higher than the intensity of the signal light traveling toward the inside of the layer 16.
【００１８】図２は、本発明の第２実施形態のシート状
に形成された光バスの断面図である。この断面図は、光
バスの厚さ方向の断面図である。この光バス４０は、信
号光が入射される信号光入射部４１と、信号光が出射さ
れる信号光出射部４４と、信号光入射部４１から入射し
た信号光を信号光出射部４４に伝播する、光バス４０本
体をなす光伝送層４６とを有している。信号光入射部４
１は、入射された信号光を光伝送層４６に向けて拡散す
る光拡散層４２を備えており、この光拡散層４２は、光
伝送層４６の端面に接着されている。また、信号光出射
部４４は、光バス４０の信号光入射部４１側とは反対側
に設けられており、この信号光出射部４４は、光伝送層
４６を伝播してきた信号光を拡散しながら反射させ、こ
の信号光出射部４４から出射する光拡散層４５を備えて
いる。光伝送層４６の、光拡散層４２が接着された端面
とは反対側の端面は、この光伝送層４６の表裏面に対し
斜めにカットされており、この斜めにカットされた端面
に、信号光出射部４４が備えている光拡散層４５が接着
されている。FIG. 2 is a sectional view of a sheet-shaped optical bus according to a second embodiment of the present invention. This sectional view is a sectional view in the thickness direction of the optical bus. The optical bus 40 includes a signal light incident portion 41 into which the signal light is incident, a signal light emitting portion 44 from which the signal light is emitted, and a signal light incident from the signal light incident portion 41 propagates to the signal light emitting portion 44. And an optical transmission layer 46 forming an optical bus 40 main body. Signal light entrance 4
1 includes a light diffusion layer 42 for diffusing incident signal light toward the light transmission layer 46, and the light diffusion layer 42 is bonded to an end face of the light transmission layer 46. Further, the signal light emitting section 44 is provided on the opposite side of the optical bus 40 from the signal light incident section 41 side, and the signal light emitting section 44 diffuses the signal light propagating through the optical transmission layer 46. A light diffusion layer 45 that reflects light while emitting from the signal light emitting unit 44 is provided. The end surface of the light transmission layer 46 opposite to the end surface to which the light diffusion layer 42 is adhered is cut obliquely to the front and back surfaces of the light transmission layer 46, and the obliquely cut end surface is provided with a signal. The light diffusion layer 45 of the light emitting section 44 is adhered.
【００１９】また、光バス４０の信号光入射部４１側の
端面４３に沿って、複数の発光素子（図２では１つの発
光素子４７のみを示す）が配列され、光バス４０の信号
光出射部４４側の上方には、この信号光出射部４４に沿
って、複数の受光素子（図２では１つの受光素子４８の
みを示す）が配列されており、発光素子４７から信号光
が出射されると、この信号光は信号光入射部４１に入射
し、信号光入射部４１が備えている光拡散層４２で光伝
送層４６に向けて拡散され、信号光出射部４４に伝播す
る。この信号光出射部４４に伝播してきた信号光は、光
拡散層４５で受光素子４８に向けて拡散しながら反射し
てこの信号光出射部４４から出射され、受光素子４８で
受光される。A plurality of light emitting elements (only one light emitting element 47 is shown in FIG. 2) are arranged along the end face 43 of the optical bus 40 on the signal light incident part 41 side. Above the unit 44 side, a plurality of light receiving elements (only one light receiving element 48 is shown in FIG. 2) are arranged along the signal light emitting unit 44, and signal light is emitted from the light emitting element 47. Then, the signal light enters the signal light incident portion 41, is diffused toward the light transmission layer 46 by the light diffusion layer 42 provided in the signal light incident portion 41, and propagates to the signal light emitting portion 44. The signal light that has propagated to the signal light emitting unit 44 is reflected by the light diffusion layer 45 while being diffused toward the light receiving element 48, emitted from the signal light emitting unit 44, and received by the light receiving element 48.
