JPH11196055A - Optical transceiver - Google Patents
Optical transceiverInfo
- Publication number
- JPH11196055A JPH11196055A JP9360437A JP36043797A JPH11196055A JP H11196055 A JPH11196055 A JP H11196055A JP 9360437 A JP9360437 A JP 9360437A JP 36043797 A JP36043797 A JP 36043797A JP H11196055 A JPH11196055 A JP H11196055A
- Authority
- JP
- Japan
- Prior art keywords
- optical transceiver
- light emitting
- signal terminal
- signal
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 56
- 230000005540 biological transmission Effects 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 20
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Optical Communication System (AREA)
Abstract
(57)【要約】
【課題】 外来雑音等の信号干渉を抑えて小型化、高速
化、高感度化を実現する光送受信器を提供する。
【解決手段】 可撓性を有する絶縁層10Bの外側にグ
ランド層10Aを配したフレキシブル基板10の信号配
線10Cを介して発光素子1および受光素子5の信号端
子を電気的に接続するとともに、グランド層10Aをア
ース層に接続して信号端子接続部を包囲する電磁シール
ドを形成する。
(57) [Problem] To provide an optical transceiver that realizes miniaturization, high speed, and high sensitivity by suppressing signal interference such as external noise. SOLUTION: A signal terminal of a light emitting element 1 and a signal terminal of a light receiving element 5 are electrically connected via a signal wiring 10C of a flexible substrate 10 having a ground layer 10A disposed outside a flexible insulating layer 10B, and a ground is provided. The layer 10A is connected to the ground layer to form an electromagnetic shield surrounding the signal terminal connection.
Description
【0001】[0001]
【発明の属する技術分野】本発明は光ファイバを用いた
通信装置に使用される光送受信器に関し、特に、外来雑
音等の信号干渉を抑えて小型化、高速化、高感度化を可
能にする光送受信器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transceiver for use in a communication device using an optical fiber, and more particularly, to miniaturization, high speed, and high sensitivity by suppressing signal interference such as external noise. It relates to an optical transceiver.
【0002】[0002]
【従来の技術】従来、光ファイバを用いた通信装置に使
用される光送受信器は、電気信号を光信号に光電変換す
るレーザーダイオード(LD)等の発光素子と、この発
光素子を駆動する送信(駆動)回路と、光信号を電気信
号に光電変換するフォトダイオード(PD)等の受光素
子と、受光素子で光電変換された電気信号を増幅・波形
整形する受信回路を有しており、発光素子の駆動回路と
受光素子の受信回路は一枚の共用基板に搭載されて筐体
に収納されている。2. Description of the Related Art Conventionally, an optical transceiver used in a communication device using an optical fiber includes a light emitting element such as a laser diode (LD) for photoelectrically converting an electric signal to an optical signal, and a transmission for driving the light emitting element. (Drive) circuit, a light receiving element such as a photodiode (PD) for photoelectrically converting an optical signal into an electric signal, and a receiving circuit for amplifying and waveform shaping the electric signal photoelectrically converted by the light receiving element. The element driving circuit and the light receiving element receiving circuit are mounted on a single common board and housed in a housing.
【0003】このような光送受信器では、通常、受光素
子で光電変換された電気信号は数μAという微少な信号
であるため、光送受信器の近傍に他の電子回路や配線が
あると信号干渉が生じて受信感度の低下が生じるという
問題がある。また、駆動回路と発光素子を接続する信号
端子、あるいは受信回路と受光素子を接続する信号端子
が拾う干渉信号によっても送受信特性の低下が生じるこ
とから、これらを防ぐものとして、受光素子全体、また
は発光素子全体を金属板等で囲むことによってシールド
を施している。近年、光送受信器には、より小型で高
速、高感度、高品質な送受信特性が要求されつつある。In such an optical transmitter / receiver, the electric signal photoelectrically converted by the light receiving element is a very small signal of several μA. Therefore, if there is another electronic circuit or wiring near the optical transmitter / receiver, signal interference may occur. This causes a problem that the reception sensitivity is reduced and the reception sensitivity is reduced. In addition, since a signal terminal connecting the drive circuit and the light emitting element, or an interference signal picked up by the signal terminal connecting the receiving circuit and the light receiving element also causes a decrease in transmission / reception characteristics, the entire light receiving element, A shield is provided by surrounding the entire light emitting element with a metal plate or the like. 2. Description of the Related Art In recent years, optical transceivers have been required to have smaller transmission speed, higher sensitivity, and higher quality transmission / reception characteristics.
