JPH11216656A - Work cutting method by wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the deformation of a cut article by blowing cooling air against a work during the cutting to suppress the heat generation and to prevent the deformation of the work. SOLUTION: A working solution 5 containing the abrasive grain is sprayed from a nozzle 6 between a semi-conductor ingot 4 and a wire 2 while feeding the wire 2 in its longitudinal direction, and the semi-conductor ingot 4 is sliced by the lapping effect to form a wafer. The semi-conductor ingot 4 is cooled by blowing cooling air 8 against the semi-conductor ingot 4 during the slicing from an air nozzle 7, and the heat generation of the semi-conductor ingot 4 during the machining is suppressed to achieve the machining with excellent accuracy. The deformation of the semi-conductor ingot 4 during the slicing is prevented, and the deformation of a wafer which is a sliced article, can be prevented thereby.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a workpiece using a wire saw, and more particularly to a method for suppressing heat generation of the workpiece due to the cutting.

[0002]

2. Description of the Related Art As shown in FIG. 5, a wire saw (piano wire) 2 is wound around three (or four) main rollers 1 in parallel at a constant pitch. The work 4 containing abrasive grains is sprayed and supplied from the nozzle 6 between the work 4 and the wire 2 while the wire 2 is fed in the direction of the line, and the work 4 is wrapped. Is cut to obtain a sliced product, and a large number of sliced products having a constant thickness can be obtained at the same time.

In the above-mentioned wire saw, although the working fluid 4 containing abrasive grains is supplied to the cutting portion of the work 4, the cooling of the work 4 is insufficient, and the work 4 generates heat by the cutting process, and The processed sliced product may be warped, and the dimensional accuracy may be reduced.

[0004]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a high-precision cut processing product by suppressing the heat generation of the work when cutting the work using a wire saw, thereby preventing the deformation of the work and the cut product. An object of the present invention is to provide a work cutting method using a wire saw that can be obtained.

[0005]

Means for Solving the Problems A method for cutting a workpiece by a wire saw according to the present invention for solving the above-mentioned problems is as follows.
In the cutting of a work by a wire saw, cooling air is blown onto the work being processed, thereby suppressing heat generation during the processing and performing high-precision processing.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a work cutting method using a wire saw according to the present invention will be described with reference to FIG.
A large number of wires (piano wires) 2 are wound around three (or four) main rollers 1 in parallel at a constant pitch, and a columnar work, a semiconductor ingot 4 in this example, is placed horizontally on the wire row 3. While pressing the wire 2 and sending the wire 2 in the line direction, a processing liquid 5 containing abrasive grains is jetted and supplied from the nozzle 6 between the semiconductor ingot 4 and the wire 2, and the semiconductor ingot 4 is sliced by a lapping action to form a wafer. As shown in FIG. 2, cooling air 8 of 10 ° C. to 25 ° C. is applied to the semiconductor ingot 4 being sliced from the air nozzle 7 at a rate of 20 l / min.
The semiconductor ingot 4 is cooled by spraying at a rate of 00 l / min, and heat generation of the semiconductor ingot 4 during processing is suppressed to perform high-precision processing. Thus, the deformation of the semiconductor ingot 4 during the slicing is prevented, and the deformation of the slicing wafer is also prevented, and the accuracy of the wafer, particularly the planar accuracy, is improved.

As shown in FIG. 3, a cylindrical work (horizontally horizontal semiconductor ingot) 4 of the air nozzle 7 is provided.
Is 20 ° to 90 °, preferably 50 ° to 80 °, and 70 ° in this example. At this time, the center line of the air nozzle 7 is at a position inclined by 45 degrees with respect to the center O of the work 4, and the lower edge of the air blowing surface of the work 4 is located at a position inclined by 20 degrees with respect to the center of the work 4.

As shown in FIG. 4A, the air nozzle 7 has a rectangular tube shape, a horizontal length of 500 mm and a hypotenuse length of 30 mm.
mm, an air introduction pipe 7a is provided on one side, but is not limited to this. As shown in FIG. 4b, the air introduction pipe 7a has a cylindrical shape, a horizontal length of 500 mm, a diameter of 30 mm, and air introduction on one side. An air nozzle 7 'provided with a pipe 7a may be used.

[0009]

As can be understood from the above description, the work cutting method using a wire saw according to the present invention suppresses heat generation by blowing cooling air to the work during the work of cutting the work, thereby preventing deformation of the work. As a result, the deformation of the cut product is prevented, and the accuracy of the cut product, particularly the planar accuracy, is improved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a work cutting method using a wire saw according to the present invention.

FIG. 2 is a schematic side view showing a state in which cooling air is blown on a work being cut in the work cutting method shown in FIG. 1;

FIG. 3 is a diagram showing a spray angle of an air nozzle and a position of the air nozzle with respect to the work shown in FIG. 2;

4A is a perspective view showing the shape and dimensions of the air nozzle shown in FIG. 2, and FIG. 4B is a perspective view showing the shape and dimensions of an air nozzle instead of this.

FIG. 5 is a schematic perspective view showing a conventional work cutting method using a wire saw.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main roller 2 Wire 4 Workpiece (semiconductor ingot) 5 Processing liquid containing abrasive grains 6 Nozzle 7, 7 'Air nozzle 8 Cooling air

Claims (1)

[Claims] 1. A method for cutting a workpiece using a wire saw, wherein in the workpiece cutting processing using a wire saw, cooling air is blown onto the workpiece being processed to suppress heat generation during the processing and perform high-precision processing.