【００２０】信号光出射部は、図２に示すように、光伝
送層内を伝播してきた信号光を受光素子に向けて拡散さ
せながら反射させてこの信号光出射部から出射する光拡
散層を備えてもよい。図２に示す光バス４０は、光伝送
層４６を伝播し光拡散層４５で拡散する信号光のうち
の、この光拡散層４５で反射する信号光を受光素子で受
光しており、光伝送層４６を伝播する信号光が効率よく
受光素子で受光されるためには、光拡散層４５は、光拡
散層４５を反射する信号光の強度が、光拡散層４５を透
過する信号光の強度より大きい強度を示すように信号光
を拡散させるものが好ましい。As shown in FIG. 2, the signal light emitting portion reflects the signal light propagating in the optical transmission layer while diffusing the signal light toward the light receiving element, and forms a light diffusion layer emitted from the signal light emitting portion. May be provided. The optical bus 40 shown in FIG. 2 receives the signal light reflected by the light diffusion layer 45 out of the signal light propagated through the light transmission layer 46 and diffused by the light diffusion layer 45 by the light receiving element. In order for the signal light propagating through the layer 46 to be efficiently received by the light receiving element, the light diffusion layer 45 must have the intensity of the signal light reflected by the light diffusion layer 45 and the intensity of the signal light transmitted by the light diffusion layer 45. It is preferable that the signal light is diffused so as to exhibit a higher intensity.
【００２１】図３は、本発明の信号処理装置の一実施形
態を示す構成概略図である。図３に示す信号処理装置６
０を構成する基体５１表面には光バス５０が固定されて
いる。この光バス５０は、図１に示す光バス１０をクラ
ッド層５２で挟んだものと、光吸収層５３とを交互に積
層して構成されている。また、信号処理装置６０は、発
光素子５４、受光素子５５、および電子回路５６が搭載
された回路基板５７と、基体固定部５８とを備えてお
り、この基体固定部５８は、回路基板５７に搭載された
発光素子５４が光バス５０の信号光入射部１１において
光バス５０と結合されるとともに、受光素子５５が光バ
ス５０の信号光出射部１４において、光バス５０と結合
される状態に基板５１上に固定する。FIG. 3 is a schematic diagram showing an embodiment of the signal processing apparatus according to the present invention. Signal processing device 6 shown in FIG.
The optical bus 50 is fixed to the surface of the base 51 constituting the optical bus 50. This optical bus 50 is configured by alternately stacking the optical bus 10 shown in FIG. 1 sandwiched between cladding layers 52 and light absorbing layers 53. Further, the signal processing device 60 includes a circuit board 57 on which the light emitting element 54, the light receiving element 55, and the electronic circuit 56 are mounted, and a base fixing part 58. The base fixing part 58 The mounted light emitting element 54 is coupled to the optical bus 50 at the signal light incident section 11 of the optical bus 50, and the light receiving element 55 is coupled to the optical bus 50 at the signal light emitting section 14 of the optical bus 50. It is fixed on a substrate 51.
【００２２】このように構成された信号処理装置６０
は、電子回路５６で処理された電気信号が発光素子５４
で信号光に変換されると、この信号光は信号光入射部１
１に入射し、信号光入射部１１が備えている光拡散層１
２で光伝送層１６に向けて拡散され、信号光出射部１４
に伝播する。この信号光出射部１４に伝播してきた信号
光は、光拡散層１５で拡散してこの信号光出射部１４か
ら出射され、受光素子５５で受光される。受光素子５５
で受光された信号光は、電気信号に変換され、この電気
信号は、別の回路基板５７の電子回路５６に入力され
る。The signal processing device 60 thus configured
Means that the electric signal processed by the electronic circuit 56 is
Is converted into a signal light by the signal light incidence unit 1
1 and the light diffusion layer 1 included in the signal light incidence unit 11
2, the light is diffused toward the optical transmission layer 16 and the signal light emitting portion 14
Propagate to The signal light that has propagated to the signal light emitting unit 14 is diffused by the light diffusion layer 15, emitted from the signal light emitting unit 14, and received by the light receiving element 55. Light receiving element 55
Is converted into an electric signal, and this electric signal is input to an electronic circuit 56 of another circuit board 57.
【００２３】この信号処理装置６０の光バス５０は、ク
ラッド層５２および光吸収層５３を備えているため、隣
り合う光伝送層間の信号光のクロストークが抑制され
る。また、この信号処理装置６０は、光バス５０を備え
ているため、信号光の入射位置や出射位置による、光バ
ス５０から出射される信号光の強度の変化は少なく、回
路基板に搭載される電子回路の設計が容易であり、Ｓ／
Ｎの向上や、コストダウンが図られる。Since the optical bus 50 of the signal processing device 60 includes the cladding layer 52 and the light absorbing layer 53, crosstalk of signal light between adjacent optical transmission layers is suppressed. Further, since the signal processing device 60 includes the optical bus 50, the intensity of the signal light emitted from the optical bus 50 changes little depending on the incident position and the emission position of the signal light, and is mounted on the circuit board. Electronic circuit design is easy and S /
N can be improved and costs can be reduced.
