JPH11201988A - Contact probe - Google Patents

Abstract

(57) [Problem] To reduce the rigidity of a contact probe to increase flexibility, and to enable fine adjustment of the fine movement of a contact pin while mounted on a probe device. A second window is formed integrally with a window of a ground made of Cu. The enlarged window 32 composed of the window 6 and the second window 34 is formed by removing the ground 2 and the film layer 3 made of polyimide resin or the like. Second window 3
Numeral 4 extends to the narrow portion 1c and has narrow frame portions 36a, 3 on both sides thereof.
6a is provided. When the base clamp 12 is slightly moved by the fine adjustment mechanism 20 in a state where the base clamp 12 is attached to the probe device 8,
The contact pin 5a moves in parallel by absorbing the stress in the thin frame portion 36a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe which is mounted on a probe device and is used to make an electrical test by contacting each terminal of a member to be inspected such as a semiconductor IC chip or an LSI chip.

[0002]

2. Description of the Related Art In general, a probe device is provided with contact pins for making an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip, or a terminal such as an LCD (liquid crystal display). A contact probe is used. For example, FIG. 14 and FIG.
In the contact probe 1 shown in FIGS. 5 and 16, for example, a pattern wiring 5 made of a Ni-based alloy or the like is arranged, and a film layer 3 made of a polyimide resin or the like and a metal layer made of Cu or the like are provided thereon via an adhesive layer 4. A certain ground 2 is stacked. The tips of the pattern wirings 5 are arranged in a substantially parallel manner at a narrow pitch and protrude from the tips of the ground 2 and the film layer 3 to form contact pins 5a, respectively. The contact probe 1 has a substantially home base shape in plan view as shown in FIG. 14, and has a tip 1a from which a contact pin 5a protrudes, a base 1b formed with a maximum width opposite to the tip 1a, and a tip 1b. The portion 1a is connected to the base 1b, and is formed of a narrow portion 1c whose width gradually decreases from the base 1b toward the tip 1a. A substantially rectangular window 6 extending in a direction perpendicular to the pattern wiring 5 is formed in the base 1b. Each end 5b of the pattern wiring 5 is connected to a terminal of a printed circuit board, which will be described later, at the window 6.

Such a contact probe 1 is shown in FIG.
As shown in FIG. 18, the probe device 8 is incorporated in a mechanical piece, and a terminal such as a semiconductor IC chip or an LCD is brought into contact with the contact pin 5a. That is, in the probe device 8 shown in FIGS. 17 and 18, for example, a top clamp 11 is mounted on a printed circuit board 10 having a disk shape and having a central window 10a, and then the contact probe 1 is double-sided taped on its lower surface. The base clamp 12 attached by, for example, is fixed to the top clamp 11 with bolts 13 or the like. By pressing down the base 1b of the contact probe 1 with the bottom clamp 14 having a substantially frame shape, the distal end 1a and the narrow portion 1c of the contact probe 1 are held in an inclined state, and the base 1b is pressed by the pressing rubber 15 of the bottom clamp 14. Printed circuit board 1
0 is pressed against the lower surface. As a result, the end 5b of the pattern wiring 5 of the contact probe 1 is pressed through the window 6 to the terminal on the lower surface of the printed circuit board 10 and is kept in contact. In such a state, the terminals 18a of the member to be inspected such as the semiconductor IC chip 18 are brought into contact with the contact pins 5a to perform an electrical test.

In such a probe device 8, when the contact pins 5a are brought into contact with, for example, the terminals 18a of the semiconductor IC chip 18 during the electrical test, the contact pins 5a and the terminals 18a of the IC chip 18 are used.
May be shifted. In such a case, the contact pin 5a and the terminal 18a may be partially displaced to cause a contact failure. Therefore, the contact pins 5 as shown in FIGS.
a fine adjustment mechanism 20 is provided. That is, in FIG. 19, the X-axis adjustment bolts 21 that penetrate the screw holes 11a on the side surfaces of the top clamp 11 and sandwich the both side surfaces of the base clamp 12 are attached in a direction intersecting the contact pins 5a. By rotating the base clamp 12 forward and backward, the base clamp 12 can be finely moved and adjusted in the X-axis direction.
Also, the through-hole 11 on the adjacent side surface of the top clamp 11
b, a Y-axis adjustment bolt 22 that is screwed into the screw hole 12b of the base clamp 12 is attached in a direction substantially parallel to the contact pin 5a. Fine movement adjustment can be performed in the Y-axis direction.

