JPH11195869A - Combination structure of electronic components and substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a combinational structure of electronic device and board in which the overall size can be reduced by decreasing the projecting height of a surface mounting electronic device from the board. SOLUTION: Under a state where the body 37 of the receptacle 36 of a connector 30 is embedded, on the surface 37a side, in the through hole 21 of a printed wiring board 20, the outer connecting part 38a of a connecting pin 38 and the end 29a of a metal 39 projecting in the horizontal direction are connected through solder to copper foils 22a, 22b formed on the surface 20a of the printed wiring board 20 on the side of the through hole 21 at a position higher by a specified height H than the surface 37b of the body 37 of the receptacle 36 thus producing a combinational structure 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a combination structure of an electronic component mounted on a substrate by surface mounting and the substrate.

[0002]

2. Description of the Related Art Conventionally, for example, as shown in FIG.
(Compact disc), MD (Mini disc), DV
Disc D such as D (digital versatile disc)
The loading device 1 for reading the image includes a movable portion 2 and a set substrate 3 disposed below the movable portion 2. Movable part 2
A tray 5 which moves horizontally to enter / exit the loading device 1 when loading / unloading the disk D, a turntable 6 which holds and rotates the disk D when reading, and a turntable. 6, a motor 7 for rotating the turntable 6, an optical pickup 8 for reading an optical signal recorded on the disk D, and a substrate 9 on which a drive circuit for driving these are mounted. doing. Note that the motor 7 and the optical pickup 8 are
The turntable 6 is housed in a housing 10 that rotates about the fulcrum C, and the turntable 6 protrudes upward from the housing 10. The board 9 forms the bottom of the housing 10 with the surface on which the connector 11 (the size of which is exaggerated in the figure) and the IC (integrated circuit) are placed face down. The set board 3 has a control circuit for the loading device 1 mounted thereon, which is disposed in parallel with the tray 5 and has a flexible flat cable (hereinafter referred to as FF).
C (described as C) 13 and a drive circuit on the substrate 9.

The loading device 1 is configured as described above. Next, the operation of the loading device 1 will be described.

When reading the disk D, the turntable 6 and the tray 5 are at the positions indicated by the dashed lines in FIG. At this time, the disk D is mounted on the turntable 6 engaged with the hole Da and is rotating.
At the same time, the lens 8a of the optical pickup 8 moves below the portion of the disk D where the optical signal is recorded, and the optical signal is read. The substrate 9 is a turntable 6
In this case, the tray 5
Is parallel to

Next, when the disk D is taken out, first, the turntable 6 is moved to a position where the turntable 6 does not collide even if the tray 5 moves in the horizontal direction, that is, as shown by a solid line. The casing 10 rotates downward about the fulcrum C so as to be located below the lower surface 5a of the tray 5. On the way, the disk D placed on the turntable 6 is held by the annular holding portion 5 b of the tray 5 and placed on the tray 5. Then, the tray 5 moves in the horizontal direction to reach the outside of the loading device 1, and the disk D is taken out.

As described above, when the tray 5 is moved from the state shown by the dashed line to the state shown by the solid line or vice versa in the horizontal direction, the housing 10 is in the state shown by the solid line. That is, the substrate 9 provided as the bottom of the housing 10 moves downward. Since the set board 3 is provided below the housing 10, the optical pickup is provided via an electronic component (largely shown for clarity in the figure) provided on the board 9, for example, the FFC 14. The electronic component 1 such as an IC (integrated circuit) is mounted on the set board 3 disposed in parallel with the tray 6 by mounting the receptacle 11 mounted on the board 9 of the connector connected to the connector 8.
8 (large in the figure for clarity)
The electronic components mounted on the set board 3 and the board 9 may be damaged. Therefore, in order to prevent this, the gap h between the electronic component of the board 9 that has rotated downward and the electronic component of the set board 3 must be increased, and the apparatus itself has to be enlarged. .

In this conventional example, the receptacle 11 of the connector mounted on the substrate 9 is mounted by surface mounting. In this case, FIG. 9 (in this figure, shown upside down from FIG. 7). ), The lower surface 11ba of the connection terminal 11b is in contact with the bottom surface 11aa of the main body 11a of the receptacle 11 because the connection terminal 11b contacts the land 9a (this height is about several μm, but is exaggerated in the figure). It projects horizontally at about the same or below. The receptacle 11 is provided with a metal fitting 11c in a direction perpendicular to the connection terminal 11b. The lower surface 11ca of the metal fitting 11c is also soldered with a land 9b of the substrate 9 (this height is about several μm, but is exaggerated in the figure. Is fixed). That is, in the conventional example, the height K ′ of the receptacle 11 attached to the substrate 9 protruding from the substrate 9 is almost the same as the height (about 2.0 mm) of the main body 11a of the receptacle 11.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made to reduce the height of an electronic component protruding from a substrate, and to reduce the size (thinness) of an apparatus using the same. It is an object to provide a combined structure of an electronic component and a substrate that can be provided.