【0004】図6は、従来の光送受信器を示し、電気信
号に応じた光信号を発生する発光素子1と、発光素子1
を駆動する駆動回路2と、光信号に応じた電気信号を発
生する受光素子5と、受光素子5から出力される電気信
号を増幅して波形整形する受信回路6と、発光素子1の
駆動回路2および受光素子5の受信回路6を搭載する回
路基板4を有し、発光素子1、受光素子5、および回路
基板4を筐体8内に収納している。FIG. 6 shows a conventional optical transceiver, in which a light emitting element 1 for generating an optical signal corresponding to an electric signal and a light emitting element 1 are shown.
, A light receiving element 5 for generating an electric signal corresponding to an optical signal, a receiving circuit 6 for amplifying an electric signal output from the light receiving element 5 and shaping the waveform, and a driving circuit for the light emitting element 1 2 and a circuit board 4 on which a receiving circuit 6 for the light receiving element 5 is mounted. The light emitting element 1, the light receiving element 5, and the circuit board 4 are housed in a housing 8.
【0005】発光素子1は、信号端子1Aを接続部3に
固定することによって回路基板4と接続されており、受
光素子5は、信号端子5Aを接続部7に固定することに
よって回路基板4と接続されている。この発光素子1お
よび受光素子5は金属製ホルダ1B、5Bを筐体8に固
定することで所定の位置に位置決めされるように構成さ
れている。回路基板4はスルーホール4Aを介して基板
裏面のアース層( 図示せず)に接続されている。The light emitting element 1 is connected to the circuit board 4 by fixing the signal terminal 1A to the connection section 3, and the light receiving element 5 is connected to the circuit board 4 by fixing the signal terminal 5A to the connection section 7. It is connected. The light emitting element 1 and the light receiving element 5 are configured to be positioned at predetermined positions by fixing the metal holders 1B and 5B to the housing 8. The circuit board 4 is connected to a ground layer (not shown) on the back surface of the board via a through hole 4A.
【0006】図7は、従来の光送受信器の側面を示し、
発光素子1の金属製ホルダ1Bから回路基板4との接続
部3にかけての信号端子1Aで信号干渉を受け易いこと
から、この部分あるいは発光素子1全体を金属板で囲ん
でシールドを施し、受光素子5についても回路基板4と
の接続部7にかけての信号端子5Aの箇所に同様にシー
ルドを施している( 同図においては金属板を図示省略し
ている)。また、この回路基板4では表面および裏面に
駆動回路2が設けられている。FIG. 7 shows a side view of a conventional optical transceiver.
Since the signal terminal 1A from the metal holder 1B of the light emitting element 1 to the connection part 3 with the circuit board 4 is susceptible to signal interference, this part or the whole light emitting element 1 is surrounded by a metal plate and shielded, The shield 5 is similarly provided at the signal terminal 5A at the connection portion 7 with the circuit board 4 (a metal plate is not shown in the figure). The drive circuit 2 is provided on the front and back surfaces of the circuit board 4.
