[go: up one dir, main page]

JPH11195563A5 - - Google Patents

Info

Publication number
JPH11195563A5
JPH11195563A5 JP1997361016A JP36101697A JPH11195563A5 JP H11195563 A5 JPH11195563 A5 JP H11195563A5 JP 1997361016 A JP1997361016 A JP 1997361016A JP 36101697 A JP36101697 A JP 36101697A JP H11195563 A5 JPH11195563 A5 JP H11195563A5
Authority
JP
Japan
Prior art keywords
sample
pair
substrate
separating
porous layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997361016A
Other languages
Japanese (ja)
Other versions
JPH11195563A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP36101697A priority Critical patent/JPH11195563A/en
Priority claimed from JP36101697A external-priority patent/JPH11195563A/en
Priority to US09/211,757 priority patent/US6418999B1/en
Priority to SG200100215A priority patent/SG87916A1/en
Priority to SG1998005839A priority patent/SG70141A1/en
Priority to TW87120972A priority patent/TW429464B/en
Priority to DE1998627459 priority patent/DE69827459T2/en
Priority to AT98310462T priority patent/ATE281909T1/en
Priority to EP19980310462 priority patent/EP0925888B1/en
Priority to AU98190/98A priority patent/AU717785B2/en
Priority to KR10-1998-0058984A priority patent/KR100366722B1/en
Publication of JPH11195563A publication Critical patent/JPH11195563A/en
Priority to US10/151,527 priority patent/US6521078B2/en
Priority to US10/318,231 priority patent/US6860963B2/en
Publication of JPH11195563A5 publication Critical patent/JPH11195563A5/ja
Withdrawn legal-status Critical Current

Links

Claims (12)

内部に脆弱な層を有する板状の試料を該脆弱な層で分離する分離装置であって、
試料に向けて流体を噴射する噴射部と、
試料を両側から挟むようにして保持する一対の保持部と、
を備え、前記一対の保持部は、前記噴射部から噴射され試料内部に注入された流体の圧力により該試料が2枚に分かれるようにして反ることを許容する一方で、その反り量を制限することを特徴とする分離装置。
A separation device for separating a plate-shaped sample having a fragile layer therein at the fragile layer,
an ejection unit that ejects a fluid toward the sample;
a pair of holders that hold the sample by sandwiching it from both sides;
wherein the pair of holding parts allow the sample to bend so as to separate into two pieces due to the pressure of the fluid sprayed from the spray part and injected into the sample, while limiting the amount of warping.
前記一対の保持部の少なくとも一方は、滑らかな凸状の支持面を有し、該支持面により試料を保持することを特徴とする請求項1に記載の分離装置。2. The separation device according to claim 1, wherein at least one of the pair of holders has a smooth, convex support surface, and the sample is held by the support surface. 前記一対の保持部の少なくとも一方は、試料と接触し得る部分が弾性体で構成されていることを特徴とする請求項1に記載の分離装置。2. The separation device according to claim 1, wherein at least one of the pair of holders has a portion that can come into contact with the sample, the portion being made of an elastic material. 前記一対の保持部の少なくとも一方は、弾性体からなる環状の支持部を有することを特徴とする請求項1に記載の分離装置。2. The separating device according to claim 1, wherein at least one of the pair of holding portions has an annular support portion made of an elastic body. 前記一対の保持部の少なくとも一方は、その本体に弾性体を介して連結された支持部を有することを特徴とする請求項1に記載の分離装置。2. The separating device according to claim 1, wherein at least one of the pair of holding parts has a support part connected to its main body via an elastic body. 試料の面と直交する方向に設けられた軸を中心にして前記保持部を回転させる回転機構を更に備えることを特徴とする請求項1乃至請求項のいずれか1項に記載の分離装置。 6. The separation apparatus according to claim 1 , further comprising a rotation mechanism that rotates the holder around an axis that is provided in a direction perpendicular to the surface of the sample. 前記一対の保持部の間隔を調整する調整機構を更に備えることを特徴とする請求項1乃至請求項のいずれか1項に記載の分離装置。 7. The separation device according to claim 1 , further comprising an adjustment mechanism for adjusting a gap between the pair of holding portions. 前記調整機構は、流体により試料を分離する際に、試料を押圧するように前記一対の保持部の間隔を調整することを特徴とする請求項に記載の分離装置。 8. The separation device according to claim 7 , wherein the adjustment mechanism adjusts the distance between the pair of holders so as to press the sample when separating the sample with a fluid. 前記調整機構は、流体により試料を分離する際に、前記一対の保持部の間隔を略一定に維持することを特徴とする請求項に記載の分離装置。 8. The separation device according to claim 7 , wherein the adjustment mechanism maintains the distance between the pair of holders at a substantially constant distance when separating the sample with a fluid. 前記一対の保持部は、試料を真空吸着する吸着機構を有することを特徴とする請求項1乃至請求項のいずれか1項に記載の分離装置。 10. The separation apparatus according to claim 1 , wherein the pair of holders has a suction mechanism for vacuum-sucking the sample. 一方の面に多孔質層及び非多孔質層を順に形成した第1の基板の前記非多孔質層側を第2の基板に貼り合わせてなる基板を前記多孔質層で分離する分離方法であって、その分離に際して、請求項1乃至請求項10のいずれか1項に記載の分離装置を使用することを特徴とする分離方法。 A separation method for separating a substrate at the porous layer, the substrate being formed by bonding the non-porous layer side of a first substrate having a porous layer and a non-porous layer formed in sequence on one surface of the first substrate to a second substrate, the separation method being characterized in that a separation device described in any one of claims 1 to 10 is used for the separation. 一方の面に多孔質層及び非多孔質層を順に形成した第1の基板の前記非多孔質層側を第2の基板に貼り合せる工程と、貼り合わせた基板を前記多孔質層で分離する分離工程とを含む基板の製造方法であって、
前記分離工程において、請求項1乃至請求項10のいずれか1項に記載の分離装置を使用することを特徴とする基板の製造方法。
A method for manufacturing a substrate, comprising: a step of bonding a first substrate, one surface of which has a porous layer and a non-porous layer formed in that order, to a second substrate at the non-porous layer side; and a separation step of separating the bonded substrates at the porous layer,
A method for manufacturing a substrate, comprising using the separating apparatus according to any one of claims 1 to 10 in the separating step.
JP36101697A 1997-12-26 1997-12-26 Sample separation apparatus and method, and substrate manufacturing method Withdrawn JPH11195563A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP36101697A JPH11195563A (en) 1997-12-26 1997-12-26 Sample separation apparatus and method, and substrate manufacturing method
US09/211,757 US6418999B1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method, and substrate manufacturing method
SG200100215A SG87916A1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method, and substrate manufacturing method
SG1998005839A SG70141A1 (en) 1997-12-26 1998-12-15 Sample separating apparatus and method and substrate manufacturing method
TW87120972A TW429464B (en) 1997-12-26 1998-12-16 Sample separating apparatus and method, and substrate manufacturing method
EP19980310462 EP0925888B1 (en) 1997-12-26 1998-12-18 Sample separating apparatus and method, and substrate manufacture method
AT98310462T ATE281909T1 (en) 1997-12-26 1998-12-18 DEVICE AND METHOD FOR SPLITTING
DE1998627459 DE69827459T2 (en) 1997-12-26 1998-12-18 Apparatus and method for splitting
AU98190/98A AU717785B2 (en) 1997-12-26 1998-12-24 Sample separating apparatus and method, and substrate manufacturing method
KR10-1998-0058984A KR100366722B1 (en) 1997-12-26 1998-12-26 Sample separating apparatus and method, and substrate manufacturing method
US10/151,527 US6521078B2 (en) 1997-12-26 2002-05-20 Sample separating apparatus and method, and substrate manufacturing method
US10/318,231 US6860963B2 (en) 1997-12-26 2002-12-12 Sample separating apparatus and method, and substrate manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101697A JPH11195563A (en) 1997-12-26 1997-12-26 Sample separation apparatus and method, and substrate manufacturing method