[0009]

The object of the present invention is to provide a substrate having a conductive pattern formed on its surface and having a hole, a main body and its end located at a predetermined height above the bottom of the main body (or an upper surface of the main body). And a connection terminal protruding in the horizontal direction at a position lower than a predetermined height from the electronic component and mounted on the substrate by surface mounting. In this state, the problem is solved by a combined structure of the electronic component and the substrate, in which the connection terminal is connected to the conductor pattern by soldering. By adopting such a structure, the height of the electronic component projecting from the substrate can be reduced by a predetermined height (when the bottom of the main body projects from the substrate, by the thickness of the substrate). In addition, the size of a device using the electronic component can be reduced.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a substrate having a conductor pattern formed on the surface and having a hole, a main body and an end portion thereof (when an electronic component is mounted on the upper surface of the substrate by surface mounting). )
A connection terminal projecting horizontally at a position above a predetermined height from the bottom surface of the main body (at a position below a predetermined height from the top surface of the main body when the electronic component is attached to the lower surface of the substrate by surface mounting). And an electronic component attached to the substrate by surface mounting, the connection terminal being connected to the conductor pattern by soldering in a state where the electronic component is buried at a predetermined height in the hole of the substrate. The structure is a combination of components and a board. This makes it possible to reduce the height of the electronic component by a predetermined height (when the main body protrudes from both sides of the substrate, by the thickness of the substrate), and to reduce the height of the electronic component by use. Can be downsized.

It is preferable that the hole formed in the substrate is a through-hole because processing is easy. Furthermore,
It is particularly effective when the electronic component of the present invention is an electronic component having a height, that is, a thickness, for example, a receiving portion (receptacle) of a connector. The substrate of the present invention refers to a substrate on which electronic components are mounted by surface mounting, for example, a printed wiring board or a flexible printed board. In the case where some member is disposed close to the surface opposite to the surface where the connection terminal of the electronic component is connected to the conductor pattern, the surface of the substrate on which this member is disposed It is preferable that the electronic component does not protrude.

Preferably, the hole into which the electronic component is embedded is formed so as to fit a portion where the main body of the electronic component is embedded. This facilitates positioning during soldering. In particular, if the connection terminals are fitted in the protruding lateral direction, when connecting the connection terminals to the conductor pattern of the board, the connection terminals are shifted in the lateral direction and come into contact with the adjacent conductor pattern. , It is possible to prevent a short circuit from occurring. Furthermore, if a metal fitting is provided on the electronic component and this is connected to the conductor pattern of the board by soldering, for example, when vibration is applied to the board,
When the electronic component is a receptacle for the connector, and a force is applied in a direction in which the electronic component can be removed from the board, for example, when the connector is repeatedly inserted and removed, the electronic component is hardly removed.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a combined structure 50 of the receptacle 36 of the connector 30 which is an electronic component of the present embodiment and the printed wiring board 20. FIG. 2 is an exploded perspective view thereof, and FIG. 3 is a front view thereof (excluding a connector 30).
4 is a sectional view taken along the line [4]-[4] in FIG. 3, and FIG. 5 is a sectional view taken along the line [5]-[5] in FIG. FIG. The printed wiring board 20 of this embodiment is used at the same location as the board 9 shown in FIG. 7 of the conventional example, that is, in FIGS. The upper and lower parts of the following description are described below in FIGS. 1 to 5.

The printed wiring board 20 has a thickness t of about 0.9 mm. The printed wiring board 20 has a through hole 21 formed therein, into which a main body 37 of a receptacle 36 of the connector 30 is fitted. Further, a plurality of copper foils 22a (which are actually several microns, but are exaggerated in FIGS. 3 and 4) are provided on one side of the longitudinal direction of the through hole 21 on the surface 20a of the printed wiring board 20. ing)
Are formed side by side, and in FIG. 1, a plurality of connection pins 38 are respectively connected by solder (not shown). The copper foil 22b is also provided in the short axis direction of the through hole 21.
(This is actually several microns, but is exaggerated in FIGS. 3 and 4), and a metal fitting 39 of a main body 37 described later is connected by solder (not shown). In addition, on the surface 20a of the printed wiring board 20,
Although not shown, other than the copper foils 22a and 22b, copper foils (that is, lands) are formed by patterning.

