JPH11285815A - Solder for aluminum, aluminum printed wiring board and semiconductor integrated circuit device and method for joining aluminum member using it - Google Patents
Solder for aluminum, aluminum printed wiring board and semiconductor integrated circuit device and method for joining aluminum member using itInfo
- Publication number
- JPH11285815A JPH11285815A JP8678098A JP8678098A JPH11285815A JP H11285815 A JPH11285815 A JP H11285815A JP 8678098 A JP8678098 A JP 8678098A JP 8678098 A JP8678098 A JP 8678098A JP H11285815 A JPH11285815 A JP H11285815A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- solder
- hard particles
- joining
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 102
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 102
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005304 joining Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000011888 foil Substances 0.000 abstract description 21
- 229910045601 alloy Inorganic materials 0.000 abstract description 12
- 239000000956 alloy Substances 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 229910020836 Sn-Ag Inorganic materials 0.000 abstract description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 abstract description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 abstract description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 abstract 1
- 229910033181 TiB2 Inorganic materials 0.000 abstract 1
- 229910007948 ZrB2 Inorganic materials 0.000 abstract 1
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000008399 tap water Substances 0.000 description 6
- 235000020679 tap water Nutrition 0.000 description 6
- 230000004907 flux Effects 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229910020218 Pb—Zn Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、アルミニウム用
はんだ、アルミニウム用はんだを用いて電子部品が接合
されたアルミニウムプリント配線基板、およびアルミニ
ウム配線が接合された半導体集積回路装置、アルミニウ
ム用はんだを用いてアルミニウム部材を接合する方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder for aluminum, an aluminum printed wiring board to which electronic components are joined by using the solder for aluminum, a semiconductor integrated circuit device to which aluminum wiring is joined, and a solder for aluminum. The present invention relates to a method for joining aluminum members.
【０００２】[0002]
【従来の技術】従来から、Ｐｂ−Ｓｎ共晶はんだがよく
知られている。また、Ｓｎ−Ｚｎ系合金がアルミニウム
用はんだとしてＪＩＳで規格化されている。2. Description of the Related Art Conventionally, Pb-Sn eutectic solder is well known. In addition, Sn-Zn based alloys are standardized by JIS as solder for aluminum.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、Ｐｂ−
Ｓｎ共晶はんだを用いてアルミニウム部材、たとえばア
ルミニウム箔を接合しようとすると、アルミニウム箔の
表面に形成された酸化膜が強固で、はんだの濡れ性が極
端に悪いため、またはんだとアルミニウムが合金を形成
しがたいため、接合することは困難であった。However, Pb-
When attempting to join an aluminum member, for example, an aluminum foil, using Sn eutectic solder, the oxide film formed on the surface of the aluminum foil is strong, and the wettability of the solder is extremely poor. Since it is difficult to form, it has been difficult to join.
【０００４】また、Ｓｎ−Ｚｎ系合金をはんだとして用
いてアルミニウム箔等のアルミニウム部材を接合しよう
とすると、上記と同じ理由で接合することは困難であっ
た。[0004] Further, when an aluminum member such as an aluminum foil is to be joined using a Sn-Zn-based alloy as solder, it has been difficult to join for the same reason as described above.
【０００５】一方、はんだの濡れ性を確保するためにフ
ッ化物系フラックスをはんだの表面に塗布してアルミニ
ウム箔等のアルミニウム部材を接合することが考えられ
る。この場合、アルミニウム箔の表面に形成された酸化
膜を破壊または改質することができるが、フラックスが
アルミニウム箔の表面に残留する。このため、アルミニ
ウム箔の表面が腐食するという問題があり、その表面を
完全に洗浄する必要がある。したがって、フラックスを
用いたアルミニウム部材のはんだ付け方法も普及してい
ないのが現状である。On the other hand, in order to secure the wettability of the solder, it is conceivable to apply a fluoride-based flux to the surface of the solder and join an aluminum member such as an aluminum foil. In this case, the oxide film formed on the surface of the aluminum foil can be destroyed or modified, but the flux remains on the surface of the aluminum foil. For this reason, there is a problem that the surface of the aluminum foil is corroded, and it is necessary to completely clean the surface. Therefore, at present, a method of soldering an aluminum member using a flux is not widespread.