【００２４】さらに、本発明の信号処理装置は、回路基
板それぞれが基体固定部に固定されると同時に、その回
路基板に搭載された発光素子および受光素子が光バスと
光学的に結合されるように構成され、微妙な位置合わせ
は不要となる。Further, in the signal processing device of the present invention, each of the circuit boards is fixed to the base fixing portion, and at the same time, the light emitting element and the light receiving element mounted on the circuit board are optically coupled to the optical bus. And fine positioning is not required.
【００２５】[0025]
【実施例】以下、本発明の実施例について説明する。こ
こに示す実施例では図１に示す光バスを用い、比較例で
は、信号光出射部に光拡散手段を備えていない単純な構
成の光バスを用いた。以下に、この比較例の光バスの構
成について説明し、その後、実施例、比較例それぞれの
光バスを用いて行なった実験結果について説明する。Embodiments of the present invention will be described below. In the embodiment shown here, the optical bus shown in FIG. 1 was used, and in the comparative example, an optical bus having a simple configuration in which the signal light emitting portion was not provided with the light diffusing means was used. Hereinafter, the configuration of the optical bus of this comparative example will be described, and then, the results of experiments performed using the optical bus of each of the example and the comparative example will be described.
【００２６】図４は、比較例の光バスを示す平面図であ
る。この図の説明にあたっては、図１と同一の構成要素
には図１に付した符号と同一の符号を付して示し、図１
との相違点のみについて説明する。図１と図４との相違
点は、図４に示す光バス３０の信号光出射部３１が、図
１に示す光バス１０の信号光出射部１４が備えている光
拡散層１５は備えていない点のみである。FIG. 4 is a plan view showing an optical bus of a comparative example. In the description of this figure, the same components as those in FIG. 1 are denoted by the same reference numerals as those in FIG.
Only the differences from the above will be described. The difference between FIG. 1 and FIG. 4 is that the signal light emitting section 31 of the optical bus 30 shown in FIG. 4 has the light diffusion layer 15 provided in the signal light emitting section 14 of the optical bus 10 shown in FIG. There is no point.
【００２７】図５は、図１、図４に示す各受光素子で受
光される信号光の強度を示すグラフである。グラフの横
軸は、実施例、比較例それぞれの光バスにおいて、図
１、図４に示す直線ＯＯ’と各受光素子との間の距離
（以下、受光素子位置と呼び、また、直線ＯＯ’と各発
光素子との間の距離を発光素子位置と呼ぶ）を示してお
り、グラフの縦軸は、実施例、比較例それぞれの光バス
において、発光素子位置が５ｍｍである発光素子（図
１，図４に示す発光素子１７）から光を出射した時の各
受光素子で受光された信号光の強度を示す。黒丸は、実
施例の光バスを用いたときの結果であり、白丸は比較例
の光バスを用いたときの結果である。FIG. 5 is a graph showing the intensity of signal light received by each of the light receiving elements shown in FIGS. The horizontal axis of the graph represents the distance between the straight line OO ′ shown in FIGS. 1 and 4 and each light receiving element (hereinafter referred to as the light receiving element position, and the straight line OO ′) in each of the optical buses of the embodiment and the comparative example. The vertical axis of the graph indicates the light emitting element (FIG. 1) in which the light emitting element position is 5 mm in each of the optical buses of the embodiment and the comparative example. 4 shows the intensity of signal light received by each light receiving element when light is emitted from the light emitting element 17) shown in FIG. The black circles show the results when the optical bus of the example was used, and the white circles show the results when the optical bus of the comparative example was used.