【0007】[0007]
【発明が解決しようとする課題】しかし、従来の光送受
信器によると、小型、高密度化の要求が進むにつれてシ
ールド用の金属板を搭載する空間を確保することが困難
であるため、光送受信特性の向上に限界がある。従っ
て、本発明の目的は外来雑音等の信号干渉を抑えて小型
化、高速化、高感度化を可能にする光送受信器を提供す
ることにある。However, according to the conventional optical transmitter / receiver, it is difficult to secure a space for mounting a metal plate for shielding as the demand for miniaturization and higher density progresses. There is a limit to the improvement of characteristics. Accordingly, it is an object of the present invention to provide an optical transceiver capable of miniaturizing, increasing speed, and increasing sensitivity by suppressing signal interference such as external noise.
【0008】[0008]
【課題を解決するための手段】本発明は上記した目的を
実現するため、回路基板上に形成された送受信回路によ
って光信号の送受信を制御される受発光素子を有する光
送受信器において、前記受発光素子と前記送受信回路の
間に設けられ、前記受発光素子の信号端子接続部と前記
送受信回路の入出力配線を電気的に接続し、かつ、電磁
シールドするフレキシブルシールド手段を有する光送受
信器を提供する。According to the present invention, there is provided an optical transmitter / receiver having a light receiving / emitting element in which transmission / reception of an optical signal is controlled by a transmission / reception circuit formed on a circuit board. An optical transceiver provided between a light emitting element and the transmitting / receiving circuit, electrically connecting a signal terminal connection part of the light receiving / emitting element and input / output wiring of the transmitting / receiving circuit, and having a flexible shield means for electromagnetically shielding. provide.
【0009】上記した光送受信器において、フレキシブ
ルシールド手段は、可撓性を有する絶縁体と、絶縁体中
に埋設されて受発光素子と送受信回路とを信号端子接続
部を介して接続する信号配線と、絶縁体の外側に設けら
れるグランド層を有し、信号端子接続部を覆うとともに
グランド層を回路基板のアース層に接続することにより
電磁シールドを形成することが好ましい。あるいは、信
号端子接続部を箱状に包囲するように構成されても良
い。In the above-mentioned optical transceiver, the flexible shield means includes a flexible insulator, and a signal wiring embedded in the insulator and connecting the light emitting / receiving element and the transmission / reception circuit via a signal terminal connection portion. And a ground layer provided outside the insulator, and the electromagnetic shield is preferably formed by covering the signal terminal connection portion and connecting the ground layer to the ground layer of the circuit board. Or you may comprise so that a signal terminal connection part may be enclosed in a box shape.
【0010】また、本発明は上記した目的を実現するた
め、回路基板上に形成された送受信回路によって受発光
素子の光信号の送受信を制御される受発光素子を有する
光送受信器において、前記回路基板と一体的に形成さ
れ、前記受発光素子の信号端子接続部と前記送受信回路
の入出力用配線を電磁シールドするフレキシブルシール
ド手段を有する光送受信器を提供する。According to another aspect of the present invention, there is provided an optical transceiver having a light emitting and receiving element in which transmission and reception of an optical signal of the light emitting and receiving element are controlled by a transmitting and receiving circuit formed on a circuit board. Provided is an optical transceiver having a flexible shield means formed integrally with a substrate and electromagnetically shielding a signal terminal connection portion of the light emitting / receiving element and an input / output wiring of the transmission / reception circuit.
【0011】上記した光送受信器において、フレキシブ
ルシールド手段は、受発光素子の信号端子接続部と送受
信回路の入出力用配線を包囲する導電性シートによって
構成されることが好ましい。In the above-mentioned optical transceiver, the flexible shield means is preferably constituted by a conductive sheet surrounding the signal terminal connection portion of the light emitting / receiving element and the input / output wiring of the transmission / reception circuit.