[0005] Further, in FIG.
The Z-axis adjustment bolt 23 that passes through the through hole 11c on the upper surface of the base probe 12 and is screwed into the screw hole 12c of the base clamp 12 is attached in a direction substantially intersecting with the contact probe 1, and rotates the Z-axis adjustment bolt 23 forward and backward. With base clamp 1
2 can be finely moved and adjusted in the Z-axis direction. Therefore, the X, Y, and Z axis adjustment bolts 21 and 2 are adjusted by the fine adjustment mechanism 20.
By rotating the base clamps 12 and 23 in the forward and reverse directions, the base clamp 12 can be finely adjusted by slightly moving each in the X, Y and Z axis directions. Thereby, the base clamp 12
By finely adjusting the distal end portion 1a and the narrow width portion 1c of the contact probe 1 fixed to the X, Y, and Z axis directions,
Each contact pin 5a can be slightly moved so as to be positioned so as to be in contact with the terminal 18a.

[0006]

However, the contact probe 1 is fixed by a bottom clamp 14 or the like in a state where the base 1b is pressed against the printed circuit board 10, and furthermore,
Since the ground 2 is made of a metal layer such as Cu and has high strength and rigidity, the contact pin 5a may not move even when the fine adjustment mechanism 20 is actuated, or may deform due to bending such as waving. The flatness of the pin 5a may be out of order. In addition, even if the contact pin 5a is slightly moved, there is a problem that the position of the contact pin 5a may be deviated in an attempt to return to the original position due to stress.

The present invention has been made in view of the above circumstances, and has as its object to provide a contact probe in which the flexibility of the contact probe is increased so that the position can be easily adjusted even if the base is fixed. And

[0008]

In the contact probe according to the present invention, a film layer and a ground, which is a metal layer, are laminated on a plurality of pattern wirings, and each tip of the pattern wiring protrudes from the film layer to form a contact pin. In the contact probe in which the ground and the film layer are cut off at the base end of the pattern wiring, a second window is formed integrally with or separately from the window. It is characterized by the following. Therefore, when the contact probe is attached to the probe device and its base is fixed, and a mechanical part such as a base clamp is moved to adjust the position of the contact pin and a portion other than the base is slightly moved, the contact Since the ground of the probe is cut off by the window and the second window, the rigidity is reduced and the flexibility is high, the flexibility of the entire contact probe is set to be large, and parts other than the fixed base are fixed. The displacement of the contact pin can be adjusted by smooth and slight parallel movement without waving, and the contact pin does not return due to stress after the adjustment, and the state of being connected to the terminal of the member to be inspected can be reliably maintained.

The second window may be formed by cutting off the film layer. Further, the second window may be provided in a narrow portion of the contact probe. Since the second window portion is provided in the narrow portion, the stress can be absorbed by the narrow frame portions on both sides of the second window portion at the time of minute movement, the waving of the contact probe can be suppressed, and the contact pin returns after adjustment. Can be prevented.

A contact probe according to the present invention is a contact probe in which a film layer and a ground which is a metal layer are laminated on a plurality of pattern wirings, and each end of the pattern wiring protrudes from the film layer to be a contact pin. , At least a part of the ground is formed in a mesh. The contact probe has a high rigidity and a high flexibility due to the ground containing the mesh, and when the probe is mounted on the probe device and the position of the contact pin is adjusted, the stress can be absorbed by the mesh and the movement can be adjusted smoothly. In addition, it is possible to prevent the displacement of the contact pin after the adjustment due to the stress. Also,
The mesh may also be formed on the film layer. In the mesh region, an Au layer may be provided on the film layer. Even if a mesh is formed on the ground, since the Au layer is formed by plating or the like on the ground, the flexibility of the contact probe is increased, and the high-frequency characteristics are degraded during the electrical test using the probe device. Can be maintained without letting them go. In the mesh area,
An adhesive may be filled. By filling the area of the ground mesh with the adhesive, it is possible to increase the flexibility of the contact probe and securely mount and fix the contact probe to the mechanical piece.