【０００６】以上のように、現状では、アルミニウムま
たはアルミニウム合金からなる部材を接合するためのは
んだとして満足した性能を有するものがなかった。As described above, at present, there has been no solder having satisfactory performance as a solder for joining members made of aluminum or aluminum alloy.
【０００７】そこで、この発明の目的は、上述の問題点
を解決するとともに、アルミニウムまたはアルミニウム
合金からなる部材を強固に接合することが可能なアルミ
ニウム用はんだ、アルミニウム用はんだを用いたプリン
ト配線基板と半導体集積回路装置、アルミニウム用はん
だを用いてアルミニウム部材を接合する方法を提供する
ことである。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a printed circuit board using an aluminum solder and an aluminum solder capable of firmly joining members made of aluminum or an aluminum alloy. An object of the present invention is to provide a semiconductor integrated circuit device and a method of joining aluminum members using aluminum solder.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、鋭意検討
した結果、アルミニウムまたはアルミニウム合金（以
下、「アルミニウム」と称する）からなる部材を接合す
るはんだの材料として比較低温度で強固な接合を得るこ
とが可能な材料を見い出した。The inventors of the present invention have conducted intensive studies and have found that as a solder material for joining a member made of aluminum or an aluminum alloy (hereinafter, referred to as "aluminum"), a comparatively low-temperature strong joining is performed. Have been found that can obtain the following.
【０００９】すなわち、この発明に従ったアルミニウム
用はんだは、導電性硬質粒子を０．１重量％以上、６０
重量％以下含む。That is, the solder for aluminum according to the present invention contains conductive hard particles in an amount of 0.1% by weight or more and 60% or more.
% By weight or less.
【００１０】アルミニウム用はんだのマトリックスの融
点は、２５０℃以下であるのが好ましい。The melting point of the matrix of the solder for aluminum is preferably 250 ° C. or less.
【００１１】硬質粒子の融点は、３００℃以上であるの
が好ましい。硬質粒子は、比抵抗が１００μΩｃｍ以下
である材料からなるのが好ましい。The hard particles preferably have a melting point of 300 ° C. or higher. The hard particles are preferably made of a material having a specific resistance of 100 μΩcm or less.
【００１２】硬質粒子は、平均粒径が１５０μｍ以下の
粉末からなるのが好ましい。硬質粒子は、ビッカース硬
度（Ｈｖ）が２５以上の材料からなるのが好ましい。The hard particles are preferably made of a powder having an average particle size of 150 μm or less. The hard particles are preferably made of a material having a Vickers hardness (Hv) of 25 or more.
【００１３】導電性硬質粒子は、ＴｉＢ2 、ＺｒＢ2 、
Ｎｉ、Ａｇ、Ｃｕ、ＡｕおよびＴｉからなる群より選ば
れた少なくとも１種の材料を含むのが好ましい。The conductive hard particles are TiB 2 , ZrB 2 ,
It is preferable to include at least one material selected from the group consisting of Ni, Ag, Cu, Au and Ti.
【００１４】この発明に従ったアルミニウムプリント配
線基板は、上述のアルミニウム用はんだを用いて電子部
品が接合されたものである。An aluminum printed wiring board according to the present invention is one in which electronic components are joined using the above-described solder for aluminum.
【００１５】また、この発明に従った半導体集積回路装
置は、上述のアルミニウム用はんだを用いてアルミニウ
ム配線が接合されたものである。Further, in a semiconductor integrated circuit device according to the present invention, an aluminum wiring is joined using the above-mentioned solder for aluminum.
【００１６】さらに、この発明に従ったアルミニウム部
材の接合方法は、上述のアルミニウム用はんだを用いて
アルミニウム部材を接合する方法において、アルミニウ
ム用はんだに超音波振動または圧力の少なくともいずれ
かを加えることを特徴とするものである。Further, in the method for joining aluminum members according to the present invention, in the method for joining aluminum members using the above-mentioned solder for aluminum, at least one of ultrasonic vibration and pressure is applied to the solder for aluminum. It is a feature.