【0012】[0012]
【発明の実施の形態】図1は、本発明の第1の実施の形
態に係る光送受信器を示し、発光素子1の信号端子と回
路基板4とを接続する接続部3を覆うフレキシブル基板
10を設けており、フレキシブル基板10は、外側に配
置されるグランド層10Aと、可撓性を有する絶縁層1
0Bと、絶縁層10B内に設けられる信号配線10Cを
備え、回路搭載部分より大なる寸法を有して構成されて
おり、接続部材13を介して発光素子1の金属製ホルダ
1Bに固定されている。このフレキシブル基板10のグ
ランド層10Aはスルーホール4Bを介してアース層
(図示せず)と接続されている。また、受光素子5の信
号端子と回路基板4とを接続する接続部7の部分につい
ても同様にフレキシブル基板10で覆われている。その
他の構成については図6と同一の引用数字を付している
ので、重複する説明を省略する。FIG. 1 shows an optical transceiver according to a first embodiment of the present invention, in which a flexible substrate 10 covering a connection portion 3 for connecting a signal terminal of a light emitting element 1 to a circuit board 4 is shown. The flexible substrate 10 includes a ground layer 10 </ b> A disposed outside and a flexible insulating layer 1.
0B, and a signal wiring 10C provided in the insulating layer 10B. The signal wiring 10C is configured to have a size larger than the circuit mounting portion, and is fixed to the metal holder 1B of the light emitting element 1 via the connection member 13. I have. The ground layer 10A of the flexible substrate 10 is connected to a ground layer (not shown) via a through hole 4B. Further, the portion of the connection portion 7 for connecting the signal terminal of the light receiving element 5 and the circuit board 4 is also covered with the flexible substrate 10. The other components are denoted by the same reference numerals as those in FIG. 6, and thus redundant description will be omitted.
【0013】図2は、光送受信器9Aの側方断面を示
し、フレキシブル基板10は、発光素子1側の一端が接
続部材13を介して金属製ホルダ1Bに固定されるとと
もに、駆動回路2側の他端が回路基板4上に固定されて
おり、発光素子1の信号端子と信号配線10Cを接続
し、この信号配線10Cを接続部3に接続した後、金属
製ホルダ1Bおよび接続部3を包囲するようにフレキシ
ブル基板10を折り曲げて形成される。図2において
は、金属製ホルダ1B側を回路基板4の裏面に折り返し
てアース層(図示せず)に接続しており、駆動回路2側
を回路基板4上でスルーホール(図示せず)を介してア
ース層と接続することにより電磁シールドを形成してい
る。また、受光素子5の信号端子と回路基板4とを接続
する接続部7の部分についても同様に構成されている。FIG. 2 shows a side cross section of the optical transceiver 9A. The flexible substrate 10 has one end on the light emitting element 1 side fixed to a metal holder 1B via a connecting member 13 and a flexible circuit board 10 on the drive circuit 2 side. Is fixed on the circuit board 4, and connects the signal terminal of the light emitting element 1 to the signal wiring 10C. After connecting the signal wiring 10C to the connection part 3, the metal holder 1B and the connection part 3 are connected. It is formed by bending the flexible substrate 10 so as to surround it. In FIG. 2, the metal holder 1B side is folded back on the back surface of the circuit board 4 and connected to a ground layer (not shown), and the drive circuit 2 side is formed with a through hole (not shown) on the circuit board 4. An electromagnetic shield is formed by connecting to an earth layer through the intermediary. In addition, the connection portion 7 for connecting the signal terminal of the light receiving element 5 and the circuit board 4 has the same configuration.
【0014】図3は、図2におけるフレキシブル基板1
0のIII-III部を示し、絶縁層10B内に設けられた信
号配線10Cは、グランド層10Aによって遮蔽される
ことにより外来雑音等による信号干渉を防止して光送受
信特性を向上させることができる。また、シールド用の
金属板が不要となるので、光送受信器の小型化が可能に
なる。FIG. 3 shows the flexible substrate 1 shown in FIG.
0 indicates a III-III portion, and the signal wiring 10C provided in the insulating layer 10B is shielded by the ground layer 10A, so that signal interference due to external noise or the like can be prevented and the optical transmission / reception characteristics can be improved. . Further, since a metal plate for shielding is not required, the size of the optical transceiver can be reduced.