Further, in the contact probe according to the present invention, a film layer and a ground which is a metal layer are laminated on a plurality of pattern wirings, and each end of the pattern wiring protrudes from the film layer to be a contact pin. In the probe, a plurality of holes are formed in the ground. By forming a plurality of holes in the ground, the rigidity of the contact probe can be reduced, the flexibility can be increased, and the smooth movement adjustment of the contact pin can be performed. Also, the holes may be formed in the film layer. The holes may be provided with an Au layer on the film layer. Even if holes are provided in the film layer, high frequency characteristics can be maintained by forming the Au layer by plating. Further, the holes may be filled with an adhesive. The contact probe can be reliably attached to the mechanical piece after the flexibility of the contact probe is increased.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of a contact probe according to a first embodiment, and FIG.
FIG. 2 is a sectional view taken along line BB of FIG. 1. In the contact probe 30 shown in FIGS. 1 and 2, an enlarged window 32 is formed by cutting off the ground 2, the film layer 3, and the adhesive layer 4 around the base 1b. The enlarged window 32 has the same width (for example, 20 mm) in the direction orthogonal to the base end 5b of the pattern wiring 5 as the window 6 (shown by a dashed line in FIG. 1) shown in FIG. The length of the extending direction of the contact probe 5 is substantially rectangular beyond the region of the window portion 6 (for example, 3 mm) and extending to the region within the narrow portion 1c of the contact probe 30 (for example, 8 mm). In other words, the enlarged window portion 32 has a configuration in which a substantially rectangular second window portion 34 is added to the conventional window portion 6 to be integrally formed. Since the enlarged window 32 extends from the base 1b of the contact probe 30 to the area of the narrow portion 1c where the width gradually decreases, the narrow windows located on both sides of the corner of the enlarged window 32 in the narrow portion 1c. Stress is easily generated in the frame portions 36a, 36a, and the thin frame portions 36a, 36a are easily deformed.

Since the present embodiment is configured as described above, such a contact probe 30 is mounted on the probe device 8 shown in FIGS.
2, the base end 5 b of the pattern wiring 5 is pressed by the pressing rubber 15 of the bottom clamp 14 at the portion of the window portion 6 to make contact with a terminal (not shown) of the printed circuit board 10. At the same time, the narrow portion 1c of the contact probe 30 is adhered and fixed to the lower surface of the base clamp 12 with a double-sided tape or the like. In this state, a part of the contact pin 5a is
In the case where a position shift occurs with respect to the terminal 18a of the C chip 18 and a contact failure occurs, the X-axis, the Y-axis of the contact pin 5a, and the fine adjustment mechanism 20 shown in FIGS.
Perform fine adjustment in the Z-axis direction. That is, the X-axis adjustment bolt 21,
By rotating at least one of the Y-axis adjustment bolt 22 and the Z-axis adjustment bolt 23 in the forward and reverse directions,
By moving and adjusting a small amount in the directions of the axis, the Y axis, and the Z axis, for example, the terminals 18a of the semiconductor IC chip 18 can be reliably brought into contact with the respective terminals 18a.

At this time, in the contact probe 30, the area of the enlarged window portion 32 is larger than that of the conventional window portion 6, so that its strength and rigidity are small. for that reason,
Even if the base 1b of the contact probe 30 is pressed and fixed between the bottom clamp 14 of the probe device 8 and the printed circuit board 10, the stress caused by the deformation of the thin frame portions 36a, 36a connecting the base 1b and the narrow portion 1c. Is absorbed, and the narrow portion 1c easily moves. Therefore, the distal end portion 1a and the narrow width portion 1c can be moved in parallel without causing any deviation in the flatness, and the positioning of the contact pin 5a can be surely adjusted. Moreover, the contact pins 5a do not move due to stress after the position adjustment. Particularly, in the present embodiment, since the enlarged window portion 32 is formed to extend to the area of the narrow portion 1c of the contact probe 30, the narrow portion 1c is formed.
Frame portions 36a, 36 located on both sides of the enlarged window portion 32 in FIG.
a is deformed and the stress at the time of fine adjustment can be absorbed.

