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JPH11289189A - Component mounting method and device - Google Patents

Component mounting method and device

Info

Publication number
JPH11289189A
JPH11289189A JP10093045A JP9304598A JPH11289189A JP H11289189 A JPH11289189 A JP H11289189A JP 10093045 A JP10093045 A JP 10093045A JP 9304598 A JP9304598 A JP 9304598A JP H11289189 A JPH11289189 A JP H11289189A
Authority
JP
Japan
Prior art keywords
component
component supply
mounting
components
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10093045A
Other languages
Japanese (ja)
Inventor
Hiroshi Uchiyama
宏 内山
Hiroshi Ogata
浩 小方
Takashi Yazawa
隆 矢澤
Yoshihiko Oda
義彦 小田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10093045A priority Critical patent/JPH11289189A/en
Publication of JPH11289189A publication Critical patent/JPH11289189A/en
Pending legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

(57)【要約】 【課題】 部品切れ停止時間を短縮し、効率良く交換作
業を行え、生産性を向上できる部品装着方法及び装置を
提供する。 【解決手段】 部品供給位置と部品交換位置との間で移
動可能な複数の部品供給部と、部品切れ時に部品供給部
を部品交換位置に移動する手段と、部品切れを検出して
部品切れ時の制御を行う手段とを備えた部品装着装置に
おいて、部品切れ発生時、部品切れした部品供給部の供
給予定の残り部品を全てスキップさせ、部品切れ通知を
行い、部品切れした部品供給部を部品交換位置へ移動さ
せるとともに、他の部品供給部から部品供給を行い、部
品交換位置で部品の補給後その部品供給部を部品供給位
置に移動させ、部品切れでスキップし未装着となってい
た部品のリカバリー装着を行うようにした。
(57) [Summary] [PROBLEMS] To provide a component mounting method and device capable of shortening a component outage stop time, efficiently performing replacement work, and improving productivity. SOLUTION: A plurality of component supply units movable between a component supply position and a component replacement position, means for moving the component supply unit to the component replacement position when components are exhausted, In the component mounting apparatus provided with means for controlling a component, when a component shortage occurs, all the remaining components to be supplied from the component supply unit that has run out of components are skipped, a component shortage notification is performed, and the component supply unit that has run out of the component is sent to the component mounting unit. Move parts to the replacement position and supply parts from other parts supply parts. After replenishing parts at the parts replacement position, move the parts supply part to the parts supply position, skip parts due to lack of parts and parts that have not been mounted Recovery mounting.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、多品種の部品を基
板上に装着する部品装着方法及び装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for mounting various types of components on a board.

【0002】[0002]

【従来の技術】近年、電子部品装着装置は、多品種の電
子部品を効率よく回路基板に装着することが要求されて
いる。その中で部品切れによる設備の停止、その部品の
補給、及び交換完了設定等の作業のために生産性が低下
することが大きな課題となっている。
2. Description of the Related Art In recent years, an electronic component mounting apparatus has been required to efficiently mount various types of electronic components on a circuit board. Among them, a major problem is that productivity is reduced due to operations such as stopping equipment due to running out of parts, replenishing the parts, and setting completion of replacement.

【0003】特に、部品供給装置が100連程度と豊富
に備えている高速装着機と言われる装着装置と違って、
カセット部品供給部やトレイ部品供給部を用いて異型部
品や大型部品を装着することを目的としている多機能装
着装置においては、機構上部品供給装置の搭載数が例え
ば20連程度に限られるため、特に部品切れに伴う生産
性低下が重要な課題となっている。
[0003] In particular, unlike a mounting device called a high-speed mounting machine, which has abundant component supply devices of about 100 units,
In a multi-functional mounting device that is intended to mount odd-shaped components or large-sized components using a cassette component supply unit or a tray component supply unit, the number of mounted mechanical component supply devices is limited to, for example, about 20 units. Particularly, productivity reduction due to running out of parts is an important issue.

【0004】以下、図1〜図3を参照しながら、多品種
の部品を装着する部品装着装置(以下、多機能装着機と
いう)について説明する。
Hereinafter, a component mounting apparatus (hereinafter, referred to as a multifunctional mounting machine) for mounting various types of components will be described with reference to FIGS.