【0015】上記した光送受信器9Aでは、外側にグラ
ンド層10Aを有するフレキシブル基板10を用いて発
光素子1および受光素子5を回路基板4に接続するとと
もに、信号端子接続部を覆い、かつ、グランド層10A
によって形成される電磁シールドで外来雑音等から遮断
するので、シールド板を設けるスペースが不要となる。
第1の実施の形態では、回路基板4と接続されていない
金属製ホルダ1B側を折り曲げて回路基板4の裏面のア
ース層にグランド層10Aを接続しているが、構成上の
制約等によって折り曲げが不可能であるときは、半田付
けや圧着によってグランド層10Aをアース層に接続す
ることで電磁シールドを強固にすることができる。In the above-mentioned optical transceiver 9A, the light emitting element 1 and the light receiving element 5 are connected to the circuit board 4 using the flexible substrate 10 having the ground layer 10A on the outside, and the signal terminal connecting portion is covered and the ground is connected to the ground. Layer 10A
Since the electromagnetic shield formed by the above shields from external noise and the like, a space for providing a shield plate becomes unnecessary.
In the first embodiment, the ground layer 10A is connected to the ground layer on the back surface of the circuit board 4 by bending the metal holder 1B side not connected to the circuit board 4; If this is not possible, the electromagnetic shield can be strengthened by connecting the ground layer 10A to the ground layer by soldering or crimping.
【0016】また、フレキシブル基板10の端部に切り
欠きを形成し、この切り欠きにめっきを施してフレキシ
ブル基板10を相互に接合することにより箱型のシール
ドを形成しても良く、この場合には、シールドをより強
固にすることができる。A box-shaped shield may be formed by forming a notch at the end of the flexible substrate 10 and plating the notch and joining the flexible substrates 10 to each other. Can make the shield stronger.
【0017】図4は、本発明の第2の実施の形態に係る
光送受信器を示し、グランド層20Aを有する導電性シ
ートによって構成されるフレキシブル基板20が発光素
子1および受光素子5の接続位置に対応して回路基板4
に一体的に設けられている。このフレキシブル基板20
は、発光素子1の金属製ホルダ1Bと信号端子1Aの接
続部3にかけての領域、および受光素子5の金属製ホル
ダ5Bと信号端子5Bの接続部7にかけての領域を広範
囲に包囲する寸法に形成されている。また、発光素子1
および受光素子5と接続される部分に形成される短冊状
の切り欠き11と、短冊状の切り欠き11を設けた導電
性シートの端末部から内側にかけて半田等のめっき層1
2を有する。グランド層20Aはスルーホール4Bを介
してアース層(図示せず)と接続されている。その他の
構成については図1と同一の引用数字を付しているの
で、重複する説明を省略する。FIG. 4 shows an optical transceiver according to a second embodiment of the present invention, in which a flexible substrate 20 formed of a conductive sheet having a ground layer 20A is connected to a light emitting element 1 and a light receiving element 5. Circuit board 4 corresponding to
Are provided integrally. This flexible substrate 20
Is formed to have a size that encompasses a wide area of the region between the metal holder 1B of the light emitting element 1 and the connection portion 3 between the signal terminal 1A and the region of the light receiving element 5 between the metal holder 5B and the connection portion 7 of the signal terminal 5B. Have been. Light emitting element 1
And a strip-shaped notch 11 formed at a portion connected to the light receiving element 5, and a plating layer 1 such as a solder from the terminal portion to the inside of the conductive sheet provided with the strip-shaped notch 11.
2 The ground layer 20A is connected to a ground layer (not shown) via the through hole 4B. The other components are denoted by the same reference numerals as those in FIG.