【００１７】[0017]
【発明の実施の形態】本発明のアルミニウム用はんだ
は、特にアルミニウム箔とプラスチックフィルムを貼り
合わせ、アルミニウム箔のエッチングにより回路パター
ンを形成したプリント配線基板において、アルミニウム
配線やＩＣチップ、チップコンデンサー等の電子部品の
接合に用いることができる。上記の接合時（はんだ付け
時）の作業温度をできるだけ低くするために、本発明の
アルミニウム用はんだのマトリックスの融点はできるだ
け低い方が好ましい。好ましくは、その融点は２５０℃
以下、より好ましくは２００℃以下である。BEST MODE FOR CARRYING OUT THE INVENTION The solder for aluminum according to the present invention is particularly suitable for a printed circuit board in which a circuit pattern is formed by laminating an aluminum foil and a plastic film and etching the aluminum foil. It can be used for joining electronic components. In order to lower the working temperature at the time of the above-mentioned joining (at the time of soldering), it is preferable that the melting point of the matrix of the aluminum solder of the present invention is as low as possible. Preferably, its melting point is 250 ° C
Or less, more preferably 200 ° C. or less.
【００１８】本発明のアルミニウム用はんだのマトリッ
クスとしては、Ｓｎ−Ａｇ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａ
ｇ−Ｂｉ系、Ｓｎ−Ａｇ−Ｂｉ−Ｃｕ系、Ｓｎ−Ｚｎ−
Ｘ系（ただし、Ｘは任意の金属元素あるいは半金属元
素）、Ｓｎ−Ｉｎ系、Ｓｎ−Ｐｂ−Ｚｎ系、Ｚｎ−Ｓｎ
系、Ｚｎ−Ｃｄ系等の合金が挙げられる。これらの合金
の中でも、特にＳｎ−Ｐｂ−Ｚｎ系合金をアルミニウム
用はんだのマトリックスとして用いるのが好ましい。The matrix of the solder for aluminum according to the present invention includes Sn-Ag type, Sn-Bi type, Sn-A
g-Bi-based, Sn-Ag-Bi-Cu-based, Sn-Zn-
X type (where X is an arbitrary metal element or metalloid element), Sn—In type, Sn—Pb—Zn type, Zn—Sn
And Zn-Cd-based alloys. Among these alloys, it is particularly preferable to use a Sn-Pb-Zn-based alloy as a matrix of the solder for aluminum.
【００１９】アルミニウム用はんだの形態は線状、粉末
状、フレーク、リボン、チップ（粒）等のいずれであっ
ても、使用することができる。The form of the solder for aluminum may be any of linear, powder, flake, ribbon, chip (grain) and the like.
【００２０】本発明のアルミニウム用はんだのマトリッ
クスに添加される導電性硬質粒子として、金属粉末、金
属間化合物粉末、導電性セラミックス粉末等を挙げるこ
とができる。特に、ＴｉＢ2 、ＺｒＢ2 、Ｎｉ、Ａｇ、
Ｃｕ、Ａｕ、Ｔｉのうち、少なくとも１種を導電性硬質
粒子として用いるのが好ましく、２種以上を混合して用
いてもよい。ＴｉＢ2 とＺｒＢ2 のセラミックスは粒子
として加工しやすく、金属に匹敵する導電性を有する。The conductive hard particles to be added to the matrix of the aluminum solder of the present invention include metal powder, intermetallic compound powder, and conductive ceramic powder. In particular, TiB 2 , ZrB 2 , Ni, Ag,
At least one of Cu, Au, and Ti is preferably used as the conductive hard particles, and two or more of them may be used in combination. TiB 2 and ZrB 2 ceramics are easy to process as particles and have conductivity comparable to metals.
【００２１】導電性硬質粒子の融点は、はんだ付け温度
より高いことが必要である。好ましくは、導電性硬質粒
子の融点は３００℃以上で、より好ましくは５００℃以
上である。The melting point of the conductive hard particles must be higher than the soldering temperature. Preferably, the melting point of the conductive hard particles is 300 ° C. or higher, more preferably 500 ° C. or higher.