【0005】多機能装着機の構成を示す図1において、
1は回路基板11を搬入・搬出する搬送部、2はカセッ
ト部品供給部、3はトレイ部品供給部である。4はXY
ロボットで、ヘッド部5及び基板認識カメラ7を任意の
位置に位置決めする。ヘッド部5は、吸着ノズル6にて
カセット部品供給部2又はトレイ部品供給部3から電子
部品Pを吸着し、基板11上に装着する。その際、基板
認識カメラ7による回路基板11の位置の計測結果に応
じてヘッド部5を回路基板の装着位置に位置決めする。
8は吸着ノズル6による電子部品の吸着姿勢を撮像計測
する部品認識カメラ、9は吸着ノズル6及び治具ノズル
を備えたノズルステーション、10はカセット部品供給
部2を矢印A方向に部品供給位置(B)と部品交換位置
(C)との間で移動させる部品交換位置移動手段であ
る。
[0005] In FIG. 1 showing the configuration of a multi-function mounting machine,
Reference numeral 1 denotes a transport unit for loading and unloading the circuit board 11, reference numeral 2 denotes a cassette component supply unit, and reference numeral 3 denotes a tray component supply unit. 4 is XY
The robot positions the head unit 5 and the board recognition camera 7 at arbitrary positions. The head unit 5 sucks the electronic component P from the cassette component supply unit 2 or the tray component supply unit 3 by the suction nozzle 6 and mounts the electronic component P on the substrate 11. At this time, the head unit 5 is positioned at the mounting position of the circuit board according to the measurement result of the position of the circuit board 11 by the board recognition camera 7.
Reference numeral 8 denotes a component recognition camera which captures and measures the suction posture of the electronic component by the suction nozzle 6, 9 denotes a nozzle station having the suction nozzle 6 and the jig nozzle, and 10 denotes a component supply position (in the direction of arrow A in the cassette component supply unit 2). This is a component replacement position moving means for moving between the component replacement position (B) and the component replacement position (C).

【0006】トレイ部品供給部3を示す図2において、
13は電子部品を配列したトレイ15を段積み状態で保
持してなるトレイマガジン14を上下に移動するリフタ
ー部であり、トレイ部品の部品交換位置移動手段を構成
している。また、リフター部13にて供給位置に位置決
めされた所定のトレイ15はトレイマガジン14から矢
印D方向に前後に引き出される。
In FIG. 2 showing the tray component supply section 3,
A lifter unit 13 moves up and down a tray magazine 14 holding trays 15 on which electronic components are arranged in a stacked state, and constitutes a component replacement position moving unit for tray components. Further, the predetermined tray 15 positioned at the supply position by the lifter unit 13 is pulled out from the tray magazine 14 back and forth in the direction of arrow D.

【0007】このように多機能装着機は、多品種の部品
をテーピング部品、トレイ収納部品又はスティック収納
部品(図示せず)等の各々適した部品供給部から供給
し、基板11上に装着するように構成されている。
As described above, the multi-function mounting machine supplies various types of components from appropriate component supply units such as taping components, tray storage components or stick storage components (not shown), and mounts the components on the substrate 11. It is configured as follows.

【0008】具体例として、テーピング部品は1.0×
0.5mm角の微小角チップ部品から44mm角の大型異型
部品まで供給可能であり、これにはコンデンサ、トラン
ジスタ部品、あるいはCSP(Chip Scale Package)部
品等が含まれる。また、トレイ収納部品は、高さ25m
m、幅150mm程度までの大型部品を供給可能であり、
大型QFP、SOP部品や、BGA(Bell Grid Alley
)部品、異型部品、高価なカスタムIC等が含まれ
る。
[0008] As a specific example, the taping component is 1.0 ×
We can supply from 0.5mm square micro chip parts to 44mm square large irregular parts, including capacitors, transistor parts, CSP (Chip Scale Package) parts and the like. The tray storage parts are 25m high.
m, large parts up to about 150mm in width can be supplied.
Large QFP and SOP parts, BGA (Bell Grid Alley
) Parts, odd-shaped parts, expensive custom ICs, etc. are included.

【0009】次に、以上の多機能装着機のカセット部品
供給部2における部品切れ時の動作について説明する。
Next, a description will be given of the operation of the cassette component supply unit 2 of the multi-function mounting machine when components run out.

【0010】まず、多機能装着機の部品供給方式とし
て、従来から4パターンのモード(接続モード、交換モ
ード、優先交換モード、準備モード)があり、各々の動
作の特徴について説明する。
First, there are four types of modes (connection mode, exchange mode, priority exchange mode, preparation mode) as a component supply system of the multi-function mounting machine, and the features of each operation will be described.