As described above, according to this embodiment, since the enlarged window 32 is formed by adding the second window 34 to the conventional window 6, even if the position of the contact pin 5a is adjusted. The tip 1a of the contact probe 30 moves smoothly and minutely without being deformed or wavy, and
a can be accurately positioned and adjusted in the X, Y, and Z axis directions. Thereafter, the contact pin 5a does not move due to stress.

In the first embodiment, the second window 34
Is formed integrally with the window portion 6, but may be formed separately by separating the ground 2 and the film layer 3 as shown in FIG.

Next, another embodiment of the present invention will be described. The same reference numerals are used for the same or similar parts as those in the above-described embodiment, and the description is omitted. A second embodiment will be described with reference to FIGS. FIG. 4 is a plan view of the contact probe according to the second embodiment, and the left side of the center line L indicates the contact probe according to the second embodiment.
The right side shows a modified example. FIG. 5 is a sectional view taken along line CC of the contact probe shown in FIG. In the contact probe 38 shown in the left half of FIG. 4, the ground 40 made of a metal layer such as Cu is formed as a mesh having a mesh shape as a whole. Therefore, the film layer 3 made of a polyimide resin or the like is laminated on the ground 40 of the mesh, and the pattern wirings 5 are arranged via the adhesive layer 4. A window 6 is formed in the base 1b of the contact probe 38 by cutting off the mesh ground 40 and the film layer 3.

As described above, according to the present embodiment, since the ground 40 is formed in a mesh, the contact probe 38 is mounted on the probe device 8 and the base clamp 12 is actuated by the fine adjustment mechanism 20. Even if it is moved slightly, the ground 40 has low rigidity and high flexibility,
Since the contact probe 38 is easily deformed in a planar shape, stress is applied to the entire tip portion 1a and the narrow portion 1c of the contact probe 38, the planar shape is maintained, and the position of the contact pin 5a is maintained without being deformed and deforming such as waving. It is possible to adjust the feeding accurately. Thereafter, the contact pin 5a does not return due to stress.

It should be noted that, instead of the ground 40 entirely formed in a mesh shape, the ground 4 as shown in the right half of FIG.
For example, a mesh part 44 having a predetermined width extending in a direction intersecting the pattern wiring 5 may be formed in a part of the second part 2, and the other part may retain the configuration of the metal foil. In this case, the ground 42 has a relatively high rigidity as compared with the ground 40 shown in the left half of FIG. 4, but is smaller than the conventional ground and has a high flexibility. Therefore, the mesh portion 44 allows the contact probe 3 at the time of fine adjustment of the contact pin 5a.
8 is secured and the contact pins 5a
Position can be adjusted accurately and smoothly. In addition, not only the ground 40 (42) of the contact probe 38 but also the film layer 3 may be similarly formed in a mesh shape.

When the whole or a part of the ground 40 (42) of the contact probe 38 is formed in a mesh shape as in the second embodiment, the high-frequency characteristics during test energization may be deteriorated. In such a case, as shown in FIG. 6, a metal layer such as Au plating is formed on the film layer 3 serving as a bottom surface in each concave portion 40a formed by each mesh of the mesh ground 40 (42). Au layer 4 consisting of
6 may be formed by electroless plating or the like. In this case, Au
It is assumed that the thickness of the layer 46 is equal to or smaller than the thickness of the mesh ground 40. This is a second modification of the second embodiment. For example, when the thickness of the ground 40 (42) is 20 μm, the thickness of the Au layer 46 by plating may be about 1 μm. With such a configuration, the ground 40 (42) of the contact probe 38
Can be maintained without deteriorating the high-frequency characteristics even if the whole or a part thereof is formed as a mesh.

Further, as in the second embodiment, the whole or a part of the ground 40 (42) of the contact probe 38 is formed in a mesh shape, so that the adhesive force of the part with the bottom surface of the base clamp 12 is improved. May be smaller. In such a case, as shown in FIG. 7, the adhesive 48 may be filled in each of the concave portions 40a having the film layer 3 as the bottom surface and constituting each mesh of the mesh ground 40 (44). . The thickness of the adhesive 48 may be equal to the thickness of the mesh ground 40. This is a third modification of the second embodiment. With such a configuration, even if the whole or a part of the ground 40 (44) of the contact probe 38 is formed as a mesh, it is possible to secure reliable adhesion to the base clamp 12. As a fourth modification of the second embodiment, as shown in FIG. 8, the ground (44) having the mesh formed entirely (or partly) is formed on the film layer 3 which forms the bottom surface of each concave portion 40a of the ground 40 (44). The Au layer 46 may be formed by electroless plating or the like, and an adhesive 48 may be filled thereon. By adopting such a configuration, it is possible to simultaneously maintain the high frequency characteristics and enhance the adhesive force to the base clamp 12.

Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a plan view of the contact probe, and FIG. 10 is a DD of the contact probe shown in FIG.
It is a line sectional view. In the contact probe 50 shown in FIGS. 9 and 10, one or a plurality of holes 52 are formed by cutting the ground 2 made of a metal layer such as Cu and the film layer 3 made of a polyimide resin or the like. In the example shown in FIG. 9, a plurality of holes 52 are provided between the pattern wirings 5 and 5 and outside the pattern wiring 5, respectively. As these holes 52, for example, circular holes 52a and polygonal holes 52b in a plan view are provided. Even if such a configuration is adopted, the rigidity of the ground 2 can be reduced and the flexibility of the contact probe 50 can be increased. FIG.
In the modification shown in FIG. 1, the contact probe 54 has a plurality of long holes 56 by cutting the ground 2 and the film layer 3.
(Holes) are provided. A plurality of the long holes 56 are provided between the pattern wirings 5 and 5, outside the pattern wiring 5, and along the pattern wiring 5.

The above-mentioned contact probe 50 (5
In 4), a plurality of holes 52 provided in the ground 2
If there is a possibility that the (long holes 56) deteriorate the high-frequency characteristics, the Au layer 46 may be formed by metal plating or the like as presented in the above-described second embodiment.
For example, as shown in FIG. 12, a hole 52 is formed only in the ground 2 and the film layer 3 made of a polyimide resin or the like is entirely left without being cut off. May be formed by electroless plating.

Since a plurality of holes 52 (elongated holes 56) and the like are provided in the ground 2 of the contact probe 50 (54), the contact probe 50
In the case where the bonding strength becomes insufficient when bonding (54), as shown in FIG. 13, the film layer 3 made of polyimide resin or the like is left without being cut off, and the hole 52 (the long hole 5) is left.
For example, the adhesive 48 may be filled on the film layer 3 which is the bottom surface of 6). In this case, the adhesive 48 is ground 2
It is preferable to fill the surface with the same level. At that time,
Au is placed on the film layer 3 which is the bottom surface of the hole 52 (the long hole 56).
Forty-six layers may be formed for maintaining high frequency characteristics, and an adhesive 48 may be filled thereon.

[0025]

As described above, in the contact probe according to the present invention, since the second window portion whose ground is cut off is formed integrally with or separately from the window portion, the contact probe is mounted on the probe device, and Even if the portion other than the base is slightly moved to adjust the position of the contact pin while the base is fixed, the ground of the contact probe is partially cut off by the window and the second window so that the rigidity is maintained. The contact probe is small and highly flexible, and the contact probe can be easily and smoothly moved by a small amount without ripples, and the position of the contact pin can be adjusted reliably and connected to the terminal of the member to be inspected. You can do it. The contact pin does not return due to stress after the adjustment. In addition, since the second window is provided in the narrow portion of the contact probe, the small frame on both sides of the second window can absorb the stress at the time of the minute movement, and the minute movement while maintaining the flatness of the contact probe. Can be adjusted.

In the contact probe according to the present invention, since at least a part of the ground is formed in the mesh, the rigidity is reduced and the flexibility is high because the ground includes the mesh. When the position of the pin is adjusted, the stress can be absorbed by the mesh portion and moved in parallel, thereby preventing the contact pin from shifting or returning due to waving or the like. In addition, since the Au layer is provided on the film layer in the mesh region, the flexibility of the contact probe can be increased, and the contact probe can be maintained without deteriorating high-frequency characteristics during an electrical test using the probe device. Further, since the mesh area is filled with the adhesive, the flexibility of the contact probe can be enhanced, and the attachment and fixing to the mechanical piece can be reliably performed.