【００２２】また、上記で列挙された導電性硬質粒子の
材料は、電位的に貴な物質であり、耐食性を改善する機
能を有する。また、これらの材料は電気導電性に優れて
いるため、大量にアルミニウム用はんだのマトリックス
に添加しても、はんだの電気抵抗値を上昇させることが
ない。The materials of the conductive hard particles listed above are substances that are noble in potential and have a function of improving corrosion resistance. In addition, since these materials are excellent in electric conductivity, even if they are added in a large amount to the matrix of the solder for aluminum, the electric resistance of the solder does not increase.
【００２３】導電性硬質粒子の含有量は、０．１重量％
以上、６０重量％以下であるのが好ましく、より好まし
くは１０重量％以上、５０重量％以下である。はんだ付
け時にアルミニウム部材を介してはんだの材料に超音波
振動または圧力が加えられると、はんだに含まれる硬質
粒子がアルミニウム部材の表面に形成された酸化膜を破
壊し、アルミニウム部材の表面に新生面を形成し、はん
だの濡れ性を良好にする。したがって、硬質粒子の含有
量が０．１重量％未満では、アルミニウムの酸化膜を破
壊する作用が十分ではない。また、硬質粒子の含有量が
６０重量％を超えると、アルミニウム用はんだとしての
本来の接着機能が損なわれ、接着強度は低下する。The content of the conductive hard particles is 0.1% by weight.
The content is preferably 60% by weight or less, more preferably 10% by weight or more and 50% by weight or less. When ultrasonic vibration or pressure is applied to the solder material via the aluminum member during soldering, the hard particles contained in the solder destroy the oxide film formed on the surface of the aluminum member and form a new surface on the surface of the aluminum member. To improve solder wettability. Therefore, when the content of the hard particles is less than 0.1% by weight, the effect of destroying the aluminum oxide film is not sufficient. On the other hand, when the content of the hard particles exceeds 60% by weight, the original bonding function as a solder for aluminum is impaired, and the bonding strength is reduced.
【００２４】導電性硬質粒子は、比抵抗が１００μΩｃ
ｍ以下の材料から選択されるのが好ましい。導電性硬質
粒子の比抵抗が１００μΩｃｍを超えると、はんだの電
気抵抗値が高くなり、発熱を引き起こし、また通電性を
低下させることになり、好ましくない。The conductive hard particles have a specific resistance of 100 μΩc.
Preferably, it is selected from materials of m or less. If the specific resistance of the conductive hard particles exceeds 100 μΩcm, the electric resistance of the solder increases, causing heat generation and lowering the electrical conductivity, which is not preferable.
【００２５】硬質粒子の平均粒径は１５０μｍ以下であ
るのが好ましく、さらに好ましくは１００μｍ以下であ
る。硬質粒子の平均粒径が１５０μｍを超えると、接合
されるアルミニウム部材の表面の単位面積あたりに作用
する硬質粒子の数が少なくなり、アルミニウムの酸化膜
を破壊する機会が少なく、その結果、はんだの濡れ性が
低下することになる。The average particle size of the hard particles is preferably 150 μm or less, more preferably 100 μm or less. When the average particle size of the hard particles exceeds 150 μm, the number of hard particles acting per unit area of the surface of the aluminum member to be joined decreases, and the opportunity to destroy the oxide film of aluminum is reduced. The wettability will be reduced.
【００２６】硬質粒子の硬度はビッカース硬度（Ｈｖ）
で２５以上必要であり、好ましくは５０以上である。硬
質粒子の硬度がビッカース硬度で２５以下であれば、ア
ルミニウムの酸化膜を破壊する効果に乏しいからであ
る。The hardness of the hard particles is Vickers hardness (Hv)
At least 25, and preferably at least 50. If the hardness of the hard particles is 25 or less in Vickers hardness, the effect of destroying the aluminum oxide film is poor.
【００２７】なお、硬質粒子の形状は特に限定されない
が、球状、涙滴状、扁平状、針状、板状、回転楕円体
状、不定形状のいずれでもよい。The shape of the hard particles is not particularly limited, but may be spherical, teardrop-like, flat, needle-like, plate-like, spheroidal or irregular.