【0011】図4に示すように、2つのカセット部品供
給部2として供給ブロックLと供給ブロックRを備えて
いる。ここで、1つの目の供給ブロックLが、Z1から
Z20の20個のカセット部品を搭載し、2つの目の供
給ブロックRが、Z21からZ40の20個のカセット
部品を搭載し、合計40個のカセット部品を搭載してい
るとする。
As shown in FIG. 4, a supply block L and a supply block R are provided as two cassette component supply units 2. Here, the first supply block L mounts 20 cassette parts Z1 to Z20, and the second supply block R mounts 20 cassette parts Z21 to Z40, for a total of 40 cassette parts. It is assumed that the cassette component is mounted.

【0012】接続モードは、Z1からZ40までの2つ
の供給ブロックL、Rを両方とも使用し、多種類の部品
供給が可能なモードであり、特に多品種少量生産を行う
場合に有効な供給方式である。
The connection mode uses two supply blocks L and R from Z1 to Z40, and is capable of supplying various kinds of components. In particular, a supply method effective in the case of multi-product small-quantity production. It is.

【0013】この場合の動作フローを図6を参照して説
明する。1つのカセット部品、例えばZ1に部品が無く
なれば、部品切れ通知して供給ブロックLが部品交換位
置へ移動するとともに装着機が停止する。そして、部品
交換位置で部品が補給され、補給完了後スイッチが押さ
れると、供給ブロックLが部品供給位置へ移動して部品
切れ部品の供給が開始され、装着が再開される。
The operation flow in this case will be described with reference to FIG. If one cassette component, for example, Z1, runs out of components, the component is notified and the supply block L moves to the component replacement position and the mounting machine stops. Then, when the components are replenished at the component replacement position and the switch is pressed after the replenishment is completed, the supply block L moves to the component supply position and the supply of the part-removed components is started, and the mounting is resumed.

【0014】交換モードは、2つの供給ブロックLとR
に同一部品を搭載しておき、片方の供給ブロックが部品
切れになると、もう片側の供給ブロックで自動的に生産
を継続する供給方式である。例えば、Z1からZ20ま
でと、Z21からZ40までを同一のテーピング部品で
供給し、Z1とZ21が同じテーピング部品の供給を行
うことで、Z1が部品切れの場合、Z21で生産し、Z
1をその間に補充することが可能であり、この間に部品
を補充していけば、Z1からZ20と、Z21からZ4
0の供給部を部品切れ毎に交互に生産でき、装着機の停
止を無くすことができる。この場合、供給できる部品種
類が少なくなる。
The exchange mode consists of two supply blocks L and R
This is a supply system in which the same parts are mounted in advance, and when one supply block runs out of parts, the other supply block automatically continues production. For example, Z1 to Z20 and Z21 to Z40 are supplied by the same taping component, and Z1 and Z21 supply the same taping component. When Z1 is out of components, Z1 is produced and Z21 is produced.
1 can be replenished in the meantime, and if parts are replenished during this time, Z1 to Z20 and Z21 to Z4
The supply unit of 0 can be alternately produced each time a part is exhausted, and the stop of the mounting machine can be eliminated. In this case, the types of components that can be supplied are reduced.

【0015】優先交換モードは、上記交換モードと同様
に部品をセットするが、優先して使用する供給ブロック
を指定しておく供給方式である。例えばZ1からZ20
を優先だとすれば、Z1が部品切れで生産がZ21に移
行した場合、Z21で生産するが、Z1の部品切れ補充
後、補充完了でZ21からZ1に再び供給を移すモード
である。
The priority replacement mode is a supply system in which components are set in the same manner as the above-described replacement mode, but a supply block to be used with priority is specified. For example, Z1 to Z20
If Z1 is out of order and Z1 runs out of parts and production shifts to Z21, then Z21 is produced, but after Z1 parts run-out replenishment is completed, supply is transferred from Z21 to Z1 again upon completion of replenishment.

【0016】準備モードは、片方の供給ブロック、例え
ばZ1からZ20のみで生産を行い、他方の供給ブロッ
ク、Z21からZ40はこの生産中に次の生産を行うテ
ーピング部品の準備を行うもので、段取り替えの多い場
合に有効なモードである。
In the preparation mode, production is performed using only one supply block, for example, Z1 to Z20, and the other supply block, Z21 to Z40, is used to prepare a taping component for performing the next production during this production. This mode is effective when there are many replacements.

