JPH11288975A5 - - Google Patents
Info
- Publication number
- JPH11288975A5 JPH11288975A5 JP1998091311A JP9131198A JPH11288975A5 JP H11288975 A5 JPH11288975 A5 JP H11288975A5 JP 1998091311 A JP1998091311 A JP 1998091311A JP 9131198 A JP9131198 A JP 9131198A JP H11288975 A5 JPH11288975 A5 JP H11288975A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding
- metal bumps
- electrodes
- bare chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
【００１６】
【課題を解決するための手段】
請求項１の発明による解決手段は、先端が尖っている金属バンプが形成されたべアチップを前記金属バンプを介して基板の電極に接続するボンディング方法において、
前記金属バンプが接続される前記基板の電極を含む前記基板のべアチップ搭載領域に封止樹脂を塗布する塗布工程と、
前記塗布工程後に前記金属バンプを超音波を印加しながら前記基板の電極に熱圧着する熱圧着工程とを具備することを特徴とするボンディング方法にある。
[0016]
[Means for solving the problem]
The solution according to the invention of claim 1 is a bonding method for connecting a bare chip having pointed metal bumps to electrodes on a substrate via the metal bumps, comprising the steps of:
a coating step of coating a sealing resin on a bare chip mounting area of the substrate including electrodes of the substrate to which the metal bumps are connected;
The bonding method is characterized by comprising, after the application step, a thermocompression bonding step of thermocompression bonding the metal bumps to the electrodes of the substrate while applying ultrasonic waves.
請求項２の発明による解決手段は、前記超音波の印加は、前記金属バンプの前記基放の電極への接触時点以降又は前記接触時点より前から開始することを特徴とする請求項１記載のボンディング方法にある。 The solution provided by the invention of claim 2 resides in the bonding method described in claim 1, characterized in that the application of the ultrasonic waves begins after or before the metal bump comes into contact with the substrate electrode.
請求項３の発明による解決手段は、前記封止樹脂は熱硬化型樹脂であり、熱圧着工程後に前記基板とベアチップとの間に介在している封止樹脂を硬化させる加熱工程を具備することを特徴とする請求項１記載のボンディング方法にある。 The solution provided by the invention of claim 3 is the bonding method described in claim 1, characterized in that the sealing resin is a thermosetting resin and includes a heating step for hardening the sealing resin interposed between the substrate and the bare chip after the thermocompression bonding step.
請求項４の発明による解決手段は、金属バンプが形成されたべアチップを前記金属バンプを介して基板の電極に接続するボンディング装置において、
前記基板のべアチッフ°搭載領域に封止樹脂を塗布する塗布機構と、前記ベアチップを保持するボンディングツールと、前記ボンディングツールを介して前記ベアチップを前記基板に対して加圧する加圧機構と、前記金属バンプの前記電極への接触部位に、前記金属バンプの前記基板の電極への接触時点以降又は前記接触時点より前から超音波を印加する超音波印加機構とを具備することを特徴とするボンディング装置にある。
The solution according to the invention of claim 4 is a bonding apparatus for connecting a bare chip having metal bumps formed thereon to electrodes of a substrate via the metal bumps, comprising:
The bonding device is characterized by comprising an application mechanism that applies sealing resin to the bare chip mounting area of the substrate, a bonding tool that holds the bare chip, a pressure mechanism that presses the bare chip against the substrate via the bonding tool, and an ultrasonic application mechanism that applies ultrasonic waves to the contact points of the metal bumps with the electrodes of the substrate after or before the metal bumps come into contact with the electrodes of the substrate.
請求項５の発明による解決手段は、前記基板は、ボンディングステージに保持され、このボンディングステージには前記基板を加熱する加熱手段が設けられていることを特徴とする請求項４記載のボンディング装置にある。 The solution provided by the invention of claim 5 resides in the bonding apparatus described in claim 4, characterized in that the substrate is held on a bonding stage, and this bonding stage is provided with heating means for heating the substrate.
