JPH11295176A - Differential pressure sensor - Google Patents
Differential pressure sensorInfo
- Publication number
- JPH11295176A JPH11295176A JP10102846A JP10284698A JPH11295176A JP H11295176 A JPH11295176 A JP H11295176A JP 10102846 A JP10102846 A JP 10102846A JP 10284698 A JP10284698 A JP 10284698A JP H11295176 A JPH11295176 A JP H11295176A
- Authority
- JP
- Japan
- Prior art keywords
- differential pressure
- substrate
- diaphragm
- sensor
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000012530 fluid Substances 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 10
- 238000005304 joining Methods 0.000 description 10
- 238000005452 bending Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000219122 Cucurbita Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、差圧センサに係
り、例えばダイアフラムの撓み量を歪みゲージの抵抗変
化や、電極間の静電容量の変化に変換することで圧力を
求める差圧センサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a differential pressure sensor, and more particularly, to a differential pressure sensor that obtains pressure by converting the amount of deflection of a diaphragm into a change in resistance of a strain gauge or a change in capacitance between electrodes. .
【０００２】[0002]
【背景技術】従来より、弾性変形するダイアフラムに流
体圧を作用させ、この時のダイアフラムの撓みを電気的
に処理することでその圧力を測定できるようにした圧力
センサが知られている。また、圧力センサの中でも、一
枚のダイアフラムの両側に異なる流体圧を作用させ、そ
の差圧分だけダイアフラムを撓ませたり、あるいは基板
の両側にダイアフラムを設け、各ダイアフラムに異なる
流体圧を作用させてそれらを撓ませるといった構成の差
圧センサが周知である。2. Description of the Related Art Conventionally, there has been known a pressure sensor in which a fluid pressure is applied to an elastically deformable diaphragm, and the deflection of the diaphragm at this time is electrically processed to measure the pressure. Also, among the pressure sensors, different fluid pressures are applied to both sides of one diaphragm, and the diaphragm is flexed by the differential pressure, or diaphragms are provided on both sides of the substrate, and different fluid pressures are applied to each diaphragm. 2. Description of the Related Art Differential pressure sensors having a configuration in which they are deflected by bending are known.
【０００３】図１２には、一枚のダイアフラムを用いて
構成された従来の差圧センサ１００が示されている。こ
の差圧センサ１００では、ダイアフラム１０１の一方の
面に圧力Ｐ１が作用し、他方の面に基板１０２の圧力導
入口１０３から導かれた圧力Ｐ２が作用する。従って、
ダイアフラム１０１は圧力Ｐ１，Ｐ２の差圧分だけ撓
み、この撓み量が各電極１０４，１０５間の静電容量の
変化として電気的に処理され、あるいはダイアフラム１
０１側にのみ電極としての歪みゲージ（１０６）を設け
る場合には、その撓み量が歪みゲージ（１０６）の抵抗
変化として電気的に処理され、差圧が求められる。FIG. 12 shows a conventional differential pressure sensor 100 constituted by using one diaphragm. In the differential pressure sensor 100, the pressure P1 acts on one surface of the diaphragm 101, and the pressure P2 guided from the pressure inlet 103 of the substrate 102 acts on the other surface. Therefore,
The diaphragm 101 bends by the pressure difference between the pressures P1 and P2, and this amount of bending is electrically processed as a change in capacitance between the electrodes 104 and 105, or the diaphragm 1
When the strain gauge (106) as an electrode is provided only on the 01 side, the amount of bending is electrically processed as a change in resistance of the strain gauge (106), and a differential pressure is obtained.
【０００４】一方、図１３には、二枚のダイアフラムを
用いて構成された従来の差圧センサ２００が示されてい
る。この差圧センサ２００では、一方のダイアフラム２
０１に圧力Ｐ１が作用し、他方のダイアフラム２０２に
圧力Ｐ２が作用する。また、基板２０３には各ダイアフ
ラム２０１、２０２との間に形成された各空隙を連通さ
せる連通孔２０４が設けられ、連通した各空隙内には流
体が充填されている。このため、各ダイアフラム２０
１，２０２は圧力Ｐ１，Ｐ２の差圧分だけ同じ方向に撓
み、それらの撓み量が各電極２０５，２０６間の静電容
量の変化、および各電極２０７，２０８間の静電容量の
変化等として電気的に処理され、差圧が求められる。な
お、差圧センサ２００において、高い測定精度が要求さ
れない場合には、二組の電極のうち一組を省略すること
も考えられる。さらに、このような差圧センサ２００で
は、連通孔２０４を設けず、各空隙を真空にするなどし
て、各ダイアフラム２０１，２０２を各圧力Ｐ１，Ｐ２
に応じた分だけ撓ませ、電気的な処理の過程で差圧を求
めることもある。On the other hand, FIG. 13 shows a conventional differential pressure sensor 200 constituted by using two diaphragms. In this differential pressure sensor 200, one diaphragm 2
01 acts on the pressure P1, and the other diaphragm 202 acts on the pressure P2. The substrate 203 is provided with a communication hole 204 for communicating each gap formed between each of the diaphragms 201 and 202, and each of the connected gaps is filled with a fluid. For this reason, each diaphragm 20
Reference numerals 1 and 202 deviate in the same direction by an amount equal to the pressure difference between the pressures P1 and P2, and the amount of the deflection is a change in the capacitance between the electrodes 205 and 206 and a change in the capacitance between the electrodes 207 and 208. And the pressure difference is determined. In the case where high measurement accuracy is not required in the differential pressure sensor 200, one of the two sets of electrodes may be omitted. Further, in such a differential pressure sensor 200, the communication holes 204 are not provided, and each of the diaphragms 201, 202 is evacuated to each pressure P1, P2
In some cases, the pressure may be deflected by an amount corresponding to the pressure, and a differential pressure may be obtained in the course of electrical processing.