【0018】図5は、光送受信器9Bの側方断面を示
し、フレキシブル基板20は、短冊状の切り欠き11を
設けることによって金属製ホルダ1B,5Bとの接触面
積を増大させており、導電性シートの端末部から内側に
かけてめっき層12を形成することによってグランド層
20Aと金属製ホルダ1B,5Bとを電気的に接続する
とともに駆動回路2の発光素子1側に位置する端子部
(アウターリード)を覆っている。また、受光素子5の
信号端子5Aと回路基板4とを接続する接続部7の部分
についても同様に構成されている。FIG. 5 shows a side cross section of the optical transceiver 9B. The flexible substrate 20 has a strip-shaped notch 11 to increase the contact area with the metal holders 1B and 5B. The ground layer 20A and the metal holders 1B and 5B are electrically connected by forming the plating layer 12 from the terminal portion to the inside of the conductive sheet, and the terminal portion (outer lead) located on the light emitting element 1 side of the drive circuit 2 ). In addition, the connection portion 7 for connecting the signal terminal 5A of the light receiving element 5 and the circuit board 4 has the same configuration.
【0019】上記した光送受信器9Bにおけるフレキシ
ブル基板20は、発光素子1および受光素子5の端子接
合部だけでなく、駆動回路2の端子部および配線を覆っ
てシールドしているので、駆動回路2からのノイズ放出
を抑制するとともに信号干渉を低減できる。また、短冊
状の切り欠き11が形成される導電性シートの端末部か
ら内側にかけてめっき層12を設けて発光素子1および
受光素子5と電気的に接続することにより、シールドを
より強固にすることができる。Since the flexible substrate 20 of the optical transceiver 9B covers not only the terminal joints of the light emitting element 1 and the light receiving element 5 but also the terminals of the drive circuit 2 and the wiring, the flexible circuit board 20 is shielded. And the signal interference can be reduced. Further, by providing a plating layer 12 from the terminal portion to the inside of the conductive sheet in which the strip-shaped notch 11 is formed and electrically connecting to the light emitting element 1 and the light receiving element 5, the shield is further strengthened. Can be.
【0020】上記したフレキシブル基板を備えた光送受
信器は、高速デジタル光通信用、高周波アナログ光通信
用の光送受信器として使用することができる。フレキシ
ブル基板の外側に配置されるグランド層は、高周波用の
場合には、銅、アルミニウム等の箔、蒸着膜、網によっ
て設けることができる。低周波用の場合には、高い透磁
率を有する材料によって設けることができる。これらの
材料の他にも電磁波を吸収するセラミック材料や有機材
料が使用できる。また、上記した材料を複数組み合わせ
ることによって広帯域に対応可能なグランド層を形成で
きる。The optical transceiver having the above-mentioned flexible substrate can be used as an optical transceiver for high-speed digital optical communication and high-frequency analog optical communication. The ground layer disposed outside the flexible substrate can be provided by a foil, a vapor-deposited film, or a net made of copper, aluminum, or the like in the case of high frequency. In the case of low frequency, it can be provided by a material having high magnetic permeability. In addition to these materials, ceramic materials and organic materials that absorb electromagnetic waves can be used. Further, a ground layer capable of supporting a wide band can be formed by combining a plurality of the above-mentioned materials.
【0021】[0021]
【発明の効果】以上説明した通り、本発明の光送受信器
によると、グランド層を配したフレキシブル基板を介し
て発光素子および受光素子の信号端子を電気的に接続す
るとともにグランド層をアース層に接続して信号端子を
包囲するシールドを形成したため、外来雑音等の信号干
渉を抑えて小型化、高速化、高感度化を実現することが
できる。As described above, according to the optical transceiver of the present invention, the signal terminals of the light emitting element and the light receiving element are electrically connected via the flexible substrate provided with the ground layer, and the ground layer is connected to the ground layer. Since a shield is formed to connect and surround the signal terminal, signal interference such as external noise can be suppressed, and miniaturization, high speed, and high sensitivity can be realized.