【００２８】はんだのマトリックス中に硬質粒子を添加
する方法は、溶解させたはんだのマトリックス合金に分
散複合化させる方法、粉末状のはんだのマトリックス合
金と混合する方法、はんだ付けの際に供給する方法、予
めはんだ付けする材料に塗布する方法、線状のはんだの
マトリックス合金の表面に塗布する方法等のいずれであ
ってもよい。最終的にはんだ付けの際に、はんだのマト
リックス合金と導電性硬質粒子とが混合して存在すれば
よい。線状のはんだのマトリックス合金等の表面に塗布
する場合には、適当なアルコール、たとえばエタノー
ル、ＩＰＡ（イソプロピルアルコール）、グリセリン、
ポリエチレングリコール、メタノール等の有機溶媒を使
用して導電性硬質粒子を塗布するのが好ましく、有機バ
インダ、たとえば、ポリブデン、ロジン、アマイド系樹
脂、オレイン酸、ステアリン酸等の油脂類、ワックス等
を併用してもよい。The method of adding the hard particles to the solder matrix includes a method of dispersing and compounding into a dissolved solder matrix alloy, a method of mixing with a powdered solder matrix alloy, and a method of supplying at the time of soldering. Any of a method of applying the material to a material to be soldered in advance and a method of applying the material to the surface of a linear solder matrix alloy may be used. Finally, at the time of soldering, the matrix alloy of the solder and the conductive hard particles may be present as a mixture. When applied to the surface of a linear solder matrix alloy or the like, an appropriate alcohol such as ethanol, IPA (isopropyl alcohol), glycerin,
It is preferable to apply conductive hard particles using an organic solvent such as polyethylene glycol and methanol, and an organic binder such as polybutene, rosin, amide resin, oleic acid, oils and fats such as stearic acid, and wax are used in combination. May be.
【００２９】本発明のアルミニウム用はんだを用いてア
ルミニウム箔等のアルミニウム部材、アルミニウムと電
子部品等を接合する方法として超音波はんだ接合方法を
用いればよい。導電性硬質粒子は、超音波によって振動
し、アルミニウムの酸化膜を破壊し、アルミニウム部材
の表面に新生面を与える作用をする。この作用によって
アルミニウム部材とはんだとの密着性が向上し、強固な
接着力を達成することができる。An ultrasonic soldering method may be used as a method for bonding an aluminum member such as an aluminum foil, aluminum and an electronic component or the like using the aluminum solder of the present invention. The conductive hard particles vibrate by ultrasonic waves, break the aluminum oxide film, and act to give a new surface to the surface of the aluminum member. By this action, the adhesion between the aluminum member and the solder is improved, and a strong adhesive force can be achieved.
【００３０】なお、超音波振動を加えなくても、アルミ
ニウム部材を介してはんだに圧力を加えるだけでも、ア
ルミニウム部材の表面に形成された酸化膜は硬質粒子に
よって突き破られ、アルミニウム部材の表面に新生面が
露出する。圧力を加えてはんだ付けを行なっても、強固
な接着を得ることができる。The oxide film formed on the surface of the aluminum member is pierced by the hard particles even if pressure is applied to the solder through the aluminum member without applying ultrasonic vibration, and the surface of the aluminum member is damaged. A new face is exposed. Even if soldering is performed by applying pressure, strong adhesion can be obtained.
【００３１】本発明のアルミニウム用はんだを用いる
と、アルミニウムプリント配線基板とＩＣチップ、チッ
プコンデンサー等の電子部品、半導体集積回路装置（Ｉ
Ｃチップ）のアルミニウム配線を強固に接合することが
できる。When the solder for aluminum of the present invention is used, an aluminum printed wiring board, electronic components such as IC chips and chip capacitors, and semiconductor integrated circuit devices (I
The aluminum wiring of (C chip) can be firmly joined.
【００３２】[0032]
【実施例】表１に示す組成のはんだを作製した。Ｚｎ、
Ｓｎ、Ｐｂを含むはんだのマトリックスを構成する粉末
はアルゴンガスアトマイズ法によって作製し、ふるい分
けして粒径８０μｍ以下の粉末を得た。この粉末に、表
１に示すようにＮｉ、ＴｉＢ2 、ＺｒＢ2 の各導電性硬
質粒子を必要量添加して混合した後、はんだに対して１
０重量％のロジンを添加してペースト状にした。はんだ
の粘度を調整するためにペースト状のはんだに少量のＩ
ＰＡを添加した。EXAMPLE A solder having the composition shown in Table 1 was prepared. Zn,
The powder constituting the solder matrix containing Sn and Pb was prepared by an argon gas atomizing method and sieved to obtain a powder having a particle size of 80 μm or less. As shown in Table 1, the conductive hard particles of Ni, TiB 2 , and ZrB 2 were added to the powder in necessary amounts and mixed, and then 1 part was added to the solder.