Publications (2)

Publication Number Publication Date
JPH11195563A JPH11195563A (en) 1999-07-21
JPH11195563A5 true JPH11195563A5 (en) 2005-08-04

Family

ID=18471840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36101697A Withdrawn JPH11195563A (en) 1997-12-26 1997-12-26 Sample separation apparatus and method, and substrate manufacturing method

Country Status (1)

Country Link
JP (1) JPH11195563A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017667A (en) * 2001-06-29 2003-01-17 Canon Inc Member separating method and separating device
JP5455987B2 (en) * 2010-08-23 2014-03-26 東京エレクトロン株式会社 Peeling apparatus, peeling system, peeling method, program, and computer storage medium
JP5580805B2 (en) * 2011-10-21 2014-08-27 東京エレクトロン株式会社 Peeling apparatus, peeling system, peeling method, program, and computer storage medium
KR102191204B1 (en) * 2019-07-31 2020-12-15 삼영공업 주식회사 Apparatus for separating connected plates and method for separating the same
US11034057B2 (en) * 2019-08-15 2021-06-15 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article

Similar Documents

Publication Publication Date Title
KR101170587B1 (en) Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function
JPH115064A5 (en)
CN106004002B (en) A kind of backlight coat peeling unit
JP2003163188A5 (en)
KR20030033084A (en) Tool for applying resilient tape to chuck used for grinding or polishing wafers
WO2003032380A1 (en) Device and method for processing substrate
TW376585B (en) Semiconductor substrate and process for producing same
JP2001060618A5 (en) Substrate adsorption and holding device and method for manufacturing an exposure device and device using the substrate adsorption and holding device
EP1552905A4 (en) CONTACTOR CLEANING SHEET, METHOD OF MANUFACTURING SAME, AND METHOD OF CLEANING CONTACTOR
SG76581A1 (en) Object separating apparatus and method and method of manufacturing semiconductor substrate
JP2534196B2 (en) Wafer sticking method
JP3088327B2 (en) Glass substrate cutting method
TW201001489A (en) Sucking and holding device
WO2015102340A1 (en) Method and apparatus for applying film
JPH11195563A5 (en)
JP2004531081A (en) Method of transporting a substantially disk-shaped workpiece and apparatus for performing the method
KR20160046732A (en) Method and apparatus for joining adhesive tape
JPH08172061A (en) Method of affixing sheet
KR100718017B1 (en) Vacuum chuck
JPH11195568A5 (en)
TWI736381B (en) Resin molding apparatus and resin molded product manufacturing method
JPH0253558A (en) Suction jig
JPS63134166A (en) Wafer holding mechanism
JP4235266B2 (en) Semiconductor wafer adsorption equipment
JPH10146755A (en) Workpiece holding back film