【００２８】比較例の光バス３０では、光伝送層１６か
ら信号光出射部３１に伝播する信号光が臨界角よりも大
きい入射角で信号光出射部３１に伝播すると、この信号
光は、光バス３０の、信号光出射部３１側の端面２３で
全反射する。この比較例の光バス３０では、光伝送層１
６はＰＭＭＡを用いて製造されており、このＰＭＭＡを
用いて製造された光伝送層１６の屈折率は１．４９であ
り、また、空気の屈折率はほぼ１であるから、信号光出
射部３１に向かって伝播する信号光に関する臨界角θc
は、θc ＝ｓｉｎ-1（１／１．４９）＝４２．１°とな
る。従って、臨界角θc ＝４２．１°よりも大きい入射
角で信号光出射部３１に向かう信号光は信号光出射部３
１側の端面２３で全反射し、比較例の光バス３０では、
発光素子１７から信号光を出射した場合、図５に示すよ
うに、受光素子位置が１４０ｍｍ以上の位置にある受光
素子では、受光される信号光の強度はほとんどゼロであ
る。また、臨界角θc ＝４２．１°よりも小さい入射角
で信号光出射部３１に向かう信号光であっても、この入
射角が臨界角に近づく程、端面２３での反射成分が増大
するため、信号光出射部３１から出射される信号光の強
度は、受光素子の配列方向で大きくばらつき、図５に示
すように、受光素子位置が大きくなるに伴ない、受光素
子で受光される信号光の強度は小さくなる。In the optical bus 30 of the comparative example, when the signal light propagating from the optical transmission layer 16 to the signal light emitting unit 31 propagates to the signal light emitting unit 31 at an incident angle larger than the critical angle, the signal light is The light is totally reflected by the end surface 23 of the bus 30 on the signal light emitting unit 31 side. In the optical bus 30 of this comparative example, the optical transmission layer 1
6 is manufactured using PMMA. Since the refractive index of the optical transmission layer 16 manufactured using this PMMA is 1.49 and the refractive index of air is almost 1, the signal light emitting section is manufactured. Critical angle θ c for the signal light propagating toward 31
Is θ c = sin −1 (1 / 1.49) = 42.1 °. Therefore, the signal light traveling toward the signal light emitting unit 31 at an incident angle larger than the critical angle θ c = 42.1 ° is emitted from the signal light emitting unit 3.
The light is totally reflected by the end face 23 on one side, and in the optical bus 30 of the comparative example,
When the signal light is emitted from the light emitting element 17, as shown in FIG. 5, the intensity of the received signal light is almost zero in the light receiving element whose light receiving element position is 140 mm or more. Further, even if the signal light travels toward the signal light emitting unit 31 at an incident angle smaller than the critical angle θ c = 42.1 °, the reflection component at the end face 23 increases as the incident angle approaches the critical angle. Therefore, the intensity of the signal light emitted from the signal light emitting unit 31 greatly varies in the arrangement direction of the light receiving elements, and as shown in FIG. The light intensity decreases.
【００２９】一方、実施例の光バス１０は、信号光出射
部１４が光拡散層１５を備えているため、光伝送層１６
から信号光出射部１４に伝播する信号光が臨界角よりも
大きい入射角で信号光出射部１４に伝播しても、この信
号光は信号光出射部１４が有する光拡散層１５で拡散さ
れてこの信号光出射部１４から出射され、図５に示すよ
うに、受光素子位置が１４０ｍｍ以上の位置にある受光
素子であっても、１．５μＷ〜２．０μＷ程度の強度の
信号光が受光されている。On the other hand, in the optical bus 10 of the embodiment, since the signal light emitting portion 14 includes the light diffusion layer 15,
Even if the signal light propagating from the signal light to the signal light emitting unit 14 propagates to the signal light emitting unit 14 at an incident angle larger than the critical angle, the signal light is diffused by the light diffusion layer 15 of the signal light emitting unit 14. As shown in FIG. 5, even if the light receiving element is located at a position of 140 mm or more, the signal light having an intensity of about 1.5 μW to 2.0 μW is received. ing.
