JPH11307303A - Chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve strength and reliability of connection of a connection land to an end face electrode, by connecting an electronic part to a connection land with a bonding wire, the connection land which is formed as a fine structure and is in the vicinity of a conductive non-through hole, and setting to corners and ledges of a three-dimensional chip part a multiple of end face electrodes which are formed by dividing the conductive non-through hole. SOLUTION: A conductive non-through hole 5 is formed on a printed wiring board 1, the hole which consists of the upper outer and the lower outer layer conductors in a desired shape, a conductive layer formed internal a hole through which the outer layer conductors on both surfaces are electrically connected and a conductive, metallic or insulating film 9 which fills one end face of the conductive hole. Next, a chip part 22 is adhered to an device mounting face formed with the film 9 with an adhesive and is connected to a connection land 24 of the upper outer layer conductor with a bonding wire. After the chip part 22 is connected in multiple rows and columns, it is solidified with a mold resin and is then formed by cutting nearly central portion of the conductive non- through hole 5 by dicing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component which is mounted on a printed wiring board by surface mounting.

[0002]

2. Description of the Related Art Generally, a chip component is an electronic component containing a semiconductor circuit element, a resistor element, a capacitor element, a light emitting / receiving element, a liquid crystal display element, and the like. End electrodes are formed on both ends of the chip component for mounting the chip component on the printed wiring board.

[0003] In the case of a conventional printed wiring board having a through-hole such as a through-hole, the flux, solder paste, solder, and the like when mounting chip component elements and chip components on the printed wiring board are used. Adhesive for protecting electronic components mounted and mounted, mold resin, and the like flow out through the through-holes of the printed wiring board to the opposite surface side of the wiring board, resulting in poor quality.

Accordingly, as shown in FIG. 4, in a conventional printed wiring board on which chip components are mounted, semi-cylindrical ends are formed at both ends in the longitudinal direction of the printed wiring board 1 as can be seen from the plan view of FIG. The end face electrode 20 is formed, which is used as a soldering allowance for chip components. As shown in the side view of FIG. 4B, the upper outer conductor 6 and the lower outer conductor 8 of the printed wiring board 1 are electrically conducted by the conductor layer 7 inside the hole, and one end surface of the hole is made conductive. A non-through conductive hole is formed to be closed by the metal or insulating film. Thereafter, the chip component element is mounted and mounted on a printed wiring board by a wire bonding method or a surface mounting method, solidified with a mold resin, and cut at a substantially central portion of the non-through conduction hole to obtain a chip component.

[0005]

As described in the prior art, in the case of a chip component for attaching a surface, one end electrode is formed on each of the ridges at both ends in the longitudinal direction of the rectangular parallelepiped of the chip component. However, the finer wiring and higher density of chip parts,
There is a need to increase the number of terminals. Further, when mounting a chip component on a printed wiring board with a surface, it is necessary to increase the number of terminals of the chip component in order to improve connection strength and connection reliability between a connection land of the printed wiring board and an end surface electrode of the chip component.

[0006]

As shown in FIG. 1, in a chip component to be mounted on a printed wiring board, a multi-segmented cylinder exposed and depressed at a lower corner on the chip component element mounting surface side. Conductive groove 15 of shape and corner cut shape
A conductor layer 7 having good solderability formed on the inner surface of the conduction groove 15; and upper and lower outer conductors 6 and 8 of a printed wiring board which is a base material of a chip component in contact with the conductor layer 7. A chip component 30 having an end surface electrode 20 composed of an outer layer conductor and a conductive, metallic, or insulating film-like body 9 for closing a groove end surface on the chip component element mounting surface side, which is one of the conductive grooves 15, is provided. Can be provided. However, a single-sided wiring board or a multilayer wiring board can be used as a printed wiring board which is a base material on which chip component elements are mounted.