0% by weight of rosin was added to form a paste. To adjust the viscosity of the solder, a small amount of I
PA was added.
【００３３】以上のようにして得られたはんだを用いて
純アルミニウム箔を接合した。具体的には、図１に示す
ように、はんだ１を挟むように２枚の純アルミニウム箔
２１と２２を配置した後、板状ヒータ３によって加熱し
ながら、超音波振動子４によって超音波の振動を純アル
ミニウム箔２１を介してはんだ１に加えた。純アルミニ
ウム箔はＪＩＳ Ａ１０５０を用い、厚みが５０μｍ、
幅が５ｍｍ、長さが５０ｍｍであった。はんだの量は約
０．１ｇであった。加熱温度は約１９０℃、加熱時間は
約７秒間であった。超音波の振動数は３００Ｈｚ、その
出力は２０Ｗであった。純アルミニウム箔２１の表面に
加えられた圧力は約５００ｇ／ｃｍ2 であった。加熱開
始からはんだ付け終了までの時間は約１５秒間であっ
た。A pure aluminum foil was joined using the solder obtained as described above. Specifically, as shown in FIG. 1, after arranging two pure aluminum foils 21 and 22 so as to sandwich the solder 1, while heating the plate-shaped heater 3, the ultrasonic oscillator 4 Vibration was applied to the solder 1 via the pure aluminum foil 21. The pure aluminum foil uses JIS A1050 and has a thickness of 50 μm,
The width was 5 mm and the length was 50 mm. The amount of solder was about 0.1 g. The heating temperature was about 190 ° C., and the heating time was about 7 seconds. The ultrasonic frequency was 300 Hz, and the output was 20 W. The pressure applied to the surface of the pure aluminum foil 21 was about 500 g / cm 2 . The time from the start of heating to the end of soldering was about 15 seconds.
【００３４】このようにして２枚の純アルミニウム箔を
はんだによって接合した試料として、表１に示すように
実施例１〜６と比較例１を作製した。各試料の接着力の
評価は、１８０°剥離試験と水道水腐食試験によって行
なった。剥離試験はＪＩＳＫ６８５４に準拠してｎ＝５
の条件で行なった。剥離角度は１８０°、剥離速度は３
００ｍｍ／分とした。水道水腐食試験は約２０℃の常温
中で水道水に各試料を完全に浸漬し、２４時間放置した
後、肉眼によって剥離状況を観察した。剥離試験と水道
水腐食試験の結果を表１に示す。As shown in Table 1, Examples 1 to 6 and Comparative Example 1 were prepared as samples in which two pure aluminum foils were joined by soldering. Evaluation of the adhesive strength of each sample was performed by a 180 ° peel test and a tap water corrosion test. The peeling test was performed according to JIS K 6854, where n = 5.
The conditions were as follows. Peeling angle 180 °, peeling speed 3
00 mm / min. In the tap water corrosion test, each sample was completely immersed in tap water at room temperature of about 20 ° C., left for 24 hours, and then visually observed the peeling state. Table 1 shows the results of the peel test and the tap water corrosion test.
【００３５】[0035]
【表１】 [Table 1]
【００３６】表１から明らかなように、硬質粒子を含む
各実施例の試料は、高い剥離強度を示し、水道水腐食試
験においても最大でも１．５ｍｍ程度の剥離が観察され
るだけであった。これに対して、比較例は、実施例に比
べて低い剥離強度を示し、水道水腐食試験においても
２．１ｍｍという大きな剥離が観察された。As is clear from Table 1, the samples of each of the examples containing hard particles exhibited high peel strength, and only a peel of about 1.5 mm at most was observed in the tap water corrosion test. . On the other hand, the comparative example exhibited lower peel strength than the example, and a large peel of 2.1 mm was observed in the tap water corrosion test.