【０００５】[0005]
【発明が解決しようとする課題】ところで、図１２に示
すような差圧センサ１００では、圧力Ｐ２側の測定流体
が空隙内に入り込んで電極１０４，１０５間に介在す
る。従って、特に静電容量の変化によって差圧を求めよ
うとすると、測定流体の種類によってその比誘電率が異
なり、これに伴って、出力される電気信号も異なるた
め、測定流体の種類を変える毎にその種類に応じた変換
回路等を用いなければならず、対応に手間がかかるとい
う問題がある。By the way, in the differential pressure sensor 100 as shown in FIG. 12, the measurement fluid on the pressure P2 side enters the gap and intervenes between the electrodes 104 and 105. Therefore, in particular, when trying to obtain a differential pressure based on a change in capacitance, the relative permittivity differs depending on the type of the measurement fluid, and the electric signal output also changes accordingly. However, there is a problem in that a conversion circuit or the like corresponding to the type must be used, and it is time-consuming to respond.
【０００６】これに対し、図１３に示す差圧センサ２０
０においては、空隙内が常に同じ封入物で満たされてい
るから、前述のような問題は生じない。しかし、差圧セ
ンサ２００では、基板２０３の両側にダイアフラム２０
１，２０２が設けられているので、厚さ寸法が大きくな
り、薄型化が難しいという問題がある。さらに、基板２
０３の両側にダイアフラム２０１，２０２を設けること
で、変換回路用の回路基板２０９（図１３）をセンサ自
身に一体に取り付けることができないため、その設置ス
ペースを別途確保する必要があるなど、構造がより複雑
になって製作が一層難しくなる。On the other hand, a differential pressure sensor 20 shown in FIG.
At 0, the above-described problem does not occur because the space is always filled with the same filling material. However, in the differential pressure sensor 200, the diaphragm 20 is provided on both sides of the substrate 203.
Since there are provided 1,202, there is a problem that the thickness dimension is large and it is difficult to reduce the thickness. Further, the substrate 2
Since the diaphragms 201 and 202 are provided on both sides of the sensor 03, the circuit board 209 (FIG. 13) for the conversion circuit cannot be integrally attached to the sensor itself. It becomes more complex and more difficult to manufacture.
【０００７】本発明の目的は、種類の異なる流体にも容
易に対応でき、かつ薄型化を促進できる差圧センサを提
供することにある。An object of the present invention is to provide a differential pressure sensor which can easily cope with different types of fluids and can promote a reduction in thickness.
【０００８】[0008]
【課題を解決するための手段】本発明の差圧センサは、
基板と、この基板に対して間隔を空けて弾性変形可能に
対向配置されたダイアフラムとで構成される複数のセン
サ部を備え、ダイアフラムには基板が設けられた側とは
反対側から圧力が作用する有効受圧面を設け、複数のセ
ンサ部のうちの少なくともいずれかのセンサ部において
（全てのセンサ部であってもよい）、基板およびダイア
フラムの各対向面に電極を設けるとともに、それらのセ
ンサ部を圧力の作用方向に対して交差する方向に並設す
ることを特徴とするものである。A differential pressure sensor according to the present invention comprises:
It has a plurality of sensor sections each composed of a substrate and a diaphragm which is spaced apart from the substrate and is elastically deformable. The diaphragm has a pressure acting from the side opposite to the side on which the substrate is provided. An effective pressure receiving surface is provided, and in at least one of the plurality of sensor units (all the sensor units may be provided), electrodes are provided on respective opposing surfaces of the substrate and the diaphragm, and the sensor units are provided. Are arranged side by side in a direction intersecting the direction in which the pressure acts.
【０００９】このような差圧センサにおいては、各セン
サ部への圧力を常に基板が設けられた側とは反対側から
ダイアフラムの有効受圧面に作用させるから、各基板と
ダイアフラムとの各対向面に設けた電極に流体を接触さ
せることなく流体の圧力が測定される。従って、各セン
サ部から出力される電気信号が流体の種類に関係なく一
様に処理されるようになり、差圧が容易に求められるよ
うになる。また、各センサ部を圧力の作用する方向に対
して交差する方向に並設するため、各センサ部を構成す
る基板同士およびダイアフラム同士、ひいては各センサ
部同士を同一平面内に配置可能となり、差圧センサ全体
の薄型化が図られる。In such a differential pressure sensor, the pressure on each sensor section is always applied to the effective pressure receiving surface of the diaphragm from the side opposite to the side on which the substrate is provided. The pressure of the fluid is measured without bringing the fluid into contact with the electrodes provided at the. Therefore, the electric signal output from each sensor unit is uniformly processed regardless of the type of the fluid, and the differential pressure can be easily obtained. In addition, since the sensor units are arranged side by side in a direction intersecting the direction in which the pressure acts, the substrates and the diaphragms constituting the sensor units can be arranged in the same plane. The thickness of the entire pressure sensor can be reduced.
【００１０】この際、各センサ部を構成する基板および
ダイアフラムのうち、少なくともいずれか一方の部材を
一体に設けることが好ましい。At this time, it is preferable that at least one of the substrate and the diaphragm constituting each sensor section is integrally provided.
【００１１】また、本発明の差圧センサでは、少なくと
も一対のセンサ部に形成された基板およびダイアフラム
間の空隙同士を連通させ、この連通した各空隙内に絶縁
性流体を充填してもよい。そして、この際、一対のセン
サ部のうちの一方のセンサ部においてのみ、基板および
ダイアフラムの各対向面に電極を設てもよい。In the differential pressure sensor according to the present invention, the gaps between the substrate and the diaphragm formed in at least one pair of sensor portions may be communicated with each other, and each of the interconnected gaps may be filled with an insulating fluid. At this time, an electrode may be provided on each of the opposing surfaces of the substrate and the diaphragm only in one of the pair of sensor units.
【００１２】さらに、以上の差圧センサにおいて、各セ
ンサ部でのダイアフラムの有効受圧面の剛性をそれぞれ
異ならせてもよい。また、本発明の差圧センサでは、基
板のダイアフラムと対向する面とは反対の面に、センサ
部から出力される電気信号を圧力値に変換する変換回路
を形成することが望ましい。Further, in the above differential pressure sensor, the rigidity of the effective pressure receiving surface of the diaphragm in each sensor may be different. In the differential pressure sensor according to the present invention, it is preferable that a conversion circuit for converting an electric signal output from the sensor unit into a pressure value is formed on a surface of the substrate opposite to a surface facing the diaphragm.
【００１３】[0013]
【発明の実施の形態】以下、本発明の各実施形態を図面
に基づいて説明する。 〔第１実施形態〕図１は、本発明の第１実施形態に係る
差圧センサ１を示す分解斜視図、図２は、図１のII−II
線断面図、図３は、図１のIII−III線断面図である。Embodiments of the present invention will be described below with reference to the drawings. [First Embodiment] FIG. 1 is an exploded perspective view showing a differential pressure sensor 1 according to a first embodiment of the present invention, and FIG. 2 is a II-II of FIG.
