JPH11177233A - Circuit board bonding equipment using anisotropic conductive film - Google Patents

Abstract

(57) Abstract: In an apparatus for joining circuit electrodes of circuit boards opposed to each other via an anisotropic conductive film, a circuit board joining apparatus capable of suppressing the apparatus cost and greatly improving productivity. provide. SOLUTION: A plurality of sets of jigs 10 and 20 for holding two circuit boards 200 and 100 so as to face each other are arranged on a rotatable work table 2 which can be indexed. A circuit positioning station 40, a thermocompression bonding station 50, and the like are sequentially arranged along the outer circumference, a support table 12 movable in the x direction and a lock mechanism 16 thereof are provided on the jig 10, and the circuit positioning station 40 includes: An observation optical system 45 for observing the circuit electrodes of the circuit board, an external driving device 41 for moving the support table 12 of the jig 10 from the outside, and a jig lock opening / closing device 42
And the heating / pressing head 51 is set in the thermocompression bonding station 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board bonding apparatus for connecting circuits using an anisotropic conductive film, and more particularly, to a flexible circuit board bonded to a heating element substrate in manufacturing a liquid jet recording head or the like. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board joining apparatus for joining circuits of resin substrates by thermocompression bonding via anisotropic conductive films.

[0002]

2. Description of the Related Art A liquid jet recording head used in a liquid jet recording apparatus or the like has a plurality of fine discharge ports for discharging a recording liquid such as ink, a plurality of liquid flow paths communicating with the discharge ports, and each liquid flow path. A plurality of ejection energy generating elements (e.g., heating elements) disposed on the recording medium, and applying a drive signal corresponding to an image signal input from the outside to the ejection energy generating element to apply a driving signal to the recording liquid in the liquid flow path. Generates thermal energy that gives a sharp rise in temperature that causes a film boiling phenomenon, forms bubbles in the recording liquid, and prints by discharging droplets of the recording liquid from the discharge port by the growth and contraction of these bubbles. It is configured to record.

[0003] By the way, various types and methods have been known for the structure and manufacturing method of this type of liquid jet recording head, and one type corresponding to the demand for high-quality, high-density and high-speed print recording has been known. As a form, a plurality of discharge ports, a liquid flow path, a heating element as a discharge energy generating element, and the like are formed on a substrate such as a silicon wafer, and a lead of a flexible circuit board (TAB) is joined to an electrical connection portion of the heating element. The liquid ejection recording head unit is manufactured by joining the wafer chip with TAB for the liquid ejection recording head to the chip tank for supplying the recording liquid. Then, a drive element substrate on which elements for individually driving and controlling the plurality of heating elements are formed is electrically connected to a wafer chip with a TAB of the liquid jet recording head unit to be integrated.

For electrically connecting two circuit boards such as a wafer chip with TAB on which these heating elements are formed and a driving element board on which driving elements for individually controlling the heating elements are formed. As an apparatus, an apparatus for connecting circuits by thermocompression bonding using an anisotropic conductive film (ACF) is known. Such a circuit board bonding apparatus is described in Japanese Utility Model Application Laid-Open No. 61-70390. As described above, there is known an apparatus for connecting circuit boards by thermocompression-bonding opposing circuits using an anisotropic conductive film using one heating / pressing head after performing circuit alignment. I have.

[0005]

However, liquid jet recording is performed by an apparatus for connecting circuits by thermocompression bonding via an anisotropic conductive film using one heating / pressing head as in the above-mentioned prior art. When performing circuit connection of the circuit board in the head, it is necessary to set the next print head in the same manner after completion of thermocompression bonding of the circuit board of each print head, which is inferior in productivity, and furthermore, the circuit connection of the print head is continuous. Can not be done. In order to increase productivity by such a conventional technique, a plurality of devices are required, and it is necessary to automate relative horizontal moving means of circuit boards opposed to each other, thereby avoiding a significant increase in device cost. Can not.

In view of the above, the present invention has been made in view of the above-mentioned unresolved problems of the prior art, and further provides an apparatus for joining circuits of opposing circuit boards via an anisotropic conductive film. Is an apparatus for joining circuits of a flexible circuit board (TAB) joined to a wafer chip having a heating element of a liquid jet recording head and a resin board having a drive circuit element through an anisotropic conductive film, thereby reducing the apparatus cost. It is an object of the present invention to provide a circuit board bonding apparatus capable of suppressing the increase in productivity.