【0017】以上、テーピング部品の場合を説明した
が、トレイ収納部品を供給するトレイ部品供給部3につ
いても2箇所備えてあり、同様な4モードの部品供給部
の選択が可能である。
Although the case of taping components has been described above, two tray component supply units 3 for supplying tray storage components are provided, and a similar four-mode component supply unit can be selected.

【0018】[0018]

【発明が解決しようとする課題】ところで、上記のよう
な構成において、準備モード、交換モード、優先交換モ
ードの3モードでは、部品切れ時や段取り替え時に有利
であるが、上述したように片方分の供給ブロックの部品
種類しか供給、装着できないという問題点を有してい
る。
In the above-described configuration, the three modes of the preparation mode, the replacement mode, and the priority replacement mode are advantageous at the time of component exhaustion or setup change. However, there is a problem that only the component types of the supply block can be supplied and mounted.

【0019】それに対して接続モードでは、多品種の部
品供給に有利であるが、部品切れ時に装置が停止し、生
産ロスが発生するという問題点を有している。
On the other hand, the connection mode is advantageous for supplying various types of parts, but has a problem that the apparatus stops when parts are exhausted, resulting in a production loss.

【0020】本発明は、上記従来の問題点に鑑み、生産
中は接続モードのように多品種の部品供給ができ、しか
も部品切れ時には装置を停止することなく部品装着を継
続できる部品装着方法及び装置を提供することを目的と
している。
In view of the above-mentioned conventional problems, the present invention provides a component mounting method and a component mounting method capable of supplying various types of components during the production as in the connection mode, and further capable of continuing the component mounting without stopping the apparatus when the components run out. It is intended to provide a device.

【0021】[0021]

【課題を解決するための手段】本発明の部品装着方法
は、部品供給位置と部品交換位置との間で移動可能でか
つそれぞれ異なった多数種類の部品が配置された複数の
部品供給部から所望の部品を供給して基板に装着する第
1工程と、第1工程中に何れかの部品供給部で部品切れ
が発生した時にその部品供給部を部品交換位置に移動し
て部品の補充を行う第2工程と、部品切れの発生した部
品供給部からの部品供給による部品装着をスキップして
他の部品供給部から部品を供給して基板に装着する第3
工程と、部品交換位置での部品補充完了後その部品供給
部を部品供給位置へ移動させて第1工程に復帰する第4
工程とを備えたものである。
According to the present invention, there is provided a component mounting method comprising a plurality of components which are movable between a component supply position and a component replacement position and in which a plurality of different types of components are arranged. A first step of supplying a component and mounting it on a substrate, and when any component supply section runs out during the first step, the component supply section is moved to a component replacement position to replenish components. The second step is a third step of skipping component mounting by component supply from a component supply unit where a component shortage has occurred, supplying components from another component supply unit, and mounting the components on a board.
A process and after the completion of component replenishment at the component replacement position, the component supply unit is moved to the component supply position and the process returns to the first process.
And a process.

【0022】第4工程では、第3工程で部品供給してい
る部品供給部からの部品供給が終了してからスキップし
た部品供給部からの部品供給によるリカバリー装着を行
う方法、または第3工程で部品供給している部品供給部
と部品供給位置に復帰してきた部品供給部の内予め優先
指定された部品供給部から供給される部品の装着を優先
して行う方法、又は第3工程で部品供給している部品供
給部からの部品供給による装着と、部品供給位置に復帰
してきた部品供給部からの部品供給によるリカバリー装
着とを任意に選択して行う方法がある。
In the fourth step, a method of performing recovery mounting by supplying a component from the component supply section skipped after the component supply from the component supply section supplying the component in the third step is completed, or in the third step, A method of prioritizing the mounting of components supplied from a previously specified component supply unit among the component supply units that are supplying components and the component supply units that have returned to the component supply position, or component supply in the third step There is a method of arbitrarily selecting between mounting by component supply from the component supply unit and recovery mounting by component supply from the component supply unit that has returned to the component supply position.