【００３７】以上に開示された実施の形態や実施例はす
べての点で例示的に示されるものであって制限的なもの
ではないと考慮されるべきである。本発明の範囲は、以
上の実施の形態や実施例ではなく、特許請求の範囲によ
って示され、特許請求の範囲と均等の意味および範囲内
でのすべての修正や変形を含むものである。The embodiments and examples disclosed above are illustrative in all respects and should be considered as non-limiting. The scope of the present invention is defined by the terms of the claims, rather than the embodiments or examples described above, and includes all modifications and variations within the scope and meaning equivalent to the terms of the claims.
【００３８】[0038]
【発明の効果】本発明のアルミニウム用はんだを用いる
ことにより、アルミニウム部材を強固に接合することが
できる。また、本発明のアルミニウム用はんだは、従来
のはんだ材料と同等以上の電気導電性を示し、良好な耐
食性を示す。さらに、本発明のアルミニウム用はんだを
用いてアルミニウム部材を接合する場合、従来のように
はんだの濡れ性を確保するためにフラックスを用いる必
要もないので、アルミニウム部材の表面を清浄にするた
めの洗浄等の後処理の必要もない。By using the solder for aluminum according to the present invention, the aluminum member can be firmly joined. Further, the solder for aluminum of the present invention exhibits electrical conductivity equal to or higher than that of a conventional solder material, and exhibits good corrosion resistance. Furthermore, when an aluminum member is joined by using the aluminum solder of the present invention, it is not necessary to use a flux to secure the wettability of the solder as in the conventional case, so that cleaning for cleaning the surface of the aluminum member is not necessary. No post-processing is required.
【００３９】なお、硬質粒子を含まない従来のはんだ材
料を用いた場合、はんだ付け後のはんだの層の厚みを制
御するために機械的なストッパを用いる必要があり、所
定の厚みを制御することは困難である。しかし、本発明
のはんだを使用する場合には、はんだに含まれる硬質粒
子がスペーサの役割を果たし、接合後のはんだ層の厚み
が一定になるという作用効果も得ることができる。When a conventional solder material containing no hard particles is used, it is necessary to use a mechanical stopper to control the thickness of the solder layer after soldering. It is difficult. However, when the solder of the present invention is used, the hard particles contained in the solder serve as a spacer, and an effect of making the thickness of the solder layer after joining constant can be obtained.
【００４０】本発明の接合方法は、アルミニウム部材を
用いた電気部品、電子部品に有用であり、特にプリント
配線基板やＩＣカード内のアルミニウム配線の接合、Ｉ
Ｃチップの実装等に好適である。The joining method of the present invention is useful for electric parts and electronic parts using aluminum members, and particularly for joining aluminum wiring in a printed wiring board or an IC card.
It is suitable for mounting a C chip.
【図１】この発明に従ったアルミニウム用はんだを用い
て純アルミニウム箔を接合する方法の一実施例を示す概
略的な断面図である。FIG. 1 is a schematic cross-sectional view showing one embodiment of a method of joining a pure aluminum foil using a solder for aluminum according to the present invention.
１ はんだ ３ 板状ヒータ ４ 超音波振動子 ２１，２２ 純アルミニウム箔 DESCRIPTION OF SYMBOLS 1 Solder 3 Plate heater 4 Ultrasonic vibrator 21 and 22 Pure aluminum foil
Claims (10)
０重量％以下含む、アルミニウム用はんだ。1. The method according to claim 1, wherein the conductive hard particles are contained in an amount of 0.1% by weight or more,
A solder for aluminum containing 0% by weight or less.
０℃以下である、請求項１に記載のアルミニウム用はん
だ。2. The melting point of the solder matrix is 25.
The solder for aluminum according to claim 1, wherein the temperature is 0 ° C or less.
る、請求項１または２に記載のアルミニウム用はんだ。3. The solder for aluminum according to claim 1, wherein said hard particles have a melting point of 300 ° C. or higher.
ｍ以下である材料からなる、請求項１から３までのいず
れかに記載のアルミニウム用はんだ。4. The hard particles have a specific resistance of 100 μΩc.
The solder for aluminum according to any one of claims 1 to 3, wherein the solder is made of a material having a particle size of m or less.