FIG. 3 is a sectional view taken along line III-III of FIG.
【００１４】差圧センサ１は、例えばセラミックス、シ
リコーン、ガラス等からなる絶縁性を有した基板１０
と、この基板１０の一方の面側に対向配置された弾性変
形可能なダイアフラム２０とを備え、このダイアフラム
２０は、基板１０と同様な材質で一様な厚さに設けられ
ている。また、基板１０とダイアフラム２０との間には
ガラスフリット等からなる接合部材３０が介装されてい
るとともに、この接合部材３０によって基板１０とダイ
アフラム２０とが所定間隔に隔てられ、接合部材３０に
設けられた丸孔開口３１，３２によってそれらの間に空
隙３３，３４が形成されている。なお、丸孔開口３１，
３２の径寸法は同じであり、また、本実施形態では、こ
れらによって形成される空隙３３，３４内を真空とする
ことが好ましい。The differential pressure sensor 1 includes an insulating substrate 10 made of, for example, ceramics, silicone, glass, or the like.
And an elastically deformable diaphragm 20 disposed on one surface side of the substrate 10 so as to face the same. The diaphragm 20 is made of the same material as the substrate 10 and has a uniform thickness. A joining member 30 made of glass frit or the like is interposed between the substrate 10 and the diaphragm 20. The joining member 30 separates the substrate 10 and the diaphragm 20 at a predetermined interval. Voids 33 and 34 are formed between the provided round hole openings 31 and 32. In addition, the round hole opening 31,
32 have the same diameter, and in the present embodiment, it is preferable that the insides of the gaps 33 and 34 formed by these are evacuated.
【００１５】基板１０のダイアフラム２０と対向した平
坦な対向面１１には、空隙３３，３４に対応した位置
に、金属の蒸着あるいはフォトレジスト法等によってそ
れぞれ同じ大きさとされた第１固定電極１２および第２
固定電極１３が設けられている。第１，第２固定電極１
２，１３の略中央には、基板１０の反対側の面と連通し
たスルーホール１４，１５が設けられ、また、第１，第
２固定電極１２，１３から外れた位置であって、接合部
材３０と重なる位置にも、別のスルーホール１６，１７
が設けられ、これらのスルーホール１４〜１７の内壁面
および端部周縁には導電性を有する金属膜が形成されて
いる。On the flat opposing surface 11 opposing the diaphragm 20 of the substrate 10, the first fixed electrode 12 and the first fixed electrode 12 having the same size are formed at positions corresponding to the gaps 33 and 34 by metal deposition or a photoresist method. Second
A fixed electrode 13 is provided. First and second fixed electrodes 1
The through holes 14 and 15 communicating with the surface on the opposite side of the substrate 10 are provided at substantially the center of the substrates 2 and 13, and are located at positions deviated from the first and second fixed electrodes 12 and 13 and are joined to each other. Another through hole 16, 17 is also provided at a position overlapping with 30.
A metal film having conductivity is formed on the inner wall surface and the peripheral edge of the through holes 14 to 17.
【００１６】ダイアフラム２０の基板１０と対向した平
坦な対向面２１には、空隙３３，３４に対応した位置
に、それぞれ同じ大きさとされた第１可動電極２２およ
び第２可動電極２３が設けられ、これらの第１、第２可
動電極２２，２３が基板１０の第１、第２固定電極１
２，１３と対向している。ダイアフラム２０の対向面２
１とは反対の面は、空隙３３，３４と対応した部分がそ
れぞれ同一面積とされた第１有効受圧面２４および第２
有効受圧面２５となっており（図１、図２中に二点鎖線
で図示）、これらの第１、第２有効受圧面２４，２５に
基板１０とは反対側から圧力Ｐ１，Ｐ２が作用するよう
になっている。A first movable electrode 22 and a second movable electrode 23 having the same size are provided at positions corresponding to the gaps 33 and 34 on a flat facing surface 21 of the diaphragm 20 facing the substrate 10. These first and second movable electrodes 22 and 23 correspond to the first and second fixed electrodes 1 of the substrate 10.
2 and 13. Opposite surface 2 of diaphragm 20
The surfaces opposite to 1 are the first effective pressure-receiving surface 24 and the second effective pressure-receiving surface 24 whose portions corresponding to the gaps 33 and 34 have the same area.
An effective pressure receiving surface 25 (shown by a two-dot chain line in FIGS. 1 and 2) is provided with pressures P1 and P2 acting on the first and second effective pressure receiving surfaces 24 and 25 from the opposite side to the substrate 10. It is supposed to.
【００１７】すなわち、本実施形態では、圧力Ｐ１が作
用する側が本発明の第１センサ部５１であるとともに、
圧力Ｐ２が作用する側が本発明の第２センサ部５２であ
る。そして、第１、第２センサ部５１，５２の各々は、
共通の基板１０およびダイアフラム２０を備えた静電容
量型のセンサを構成し、圧力Ｐ１，Ｐ２が作用する方向
に対して直交する同一面内に並設されている。That is, in this embodiment, the side on which the pressure P1 acts is the first sensor section 51 of the present invention,
The side on which the pressure P2 acts is the second sensor section 52 of the present invention. Each of the first and second sensor units 51 and 52
A capacitance-type sensor having a common substrate 10 and a diaphragm 20 is formed, and is arranged side by side in the same plane orthogonal to the direction in which the pressures P1 and P2 act.
【００１８】このような差圧センサ１は、基板１０に取
り付けられた回路基板４０を備えており、この回路基板
４０には各センサ部５１，５２からの電気信号を処理し
て圧力値に変換する変換回路７０が設けられている。ま
た、回路基板４０は、例えば基板１０の各スルーホール
１４〜１７に挿入されて半田付け等される接合ピン４１
を介してその基板１０に固定され、これと同時に、変換
回路７０が接合ピン４１およびスルーホール１４，１５
を介して第１、第２固定電極１２、１３と導通し、別の
接合ピン４１、スルーホール１６，１７、および接合部
材３０の貫通孔３５，３６を介して第１、第２可動電極
２２，２３の各引出部２２Ａ、２３Ａと導通するように
なっている。The differential pressure sensor 1 includes a circuit board 40 mounted on the board 10, and the circuit board 40 processes electric signals from the sensor units 51 and 52 and converts them into pressure values. A conversion circuit 70 is provided. Further, the circuit board 40 includes, for example, bonding pins 41 inserted into the through holes 14 to 17 of the board 10 and soldered or the like.