【0023】また、本発明の部品装着装置は、部品供給
位置と部品交換位置との間で移動可能な複数の部品供給
部と、部品を吸着する吸着ノズルを備えたヘッド部と、
ヘッド部を任意の位置に位置決めする手段と、部品切れ
時に部品供給部を部品交換位置に移動する手段と、部品
切れを検出して部品切れ時の制御を行う制御手段とを備
えた部品装着装置において、部品切れ発生時、部品切れ
した部品供給部の供給予定の残り部品を全てスキップさ
せ、部品切れ通知を行い、部品切れした部品供給部を部
品交換位置へ移動させるとともに、他の部品供給部から
部品供給を行い、部品交換位置で部品の補給後その部品
供給部を部品供給位置に移動させ、部品切れでスキップ
し未装着となっていた部品のリカバリー装着を行うよう
にしたものである。
Also, the component mounting apparatus of the present invention includes a plurality of component supply units movable between a component supply position and a component replacement position, a head unit having a suction nozzle for sucking components,
A component mounting apparatus comprising: means for positioning a head at an arbitrary position; means for moving a component supply unit to a component replacement position when a component runs out; and control means for detecting a component run and performing control when the component runs out. In the event that a component shortage occurs, all the remaining components to be supplied from the component supply unit that has run out of components are skipped, a component shortage notification is performed, the component supply unit that has run out of components is moved to the component replacement position, and another component supply unit is used. After the parts are supplied at the part replacement position, the parts supply part is moved to the parts supply position after the parts are replenished, and the parts that have been skipped due to the lack of parts and have not been mounted are subjected to recovery mounting.

【0024】これにより、生産中は複数の部品供給部に
種類の異なる部品を配置することにより多品種の部品供
給ができ、しかも部品切れ時にも設備を停止することな
く継続生産できて生産ロスなしで部品交換を行うことが
でき、またその部品交換は部品供給部を部品交換位置に
移動させて行うので生産中にも簡単に効率良く交換する
ことができ、また部品切れでスキップした部品は部品交
換後にリカバリー装着することにより円滑に正規の生産
に復帰でき、部品切れで装置を停止することを極力抑え
て生産性を向上できる。
[0024] Thus, during the production, various kinds of parts can be supplied by arranging different types of parts in a plurality of parts supply units, and even when parts run out, continuous production can be performed without stopping the equipment and there is no production loss. The parts can be replaced by moving the parts supply unit to the parts replacement position, so the parts can be replaced easily and efficiently during production. By installing the recovery after the replacement, it is possible to smoothly return to the normal production, and stop the apparatus due to the lack of parts as much as possible, thereby improving the productivity.

【0025】[0025]

【発明の実施の形態】以下、本発明の部品装着装置の一
実施形態について、図1〜図5を参照して説明する。な
お、本実施形態における部品装着装置のメカニカルな構
成については、図1〜図4で説明した従来例と全く同一
であるため、その説明を援用してここでの詳しい説明は
省略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a component mounting apparatus according to the present invention will be described below with reference to FIGS. Since the mechanical configuration of the component mounting apparatus according to the present embodiment is exactly the same as the conventional example described with reference to FIGS. 1 to 4, the detailed description is omitted here with the help of the description.

【0026】図1は本実施形態の多機能装着機の全体構
成を示す斜視図、図2はトレイ部品供給部3の斜視図、
図3はトレイ部品供給部の一部とヘッド部5にて基板1
1上に部品Pを装着する状態を示す斜視図である。
FIG. 1 is a perspective view showing the overall configuration of the multi-function mounting machine of the present embodiment, FIG. 2 is a perspective view of a tray component supply unit 3,
FIG. 3 shows a part of the tray component supply unit and the substrate
FIG. 2 is a perspective view showing a state in which a component P is mounted on the upper part 1;

【0027】電子部品Pの装着時には、図1〜図3に示
すように、回路基板11が搬送部1により装着位置に搬
入されて位置決め固定される。次にXYロボット4がヘ
ッド部5を回路基板11上に移動し、基板認識カメラ7
が基板11を認識し、装着すべき位置を計測する。次
に、XYロボット4がヘッド部5を部品供給部2又は3
上に移動し、吸着ノズル6にて電子部品Pを吸着する。
次に、ヘッド部5が移動して吸着した電子部品Pが部品
認識カメラ8上に位置すると、ヘッド部5は、吸着ノズ
ル6を下降させて吸着した電子部品Pを部品認識カメラ
8のフォーカス面に位置させる。電子部品Pが部品認識
カメラ8で撮像され、この情報を元に位置補正後、電子
部品Pが基板11上に装着される。
When the electronic component P is mounted, as shown in FIGS. 1 to 3, the circuit board 11 is carried into the mounting position by the transport unit 1 and is positioned and fixed. Next, the XY robot 4 moves the head unit 5 onto the circuit board 11, and the board recognition camera 7
Recognizes the substrate 11 and measures the position to be mounted. Next, the XY robot 4 moves the head unit 5 to the component supply unit 2 or 3
The electronic component P is moved upward and is sucked by the suction nozzle 6.
Next, when the electronic component P sucked by the movement of the head unit 5 is positioned on the component recognition camera 8, the head unit 5 lowers the suction nozzle 6 to move the electronic component P sucked to the focus surface of the component recognition camera 8. Position. The electronic component P is imaged by the component recognition camera 8, the position of which is corrected based on this information, and the electronic component P is mounted on the substrate 11.