As is well known, the connector 30 has an insertion portion 31.
And a receptacle 36. Plug-in part 31
As shown in FIG. 2, the tip of the FFC 25 is
A plurality (ten in the figure) of linear copper foils 32 are formed at equal intervals on the upper surface of the insulating plate 33 so as to correspond to the connection pins 38 of the receptacle 36. Have been. Note that the FFC 25 of this embodiment is
Is an optical pickup 8 similar to the conventional FFC 14.
Connected to

On the other hand, the receptacle 36 of the connector 30
As shown in FIG. 5, the main body 37 has a substantially rectangular main body 37 having an internal space 37s , and a plurality of (ten) connection pins 38 from which an external connection portion 38a protrudes to the outside from a side surface 37c of the main body 37. doing. The main body 37 is made of a synthetic resin such as PPS (polyphenylene sulfide), and has a height I of about 2.0 mm in this embodiment. Body 37
The inner space 37 is provided on a side surface 37d opposite to the side surface 37c.
An opening 37da communicating with s is formed. Further, the other side surfaces 37e and 37f of the main body 37 are provided with L-shaped fittings 3.
9 (which is made of, for example, solder-plated phosphor bronze) is fixed at its end 39a to the connection pin 38.
The external connection portion 38a extends in the horizontal direction at substantially the same position as the position where the external connection portion 38a projects, and is fixed to the copper foil 22b of the printed wiring board 20 by solder (not shown).

The connection pin 38 is made of, for example, phosphor bronze plated with solder of several microns, and has a bifurcated shape on the left side of FIG. Right part is external connection part 3.
8a, it extends horizontally outside the main body 37 at a position above the surface 37b of the main body 37 by a predetermined height H. The predetermined height H is set between the surface 37b and the lower surface 3 of the external connection portion 38a.
8aa, and the height H is about 0.8 mm in this embodiment. As shown by a dashed line in FIG. 4, the forked left part 38b is fitted in the internal space 37s of the main body 37, and its tip part 38bb
Has a shape similar to the tip of a clothespin.
Therefore, as shown in FIG. 1, when the insertion portion 31 is inserted from the opening 37 da of the main body 37, the distal end portion 38 bb of the connection pin 38 is connected to the copper foil 32 of the insertion portion 31.
The optical pickup 8 is electrically connected to the drive circuit on the substrate 20 via the connector 30 and the FFC 25.

In this embodiment, the printed wiring board 2
In the position where the receptacle 36 of the connector 30 of 0 is provided,
After the through hole 21 is opened and the main body of the receptacle 36 is buried therein (at this time, the copper foil 22 of the printed wiring board 20 is
a and 22b abut against the connection pin 38 and the end 39a of the metal fitting 39), and connect the copper foils 22a and 22b to the connection pin 3
8. Solder the end 39a of the metal fitting 39 to the connector 30 as an electronic component and the printed wiring board 2 respectively.
A combination structure 50 with 0 is obtained.

That is, in the present embodiment, the lower portion of the main body 37 is buried in the through hole 21 of the printed wiring board 20 in a state where the main body 37 does not project downward from the front surface 20b in FIGS. The height K of the main body 37 protruding from the wiring board 20 is about 1.2 mm, which is about 0.8 m compared to the conventional height K ′ of about 2.0 mm.
m (the amount embedded in the through-hole 21) and the height can be reduced. In the present embodiment, the surface 37b of the main body 37 is used.
And approximately the same as the surface 20b of the printed wiring board 20 (although there is a difference of about 0.1 mm), so that the height protruding from the printed wiring board 20 is made as small as possible.
Even if components such as the optical pickup 8 are disposed on the surface 20b side of the printed wiring board 20, no problem occurs. Furthermore, since the metal fitting 39 is provided on the side of the main body 37, the main body 37 can be firmly fixed. Therefore, it is possible to suppress the upward movement of the receptacle 30 of the connector 30 that occurs when the insertion and removal of the insertion portion 31 are repeated.

Although the embodiments of the present invention have been described above, the present invention is, of course, not limited thereto, and various modifications can be made based on the technical concept of the present invention.

For example, in the above embodiment, CD, MD, D
Although the loading mechanism for reading a disk such as a VD has been described, the present invention is of course applicable to a case where the height of electronic components mounted on the substrate cannot be increased, for example, when wiring the substrate in multiple layers. .

In the above embodiment, the electronic component is the receptacle 36 of the connector 30 attached to the substrate. However, the electronic component may be a known IC. That is,
For example, as shown in FIG. 6A, a combination structure 50 may be used in which a known IC is attached to a substrate with the surface mounted upside down from a normal surface mount. This is because the outer leads 12b, which are located a predetermined height H 'above the surface 12aa of the main body 12a, which is the package of the IC 12, and have the ends 12ba extending in the horizontal direction, are connected to the lands 22 of the substrate 20'.
a 'is connected by soldering. Further, as in the case of an IC 12 'shown in FIG. 6B, the end protrudes at a position where the outer lead portion 12b' protrudes from the main body 12a ', that is, at a position above a predetermined height H "from the bottom surface 12aa'. Alternatively, a combination structure 50 ″ may be connected to the land 22 a ″ of the substrate 20 ″ (by solder (not shown)). That is, this is a structure in which an IC is omitted in which the processing of bending the lead portion 12a ″ is omitted.