【図1】本発明の第1の実施の形態に係る光送受信器を
示す説明図。FIG. 1 is an explanatory diagram showing an optical transceiver according to a first embodiment of the present invention.
【図2】本発明の第1の実施の形態に係る光送受信器を
示す説明図。FIG. 2 is an explanatory diagram showing an optical transceiver according to the first embodiment of the present invention.
【図3】図2のIII-III部における断面図。FIG. 3 is a sectional view taken along the line III-III in FIG. 2;
【図4】本発明の第2の実施の形態に係る光送受信器を
示す説明図。FIG. 4 is an explanatory diagram showing an optical transceiver according to a second embodiment of the present invention.
【図5】本発明の第2の実施の形態に係る光送受信器を
示す説明図。FIG. 5 is an explanatory diagram showing an optical transceiver according to a second embodiment of the present invention.
【図6】従来の光送受信器を示す説明図。FIG. 6 is an explanatory diagram showing a conventional optical transceiver.
【図7】従来の光送受信器を示す説明図。FIG. 7 is an explanatory diagram showing a conventional optical transceiver.
1,発光素子 1A,信号端子 1B,金属製ホルダ 2,駆動回路 3,接続部 4,回路基板 4A,スルーホール 4B,スルーホール 5,受光素子 5A,信号端子 5B,金属製ホルダ 6,受信回路 7,接続部 8,筐体 9,光送受信器 9A,光送受信器 9B,光送受信器 10,フレキシブル基板 10A,グランド層 10B,絶縁層 10C,信号配線 11,切り込み 12,めっき層 13,接続部材 20,フレキシブル基板 20A,グランド層 1, light emitting element 1A, signal terminal 1B, metal holder 2, drive circuit 3, connection part 4, circuit board 4A, through hole 4B, through hole 5, light receiving element 5A, signal terminal 5B, metal holder 6, receiving circuit 7, connection part 8, housing 9, optical transceiver 9A, optical transceiver 9B, optical transceiver 10, flexible substrate 10A, ground layer 10B, insulating layer 10C, signal wiring 11, notch 12, plating layer 13, connection member 20, flexible board 20A, ground layer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H04B 10/02 10/18 ──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. 6 Identification code FI H04B 10/02 10/18
Claims (5)
って光信号の送受信を制御される受発光素子を有する光
送受信器において、 前記受発光素子と前記送受信回路の間に設けられ、前記
受発光素子の信号端子接続部と前記送受信回路の入出力
配線を電気的に接続し、かつ、電磁シールドするフレキ
シブルシールド手段を有することを特徴とする光送受信
器。1. An optical transceiver having a light emitting and receiving element whose transmission and reception of an optical signal is controlled by a transmitting and receiving circuit formed on a circuit board, wherein the optical transceiver is provided between the light receiving and emitting element and the transmitting and receiving circuit, and An optical transceiver comprising a flexible shield means for electrically connecting a signal terminal connection portion of an element to an input / output wiring of the transmission / reception circuit and for electromagnetically shielding.
性を有する絶縁体と、前記絶縁体中に埋設されて前記受
発光素子と前記送受信回路とを前記信号端子接続部を介
して接続する信号配線と、前記絶縁体の外側に設けられ
るグランド層を有し、前記信号端子接続部を覆うととも
に前記グランド層を前記回路基板のアース層に接続する
ことにより電磁シールドを形成する構成の請求項第1項
記載の光送受信器。2. The flexible shield means includes: a flexible insulator; and a signal wiring embedded in the insulator to connect the light emitting / receiving element and the transmission / reception circuit via the signal terminal connection portion. And a ground layer provided outside the insulator, wherein the electromagnetic shield is formed by covering the signal terminal connection portion and connecting the ground layer to a ground layer of the circuit board. The optical transceiver according to the item.