以下の粉末からなる、請求項１から４までのいずれかに
記載のアルミニウム用はんだ。5. The hard particles have an average particle size of 150 μm.
The solder for aluminum according to any one of claims 1 to 4, comprising the following powder.
ｖ）が２５以上の材料からなる、請求項１から５までの
いずれかに記載のアルミニウム用はんだ。6. The hard particles have a Vickers hardness (H).
The solder for aluminum according to any one of claims 1 to 5, wherein v) is composed of 25 or more materials.
Ｎｉ、Ａｇ、Ｃｕ、ＡｕおよびＴｉからなる群より選ば
れた少なくとも１種の材料を含む、請求項１から６まで
のいずれかに記載のアルミニウム用はんだ。7. The hard particles include TiB 2 , ZrB 2 ,
The solder for aluminum according to any one of claims 1 to 6, comprising at least one material selected from the group consisting of Ni, Ag, Cu, Au and Ti.
れたアルミニウム用はんだを用いて電子部品が接合され
たアルミニウムプリント配線基板。8. An aluminum printed wiring board to which an electronic component is joined by using the aluminum solder according to any one of claims 1 to 7.
れたアルミニウム用はんだを用いてアルミニウム配線が
接合された半導体集積回路装置。9. A semiconductor integrated circuit device wherein an aluminum wiring is joined using the aluminum solder according to claim 1. Description:
されたアルミニウム用はんだを用いてアルミニウム部材
を接合する方法において、アルミニウム用はんだに超音
波振動または圧力の少なくともいずれかを加えることを
特徴とする、アルミニウム部材の接合方法。10. The method for joining aluminum members using the solder for aluminum according to claim 1, wherein at least one of ultrasonic vibration and pressure is applied to the solder for aluminum. A method for joining aluminum members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8678098A JPH11285815A (en) | 1998-03-31 | 1998-03-31 | Solder for aluminum, aluminum printed wiring board and semiconductor integrated circuit device and method for joining aluminum member using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8678098A JPH11285815A (en) | 1998-03-31 | 1998-03-31 | Solder for aluminum, aluminum printed wiring board and semiconductor integrated circuit device and method for joining aluminum member using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11285815A true JPH11285815A (en) | 1999-10-19 |
Family
ID=13896279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8678098A Pending JPH11285815A (en) | 1998-03-31 | 1998-03-31 | Solder for aluminum, aluminum printed wiring board and semiconductor integrated circuit device and method for joining aluminum member using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11285815A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2100686A1 (en) * | 2008-03-11 | 2009-09-16 | ProLas GmbH | Method for soldering metallic joint partners and device therefor |
| WO2016071230A1 (en) * | 2014-11-07 | 2016-05-12 | Danfoss Silicon Power Gmbh | Sintering paste and method for bonding joining partners |
| CN115401357A (en) * | 2022-08-31 | 2022-11-29 | 昆明理工大学 | Composite solder alloy containing in-situ synthesized nano reinforcing phase and preparation method thereof |
| CN119501367A (en) * | 2024-11-14 | 2025-02-25 | 广东工业大学 | A tin-based bismuth-rich flux-cored welding wire, welding spot, and preparation method and application thereof |
-
1998
- 1998-03-31 JP JP8678098A patent/JPH11285815A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2100686A1 (en) * | 2008-03-11 | 2009-09-16 | ProLas GmbH | Method for soldering metallic joint partners and device therefor |
| WO2016071230A1 (en) * | 2014-11-07 | 2016-05-12 | Danfoss Silicon Power Gmbh | Sintering paste and method for bonding joining partners |
| CN115401357A (en) * | 2022-08-31 | 2022-11-29 | 昆明理工大学 | Composite solder alloy containing in-situ synthesized nano reinforcing phase and preparation method thereof |
| CN115401357B (en) * | 2022-08-31 | 2024-01-30 | 昆明理工大学 | Composite solder alloy containing in-situ synthesized nano reinforcing phase and preparation method thereof |
| CN119501367A (en) * | 2024-11-14 | 2025-02-25 | 广东工业大学 | A tin-based bismuth-rich flux-cored welding wire, welding spot, and preparation method and application thereof |
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