In the above embodiment, the receptacle 36 of the connector 30, which is an electronic component, protrudes from one side of the board 20. However, as shown in the combination structure 50 'shown in FIG. To the upper surface 20 of the substrate 20 '.
a 'and the lower surface 20b'. In this case, the height protruding from the substrate 20 '(the sum of the height protruding upward and the height protruding downward) is reduced by the thickness t' of the substrate 20 '.

Further, in the above embodiment, the through hole 21 formed in the printed wiring board 20 is provided with the through hole 21 in which the main body 37 of the rectangular receptacle 36 is fitted.
Even if they do not fit, the main body 37 is
May be connected to the printed wiring board 20. Further, the main body 37 is fitted into the through-hole 21 in order to further secure the main body 37. However, as in the case of the receptacle 36 in the above-described embodiment, there is little possibility that the main body 37 will be easily removed from the substrate 20. Alternatively, the main body 37 may not be fitted into the through hole 21.

[0026]

As described above, according to the combined structure of the electronic component and the substrate of the present invention, the height of the electronic component protruding from the substrate can be reduced, so that the substrate is disposed in the apparatus. The height required for the operation can be reduced. Therefore, it is possible to reduce the size of the entire device.

[Brief description of the drawings]

FIG. 1 is a perspective view of a combination structure of an electronic component and a substrate according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a combination structure of an electronic component and a substrate according to an embodiment of the present invention.

FIG. 3 is a front view of a combination structure of an electronic component and a substrate according to an embodiment of the present invention.

FIG. 4 is a sectional view taken along the line [4]-[4] in FIG.

FIG. 5 is a sectional view taken along line [5]-[5] in FIG. 3;

FIG. 6 is a cross-sectional view of a combination structure of an electronic component and a substrate according to a modification of the present invention, wherein A shows a first modification and B shows a second modification.

FIG. 7 is a partial sectional view showing a main part of a conventional loading structure for reading a disk.

FIG. 8 is a front view of a conventional combination structure of a connector and a board.

9 is a cross-sectional view taken along the line [9]-[9] in FIG.

[Explanation of symbols]

12, 12 '... IC, 20, 20', 20 "... substrate, 20a, 20b ... surface, 21 ... through hole, 22
a, 22b: copper foil, 25: FFC, 30: connector, 31: insertion part, 32: copper foil, 33: insulating plate,
36 ... receptacle, 37 ... body, 37b ... surface,
37c, 37d ... side surface, 37da ... opening, 37e,
37f ... side surface, 38 ... connection pin, 38a ... external connection part, 39 ... metal fittings, 39a ... end part, 50, 50 ',
50 "... Combination structure, H... Predetermined height, K... Protruding height from substrate, t... Substrate thickness.

Claims (7)

[Claims] 1. A substrate having a conductor pattern formed on a surface thereof and having a hole, a main body, and a connection terminal having an end protruding horizontally at a predetermined height above a bottom surface of the main body, or An electronic component having an end portion having a connection terminal projecting horizontally at a position below a predetermined height from the upper surface of the main body, and an electronic component attached to the substrate by surface mounting; A combination structure of the electronic component and the board, wherein the connection terminal is connected to the conductor pattern by soldering in a state where the electronic component is buried at the predetermined height. 2. The combination structure according to claim 1, wherein said hole is a through hole. 3. When the electronic component is attached to the substrate, the bottom surface or the top surface of the main body is opposite to the surface on which the conductor pattern to which the connection terminal is connected is formed. 3. The combination structure of an electronic component and a board according to claim 2, wherein the board is substantially flush with a surface of the board. 4. The combination structure according to claim 2, wherein a portion of said electronic component to be filled in said hole of said substrate is fitted in said hole. 5. A combination of an electronic component and a board according to claim 2, wherein the electronic component is provided with a metal fitting, and the metal fitting is connected to the conductor pattern by soldering. Construction. 6. The receiving portion in a set of connectors comprising a plug portion connected to an insulated wire or cable, and a receiving portion which is separably fitted with the plug portion and is provided on the substrate. The combination structure of an electronic component and a substrate according to any one of claims 1 to 5, wherein? Is the electronic component. 7. The combination structure according to claim 6, wherein the substrate is a printed wiring board.