Is fixed to the substrate 10 through the connection pins, and at the same time, the conversion circuit 70 is connected to the bonding pins 41 and the through holes 14 and 15.
The first and second movable electrodes 22 are electrically connected to the first and second fixed electrodes 12 and 13 through the other joint pins 41, through holes 16 and 17, and through holes 35 and 36 of the joint member 30. , 23 are connected to the respective lead-out portions 22A, 23A.
【００１９】つまり、図３に示すように、スルーホール
１７と連通した貫通孔３６内には、そのスルーホール１
７の金属膜と第２可動電極２３の引出部２３Ａとを導通
させる導電ペースト３７が充填され、これによって第２
可動電極２３と変換回路７０とを導通させることが可能
になっている。なお、第１可動電極２２側も同様であ
る。That is, as shown in FIG. 3, the through hole 36 communicating with the through hole 17 has the through hole 1 therein.
7 is filled with a conductive paste 37 for electrically connecting the metal film of No. 7 and the lead portion 23A of the second movable electrode 23.
It is possible to make the movable electrode 23 and the conversion circuit 70 conductive. The same applies to the first movable electrode 22 side.
【００２０】このような差圧センサ１では、圧力Ｐ１，
Ｐ２に応答して第１、第２有効受圧面２４，２５がそれ
ぞれ撓み、それらの撓みによる第１固定電極１２および
第１可動電極２２間の静電容量の変化、第２固定電極１
３および第２可動電極２３間の静電容量の変化により、
差圧が求められる。In such a differential pressure sensor 1, the pressures P1,
In response to P2, the first and second effective pressure receiving surfaces 24 and 25 are respectively bent, and the change in the capacitance between the first fixed electrode 12 and the first movable electrode 22 due to the bending, the second fixed electrode 1
Due to the change in capacitance between the third and second movable electrodes 23,
A differential pressure is required.
【００２１】このような本実施形態によれば、以下のよ
うな効果がある。 １） 差圧センサ１では、圧力Ｐ１，Ｐ２が基板１０が
設けられた側とは反対側からダイアフラム２０の第１、
第２有効受圧面２４，２５に作用するため、基板１０と
ダイアフラム２０との各対向面１１，２１に設けられた
第１、第２固定電極１２，１３および第１、第２可動電
極２２，２３に測定流体を接触させずに流体圧を測定で
きる。従って、第１、第２有効受圧面２４，２５の撓み
に応じて出力される第１、第２固定電極１２，１３およ
び第１、第２可動電極２２，２３の電気信号を、流体の
種類に関係なく電気的に一様に処理でき、容易に差圧を
求めることができる。According to this embodiment, the following effects can be obtained. 1) In the differential pressure sensor 1, the pressures P1 and P2 are applied to the first and second diaphragms 20 from the side opposite to the side on which the substrate 10 is provided.
In order to act on the second effective pressure receiving surfaces 24, 25, the first and second fixed electrodes 12, 13 and the first and second movable electrodes 22, provided on the opposing surfaces 11, 21 of the substrate 10 and the diaphragm 20, respectively. The fluid pressure can be measured without bringing the measurement fluid into contact with 23. Therefore, the electric signals of the first and second fixed electrodes 12 and 13 and the first and second movable electrodes 22 and 23, which are output in accordance with the bending of the first and second effective pressure receiving surfaces 24 and 25, are converted into the type of the fluid. , And the pressure difference can be easily obtained.
【００２２】２） 各センサ部５１，５２は、圧力Ｐ
１，Ｐ２が作用する方向に対して交差する方向に並設さ
れているので、構造を簡単にして差圧センサ１全体の薄
型化を図ることができるうえ、容易に製作できる。そし
て、基板１０が一体ものとされ、さらにはダイアフラム
２０も一体ものとされ、これによって基板１０およびダ
イアフラム２０を各センサ部５１，５２で共通なものと
されているから、各センサ部５１，５２でそれらを個別
に設ける場合に比し、部品点数を減らすことができる。2) Each of the sensor units 51 and 52 has a pressure P
Since the pressure sensors 1 and 2 are arranged side by side in a direction intersecting with the direction in which they act, the structure can be simplified, the entire differential pressure sensor 1 can be reduced in thickness, and it can be easily manufactured. The substrate 10 is integrated, and the diaphragm 20 is also integrated, so that the substrate 10 and the diaphragm 20 are shared by the sensor units 51 and 52. Therefore, the number of parts can be reduced as compared with the case where they are individually provided.
【００２３】３） ダイアフラム２０が一体ものである
ことにより、第１、第２有効受圧面２４，２５を同一平
面内に設けて圧力Ｐ１，Ｐ２を同一方向から作用させる
ことができ、基板１０の背面側（ダイアフラム２０が設
けられていない側）に回路基板４０を取り付けることが
できる。この際、ダイアフラム２０が基板１０の一方側
にのみ設けられているので、基板１０や接合部材３０に
スルーホール１４〜１７および貫通孔３５，３６を設け
て第１、第２固定電極１２，１３および第１、第２可動
電極２２，２３を回路基板４０側に容易に引き出すこと
ができ、構造を簡単にできる。このため、差圧センサ１
を安価に製作することが可能である。3) Since the diaphragm 20 is integrated, the first and second effective pressure receiving surfaces 24 and 25 can be provided in the same plane to apply the pressures P1 and P2 from the same direction. The circuit board 40 can be attached to the back side (the side where the diaphragm 20 is not provided). At this time, since the diaphragm 20 is provided only on one side of the substrate 10, the first and second fixed electrodes 12, 13 are provided by providing through holes 14 to 17 and through holes 35, 36 in the substrate 10 and the joining member 30. In addition, the first and second movable electrodes 22 and 23 can be easily pulled out to the circuit board 40 side, and the structure can be simplified. Therefore, the differential pressure sensor 1
Can be manufactured at low cost.