In the contact probe according to the present invention, since a plurality of holes are formed in the ground, the rigidity of the contact probe can be reduced and the flexibility can be increased. In addition, since the hole is provided with the Au layer on the film layer, high-frequency characteristics can be maintained. Further, since the hole is filled with the adhesive, the flexibility of the contact probe can be increased and the attachment to the mechanical piece can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a plan view of a contact probe according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line BB of the contact probe shown in FIG.

FIG. 3 is a plan view showing a modification of the contact probe according to the first embodiment.

FIG. 4 is a plan view of a contact probe according to a second embodiment of the present invention, showing a different example between the left side and the right side with respect to a center line L.

5 is a cross-sectional view of the contact probe shown in FIG. 4, taken along line CC.

FIG. 6 is a diagram showing a second modification of the contact probe according to the second embodiment.

FIG. 7 is a diagram showing a third modification of the contact probe according to the second embodiment.

FIG. 8 is a diagram showing a fourth modification of the contact probe according to the second embodiment.

FIG. 9 is a plan view of a contact probe according to a third embodiment of the present invention.

FIG. 10 is a vertical sectional view taken along line DD of the contact probe shown in FIG. 9;

FIG. 11 is a plan view showing a modification of the contact probe shown in FIG.

FIG. 12 is a longitudinal sectional view showing a second modification of the contact probe according to the third embodiment of the present invention.

FIG. 13 is a longitudinal sectional view showing a third modification of the contact probe according to the third embodiment of the present invention.

FIG. 14 is a plan view of a contact probe according to the prior art.

FIG. 15 AA of the contact probe shown in FIG.
It is a line sectional view.

FIG. 16 is a BB diagram of the contact probe shown in FIG. 14;
It is a line sectional view.

FIG. 17 is an exploded perspective view of a probe device to which the contact probe shown in FIG. 14 is attached.

18 is a longitudinal sectional view of the probe device shown in FIG.

19 is a plan view of relevant parts showing a fine adjustment mechanism of a contact pin of the probe device shown in FIG. 17;

20 is a longitudinal sectional view of the fine adjustment device shown in FIG.

[Explanation of symbols]

 1, 30, 38, 50, 54 Contact probe 2, 40, 42 Ground 1c Narrow width part 5 Wiring pattern 5a Contact pin 6 Window part 32 Enlarged window part 34 Second window part 44 Mesh part 46 Au layer 48 Adhesive

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshinobu Ishii 12th Techno Park, Mita City, Hyogo Prefecture Inside the Mita Plant of Mitsubishi Materials Corporation (72) Inventor Hideaki Yoshida 12th Techno Park, Mita City, Hyogo Prefecture 6. Mitsubishi Materials Corporation Mita Plant

Claims (11)

[Claims] A film layer and a ground made of a metal layer are laminated on the plurality of pattern wirings, each tip of the pattern wiring protrudes from the film layer to form a contact pin, and a base of the pattern wiring is formed. A contact probe in which a window portion in which the ground and the film layer are cut off is formed at an end, wherein a second window portion in which the ground is cut off integrally with or separately from the window portion is formed. . 2. The contact probe according to claim 1, wherein the second window is formed by cutting off a film layer. 3. The contact probe according to claim 1, wherein the second window is provided in a narrow portion of the contact probe. 4. A contact probe in which a film layer and a ground made of a metal layer are laminated on a plurality of pattern wirings, and each tip of the pattern wiring protrudes from the film layer to be a contact pin. A contact probe at least partially formed in a mesh. 5. The contact probe according to claim 4, wherein said mesh is also formed on a film layer. 6. The contact probe according to claim 4, wherein an Au layer is provided on the film layer in the mesh area. 7. The contact probe according to claim 4, wherein an area of the mesh is filled with an adhesive. 8. A contact probe in which a film layer and a ground made of a metal layer are laminated on a plurality of pattern wirings, and each tip of the pattern wiring protrudes from the film to serve as a contact pin. A contact probe characterized by having a hole formed therein. 9. The contact probe according to claim 8, wherein said holes are also formed in a film layer. 10. The hole is provided with Au on the film layer.
9. The contact probe according to claim 8, wherein a layer is provided. 11. The contact probe according to claim 8, wherein the hole is filled with an adhesive.