JPH11177198A - Flexible wiring board - Google Patents
Flexible wiring boardInfo
- Publication number
- JPH11177198A JPH11177198A JP9362948A JP36294897A JPH11177198A JP H11177198 A JPH11177198 A JP H11177198A JP 9362948 A JP9362948 A JP 9362948A JP 36294897 A JP36294897 A JP 36294897A JP H11177198 A JPH11177198 A JP H11177198A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- connection
- conductive
- conductive patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【課題】 本発明は、接着強度を高め、もって接続の信
頼性を向上させることのできるフレキシブル配線基板を
提供する。
【解決手段】 柔軟な絶縁性シートを用いた基板10
と、この基板上に平行に印刷配線された複数の導電性パ
ターン11と、この導電性パターンの端部に設けられる
接続用端子部12とを備えるフレキシブル配線基板であ
る。本発明では、前記端子部が指型13に複数に分割さ
れている。
(57) [Problem] To provide a flexible wiring board capable of increasing the bonding strength and thereby improving the connection reliability. A substrate 10 using a flexible insulating sheet is provided.
And a plurality of conductive patterns 11 printed and wired in parallel on the substrate, and a connection terminal portion 12 provided at an end of the conductive pattern. In the present invention, the terminal portion is divided into a plurality of fingers 13.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、接続部の接着強度
を向上させたフレキシブル配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board having an improved bonding strength at a connection portion.
【0002】[0002]
【従来の技術】柔軟な絶縁性シート基板上に複数の導電
性パターンを平行に印刷配線したフレキシブル配線基板
は、装置間または回路ユニット間での多数の信号線の授
受に使用される。この種のフレキシブル配線基板の導電
性パターンは、その端部に接続用端子部が形成され、こ
の端子部を通常のプリント配線基板や他のフレキシブル
配線基板と接続する。2. Description of the Related Art A flexible wiring board in which a plurality of conductive patterns are printed and printed in parallel on a flexible insulating sheet substrate is used for transmitting and receiving a large number of signal lines between devices or circuit units. A connection terminal portion is formed at an end of the conductive pattern of this type of flexible wiring board, and this terminal portion is connected to a normal printed wiring board or another flexible wiring board.
【0003】図3は、フレキシブル配線基板どうしを接
続する場合の平面図である。一方の絶縁性シート基板1
0はその上側表面に複数の導電性パターン11が形成さ
れ、このパターン11の端部12が接続用端子部となっ
ている。他方の絶縁性シート基板20はその下側表面に
複数の導電性パターン21が形成され、このパターン2
1の端部22が接続用端子部となっている。FIG. 3 is a plan view when connecting flexible wiring boards. One insulating sheet substrate 1
In the case 0, a plurality of conductive patterns 11 are formed on the upper surface, and the end 12 of the pattern 11 is a connection terminal. The other insulating sheet substrate 20 has a plurality of conductive patterns 21 formed on the lower surface thereof.
One end 22 is a connection terminal.
【0004】基板10,20の導電性パターン11,2
1は同じ配列形態であり、これらを図4(A)のように
重ねると、端子部12,22は対向する。そこで、両端
子部12,22間に図4(B)のように導電性の接着
剤、例えば異方性導電膜(ACF)30を介在させて圧
接し、両者の間が導電性を有するように接着する。The conductive patterns 11 and 12 on the substrates 10 and 20
1 have the same arrangement form, and when these are overlapped as shown in FIG. 4A, the terminal portions 12 and 22 are opposed to each other. Therefore, as shown in FIG. 4 (B), a conductive adhesive, for example, an anisotropic conductive film (ACF) 30 is interposed between the two terminal portions 12 and 22 so as to press-contact with each other so that the two portions have conductivity. Glue to
【0005】[0005]
【発明が解決しようとする課題】上述した導電性パター
ン11,21の接続用端子部12,22は、導電性パタ
ーン11,21の幅と等しいので面積が小さい。このた
め、接着剤30による接着強度が弱く、剥がれ易い。特
に、導電性パターン11,21の配列方向側部に近い接
続部12,22間が最も剥がれ易く、フレキシブル配線
基板の接続の信頼性を損なわせている。The connection terminals 12, 22 of the conductive patterns 11, 21 described above have a small area because they are equal to the width of the conductive patterns 11, 21. For this reason, the adhesive strength by the adhesive 30 is weak, and it is easy to peel off. In particular, the connection portions 12 and 22 that are closer to the side in the arrangement direction of the conductive patterns 11 and 21 are most easily peeled off, which impairs the reliability of connection of the flexible wiring board.
【0006】本発明は、導電性パターン端部の接続用端
子部の形状または配置を工夫することにより、接着強度
を高め、もって接続の信頼性を向上させることのできる
フレキシブル配線基板を提供することを目的としてい
る。An object of the present invention is to provide a flexible wiring board capable of improving the bonding strength and consequently improving the connection reliability by devising the shape or arrangement of the connection terminal portion at the end of the conductive pattern. It is an object.