【００２４】〔第２実施形態〕図４には、本発明の第２
実施形態に係る差圧センサ２が示されている。差圧セン
サ２では、第２有効受圧面２５の面積が第１有効受圧面
２４の面積よりも小さく、その剛性が高められている
点、およびそれに伴って第２固定電極１３、第２可動電
極２３、空隙３４も小さく設けられている点で第１実施
形態の差圧センサ１とは異なる。他の構成は差圧センサ
１と同じである。なお、第１実施形態と同じ構成部材に
は同一符号を付し、それらの説明を省略する。[Second Embodiment] FIG. 4 shows a second embodiment of the present invention.
The differential pressure sensor 2 according to the embodiment is shown. In the differential pressure sensor 2, the area of the second effective pressure receiving surface 25 is smaller than the area of the first effective pressure receiving surface 24, the rigidity thereof is increased, and accordingly, the second fixed electrode 13 and the second movable electrode 23 and the gap 34 are different from the differential pressure sensor 1 of the first embodiment in that they are also small. Other configurations are the same as those of the differential pressure sensor 1. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
【００２５】このような差圧センサ２では、前記１）〜
３）の各効果に加え、以下の効果がある。 ４） 第１、第２有効受圧面２４、２５の面積が相違す
ることでそれらの剛性が異なるため、剛性の大きい第２
有効受圧面２５により大きな圧力Ｐ２を作用させること
ができ、第１，第２センサ部５１，５２では、対応でき
る圧力レンジを変えることが可能である。In such a differential pressure sensor 2, the above 1) to
There are the following effects in addition to the effects of 3). 4) Since the stiffness of the first and second effective pressure receiving surfaces 24 and 25 is different due to the difference in area, the second stiffness of the second effective pressure receiving surface 24 and 25 is large.
A large pressure P2 can be applied to the effective pressure receiving surface 25, and the first and second sensor units 51 and 52 can change the pressure range that can be supported.
【００２６】〔第３実施形態〕図５、図６には、本発明
の第３実施形態に係る差圧センサ３が示されている。差
圧センサ３では、空隙３３，３４が基板１０に設けられ
た溝１８および接合部材３０に設けられた切欠部３８で
連通している点、第１センサ部５１にのみ固定電極１２
および可動電極２２が設けられている点、および連通し
た空隙３３，３４内に例えばシリコーンオイル等の絶縁
性流体６０が充填封入されている点で第１実施形態の差
圧センサ１とは大きく異なる。他の構成は差圧センサ１
とほぼ同じであり、他の構成部材の説明を省略する。な
お、空隙３３，３４を連通させるのには、溝１８または
切欠部３８のいずれかを設ければよく、あるいは他の手
段として、接合部材３０にパイプ等で埋設してもよく、
任意の構造を適用できる。[Third Embodiment] FIGS. 5 and 6 show a differential pressure sensor 3 according to a third embodiment of the present invention. In the differential pressure sensor 3, the gaps 33 and 34 communicate with each other through the groove 18 provided in the substrate 10 and the notch 38 provided in the joining member 30, and the fixed electrode 12 is provided only in the first sensor 51.
This is greatly different from the differential pressure sensor 1 of the first embodiment in that the movable electrode 22 is provided and that the communicating gaps 33 and 34 are filled with an insulating fluid 60 such as silicone oil. . Another configuration is a differential pressure sensor 1.
This is almost the same as that described above, and the description of the other components will be omitted. In order to allow the gaps 33 and 34 to communicate with each other, either the groove 18 or the notch 38 may be provided. Alternatively, the gaps 33 and 34 may be embedded in the joining member 30 with a pipe or the like.
Any structure can be applied.
【００２７】このような差圧センサ３では、前記１）〜
３）の各効果に加え、以下の効果がある。 ５） 空隙３３，３４が溝１８および切欠部３８で連通
し、それらの内部に絶縁性流体６０が充填されているか
ら、第１、第２有効受圧面２４，２５を圧力Ｐ１，Ｐ２
の差圧分に対応した同じ量だけ撓ませることができる。
従って、第１センサ部５１にのみ固定電極１２および可
動電極２２を設けるだけで差圧を測定でき、構造をより
簡素化して一層安価に製作できる。In such a differential pressure sensor 3, the above 1) to
There are the following effects in addition to the effects of 3). 5) Since the gaps 33 and 34 communicate with each other through the groove 18 and the notch 38 and the inside thereof is filled with the insulating fluid 60, the first and second effective pressure receiving surfaces 24 and 25 are subjected to the pressures P1 and P2.
Can be flexed by the same amount corresponding to the differential pressure.
Therefore, the differential pressure can be measured only by providing the fixed electrode 12 and the movable electrode 22 only in the first sensor unit 51, and the structure can be simplified and the device can be manufactured at lower cost.
【００２８】〔第４実施形態〕図７、図８には、本発明
の第４実施形態に係る差圧センサ４が示されている。差
圧センサ４では、前述と同様な溝１８および切欠部３８
が設けられて空隙３３，３４が連通している点、面積の
小さい第２有効受圧面２５を備えた第２センサ部５２に
のみ固定電極１３および可動電極２３が設けられている
点、および空隙３３，３４内に絶縁性流体６０が充填封
入されている点で第２実施形態の差圧センサ２とは異な
る。他の構成は差圧センサ２と同じである。[Fourth Embodiment] FIGS. 7 and 8 show a differential pressure sensor 4 according to a fourth embodiment of the present invention. In the differential pressure sensor 4, the groove 18 and the notch 38
Are provided and the gaps 33 and 34 communicate with each other; the fixed electrode 13 and the movable electrode 23 are provided only in the second sensor portion 52 having the second effective pressure receiving surface 25 having a small area; It differs from the differential pressure sensor 2 of the second embodiment in that the insulating fluid 60 is filled and sealed in the insides 33 and 34. Other configurations are the same as those of the differential pressure sensor 2.
【００２９】このような差圧センサ４では、前述したよ
うに、第２有効受圧面２５の剛性が第１有効受圧面２４
の剛性に比して大きくなるから、空隙３３，３４内の絶
縁性流体６０が周囲の温度変化によって例えば熱膨張
し、体積が増えると、図８（Ａ）、（Ｂ）に示すよう
に、剛性の小さい第１有効受圧面２４が第２有効受圧面
２５よりも大きく撓むようになる。ここで、有効受圧面
の撓みωは、空隙内の内圧力をＰ、有効受圧面の半径を
ａ、ダイアフラムの曲げ剛性に関する定数をＤとする
と、以下の式（１）で表される。In such a differential pressure sensor 4, as described above, the rigidity of the second effective pressure receiving surface 25 is lower than that of the first effective pressure receiving surface 24.