Claims (5)
前記金属バンプが接続される前記基板の電極を含む前記基板のべアチップ搭載領域に封止樹脂を塗布する塗布工程と、
前記塗布工程後に前記金属バンプを超音波を印加しながら前記基板の電極に熱圧着する熱圧着工程とを具備することを特徴とするボンディング方法。 A bonding method for connecting a bare chip having pointed metal bumps to electrodes on a substrate via the metal bumps, comprising:
a coating step of coating a sealing resin on a bare chip mounting area of the substrate including electrodes of the substrate to which the metal bumps are connected;
a thermocompression bonding step of thermocompressing the metal bumps to the electrodes of the substrate while applying ultrasonic waves after the coating step;
前記基板のべアチッフ°搭載領域に封止樹脂を塗布する塗布機構と、前記ベアチップを保持するボンディングツールと、前記ボンディングツールを介して前記ベアチップを前記基板に対して加圧する加圧機構と、前記金属バンプの前記電極への接触部位に、前記金属バンプの前記基板の電極への接触時点以降又は前記接触時点より前から超音波を印加する超音波印加機構とを具備することを特徴とするボンディング装置。 A bonding apparatus for connecting bare chips having metal bumps formed thereon to electrodes on a substrate via the metal bumps,
A bonding device comprising: an application mechanism that applies sealing resin to the bare chip mounting area of the substrate; a bonding tool that holds the bare chip; a pressure mechanism that presses the bare chip against the substrate via the bonding tool; and an ultrasonic application mechanism that applies ultrasonic waves to the contact points of the metal bumps with the electrodes of the substrate after or before the metal bumps come into contact with the electrodes of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10091311A JPH11288975A (en) | 1998-04-03 | 1998-04-03 | Bonding method and bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10091311A JPH11288975A (en) | 1998-04-03 | 1998-04-03 | Bonding method and bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11288975A JPH11288975A (en) | 1999-10-19 |
| JPH11288975A5 true JPH11288975A5 (en) | 2005-09-15 |
Family
ID=14022934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10091311A Pending JPH11288975A (en) | 1998-04-03 | 1998-04-03 | Bonding method and bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11288975A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000068327A (en) * | 1998-08-20 | 2000-03-03 | Matsushita Electric Ind Co Ltd | Component mounting method and equipment |
| JP3830125B2 (en) * | 2000-03-14 | 2006-10-04 | 株式会社東芝 | Semiconductor device manufacturing method and semiconductor device |
| JP4585196B2 (en) * | 2003-12-16 | 2010-11-24 | 富士通セミコンダクター株式会社 | Electronic component bonding method and apparatus |
| JP4260721B2 (en) | 2004-10-29 | 2009-04-30 | 富士通株式会社 | Electronic component board mounting method and board mounting apparatus |
| JP4733441B2 (en) * | 2005-06-27 | 2011-07-27 | アスリートＦａ株式会社 | Electronic component joining equipment |
-
1998
- 1998-04-03 JP JP10091311A patent/JPH11288975A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2002045152A3 (en) | Flip chip mounting technique | |
| JPH10199932A (en) | Semiconductor chip component mounting method | |
| JP3687280B2 (en) | Chip mounting method | |
| JP2727443B2 (en) | Semiconductor chip bonding method | |
| US20100133671A1 (en) | Flip-chip package structure and the die attach method thereof | |
| JPH11288975A5 (en) | ||
| US20030085474A1 (en) | Method of attaching semiconductor devices on a switching device and such an attached device | |
| JP3376861B2 (en) | Mounting method of work with bump | |
| KR101093060B1 (en) | Mounting method and structure of electronic parts with bump | |
| JPH0244745A (en) | Wire bonding | |
| JP3412672B2 (en) | Semiconductor device and method of manufacturing this semiconductor device | |
| JP3726795B2 (en) | Bumped workpiece mounting method | |
| JPH11288975A (en) | Bonding method and bonding apparatus | |
| JPH11135561A (en) | Anisotropic conductive adhesive film, manufacturing method thereof, flip chip mounting method, and flip chip mounting substrate | |
| JPH07326710A (en) | Semiconductor mounting structure | |
| JPH11204572A (en) | Semiconductor device mounting structure and method of manufacturing the same | |
| JP2812304B2 (en) | Repair method for flip-chip type semiconductor device | |
| JPH10233417A (en) | Semiconductor device and manufacturing method thereof | |
| JP3702929B2 (en) | Wire bonding method | |
| JP2005353672A (en) | Flip chip mounting method | |
| JPH118258A (en) | Suction / pressurizing chuck and method of manufacturing semiconductor device using the chuck | |
| JP4006900B2 (en) | Substrate, connection structure thereof, and method of manufacturing substrate | |
| JP3064843B2 (en) | Chip bonding method | |
| JP3445687B2 (en) | Mounting method of semiconductor chip | |
| JP4234518B2 (en) | Semiconductor mounting substrate manufacturing method, semiconductor package manufacturing method, semiconductor mounting substrate and semiconductor package |