【００３０】また、実施例の光バス１０では、信号光出
射部１４が光拡散層１５を備えているため、信号光出射
部１４に向かって伝播する信号光がこの信号光出射部１
４に対してほぼ垂直に伝播する信号光であっても、この
信号光は、光拡散層１５により光バス１０の厚さ方向や
受光素子の配列方向に広がりながら拡散するが、比較例
の光バス３０では、信号光が信号光出射部３１に対して
ほぼ垂直に伝播しても、この信号光は端面２３での反射
成分がほとんどなく、この信号光の大部分は信号光出射
部３１から出射されるため、実施例の光バス１０は、比
較例の光バス３０と比較すると、受光素子で受光される
信号光の強度は小さくなる。実施例１の光バス１０で
は、図５に示すように、受光素子位置が０ｍｍから８０
ｍｍの範囲では、比較例の光バス３０よりも受光素子で
受光される信号光の強度が小さくなっている。図５のグ
ラフから、実施例の光バス１０は、比較例の光バス３０
よりも、受光素子位置による、受光される信号光の強度
のばらつきが小さいことがわかる。Further, in the optical bus 10 of the embodiment, since the signal light emitting section 14 includes the light diffusion layer 15, the signal light propagating toward the signal light emitting section 14 emits the signal light.
4, the signal light is diffused by the light diffusion layer 15 while spreading in the thickness direction of the optical bus 10 and the arrangement direction of the light receiving elements. In the bus 30, even if the signal light propagates almost perpendicularly to the signal light emitting unit 31, the signal light has almost no reflection component on the end face 23, and most of the signal light is transmitted from the signal light emitting unit 31. Since the light is emitted, the intensity of the signal light received by the light receiving element of the optical bus 10 of the embodiment is smaller than that of the optical bus 30 of the comparative example. In the optical bus 10 of the first embodiment, as shown in FIG.
In the range of mm, the intensity of the signal light received by the light receiving element is smaller than that of the optical bus 30 of the comparative example. From the graph of FIG. 5, the optical bus 10 of the embodiment is different from the optical bus 30 of the comparative example.
It can be seen that the variation in the intensity of the received signal light depending on the position of the light receiving element is smaller than that of the light receiving element.
【００３１】図６は、図１、図４に示す各発光素子から
信号光を出射した際の、ある一つの受光素子で受光され
た信号光の強度を示すグラフである。グラフの横軸は、
実施例、比較例それぞれの光バスにおいて、信号光入射
部に沿って並ぶ発光素子の発光素子位置を示しており、
グラフの縦軸は、実施例、比較例それぞれの光バスにお
いて、各発光素子から光を出射したときの、受光素子位
置が５ｍｍである受光素子（図１，図４に示す受光素子
２０）で受光された信号光の強度を示す。黒丸は、実施
例の光バスを用いたときの結果であり、白丸は比較例の
光バスを用いたときの結果である。FIG. 6 is a graph showing the intensity of signal light received by one light receiving element when the signal light is emitted from each light emitting element shown in FIGS. The horizontal axis of the graph is
In each of the optical buses of the example and the comparative example, the light emitting element positions of the light emitting elements arranged along the signal light incident portion are shown.
The vertical axis of the graph indicates a light receiving element (light receiving element 20 shown in FIGS. 1 and 4) whose light receiving element position is 5 mm when light is emitted from each light emitting element in each of the optical buses of the embodiment and the comparative example. This shows the intensity of the received signal light. The black circles show the results when the optical bus of the example was used, and the white circles show the results when the optical bus of the comparative example was used.
【００３２】比較例の光バス３０では、発光素子位置が
１３５ｍｍである発光素子から信号光を出射した場合、
図６に示すように、受光素子位置が１４５ｍｍである受
光素子で受光される信号光の強度はほとんどゼロであ
り、また、臨界角θc ＝４２．１°よりも小さい入射角
で信号光出射部３１に向かう信号光であっても、この入
射角が臨界角に近づく程、端面２３での反射成分が増大
するため、受光素子で受光される信号光の強度は、発光
素子位置により大きくばらつき、図６に示すように、発
光素子位置が大きくなるに伴ない、受光素子で受光され
る信号光の強度は小さくなる。In the optical bus 30 of the comparative example, when signal light is emitted from a light emitting element whose light emitting element position is 135 mm,
As shown in FIG. 6, the intensity of the signal light received by the light receiving element whose light receiving element position is 145 mm is almost zero, and the signal light is emitted at an incident angle smaller than the critical angle θ c = 42.1 °. Even if the signal light travels toward the portion 31, as the incident angle approaches the critical angle, the reflection component at the end face 23 increases, so that the intensity of the signal light received by the light receiving element greatly varies depending on the position of the light emitting element. As shown in FIG. 6, as the position of the light emitting element increases, the intensity of the signal light received by the light receiving element decreases.