When the insulating fluid 60 in the gaps 33 and 34 expands thermally, for example, due to a change in ambient temperature and increases in volume, as shown in FIGS. 8A and 8B, The first effective pressure receiving surface 24 having a small rigidity bends more than the second effective pressure receiving surface 25. Here, the deflection ω of the effective pressure receiving surface is represented by the following equation (1), where P is the internal pressure in the gap, a is the radius of the effective pressure receiving surface, and D is the constant relating to the bending rigidity of the diaphragm.
【００３０】[0030]
【数１】 (Equation 1)
【００３１】従って、例えば、第１有効受圧面２４の半
径ａ１を第２有効受圧面２５の半径ａ２の２倍とすれ
ば、第２有効受圧面２５の撓みω２は、式（１）から第
１有効受圧面２４の撓みω１の２-4倍となり、撓みが著
しく小さくなることがわかる。Therefore, for example, if the radius a1 of the first effective pressure receiving surface 24 is set to be twice the radius a2 of the second effective pressure receiving surface 25, the deflection ω2 of the second effective pressure receiving surface 25 becomes It can be seen that the deflection ω1 of the one effective pressure receiving surface 24 is 2 −4 times, and the deflection is extremely small.
【００３２】すなわち、本実施形態では、１）〜３）、
５）の効果に加え、以下の効果がある。 ６） 第１有効受圧面２４の面積を第２有効受圧面２５
の面積より大きくし、その剛性を小さくしたので、絶縁
性流体６０の温度変化に伴う体積変化を剛性の小さい第
１有効受圧面２４側で吸収することができる。このた
め、第２有効受圧面２５と同じ面積の有効受圧面を二つ
設けた場合に比べ、第２有効受圧面２５の撓みが２4／
２となり、よって、第２センサ部５２側にのみ固定電極
１３および可動電極２３を設ければ、温度係数も２4／
２に改善され、より精度の高い差圧センサを得ることが
できる。That is, in this embodiment, 1) to 3),
There are the following effects in addition to the effect of 5). 6) The area of the first effective pressure receiving surface 24 is changed to the second effective pressure receiving surface 25.
And the rigidity thereof is reduced, so that the volume change of the insulating fluid 60 due to the temperature change can be absorbed by the first effective pressure receiving surface 24 having a small rigidity. For this reason, the bending of the second effective pressure receiving surface 25 is 2 4/4 compared to the case where two effective pressure receiving surfaces having the same area as the second effective pressure receiving surface 25 are provided.
Therefore, if the fixed electrode 13 and the movable electrode 23 are provided only on the second sensor section 52 side, the temperature coefficient becomes 2 4 /
2 and a more accurate differential pressure sensor can be obtained.
【００３３】〔第５実施形態〕図９には、本発明の第５
実施形態に係る差圧センサ５が示されている。差圧セン
サ５では、基板１０の背面側にスクリーン印刷等によっ
て回路パターンや絶縁膜が形成されており、この回路パ
ターンにＩＣ、コンデンサ、抵抗等の種々の電子回路部
品が実装され、これらによって前述の変換回路７０が形
成されているつまり、この点において差圧センサ５は第
１実施形態の差圧センサ１と異なり、前記１）〜３）の
効果の他、以下の効果を奏する。 ７）差圧センサ５では、変換回路７０が基板１０の背面
に直に設けられているため、前述来の回路基板４０を不
要にでき、部品点数をより減らすことができる。[Fifth Embodiment] FIG. 9 shows a fifth embodiment of the present invention.
The differential pressure sensor 5 according to the embodiment is shown. In the differential pressure sensor 5, a circuit pattern or an insulating film is formed on the back side of the substrate 10 by screen printing or the like, and various electronic circuit components such as an IC, a capacitor, and a resistor are mounted on the circuit pattern. That is, the differential pressure sensor 5 differs from the differential pressure sensor 1 of the first embodiment in this point, and has the following effects in addition to the effects 1) to 3). 7) In the differential pressure sensor 5, since the conversion circuit 70 is provided directly on the back surface of the substrate 10, the circuit substrate 40 described above can be omitted, and the number of components can be further reduced.
【００３４】なお、本発明は、前記実施形態に限定され
るものではなく、本発明の目的を達成できる他の構成等
を含み、以下に示すような変形等も本発明に含まれる。
例えば、前記各実施形態では、基板１０とダイアフラム
２０とを丸孔開口３１，３２を備えた接合部材３０で接
合することで空隙３３，３４が形成されていたが、基板
およびダイアフラムのいずれか一方、あるいは両方に凹
部を設ることで空隙を設けてもよい。このような場合に
は、基板とダイアフラムとを例えば鑞付けによって直に
接合でき、所定の厚さ寸法の接合部材を省くことができ
る。It should be noted that the present invention is not limited to the above-described embodiment, but includes other configurations that can achieve the object of the present invention, and the following modifications are also included in the present invention.
For example, in each of the above-described embodiments, the gaps 33 and 34 are formed by joining the substrate 10 and the diaphragm 20 with the joining member 30 having the round hole openings 31 and 32, but any one of the substrate and the diaphragm is used. Alternatively, a void may be provided by providing a concave portion in both. In such a case, the substrate and the diaphragm can be directly joined, for example, by brazing, and a joining member having a predetermined thickness dimension can be omitted.
【００３５】前記各実施形態では、基板１０、ダイアフ
ラム２０，および接合部材３０が平面矩形状であった
が、それらの形状は、例えば第１、第２有効受圧面２
４，２５の形状に応じたひょうたん形（めがね形）であ
ってもよく、加工性や材質等を勘案して任意に決められ
てよい。In each of the above embodiments, the substrate 10, the diaphragm 20, and the joining member 30 have a rectangular shape in a plane, but their shapes are, for example, the first and second effective pressure receiving surfaces 2 respectively.
It may be a gourd shape (glass shape) according to the shapes of 4, 25, and may be arbitrarily determined in consideration of workability, material, and the like.