【0028】次に、上記多機能装着機におけるカセット
部品供給部2から供給される部品の装着手順について、
主に図4、図5を参照して説明する。
Next, a procedure for mounting components supplied from the cassette component supply unit 2 in the multifunction mounting machine will be described.
This will be mainly described with reference to FIGS.

【0029】供給される部品は、図4に示すように、2
つのカセット部品供給部2である供給ブロックLと供給
ブロックRのZ1からZ40までに必要な部品が配置さ
れている。そして、例えばZ1から順番に装着を開始す
るものとする。まず、部品を吸着し、続いて部品残数を
チェックする。残数があれば、問題なくそのまま部品認
識を行った後基板11上に装着する。以上の動作を繰り
返して順次部品を基板に装着する。この間に、例えばZ
10で部品切れが発生したら、Z11からZ20までの
部品の装着は行わずにスキップして、部品切れ通知を行
い、部品ブロックLを部品交換位置移動手段10にて部
品交換位置へ移動させる。それと同時に、部品供給する
供給ブロックを他の部品ブロックRへ移動し、部品ブロ
ックRの部品Z21からZ40の部品供給を開始する。
また、この間に部品ブロックLに部品を必要分補給した
後、補給完了スイッチを押す。すると、部品交換位置移
動手段10にて供給ブロックLは部品供給に戻る。そし
て、供給ブロックRの部品供給が終わった後、それに続
いて部品切れでスキップした供給ブロックLのZ11か
らZ20の部品供給を行い、リカバリー生産を行う。そ
の際、もし新たな部品切れが発生した場合は、上記動作
を繰り返し行う。リカバリー動作の解除は、キー入力に
より解除することが可能である。
The parts supplied are, as shown in FIG.
Necessary components are arranged in Z1 to Z40 of the supply block L and the supply block R, which are two cassette component supply units 2. Then, for example, it is assumed that mounting is started in order from Z1. First, a component is sucked, and then the number of remaining components is checked. If there is a remaining number, it is mounted on the board 11 after performing component recognition without any problem. By repeating the above operation, the components are sequentially mounted on the board. During this time, for example, Z
If the component has run out in step 10, skip the component mounting from Z11 to Z20, skip the component, notify the component running out, and move the component block L to the component replacement position by the component replacement position moving means 10. At the same time, the supply block for supplying components is moved to another component block R, and component supply of components Z21 to Z40 of the component block R is started.
During this time, after the parts are replenished to the parts block L as needed, the supply completion switch is pressed. Then, the supply block L returns to the component supply by the component replacement position moving means 10. Then, after the supply of the components of the supply block R is completed, the components from the components Z11 to Z20 of the supply block L skipped due to the component shortage are supplied, and the recovery production is performed. At this time, if a new component runs out, the above operation is repeated. The release of the recovery operation can be released by key input.

【0030】上記説明では、供給ブロックLが復帰した
後、供給ブロックLに部品補給している間に部品供給し
ていた供給ブロックRからの部品供給が終了してから、
供給ブロックLからの部品供給によるリカバリー装着を
行う例を示したが、供給ブロックLが復帰した後、供給
ブロックLと供給ブロックRの内予め優先指定された供
給ブロックL又はRから供給される部品の装着を優先し
て行うようにしても良く、また供給ブロックLからの部
品供給によるリカバリー装着と供給ブロックRからの部
品供給による装着を装着能率を最適化する適当なアルゴ
リズムに基づいて任意に選択して行うようにしても良
い。
In the above description, after the supply block L is restored, the component supply from the supply block R, which has been supplying components while the components are being supplied to the supply block L, ends.
Although the example in which the recovery mounting is performed by supplying the components from the supply block L has been described, after the supply block L is restored, the components supplied from the supply block L or the supply block L of the supply block L which has been designated in advance by priority. Mounting may be performed with priority, and recovery mounting by supplying components from the supply block L and mounting by supplying components from the supply block R may be arbitrarily selected based on an appropriate algorithm for optimizing the mounting efficiency. You may do it.