【００３３】一方、実施例の光バス１０は、信号光出射
部１４が光拡散層１５を備えているため、光伝送層１６
から信号光出射部１４に伝播する信号光が臨界角よりも
大きい入射角で信号光出射部１４に伝播しても、この信
号光は信号光出射部１４が有する光拡散層１５で拡散さ
れてこの信号光出射部１４から出射され、図６に示すよ
うに、発光素子位置が１４５ｍｍの位置にある発光素子
であっても、１μＷ程度の強度の信号光が受光されてい
る。On the other hand, in the optical bus 10 of the embodiment, since the signal light emitting portion 14 includes the light diffusion layer 15,
Even if the signal light propagating from the signal light to the signal light emitting unit 14 propagates to the signal light emitting unit 14 at an incident angle larger than the critical angle, the signal light is diffused by the light diffusion layer 15 of the signal light emitting unit 14. As shown in FIG. 6, even the light emitting element whose light emitting element position is at a position of 145 mm receives signal light having an intensity of about 1 μW, as shown in FIG.
【００３４】また、実施例の光バス１０では、信号光出
射部１４に対してほぼ垂直に信号光が伝播しても、光拡
散層１５により光バス１０の厚さ方向や受光素子の配列
方向に広がりながら拡散するが、比較例の光バス３０で
は、信号光出射部３１に対してほぼ垂直に信号光が伝播
すると、この信号光は端面２３での反射成分がほとんど
なく、この信号光の大部分は信号光出射部３１から出射
されるため、実施例の光バス１０は、比較例の光バス３
０と比較すると、受光素子で受光される信号光の強度は
小さくなる。実施例１の光バス１０では、図６に示すよ
うに、発光素子位置が０ｍｍから７５ｍｍの範囲では、
比較例の光バス３０よりも受光素子で受光される信号光
の強度が小さくなっている。図６のグラフから、図１に
示す光バス１０は、比較例の光バス３０よりも、発光素
子位置による、受光素子で受光される信号光の強度のば
らつきが小さいことがわかる。Further, in the optical bus 10 of the embodiment, even if the signal light propagates almost perpendicularly to the signal light emitting portion 14, the light diffusion layer 15 causes the thickness direction of the optical bus 10 and the arrangement direction of the light receiving elements. In the optical bus 30 of the comparative example, when the signal light propagates almost perpendicularly to the signal light emitting unit 31, the signal light has almost no reflection component at the end face 23, and the signal light Since most of the light is emitted from the signal light emitting unit 31, the optical bus 10 of the example is different from the optical bus 3 of the comparative example.
Compared with 0, the intensity of the signal light received by the light receiving element is smaller. In the optical bus 10 of the first embodiment, as shown in FIG. 6, when the position of the light emitting element is in the range of 0 mm to 75 mm,
The intensity of the signal light received by the light receiving element is lower than that of the optical bus 30 of the comparative example. From the graph of FIG. 6, it can be seen that the optical bus 10 shown in FIG. 1 has a smaller variation in the intensity of the signal light received by the light receiving element depending on the light emitting element position than the optical bus 30 of the comparative example.
【００３５】図５、図６のグラフに示した結果から、本
発明の光バスを用いることにより、Ｓ／Ｎの向上や、コ
ストダウンが図られた信号処理装置が得られることがわ
かる。From the results shown in the graphs of FIG. 5 and FIG. 6, it is understood that the use of the optical bus of the present invention can provide a signal processing device with improved S / N and reduced cost.
【００３６】[0036]
【発明の効果】以上説明したように、本発明の光バスに
よれば、温度変化等があっても信号光入射部から入射し
た信号光は確実に信号光出射部から出射される。また、
本発明の光バスによれば、信号光の入射位置や出射位置
による、出射される信号光の強度の変化は少ない。As described above, according to the optical bus of the present invention, the signal light incident from the signal light incident portion is surely emitted from the signal light emitting portion even if there is a temperature change or the like. Also,
According to the optical bus of the present invention, the intensity of the emitted signal light varies little depending on the incident position and the emission position of the signal light.
【００３７】また、本発明の信号処理装置によれば、Ｓ
／Ｎの向上や、コストダウンが図られる。According to the signal processing device of the present invention, S
/ N and cost reduction.
【図１】本発明の第１実施形態の光バスを示す平面図で
ある。FIG. 1 is a plan view showing an optical bus according to a first embodiment of the present invention.