【００３６】前記第２，第４実施形態では、第１，第２
有効受圧面２４，２５の面積を変えることによってそれ
らの剛性を変えていたが、剛性を変える方法としては、
これに限定されるものではなく、例えば図１０に示すよ
うに、形状の異なる有効受圧面２４，２５を設けること
で剛性を変えたり、図１１に示すように、有効受圧面２
４，２５（ダイアフラム２０）の厚さ寸法を変えること
で剛性を変えてもよく、その実施にあたって適宜な方法
を適用できる。なお、厚さ寸法によって剛性を変える場
合には、電極の形状や接合部材の開口形状を変える必要
がなく、他の差圧センサと部材を共用できるというメリ
ットがある。In the second and fourth embodiments, the first and second
The rigidity of the effective pressure receiving surfaces 24 and 25 has been changed by changing the area thereof.
The present invention is not limited to this. For example, as shown in FIG. 10, the rigidity is changed by providing effective pressure receiving surfaces 24 and 25 having different shapes, or as shown in FIG.
The rigidity may be changed by changing the thickness dimension of the 4, 25 (diaphragm 20), and an appropriate method can be applied in implementing the rigidity. When the rigidity is changed depending on the thickness, there is no need to change the shape of the electrode and the opening shape of the joining member, and there is an advantage that the member can be shared with other differential pressure sensors.
【００３７】さらに、第１実施形態で説明した差圧セン
サ１において、各空隙３３，３４を連通させて絶縁性流
体を充填するか、あるいは第３実施形態で説明した差圧
センサ３において、第２センサ部５２にも電極を設ける
かしてもよい。このような場合には、同じ量だけ撓む第
１，第２有効受圧面２４，２５の両方で静電容量の変化
を検出するため、静電容量の変化を周知の補正式等を用
いて演算すれば、出力される圧力値の直線性誤差、温度
特性、経時変化などによる誤差を補正できる。Further, in the differential pressure sensor 1 described in the first embodiment, the gaps 33 and 34 are communicated with each other to fill the insulating fluid, or in the differential pressure sensor 3 described in the third embodiment, An electrode may be provided in the two sensor unit 52 as well. In such a case, in order to detect the change in the capacitance on both the first and second effective pressure receiving surfaces 24 and 25 that are bent by the same amount, the change in the capacitance is calculated using a well-known correction formula or the like. By performing the calculation, it is possible to correct an error due to a linearity error of the output pressure value, a temperature characteristic, a temporal change, or the like.
【００３８】前記各実施形態の差圧センサ１〜５は、静
電容量型であったが、本発明に係る差圧センサとして
は、歪みゲージの抵抗変化によって圧力測定を行うもの
であってもよい。さらに、前記各実施形態の差圧センサ
１〜５では、基板１０およびダイアフラム２０が第１，
第２センサ部５１，５２で共通とされた一体ものであっ
たが、基板やダイアフラムを二枚ずつ用い、それらを一
枚のベース部材上に並設して一対のセンサ部を設けた場
合等でも本発明に含まれる。要するに、各センサ部が同
一平面で並設されるように構成されていればよい。Although the differential pressure sensors 1 to 5 of the above embodiments are of the capacitance type, the differential pressure sensors according to the present invention may be those which measure the pressure by changing the resistance of a strain gauge. Good. Further, in the differential pressure sensors 1 to 5 of the above embodiments, the substrate 10 and the diaphragm 20 are the first and the second.
Although the two sensors are integral with each other in the second sensor units 51 and 52, a case where a pair of sensor units is provided by using two substrates and two diaphragms and arranging them in parallel on one base member is used. However, it is included in the present invention. In short, it suffices if the sensor units are configured so as to be arranged side by side on the same plane.
【００３９】また、前記各実施形態では、センサ部が一
対設けられていたが、三つ以上並設されていてもよく、
センサ部の数は、差圧センサの使用目的等を勘案して任
意に決められてよい。In each of the above embodiments, a pair of sensor portions is provided, but three or more sensor portions may be provided in parallel.
The number of sensor units may be arbitrarily determined in consideration of the purpose of use of the differential pressure sensor and the like.
【００４０】[0040]
【発明の効果】以上に述べたように、本発明によれば、
種類の異なる流体にも容易に対応でき、かつ薄型化を促
進できるという効果がある。As described above, according to the present invention,
There is an effect that it is possible to easily cope with different types of fluids and promote thinning.
【図１】本発明の第１実施形態に係る差圧センサを示す
分解斜視図である。FIG. 1 is an exploded perspective view showing a differential pressure sensor according to a first embodiment of the present invention.
【図２】図１のII−II線断面図である。FIG. 2 is a sectional view taken along line II-II of FIG.
【図３】図１のIII−III線断面図である。FIG. 3 is a sectional view taken along line III-III of FIG. 1;
【図４】本発明の第２実施形態に係る差圧センサを示す
分解斜視図である。FIG. 4 is an exploded perspective view showing a differential pressure sensor according to a second embodiment of the present invention.
【図５】本発明の第３実施形態に係る差圧センサを示す
分解斜視図である。FIG. 5 is an exploded perspective view showing a differential pressure sensor according to a third embodiment of the present invention.
【図６】図５のVI−VI線断面図である。6 is a sectional view taken along line VI-VI of FIG.
【図７】本発明の第４実施形態に係る差圧センサを示す
分解斜視図である。FIG. 7 is an exploded perspective view showing a differential pressure sensor according to a fourth embodiment of the present invention.
【図８】第４実施形態の変化状態を説明するための断面
図である。FIG. 8 is a cross-sectional view for explaining a change state of the fourth embodiment.
【図９】本発明の第５実施形態に係る差圧センサを示す
断面図である。FIG. 9 is a sectional view showing a differential pressure sensor according to a fifth embodiment of the present invention.
【図１０】本発明の変形例を示す分解斜視図である。FIG. 10 is an exploded perspective view showing a modification of the present invention.
【図１１】本発明の他の変形例を示す分解斜視図であ
る。FIG. 11 is an exploded perspective view showing another modified example of the present invention.
【図１２】従来技術を示す断面図である。FIG. 12 is a sectional view showing a conventional technique.
【図１３】他の従来技術を示す断面図である。FIG. 13 is a sectional view showing another conventional technique.