[0007]

In order to achieve the above object, a circuit board bonding apparatus using an anisotropic conductive film according to the present invention comprises a plurality of electrode portions of a circuit board opposed to each other via an anisotropic conductive film. In a circuit board joining apparatus to be connected by thermocompression bonding, a plurality of sets of first and second sets of holding means for holding circuit boards having electrode portions facing each other are arranged on a movable worktable at equal intervals. The electrode positioning means for positioning the electrode part of the circuit board along the movement path of the holding means which is arranged and moved along with the movement of the work table is connected by thermocompression bonding to the electrode part opposed to the electrode positioning means. Heating and pressurizing means is provided, a first holding means of the set of holding means has a moving mechanism movable in an arrangement direction of electrodes to be connected, and a locking mechanism for restraining and locking movement of the moving mechanism. And a detecting means for detecting the degree of overlap of the electrode portions of the circuit board held by the first and second sets of holding means, respectively, Lock opening / closing means for opening and closing the lock mechanism of the holding means, external driving means for moving the moving mechanism from outside, and control means for controlling the operation of the external driving means based on detection information from the detecting means. It is characterized by doing.

In the circuit board bonding apparatus using an anisotropic conductive film according to the present invention, the work table is a rotary table capable of uniform indexing, and the first and second holding means are provided on the rotary table respectively. It is preferable to arrange a plurality of them at equal intervals on the center of the circle.

Further, in the circuit board bonding apparatus using the anisotropic conductive film of the present invention, supply means for supplying the circuit board having the electrode portion to the first and second sets of holding means, respectively; Discharging means for discharging the circuit board to which the electrode portion is bonded from the first and second set of holding means is further provided along the movement path of the holding means which moves along with the movement of the work table. Is preferred.

Further, a circuit board bonding apparatus using an anisotropic conductive film according to the present invention includes a flexible circuit board bonded to a wafer chip having a heating element mounted on a recording head body constituting a liquid jet recording head. It is suitable for circuit bonding with a resin substrate having a circuit pattern.

[0011]

According to the circuit board joining apparatus of the present invention, a plurality of sets of jigs each for setting two circuit boards for joining circuit electrode portions via an anisotropic conductive film are provided on a rotary type work table. One of the jigs is provided with a one-axis moving mechanism and a locking mechanism capable of moving in the arrangement direction of the circuit electrode portion, and a circuit electrode positioning station and a thermocompression bonding station are arranged along the work table. By installing one observation optical system, one external drive device and one jig lock opening / closing device in the circuit electrode positioning station, and one heating / pressing head in the thermocompression bonding station, Circuit board positioning and thermocompression bonding and other processes can be performed sequentially according to the indexing rotation of the worktable.
It is not necessary to install a plurality of jigs for a circuit board provided with an expensive one-axis table with a drive on a work table as in the related art, so that the apparatus cost can be reduced and productivity can be greatly improved. The operation of each station can be performed in parallel at each station by installing a plurality of sets of jigs on the work table.

The present invention also relates to a method for joining a circuit electrode of a flexible circuit board joined to a wafer chip having a heating element of a liquid jet recording head and a circuit electrode of a resin board having a drive circuit element via an anisotropic conductive film. By employing the circuit board bonding apparatus, it is possible to keep the apparatus cost low and to greatly improve the productivity of manufacturing the liquid jet recording head.

[0013]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view showing the structure of the circuit board bonding apparatus of the present invention, and FIG. 2 is a schematic side view showing the structure of the circuit board bonding apparatus of the present invention with a part thereof being omitted. FIG.

In FIG. 1 and FIG. 2, an indexable rotary worktable 2 which is driven to rotate by a direct drive motor 3 is mounted on a gantry 1. The worktable 2 has two electrodes having electrodes. Jig 1 for detachably holding the circuit boards of the above so as to face each other
A plurality of sets (four sets in FIG. 1) are arranged at equal intervals on the same circle center as one set of 0 and 20. Then, along the outer periphery of the work table 2, the supply station 3
0, a circuit pattern alignment station 40, a thermocompression bonding station 50, and a finished product discharging station 60 are sequentially arranged on the gantry 1.