【0007】[0007]
【課題を解決するための手段】本発明の上記目的は、柔
軟な絶縁性シートを用いた基板と、この基板上に平行に
印刷配線された複数の導電性パターンと、この導電性パ
ターンの端部に設けられる接続用端子部とを備え、前記
端子部が指型に複数に分割されているフレキシブル配線
基板で達成できる。SUMMARY OF THE INVENTION The object of the present invention is to provide a substrate using a flexible insulating sheet, a plurality of conductive patterns printed in parallel on the substrate, and an end of the conductive pattern. And a connection terminal portion provided on the portion, and the terminal portion can be attained by a flexible wiring board divided into a plurality of fingers.
【0008】1つの導電性パターンの接続用端子部が複
数に分割されていると、この導電性パターンの一部の端
子部が接着不良で接続が不安定になっても、残りの端子
部によって確実に接続状態が維持されるため、フレキシ
ブル配線基板の接続の安定性が向上する。If the connection terminal portion of one conductive pattern is divided into a plurality of portions, even if some of the terminal portions of this conductive pattern become defective due to poor adhesion and the connection becomes unstable, the remaining terminal portions may be used. Since the connection state is reliably maintained, the connection stability of the flexible wiring board is improved.
【0009】本発明の1つの実施形態によれば、前記複
数の導電性パターンの配列方向両側部の前記端子部は、
配列方向中央部の前記端子部より分割数が多いものであ
る。このことにより、特に剥がれ易い両側部の接着強度
を増強する。According to one embodiment of the present invention, the terminal portions on both sides in the arrangement direction of the plurality of conductive patterns are:
The number of divisions is larger than that of the terminal portion at the center in the arrangement direction. This enhances the adhesive strength of both sides, which are particularly easily peeled.
【0010】本発明の他の実施形態によれば、前記複数
の導電性パターンの隣接パターン間または配列方向両側
部の外側に、前記導電性パターンとは接続されていない
ダミーパターンを形成する。このことにより、作業ミス
による接続不良を防止する。According to another embodiment of the present invention, a dummy pattern that is not connected to the conductive pattern is formed between adjacent patterns of the plurality of conductive patterns or outside both sides in the arrangement direction. This prevents a connection failure due to a work error.
【0011】[0011]
【発明の実施の形態】以下、図面に示した実施形態を参
照して、本発明を詳細に説明する。図1は、本発明の一
実施形態を示すフレキシブル配線基板の平面図である。
この図において、一方の絶縁性シート基板10はその上
側表面に複数の導電性パターン11が形成され、このパ
ターン11の端部12が接続用端子部となっている。他
方の絶縁性シート基板20はその下側表面に複数の導電
性パターン21が形成され、このパターン21の端部2
2が接続用端子部となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments shown in the drawings. FIG. 1 is a plan view of a flexible wiring board showing one embodiment of the present invention.
In this figure, one of the insulating sheet substrates 10 has a plurality of conductive patterns 11 formed on an upper surface thereof, and ends 12 of the patterns 11 are connection terminals. The other insulating sheet substrate 20 has a plurality of conductive patterns 21 formed on the lower surface thereof.
Reference numeral 2 denotes a connection terminal.
【0012】本発明のフレキシブル配線基板は、導電性
パターン11,21の接続用端子部12,22が複数の
指13,23に分割された指型をしている。図示の例で
は、中央部の端子部12,22が2本の指13,23を
有するように分割されているのに対し、両側部の端子部
12,22はそれより分割数の多い3本の指13,23
に分割されている。The flexible wiring board of the present invention has a finger shape in which the connection terminals 12, 22 of the conductive patterns 11, 21 are divided into a plurality of fingers 13, 23. In the illustrated example, the terminal portions 12 and 22 at the center are divided so as to have two fingers 13 and 23, whereas the terminal portions 12 and 22 at both sides are divided into three portions having a larger number of divisions. Fingers 13,23
Is divided into
【0013】図1に示す本発明のフレキシブル配線基板
も、図4で説明したと同様の手法で接続される。この場
合、本発明では、1つの導電性パターン11,21の接
続部12,22が少なくとも2つの指13,23に分割
されているので、1つの指の接続が不安定であっても、
残りの指によって接続が確保される。特に、基板側部の
指13,23の本数は中央部より多いので、その分、接
続の信頼性は向上し、剥がれ易い基板側部の接続部の接
着強度を増強する。The flexible wiring board of the present invention shown in FIG. 1 is connected in the same manner as described with reference to FIG. In this case, in the present invention, since the connection portions 12 and 22 of one conductive pattern 11 and 21 are divided into at least two fingers 13 and 23, even if the connection of one finger is unstable,
The connection is secured by the remaining fingers. In particular, since the number of fingers 13 and 23 at the side of the substrate is larger than that at the center, the reliability of the connection is improved and the adhesive strength of the connection at the side of the substrate which is easily peeled is increased.