【0031】また、以上の説明ではカセット部品供給部
2から供給される部品の装着手順についてのみ説明した
が、トレイ部品供給部3からの部品供給する場合も同様
であり、両者を併用して部品装着する場合も同様であ
る。
In the above description, only the procedure for mounting components supplied from the cassette component supply unit 2 has been described. However, the same applies to the case where components are supplied from the tray component supply unit 3; The same applies to the case of mounting.

【0032】[0032]

【発明の効果】本発明の部品装着方法及び装置によれ
ば、以上の説明から明らかなように、生産中は複数の部
品供給部に異なった部品を配置して多品種の部品装着が
でき、かつ部品切れ発生時には、部品切れした部品供給
部の供給予定の残り部品を全てスキップさせ、部品切れ
通知を行い、部品切れした部品供給部を部品交換位置ヘ
移動させるとともに、他の部品供給部に部品供給を移し
て部品装着を継続し、部品交換位置で部品の補給後、そ
の部品供給部を生産位置に移動させ、部品切れでスキッ
プし未装着となっていた部品のリカバリー装着を行うよ
うにしたので、生産を継続しながら部品交換を行うこと
ができ、部品切れで装置を停止することを極力抑えて生
産性を向上できるという効果が得られる。
According to the component mounting method and apparatus of the present invention, as is apparent from the above description, it is possible to mount various types of components by arranging different components in a plurality of component supply units during production. In addition, when a component shortage occurs, all of the remaining components to be supplied from the component supply unit that has been cut out are skipped, a component exhaustion notification is performed, the component supply unit that has lost the component is moved to the component replacement position, and another component supply unit is sent to another component supply unit. Transfer component supply and continue component mounting.After replenishing components at the component replacement position, move the component supply unit to the production position, and perform recovery mounting of components that were skipped due to component exhaustion and were not mounted. As a result, parts can be replaced while production is continued, and the effect of improving productivity by minimizing stoppage of the apparatus due to running out of parts can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態における部品装着装置の全
体概略斜視図である。
FIG. 1 is an overall schematic perspective view of a component mounting apparatus according to an embodiment of the present invention.

【図2】同実施形態におけるトレイ部品供給部の斜視図
である。
FIG. 2 is a perspective view of a tray component supply unit in the embodiment.

【図3】同実施形態におけるトレイ部品供給部とヘッド
部の詳細斜視図である。
FIG. 3 is a detailed perspective view of a tray component supply unit and a head unit in the embodiment.

【図4】同実施形態における複数の部品供給部の部品配
置状態の説明図である。
FIG. 4 is an explanatory diagram of a component arrangement state of a plurality of component supply units in the embodiment.

【図5】同実施形態における装着動作のフローチャート
である。
FIG. 5 is a flowchart of a mounting operation in the embodiment.

【図6】従来例における装着動作のフローチャートであ
る。
FIG. 6 is a flowchart of a mounting operation in a conventional example.

【符号の説明】[Explanation of symbols]