In this embodiment, 2 for connecting the electrode portions is used.
As an example of a circuit board, a recording head unit 100 constituting a liquid jet recording head as shown in FIG. 3 and a resin substrate 200 to which an anisotropic conductive film is adhered will be described. That is, the circuit pattern portion 10 of the flexible circuit board (TAB) 103 of the recording head unit 100
A case in which the circuit board 4 and the circuit pattern portion 202 of the resin substrate 201 are electrically connected via the anisotropic conductive film 210 will be described.

In FIG. 3, a recording head unit 100 constituting a liquid jet recording head forms a plurality of discharge ports for discharging a recording liquid, a liquid flow path, and a heating element as a discharge energy generating element on a substrate such as a silicon wafer. To form a wafer chip (element substrate provided with a heating element) 102, a flexible circuit board (TAB) 103 is bonded to the wafer chip 102, and this is connected to the recording head body 1.
01 and a flexible circuit board (T
AB) 103 is provided with a TAB circuit pattern portion 104, and positioning projections 101a and 101b (the projection 101b is not shown) are provided on both sides of the recording head main body 101. Then, a resin substrate 201 having a circuit pattern portion 202 joined to the TAB circuit pattern portion 104 of the flexible circuit board (TAB) 103
Has an element for driving and controlling a heating element and the like,
A positioning through hole 20 is provided at a predetermined position of the resin substrate 201.
4a and 204b are provided. And the resin substrate 2
01, the circuit pattern part 202 is connected to the anisotropic conductive film (AC) prior to joining with the TAB circuit pattern part 104.
F) 210 is deposited. This anisotropic conductive film (AC
F) The resin substrate 201 to which the 210 is attached is referred to as a resin substrate 200 with an ACF.

Next, the details of the jig for mounting the circuit board and the stations in the circuit board bonding apparatus of the present invention will be sequentially described.

As shown in FIGS. 1 and 4, a pair of jigs 10 and 20 are arranged on the work table 2 so as to face each other in the radial direction, and are equally spaced on the same circle. A plurality of sets (four in the figure) are provided. In one set of jigs 10 and 20, the jig 10 arranged radially outward of the work table 2 is a jig for attaching the resin substrate 200 with the ACF to which the anisotropic conductive film 210 is attached. A jig 20 disposed radially inward of the work table 2 so as to face the jig 10 attaches a recording head unit 100 in which a wafer chip 102 to which a flexible circuit board (TAB) 103 is bonded is mounted on a recording head main body 101. Jig for

As shown in FIGS. 4 and 5, the jig 10 has a jig base 11 fixed to the work table 2 so that a part thereof projects outward from the outer peripheral edge of the work table 2. The jig base 11 has a linear guide 13 that guides and holds the support table 12 that supports the resin substrate 200 with the ACF so as to be movable in the arrangement direction of the circuit patterns (that is, the x direction). The stoppers 14a and 14b arranged on both sides to restrict the moving range of the support table 12 in the x direction, and the lock mechanism 16 for fixing the support table 12 at an appropriate position and restraining the movement of the support table are moved vertically (z (Direction). The support table 12 supporting the resin substrate 200 with the ACF is supported movably in the x direction along the linear guide 13,
Through holes 204a, 204 for positioning of resin substrate 201
b, positioning pins 12a, 1
2b, and a resin substrate 2 with an ACF on the rear end side.
A stepped surface 18 is formed below the surface supporting the second step 00 and is formed with a step. A positioning rod 43 of a jig external drive device 41 (see FIG. 7) described later is provided on a rear end edge of the stepped surface 18. A V-shaped depression 19 is provided which engages with the recess. Further, the lock mechanism 16 formed in a U-shape in a side view is held by the lock mechanism guide portion 15 so as to be movable in the vertical direction (z direction) by an uneven engagement relationship such as a dovetail groove relationship, and a jig base. Spring 1 mounted on the lower surface of 11
7, the lock pad 16a fixed to the upper portion of the lock mechanism 16 presses the step surface 18 of the support table 12, locks the movement of the support table 12 in the x direction, and moves the support table. Restrained. When the lock mechanism 16 is pushed upward from the lower side in the z direction by the operation of a jig lock opening / closing device 42 (see FIG. 7) for a resin substrate, which will be described later, the lock pad 16a of the lock mechanism 16 becomes a step surface of the support table 12. The lock of the support table 12 is released by moving upward away from the support table 18 so that the support table 12 can be moved.