【図２】本発明の第２実施形態の光バスの断面図であ
る。FIG. 2 is a sectional view of an optical bus according to a second embodiment of the present invention.
【図３】本発明の信号処理装置の一実施形態を示す構成
概略図である。FIG. 3 is a schematic configuration diagram illustrating an embodiment of a signal processing device of the present invention.
【図４】信号光出射部に光拡散層をもたない光バスを示
す平面図である。FIG. 4 is a plan view showing an optical bus having no light diffusion layer in a signal light emitting unit.
【図５】図１、図４に示す各受光素子で受光される信号
光の強度を示すグラフである。FIG. 5 is a graph showing the intensity of signal light received by each light receiving element shown in FIGS. 1 and 4;
【図６】図１、図４に示す各発光素子から信号光を出射
した際の、ある一つの受光素子で受光される信号光の強
度を示すグラフである。FIG. 6 is a graph showing the intensity of signal light received by one light receiving element when the signal light is emitted from each light emitting element shown in FIGS. 1 and 4;
【符号の説明】 １０，４０，５０ 光バス １１，４１ 信号光入射部 １２，１５，４２，４５ 光拡散層 １３，２３，４３ 端面 １４，４４ 信号光出射部 １６，４６ 光伝送層 １７，１８，１９，４７，５４ 発光素子 ２０，２１，２２，４８，５５ 受光素子 ５１ 基板 ５２ クラッド層 ５３ 光吸収層 ５６ 電子回路 ５７ 回路基板 ５８ 基体固定部[Description of Signs] 10, 40, 50 Optical bus 11, 41 Signal light incident part 12, 15, 42, 45 Light diffusion layer 13, 23, 43 End face 14, 44 Signal light emitting part 16, 46 Optical transmission layer 17, 18, 19, 47, 54 Light emitting element 20, 21, 22, 48, 55 Light receiving element 51 Substrate 52 Cladding layer 53 Light absorbing layer 56 Electronic circuit 57 Circuit board 58 Base fixing portion
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０４Ｂ 10/12 (72)発明者 塩谷 剛和 神奈川県足柄上郡中井町境430 グリーン テクなかい 富士ゼロックス株式会社内 (72)発明者 逆井 一宏 神奈川県足柄上郡中井町境430 グリーン テクなかい 富士ゼロックス株式会社内 (72)発明者 浜田 勉 神奈川県足柄上郡中井町境430 グリーン テクなかい 富士ゼロックス株式会社内 (72)発明者 舟田 雅夫 神奈川県足柄上郡中井町境430 グリーン テクなかい 富士ゼロックス株式会社内 (72)発明者 小澤 隆 神奈川県足柄上郡中井町境430 グリーン テクなかい 富士ゼロックス株式会社内──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI H04B 10/12 (72) Inventor Gowa Shiotani 430 Border, Nakai-cho, Ashigara-gun, Kanagawa Prefecture Green Tech Nakai Inside Fuji Xerox Co., Ltd. (72) Inventor Kazuhiro Sakai 430 Nakaicho, Nakaicho, Ashigara-gun, Kanagawa Prefecture Green Tech Nakai, Fuji Xerox Co., Ltd. 430 Green Sakai Naka-cho, Fuji Xerox Co., Ltd. (72) Inventor Takashi Ozawa 430 Sakai Nakaicho, Ashigara-gun, Kanagawa Green Tech Nakai Inside Fuji Xerox Co., Ltd.
Claims (2)
号光が出射される信号光出射部と、前記信号光入射部か
ら入射した信号光を信号光出射部に伝播する光バス本体
とを有する光バスであって、 前記信号光入射部が、入射した信号光を光バス本体内に
向けて拡散する第１の光拡散手段を備えるとともに、 前記信号光出射部が、光バス本体内を伝播してきた信号
光を拡散して該信号光出射部から出射する第２の光拡散
手段を備えたことを特徴とする光バス。1. A signal light incident part on which a signal light is incident, a signal light emitting part from which the signal light is emitted, and an optical bus main body for propagating the signal light incident from the signal light incident part to the signal light emitting part. An optical bus having: a first light diffusing means for diffusing incident signal light into an optical bus main body, wherein the signal light incident section includes an optical bus main body; An optical bus, comprising: a second light diffusing means for diffusing signal light propagating through the inside and emitting the signal light from the signal light emitting unit.