信号端子接続部を箱状に包囲するように構成される請求
項第1項記載の光送受信器。3. The optical transceiver according to claim 1, wherein said flexible shield means is configured to surround said signal terminal connection portion in a box shape.
って受発光素子の光信号の送受信を制御される受発光素
子を有する光送受信器において、 前記回路基板と一体的に形成され、前記受発光素子の信
号端子接続部と前記送受信回路の入出力用配線を電磁シ
ールドするフレキシブルシールド手段を有することを特
徴とする光送受信器。4. An optical transceiver having a light emitting and receiving element in which transmission and reception of an optical signal of the light emitting and receiving element is controlled by a transmitting and receiving circuit formed on a circuit board, wherein the light transmitting and receiving element is formed integrally with the circuit board. An optical transceiver comprising: a flexible shield means for electromagnetically shielding a signal terminal connection portion of an element and an input / output wiring of the transmission / reception circuit.
受発光素子の信号端子接続部と前記送受信回路の入出力
用配線を包囲する導電性シートによって構成される請求
項第4項記載の光送受信器。5. The optical transceiver according to claim 4, wherein said flexible shield means is constituted by a conductive sheet surrounding a signal terminal connection portion of said light emitting / receiving element and an input / output wiring of said transmission / reception circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9360437A JPH11196055A (en) | 1997-12-26 | 1997-12-26 | Optical transceiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9360437A JPH11196055A (en) | 1997-12-26 | 1997-12-26 | Optical transceiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11196055A true JPH11196055A (en) | 1999-07-21 |
Family
ID=18469398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9360437A Pending JPH11196055A (en) | 1997-12-26 | 1997-12-26 | Optical transceiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11196055A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003044916A1 (en) * | 2001-11-23 | 2003-05-30 | Optillion Ab | Optoelectrical transceiver |
| US6992895B2 (en) | 2001-11-23 | 2006-01-31 | Finisar Corporation | Heat controlled optoelectrical unit |
| JP2007043496A (en) * | 2005-08-03 | 2007-02-15 | Sumitomo Electric Ind Ltd | Optical transceiver |
| JP2008501247A (en) * | 2004-06-30 | 2008-01-17 | インテル・コーポレーション | Equipment for electro-optical interconnection |
| US7366367B2 (en) | 2003-05-21 | 2008-04-29 | Sumitomo Electric Industries, Ltd. | Optical data link and method of manufacturing optical data link |
| JP2008109160A (en) * | 2008-01-07 | 2008-05-08 | Opnext Japan Inc | Optical module and optical transmission device |
| US7412120B2 (en) | 2004-05-19 | 2008-08-12 | Opnext Japan, Inc. | Optical module and optical transmission apparatus |
-
1997
- 1997-12-26 JP JP9360437A patent/JPH11196055A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003044916A1 (en) * | 2001-11-23 | 2003-05-30 | Optillion Ab | Optoelectrical transceiver |
| US6992895B2 (en) | 2001-11-23 | 2006-01-31 | Finisar Corporation | Heat controlled optoelectrical unit |
| US7025510B2 (en) | 2001-11-23 | 2006-04-11 | Finisar Corporation | Modular fiber-optic transceiver |
| US7366367B2 (en) | 2003-05-21 | 2008-04-29 | Sumitomo Electric Industries, Ltd. | Optical data link and method of manufacturing optical data link |
| US7412120B2 (en) | 2004-05-19 | 2008-08-12 | Opnext Japan, Inc. | Optical module and optical transmission apparatus |
| JP2008501247A (en) * | 2004-06-30 | 2008-01-17 | インテル・コーポレーション | Equipment for electro-optical interconnection |
| JP2007043496A (en) * | 2005-08-03 | 2007-02-15 | Sumitomo Electric Ind Ltd | Optical transceiver |
| JP2008109160A (en) * | 2008-01-07 | 2008-05-08 | Opnext Japan Inc | Optical module and optical transmission device |
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