The other jig 20 disposed radially inward of the work table 2 opposite to the jig 10 has a jig for mounting the recording head unit 100 as shown in FIGS. A recording head unit 10
0 and a y reference surface 2 serving as a reference for positioning the print head unit 100 in the y direction.
3 and an operating claw body 25 connected to a piston rod 24a of a cylinder 24 fixed to the jig base 21 and configured to be movable in the y-direction by the operation of the cylinder 24. Equipped, operating claw body 25
Are formed in a U-shape in plan view, and engaging tips 2
5a and 25b (the engaging claws 25b are not shown). When the recording head unit 100 is placed on the support surface 22 of the jig base 21 of the jig 20 at the supply station 30, the operation claw 25 is moved in the y direction by the operation of the cylinder 24, and the both ends of the claw 25 are moved. Double engaging claw 25
a and 25b engage with the positioning projections 101a and 101b on both sides of the recording head unit 100, respectively.
The recording head unit 100 is moved in the y direction, and the back surface thereof is pressed against the y reference surface 23 of the jig base 21 for positioning. At this time, the position of the recording head unit 100 in the x direction is set so that the gap between the two engaging claws 25a and 25b of the operating claw body 25 and the outer shape of the recording head head unit 100 in the x direction are fitted with a small gap. To both engagement claws 25a,
By setting the interval width of 25b, the position of the recording head unit 100 in the x direction is determined without rattling.

As shown in FIG. 1, the supply station 30 is provided with magazines 33 and 34 for accommodating the recording head unit 100 and the resin substrate 200 with the ACF, respectively, and a transfer robot 31 having hand means 32. , The transfer robot 31 has its hand means 3
2, the recording head unit 100 and the resin substrate 200 with the ACF accommodated in the magazines 33 and 34 are gripped, and the jigs 20 and 10 on the work table 2 are held.
Supply to

Circuit pattern positioning station 40
As shown in FIGS. 1, 2, and 7, a jig external drive device 41, a jig lock opening / closing device 42, and an observation optical system 45 such as a camera connected to an image processing device 46 are provided. The jig external drive device 41 includes a single-axis stage 47 movable in the x direction, a stepping motor 47 a for driving the single-axis stage 47, a cylinder 44 fixed to the single-axis stage 47, and a cylinder 44. A stepping motor 47a for driving a one-axis stage, which is composed of a positioning rod 43 which expands and contracts by operation and is fixed to the gantry 1, is connected to a controller 48, and drives the one-axis stage 47 in response to a command from the controller 48. The cylinder 44
The positioning rod 43 is mounted on the support table 12 of the jig 10.
Are arranged on the one-axis stage 47 so as to be able to engage with the V-shaped recess 19. The jig lock opening / closing device 42 is provided below a portion of the jig 10 corresponding to the lock mechanism 16 and includes a push-up rod 42a and a cylinder 42b that drives the push-up rod 42a. When aligning,
When the push-up rod 42a is raised in the z direction by the operation of the cylinder 42b, the lock mechanism 16 of the jig 10 is moved upward from below against the urging force of the push-up spring 17, and the lock pad 16a is supported. 12
The lock of the support table 12 is released by moving the support table 12 away from the stepped surface 18 of the above, and the support table 12 can be moved in the x direction. That is, it enables the alignment of the circuit pattern. The observation optical system 45 such as a camera
The TAB circuit pattern of the recording head unit 100 which is fixed to the support 1a erected on the gantry 1 and is disposed above the work table 2 so that the circuit pattern portions of both circuit boards can be observed. The configuration is such that the portion 104 and the circuit pattern portion 202 of the resin substrate 200 with ACF are observed, and the image information thereof is transmitted to the image processing device 46. The image processing device 46 extracts the circuit pattern portions 104, 2 of the two from the image information observed by the observation optical system 45.
02 is calculated, and the controller 48 calculates
The calculated value is compared with a preset overlap width of the circuit pattern, and based on the comparison result, the stepping motor 47a for driving the one-axis stage is appropriately operated, and the jig 10 is moved together with the one-axis stage 47. The support table 12 is moved via the positioning rod 43 so that the value calculated from the image information is controlled to be equal to or smaller than a preset overlap width.