ら出射される信号光に担持させる信号を生成する回路が
搭載された第１の回路基板、 信号光を入射する信号光入射端および該信号光入射端か
ら入射した信号光が担持する信号に基づいて信号処理を
行なう回路が搭載された第２の回路基板、 前記基体に固定された、信号光が入射される信号光入射
部と、信号光が出射される信号光出射部と、前記信号光
入射部から入射した信号光を信号光出射部に伝搬する光
バス本体とを有し、前記信号光入射部が、入射した信号
光を光バス本体内に向けて拡散する第１の光拡散手段を
備え、前記信号光出射部が、光バス本体内を伝播してき
た信号光を拡散してこの信号光出射部から出射する第２
の光拡散手段を備えてなる光バス、および、 前記第１の回路基板および前記第２の回路基板を、前記
第１の回路基板に搭載された信号光出射端が前記信号光
入射部において前記光バスと結合されるとともに、前記
第２の回路基板に搭載された信号光入射端が前記信号光
出射部において前記光バスと結合される状態に前記基体
上に固定する基体固定部を備えたことを特徴とする信号
処理装置。A first circuit board on which a base, a signal light emitting end for emitting signal light, and a circuit for generating a signal to be carried by the signal light emitted from the signal light emitting end are mounted; A second circuit board on which a signal light incident end to be processed and a circuit for performing signal processing based on a signal carried by the signal light incident from the signal light incident end are mounted; A signal light incident portion, a signal light emitting portion from which the signal light is emitted, and an optical bus main body for transmitting the signal light incident from the signal light incident portion to the signal light emitting portion; Comprises first light diffusing means for diffusing the incident signal light into the optical bus main body, wherein the signal light emitting section diffuses the signal light propagating in the optical bus main body to emit the signal light. The second emitted from the part
An optical bus comprising light diffusion means, and the first circuit board and the second circuit board, wherein the signal light emitting end mounted on the first circuit board has A signal light incident end mounted on the second circuit board, the signal light incident end mounted on the second circuit board, and a substrate fixing portion fixed to the substrate in a state of being coupled to the optical bus at the signal light emitting portion; A signal processing device characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587197A JP3528523B2 (en) | 1997-07-22 | 1997-07-22 | Optical bus and signal processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587197A JP3528523B2 (en) | 1997-07-22 | 1997-07-22 | Optical bus and signal processor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1141172A true JPH1141172A (en) | 1999-02-12 |
| JP3528523B2 JP3528523B2 (en) | 2004-05-17 |
Family
ID=16348382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19587197A Expired - Fee Related JP3528523B2 (en) | 1997-07-22 | 1997-07-22 | Optical bus and signal processor |
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| Country | Link |
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| JP (1) | JP3528523B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001343532A (en) * | 2000-03-31 | 2001-12-14 | Mitsubishi Electric Corp | Front light, reflective liquid crystal display device and portable information terminal |
| US6636283B2 (en) | 2000-03-31 | 2003-10-21 | Mitsubishi Denki Kabushiki Kaisha | Front light, reflective liquid crystal display device and personal digital assistant |
| US6792213B1 (en) | 1999-09-08 | 2004-09-14 | Fuji Xerox Co., Ltd. | Optical signal transmitting apparatus, optical data bus system and signal processing apparatus |
| US7245832B2 (en) | 2001-06-29 | 2007-07-17 | Fuji Xerox Co., Ltd. | Radio communication apparatus |
-
1997
- 1997-07-22 JP JP19587197A patent/JP3528523B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6792213B1 (en) | 1999-09-08 | 2004-09-14 | Fuji Xerox Co., Ltd. | Optical signal transmitting apparatus, optical data bus system and signal processing apparatus |
| JP2001343532A (en) * | 2000-03-31 | 2001-12-14 | Mitsubishi Electric Corp | Front light, reflective liquid crystal display device and portable information terminal |
| US6636283B2 (en) | 2000-03-31 | 2003-10-21 | Mitsubishi Denki Kabushiki Kaisha | Front light, reflective liquid crystal display device and personal digital assistant |
| US7245832B2 (en) | 2001-06-29 | 2007-07-17 | Fuji Xerox Co., Ltd. | Radio communication apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3528523B2 (en) | 2004-05-17 |
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