In general, in a rectangular parallelepiped chip component, four end electrodes can be formed at the lower corners on the chip component element mounting surface side. In addition, pentagonal prism shape, hexagonal prism shape,
By forming an end face electrode in a lower corner on the chip component element mounting surface side in an octagonal column shape or the like, five, six, or eight end face electrodes can be formed. In the case where the chip component element is large and has a large current capacity or is used as a ground electrode, two or three end electrodes are connected so as to have the same potential, and the connection land of the printed wiring board and the end electrode of the chip component are connected. Connection strength and connection reliability can be improved.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. First, as shown in FIG. 3, an upper outer conductor, a lower outer conductor having a desired shape on the printed wiring board 1, a conductor layer formed on an inner surface of a hole for electrically connecting the outer conductors on both sides, and one of the conduction holes A non-through conductive hole 5 made of a conductive, metallic, insulating, or other film-like body 9 closing the end face of the non-through hole is formed. In this case, single components required for one chip component are formed in multiple rows and multiple rows continuously in the vertical and horizontal directions. Next, the chip component element 22 is fixed to the chip component element mounting surface side on which the film-like body 9 is formed with an adhesive, and the connection land 24 formed on the chip component element 22 and the upper outer conductor of the wiring board with the bonding wire 23. And connect. Then, the chip component elements 22 are connected and formed in many stages and many rows. In this drawing, an example in which four end face electrodes are formed from one chip component element 22 is shown. Then, after solidifying with a coating material such as a mold resin, the substantially central portion of the non-through conductive hole 5 is set to (X1-X1, X2-X2, X3-X3, X4-X4,
Y1-Y1, Y2-Y2) are cut by dicing to obtain chip components.

Next, the features of the chip component of the present invention will be described with reference to the developed view of FIG. As described above, the chip component element is mounted on the printed wiring board 1 in which one end face of the conduction hole is closed with the film-like body 9 and the non-through conduction hole is formed, and the chip component is molded with the covering material to form the package part 25. To form After that, it is cut into a single chip component. The printed circuit board 1 is formed with a conductor circuit including an upper outer conductor 6, a lower outer conductor 8, and a conductor layer 7 for electrically connecting the outer conductors on both sides of a desired shape. In order to prevent the adhesive or the molding resin from flowing out through the through hole when the chip component element is molded, the film-like body 9 covering one end face of the through hole, that is, the end face on the mounting surface side of the chip component element is conductive. And a metallic metal foil, a plating film, a vapor-deposited film, and a conductive film, and may be an insulating film 9 such as a masking tape, a resin paint film, or a film film. The feature of the terminal connected to the outside of the chip component is that the chip component element mounting surface side, that is, the package portion 2
The conductive groove 15 is formed by exposing and depressing at the corner of the solid below 5 to divide the cylindrical non-through conductive hole into multiple parts. The inner surface of the conduction groove 15 is an end surface electrode 20 having the conductor layer 7 having good solderability as an end surface conductor layer. In this drawing, the chip component 30 is a state in which four end face electrodes 20 are formed at corners below the package portion 25 of the chip component element having a rectangular parallelepiped shape.

As shown in the plan view of FIG. 2, not only the end electrode 20A of the three-dimensional corner portion but also the chip component 30 is formed.
Side of the connection to the printed wiring board, ie, the chip component 30
The edge electrode 20B of the ridge line portion which is depressed and exposed at the bottom ridge line portion can be formed. By forming the chip component 30 having a large number of end face electrodes in this way, it is possible to achieve multi-terminal, miniaturization, fine wiring, and high density of the chip component.

[0011]

According to the present invention, an electronic component connected by a wire bonding method is connected to a finely wired connection land near a non-through conduction hole by a bonding wire.
By setting a large number (4 to 16) of the end surface electrodes obtained by dividing the non-through conduction holes at the corners and ridges of the three-dimensional chip component, it is possible to provide a chip component that can be mounted with a general surface. . In addition to increasing the number of terminals, miniaturization, finer wiring, and higher density of the chip component, the connection strength between the connection land of the printed wiring board and the end surface electrode of the chip component can be improved.

[Brief description of the drawings]

FIG. 1 is a development view of a chip component of the present invention.

FIG. 2 is a plan view of a chip component having a large number of end face electrodes of the present invention.

FIG. 3 is a plan view illustrating a method for manufacturing a chip component according to the present invention.

FIG. 4 is a plan view and a side view of a conventional chip component having end electrodes.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Wiring board 5 ... Non-through conduction hole 6 ... Upper outer layer conductor 7
... Conductor layer 8 ... Lower outer layer conductor 9 ... Membrane 15 ... Conduction groove 20 ... End face electrode 22 ... Chip component element 23 ... Bonding wire 2
4. Connection land 25 Package part 30 ... Chip component.

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[Procedure amendment]

[Submission date] May 17, 1999

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

Claims (2)

[Claims] In a chip component mounted on a printed wiring board with a surface, a conduction groove (15) formed by exposing at a lower corner portion on a chip component element mounting surface side and an inner surface of the conduction groove. An end face electrode (7) comprising a conductor layer (7), outer layer conductors (6, 8) on both sides of the wiring board in contact with the conductor layer, and a film-like body (9) for closing one of the conductive grooves. 20) chip components (3)
0). 2. The chip component (30) according to claim 1, further comprising a plurality of end electrodes (20) at a lower corner on the chip component element mounting surface side.