As shown in FIGS. 1, 2 and 8, the thermocompression bonding station 50 includes a support 1 erected on the gantry 1.
b, a heating and pressing head 51 and a controller 48 movably supported by a cylinder 54 attached to the
The heater 52 is heated to a temperature set in advance by a heater controller 53 controlled by the heater 52. The heating / pressing head 51 heated by the heater 52 is lowered by the operation of the cylinder 54, and the circuit pattern alignment station 40 The TAB circuit pattern portion 104 on the jigs 10 and 20 and the circuit pattern portion 202 of the resin substrate 200 with ACF are thermocompressed via an anisotropic conductive film (ACF) 210.

Then, the finished product discharging station 60
As shown in FIGS. 1 and 2, a hand for removing the resin substrate 200 with the ACF and the integrated recording head unit 100 from the respective jigs 10 and 20 on the work table 2 by thermocompression bonding of the circuit pattern portion. A transport robot 61 having means 62 and a magazine 63 for accommodating the integrated recording head unit 100 and the resin substrate 200 are provided.

Next, an embodiment in which the circuit patterns of the circuit boards facing each other are joined by the circuit board joining apparatus of the present invention configured as described above will be described.

First, at the supply station 30, the resin substrate 200 with ACF and the recording head unit 100 stored in the magazines 34 and 33 are gripped by the hand means 32 of the transfer robot 31 and The jigs 10 and 20 are sequentially supplied. ACF
As shown in FIG. 5, the resin substrate 200 is attached to the jig 20 such that the positioning holes 204 a and 204 b are fitted to the positioning pins 12 a and 12 b provided on the support table 12 of the jig 10. Set. Note that the support table 12 of the jig 10 is locked by the lock mechanism 16. Then, the recording head unit 100 is mounted on the support surface 22 of the jig base 21 of the jig 20 as shown in FIG. And
The two engaging claws 25a and 25b at the ends thereof are positioning protrusions 1 provided on both side surfaces of the recording head unit 100.
01a, 101b and the recording head unit 10
0 in the y direction, and the back surface of the jig base 21
It is positioned by pressing against the reference surface 23. At this time, the position of the recording head unit 100 in the x direction is
The width of the gap between the two engaging claws 25a and 25b is set so that the gap between the two engaging claws 25a and 25b fits into the outer shape of the recording head head unit 100 in the x direction with a small gap. The position of the recording head unit 100 in the x direction is determined without rattling.

Thus, the resin substrate 200 with ACF and the recording head unit 100 are set on the respective jigs 10 and 20 as shown by broken lines in FIG. 4, and the TAB circuit pattern portion 104 and the resin substrate circuit pattern portion 202 are set. Are arranged in a positional relationship of vertically overlapping each other with the anisotropic conductive film 210 interposed therebetween.

Thereafter, the work table 2 is rotated by indexing the table by driving the direct drive motor 3, and the resin substrate 200 and the recording head unit 100 set on the jigs 10 and 20 are transferred to the circuit pattern positioning station 40. And is positioned at the predetermined working position. At this time, a new set of jigs 10 and 20 are brought to the supply station 30 and positioned, and the new set of jigs 10 and 20 are recorded on the new set of jigs 10 and 20 in the same manner as described above. The head unit 100 is supplied and set.