１，２，３，４，５ 差圧センサ １０ 基板 １２，１３，２２，２３ 電極 ２０ ダイアフラム ２４，２５ 有効受圧面 ３３，３４ 空隙 ５１，５２ センサ部 ６０ 絶縁性流体 ７０ 変換回路 1, 2, 3, 4, 5 Differential pressure sensor 10 Substrate 12, 13, 22, 23 Electrode 20 Diaphragm 24, 25 Effective pressure receiving surface 33, 34 Air gap 51, 52 Sensor unit 60 Insulating fluid 70 Conversion circuit
Claims (6)
弾性変形可能に対向配置されたダイアフラムとで構成さ
れる複数のセンサ部を備え、前記ダイアフラムには前記
基板が設けられた側とは反対側から圧力が作用する有効
受圧面が設けられ、前記複数のセンサ部のうちの少なく
ともいずれかのセンサ部には前記基板および前記ダイア
フラムの各対向面に電極が設けられ、前記各センサ部が
前記圧力の作用方向に対して交差する方向に並設されて
いることを特徴とする差圧センサ。1. A sensor comprising a plurality of sensor units each comprising a substrate and a diaphragm which is elastically deformable and opposed to the substrate at a distance from the substrate, wherein the diaphragm has a side on which the substrate is provided. Is provided with an effective pressure receiving surface on which pressure acts from the opposite side, and at least one of the plurality of sensor units is provided with an electrode on each of opposing surfaces of the substrate and the diaphragm; Are arranged side by side in a direction intersecting the direction in which the pressure acts.
前記各センサ部を構成する前記基板および前記ダイアフ
ラムのうち、少なくともいずれか一方の部材が一体に設
けられていることを特徴とする差圧センサ。2. The differential pressure sensor according to claim 1, wherein
A differential pressure sensor, wherein at least one of the substrate and the diaphragm constituting each of the sensor units is provided integrally.
ンサにおいて、前記複数のセンサ部うちの少なくとも一
対のセンサ部に形成された前記基板および前記ダイアフ
ラム間の空隙同士が連通し、この連通した各空隙内には
絶縁性流体が充填されていることを特徴とする差圧セン
サ。3. The differential pressure sensor according to claim 1, wherein gaps between the substrate and the diaphragm formed in at least one pair of the sensor units among the plurality of sensor units communicate with each other. A differential pressure sensor, wherein each of the communicating gaps is filled with an insulating fluid.
前記一対のセンサ部のうちの一方のセンサ部にのみ、前
記基板および前記ダイアフラムの各対向面に電極が設け
られていることを特徴とする差圧センサ。4. The differential pressure sensor according to claim 3, wherein
An electrode is provided on each of opposing surfaces of the substrate and the diaphragm only in one of the pair of sensor units.
ンサにおいて、前記各センサ部では前記ダイアフラムの
有効受圧面の剛性がそれぞれ異なることを特徴とする差
圧センサ。5. The differential pressure sensor according to claim 1, wherein the rigidity of the effective pressure receiving surface of the diaphragm is different in each of the sensor units.
ンサにおいて、前記基板の前記ダイアフラムと対向する
面とは反対の面には前記センサ部から出力される電気信
号を圧力値に変換する変換回路が形成されていることを
特徴とする差圧センサ。6. The differential pressure sensor according to claim 1, wherein an electric signal output from the sensor section is converted into a pressure value on a surface of the substrate opposite to a surface facing the diaphragm. A differential pressure sensor, wherein a conversion circuit for converting is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10102846A JPH11295176A (en) | 1998-04-14 | 1998-04-14 | Differential pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10102846A JPH11295176A (en) | 1998-04-14 | 1998-04-14 | Differential pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11295176A true JPH11295176A (en) | 1999-10-29 |
Family
ID=14338325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10102846A Pending JPH11295176A (en) | 1998-04-14 | 1998-04-14 | Differential pressure sensor |
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| Country | Link |
|---|---|
| JP (1) | JPH11295176A (en) |
Cited By (16)
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| JP2002107252A (en) * | 2000-09-27 | 2002-04-10 | Kyocera Corp | Package for pressure detector |
| JP2002107253A (en) * | 2000-09-28 | 2002-04-10 | Kyocera Corp | Package for pressure detector |
| JP2002107254A (en) * | 2000-09-28 | 2002-04-10 | Kyocera Corp | Package for pressure detector |
| JP2002131162A (en) * | 2000-10-26 | 2002-05-09 | Kyocera Corp | Package for pressure detector |
| JP2003004568A (en) * | 2001-06-25 | 2003-01-08 | Anelva Corp | Capacitive pressure sensor |
| JP2003004565A (en) * | 2001-06-27 | 2003-01-08 | Kyocera Corp | Package for pressure detector |
| JP2003042872A (en) * | 2001-07-26 | 2003-02-13 | Kyocera Corp | Package for pressure detector |
| JP2004340576A (en) * | 2003-03-17 | 2004-12-02 | Kyocera Corp | Package for pressure detector |
| JP2005188989A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Package for pressure detection device |
| JP2007335857A (en) * | 2006-05-23 | 2007-12-27 | Sensirion Ag | Pressure sensor having chamber and method of manufacturing the same |
| JP2009522550A (en) * | 2005-12-31 | 2009-06-11 | コーニング インコーポレイテッド | Microreactor glass diaphragm sensor |
| WO2016203694A1 (en) * | 2015-06-18 | 2016-12-22 | 株式会社鷺宮製作所 | Pressure switch, pressure sensor, and module for these |
| JP2017054779A (en) * | 2015-09-11 | 2017-03-16 | 株式会社鷺宮製作所 | Capacitance detection type pressure switch and pressure sensor |
| JP2018159593A (en) * | 2017-03-22 | 2018-10-11 | アズビル株式会社 | Differential pressure sensor chip, differential pressure transmitter, and method for manufacturing differential pressure sensor chip |
| WO2019225205A1 (en) * | 2018-05-22 | 2019-11-28 | 株式会社村田製作所 | Pressure detection element and pressure detection device |
| JP2020190468A (en) * | 2019-05-22 | 2020-11-26 | 株式会社堀場エステック | Pressure measuring device |
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| WO2019225205A1 (en) * | 2018-05-22 | 2019-11-28 | 株式会社村田製作所 | Pressure detection element and pressure detection device |
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