2 カセット部品供給部 3 トレイ部品供給部 4 XYロボット 5 ヘッド部 6 吸着ノズル 10 部品交換位置移動手段 13 リフター部(部品交換位置移動手段) 2 Cassette component supply unit 3 Tray component supply unit 4 XY robot 5 Head unit 6 Suction nozzle 10 Component replacement position moving means 13 Lifter unit (component replacement position moving means)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 小田 義彦 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshihiko Oda 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 部品供給位置と部品交換位置との間で移
動可能でかつそれぞれ異なった多数種類の部品が配置さ
れた複数の部品供給部から所望の部品を供給して基板に
装着する第1工程と、第1工程中に何れかの部品供給部
で部品切れが発生した時にその部品供給部を部品交換位
置に移動して部品の補充を行う第2工程と、部品切れの
発生した部品供給部からの部品供給による部品装着をス
キップして他の部品供給部から部品を供給して基板に装
着する第3工程と、部品交換位置での部品補充完了後そ
の部品供給部を部品供給位置へ移動させて第1工程に復
帰する第4工程とを備えたことを特徴とする部品装着方
法。
1. A first component, which supplies a desired component from a plurality of component supply units which are movable between a component supply position and a component replacement position and in which a plurality of different types of components are arranged, and are mounted on a substrate. A second step of moving a component supply unit to a component replacement position and replenishing a component when a component shortage occurs in any of the component supply units during the first process; A third step of skipping component mounting by a component supply from a unit and supplying components from another component supply unit and mounting the components on a board, and moving the component supply unit to the component supply position after completion of component replenishment at the component replacement position A fourth step of moving and returning to the first step.
【請求項2】 第4工程では、第3工程で部品供給して
いる部品供給部からの部品供給が終了してからスキップ
した部品供給部からの部品供給によるリカバリー装着を
行うことを特徴とする請求項1記載の部品装着方法。
2. In the fourth step, after the component supply from the component supply unit that supplies components in the third step ends, recovery mounting is performed by component supply from the skipped component supply unit. The component mounting method according to claim 1.
【請求項3】 第4工程では、第3工程で部品供給して
いる部品供給部と部品供給位置に復帰してきた部品供給
部の内予め優先指定された部品供給部から供給される部
品の装着を優先して行うことを特徴とする請求項1記載
の部品装着方法。
3. In the fourth step, mounting of a component supplied from a previously specified component supply unit of the component supply unit that supplies components in the third step and the component supply unit that has returned to the component supply position. 2. The component mounting method according to claim 1, wherein priority is given to performing the mounting.
【請求項4】 第4工程では、第3工程で部品供給して
いる部品供給部からの部品供給による装着と、部品供給
位置に復帰してきた部品供給部からの部品供給によるリ
カバリー装着とを任意に選択して行うことを特徴とする
請求項1記載の部品装着方法。
In the fourth step, mounting by component supply from the component supply unit that supplies components in the third step and recovery mounting by component supply from the component supply unit that has returned to the component supply position are optional. 2. The component mounting method according to claim 1, wherein the selecting is performed.
【請求項5】 部品供給位置と部品交換位置との間で移
動可能な複数の部品供給部と、部品を吸着する吸着ノズ
ルを備えたヘッド部と、ヘッド部を任意の位置に位置決
めする手段と、部品切れ時に部品供給部を部品交換位置
に移動する手段と、部品切れを検出して部品切れ時の制
御を行う制御手段とを備えた部品装着装置において、部
品切れ発生時、部品切れした部品供給部の供給予定の残
り部品を全てスキップさせ、部品切れ通知を行い、部品
切れした部品供給部を部品交換位置へ移動させるととも
に、他の部品供給部から部品供給を行い、部品交換位置
で部品の補給後その部品供給部を部品供給位置に移動さ
せ、部品切れでスキップし未装着となっていた部品のリ
カバリー装着を行うようにしたことを特徴とする部品装
着装置。
5. A plurality of component supply units movable between a component supply position and a component replacement position, a head unit having a suction nozzle for sucking components, and means for positioning the head unit at an arbitrary position. In a component mounting apparatus provided with means for moving a component supply unit to a component replacement position when a component runs out, and control means for detecting a component run-out and performing control when the component runs out, when a component run-out occurs, All the remaining parts to be supplied by the supply unit are skipped, a component shortage notification is performed, the component supply unit that has run out of components is moved to the component replacement position, and a component is supplied from another component supply unit, and the component is supplied at the component replacement position. A component mounting apparatus characterized in that the component supply unit is moved to a component supply position after replenishment, and the component mounting unit skips due to component exhaustion and performs recovery mounting of components that have not been mounted.
JP10093045A 1998-04-06 1998-04-06 Component mounting method and device Pending JPH11289189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10093045A JPH11289189A (en) 1998-04-06 1998-04-06 Component mounting method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10093045A JPH11289189A (en) 1998-04-06 1998-04-06 Component mounting method and device

Publications (1)

Publication Number Publication Date
JPH11289189A true JPH11289189A (en) 1999-10-19

Family

ID=14071546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10093045A Pending JPH11289189A (en) 1998-04-06 1998-04-06 Component mounting method and device

Country Status (1)

Country Link
JP (1) JPH11289189A (en)

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Publication number Priority date Publication date Assignee Title
JP2011054712A (en) * 2009-09-01 2011-03-17 Panasonic Corp Electronic component-packaging device and method of packaging electronic component
JP2011054711A (en) * 2009-09-01 2011-03-17 Panasonic Corp Electronic component-packaging device
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