Circuit pattern alignment station 40
Jig 1 for holding resin substrate 200 with ACF
The lock mechanism 16 of the jig 0 is moved up by the push-up rod 42 a by the operation of the cylinder 42 b of the jig lock opening / closing device 42 fixed on the gantry 1.
And the lock pad 16a of the lock mechanism 16 is separated from the step surface 18 of the support table 12, whereby the lock of the support table 12 is released.
Then, the one-axis stage 4 in the jig external drive device 41
The positioning rod 43 is extended by the operation of the cylinder 44 fixed to 7, and the V of the support table 12 of the jig 10 is adjusted.
It fits into the letter-shaped depression 19. Thus, the position of the support table 12 of the jig 10 is adjusted to the position of the one-axis stage 47. Thereafter, the TAB circuit pattern portion 104 of the recording head unit 100 and the circuit pattern portion 2 of the resin substrate 200 with the ACF are operated by the observation optical system 45 such as a camera.
02 is observed, and the image information is transmitted to the image processing device 46. The image processing device 46 calculates the overlap width of the two circuit pattern portions from the image information observed by the observation optical system 45, and the controller 48 sets the overlap width calculated by the image processing to the overlap of the preset circuit pattern. The stepping motor 47a for driving the one-axis stage is operated based on the comparison result,
The axis stage 47 is moved in the x direction, and at the same time, the support table 12 is integrally moved in the x direction via the positioning rod 43. Thus, the resin substrate 20 with the ACF
0 circuit pattern section 202 is the TAB circuit pattern section 10
4 is appropriately moved in the x direction, and the TAB circuit pattern portion 104 and the circuit pattern portion 202 are accurately aligned. Then, after the positioning is completed, by lowering the push-up rod 42a of the jig lock opening / closing device 42, the lock mechanism 16 is lowered by the urging force of the spring 17, and the lock pad 16a is moved to the step surface 18 of the support table 12. To lock the support table 12 again. Next, the positioning rod 43 of the jig external drive device 41 is moved backward by the cylinder 41. Thus, the resin substrate 200 with the ACF is fixed in a state where the circuit pattern portion 202 is accurately aligned with the TAB circuit pattern portion 104 of the recording head unit 100.

Circuit pattern alignment station 40
Resin substrate 200 on jigs 10 and 20 aligned with each other
The recording head unit 100 is rotated together with the jigs 10 and 20 by indexing the table by driving the direct drive motor 3, and
Transferred to and positioned.

At the thermocompression bonding station 50, the heating / pressing head 51 heated by the heater 52 heated to a temperature preset by the heater controller 53 is lowered by the operation of the cylinder 54, and the circuit pattern alignment station 40 TAB circuit pattern portion 104 and resin substrate 20 with ACF aligned in step
The 0 circuit pattern portion 202 is thermocompression-bonded via the anisotropic conductive film 210. Thereby, the TAB circuit pattern and the circuit pattern of the resin substrate with ACF can be electrically connected via the anisotropic conductive film. Then, the heating / pressing head 51 is raised by the operation of the cylinder 54,
The operation of the thermocompression station ends.

Thereafter, the recording head unit 100 and the resin substrate 200 which have been integrated by thermocompression bonding at the thermocompression bonding station 50 are transferred to the finished product discharge station 60 by the drive of the direct drive motor 3, where the FIG. 2, as shown in FIG. 2, the jigs 10 and 20 are taken out of the jigs 10 and 20 by the hand means 62 of the transfer robot 61 and stored in the magazine 63 as a finished product.

As described above, according to the circuit board joining apparatus of the present invention, a plurality of sets of jigs for setting two circuit boards for joining the circuit electrode portions via the anisotropic conductive film can be divided. One jig is provided with a one-axis moving mechanism and a locking mechanism capable of moving in the arrangement direction of the circuit electrode portion, and a circuit board supply station is provided along the periphery of the work table.
A circuit electrode positioning station, thermocompression station, etc. are provided. One observation optical system, one external drive device and one jig lock opening / closing device are installed at the circuit electrode positioning station, and the thermocompression station is installed at the thermocompression station. By installing one heating / pressing head, positioning of the circuit board, thermocompression bonding, and other processes can be performed sequentially according to the indexing rotation of the work table. There is no need to install a plurality of jigs for a circuit board provided with a single-axis table on a work table, so that the apparatus cost can be reduced and productivity can be greatly improved. The operation of each station is
By installing a plurality of sets of jigs for holding a circuit board on the work table, the jigs can be performed in each station in parallel.

[0035]

As described above, according to the circuit board bonding apparatus of the present invention, the positioning of the circuit board and the thermocompression bonding and other steps can be sequentially performed in parallel, thereby reducing the cost of the apparatus. Thus, the productivity can be greatly improved.

Further, a jig for the resin substrate is provided with a one-axis moving mechanism and a lock mechanism for the same, and an external driving device and a lock opening / closing device are arranged at a portion where the observation optical system is installed, thereby performing circuit pattern alignment. By doing so, it is not necessary to dispose a plurality of jigs for a circuit board provided with a single-axis table with an expensive drive on a work table as in the related art, and a low-cost apparatus can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a configuration of a circuit board bonding apparatus of the present invention.

FIG. 2 is a schematic side view showing a configuration of a circuit board bonding apparatus of the present invention, with a part thereof being omitted;

FIG. 3 is a schematic perspective view of a recording head unit and a resin substrate of a liquid jet recording head to which circuit electrodes are joined by the circuit board joining apparatus of the present invention.

FIG. 4 is a schematic side view showing a positional relationship between a jig for attaching a recording head unit and a jig for attaching a resin substrate.

FIG. 5 is a perspective view illustrating a state where the resin substrate is set on a jig for mounting the resin substrate.

FIG. 6 is a perspective view illustrating a state where the recording head unit is set on a jig for attaching the recording head unit.

FIG. 7 is a schematic side view illustrating a configuration of a circuit pattern alignment station in the circuit board bonding apparatus of the present invention.

FIG. 8 is a schematic side view illustrating a configuration of a thermocompression bonding station in the circuit board bonding apparatus of the present invention.

[Explanation of symbols]

 Reference Signs List 1 base 2 work table 3 direct drive motor 10 jig (for resin substrate with ACF) 11 jig base 12 support table 13 linear guide 16 lock mechanism 19 V-shaped recess 20 (for recording head unit) jig 21 jig Base 23 y Reference surface 25 Working claw body 30 Supply station 40 Circuit pattern positioning station 41 Jig external drive device 42 Jig lock opening / closing device 43 Positioning rod 45 Observation optical system (camera) 46 Image processing device 47 1-axis stage 47a Stepping Motor 48 Controller 50 Thermocompression bonding station 51 Heating / pressing head 52 Heater 53 Heater controller 60 Finished product discharge station 100 Recording head unit 101 Recording head body 102 Wafer chip 103 Flexible Road substrate 104 TAB circuit pattern portion 200 anisotropic conductive film (ACF) with the resin substrate 201 resin substrate 202 circuit pattern portion 210 anisotropically conductive film

Claims (4)

[Claims] 1. A circuit board joining apparatus for connecting a plurality of electrode portions of a circuit board facing each other via an anisotropic conductive film by thermocompression bonding, wherein a circuit board having an electrode section is held so as to face each other. A plurality of first and second sets of holding means are arranged at equal intervals on a movable worktable, and the electrodes of the circuit board are moved along the movement path of the holding means moving with the movement of the worktable. An electrode positioning means for positioning the electrodes and a heating and pressurizing means for connecting the opposing electrode parts by thermocompression bonding, wherein the first holding means of the set of holding means comprises A moving mechanism movable in the arrangement direction, and a lock mechanism for restraining and locking movement of the moving mechanism, wherein the electrode positioning means is held by the first and second sets of holding means, respectively. Detecting means for detecting the degree of overlap of the respective electrode portions of the circuit board to be operated, lock opening / closing means for opening / closing a lock mechanism of the first holding means, external driving means for moving the moving mechanism from outside, Control means for controlling the operation of the driving means based on the detection information from the detection means. A circuit board bonding apparatus using an anisotropic conductive film. 2. The worktable is a rotary table that can be uniformly indexed, and a plurality of first and second holding means are arranged on the rotary table at equal intervals on the same circle. A circuit board bonding apparatus using the anisotropic conductive film according to 1. 3. A supply means for supplying a circuit board having an electrode portion to a first and a second set of holding means, respectively, and a circuit board to which the electrode section is joined is provided by a first and a second set. 3. An anisotropic conductive film according to claim 1, wherein a discharge means for discharging from the holding means is further arranged along a movement path of the holding means which moves along with movement of the work table. Circuit board bonding equipment used. 4. One of the circuit boards to be joined is a flexible circuit board joined to a wafer chip formed with a heating element mounted on a print head main body, and the other circuit board is a resin board having a circuit pattern. A circuit board joining apparatus using the anisotropic conductive film according to claim 1.