【0014】図2は、本発明の他の実施形態を示すフレ
キシブル配線基板の平面図である。本例で示すフレキシ
ブル配線基板は、導電性パターン11の接続部12の隣
接パターン間および基板側部に、導電性パターン11と
は接続されていないダミーパターン14を、接続部12
と同程度の長さに形成したものである。FIG. 2 is a plan view of a flexible wiring board showing another embodiment of the present invention. In the flexible wiring board shown in this example, a dummy pattern 14 that is not connected to the conductive pattern 11 is provided between adjacent patterns of the connecting part 12 of the conductive pattern 11 and between the adjacent parts of the board.
It is formed to have the same length as that.
【0015】このダミーパターン14の使用は、図示せ
ぬ他方のフレキシブル配線基板(前述した20に相当)
との接続時の作業ミスで、両基板が導電性パターン11
の配列方向に位置ズレを起こしても、ダミーパターン1
4が接着面積を補うため、接続の安定性が確保される利
点を与える。The use of this dummy pattern 14 is based on the other flexible wiring board (not shown) (corresponding to 20 described above).
When both substrates are connected to the conductive pattern 11
Of the dummy pattern 1
4 provides an advantage that the connection stability is ensured because the adhesive area is supplemented.
【0016】[0016]
【発明の効果】以上述べたように本発明によれば、導電
性パターン端部の接続用端子部の形状または配置を工夫
したので、接続部の接着強度が高く、接続の信頼性を向
上させたフレキシブル配線基板を得ることができる。As described above, according to the present invention, the shape or arrangement of the connection terminal at the end of the conductive pattern is devised, so that the bonding strength of the connection is high and the reliability of the connection is improved. Flexible wiring board can be obtained.
【図1】 本発明の一実施形態を示すフレキシブル配線
基板の平面図である。FIG. 1 is a plan view of a flexible wiring board according to an embodiment of the present invention.
【図2】 本発明の他の実施形態を示すフレキシブル配
線基板の平面図である。FIG. 2 is a plan view of a flexible wiring board according to another embodiment of the present invention.
【図3】 従来のフレキシブル配線基板の平面図であ
る。FIG. 3 is a plan view of a conventional flexible wiring board.
【図4】 従来のフレキシブル配線基板の接続状態を示
す平面図及び側面図である。FIG. 4 is a plan view and a side view showing a connection state of a conventional flexible wiring board.
10,20 絶縁性シート基板 11,12 導電性パターン 12,22 接続用端子部 13,23 分割された指 14 ダミーパターン 10, 20 Insulating sheet substrate 11, 12 Conductive pattern 12, 22 Connection terminal part 13, 23 Divided finger 14 Dummy pattern
Claims (3)
ンと、 この導電性パターンの端部に設けられる接続用端子部と
を備え、 前記端子部が指型に複数に分割されていることを特徴と
するフレキシブル配線基板。1. A substrate using a flexible insulating sheet, a plurality of conductive patterns printed and wired in parallel on the substrate, and a connection terminal portion provided at an end of the conductive pattern. A flexible wiring board, wherein the terminal portion is divided into a plurality of fingers.
側部の前記端子部は、配列方向中央部の前記端子部より
分割数が多いことを特徴とする請求項1のフレキシブル
配線基板。2. The flexible wiring board according to claim 1, wherein the terminal portions on both sides in the arrangement direction of the plurality of conductive patterns have a larger number of divisions than the terminal portions in the center portion in the arrangement direction.
ン間または配列方向両側部の外側に、前記導電性パター
ンとは接続されていないダミーパターンを形成してなる
ことを特徴とする請求項1または2のフレキシブル基
板。3. A dummy pattern that is not connected to the conductive pattern is formed between adjacent patterns of the plurality of conductive patterns or outside of both sides in the arrangement direction. 2. Flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362948A JPH11177198A (en) | 1997-12-12 | 1997-12-12 | Flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362948A JPH11177198A (en) | 1997-12-12 | 1997-12-12 | Flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11177198A true JPH11177198A (en) | 1999-07-02 |
Family
ID=18478138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9362948A Pending JPH11177198A (en) | 1997-12-12 | 1997-12-12 | Flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11177198A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359997B2 (en) * | 1996-04-26 | 2002-03-19 | Harman Audio Electronic Systems Gmbh | Loudspeaker having radially magnetized magnetic ring |
| KR100395814B1 (en) * | 2000-11-14 | 2003-08-27 | 삼성에스디아이 주식회사 | An open-protected type flexible printed circuit |
| JP2007234915A (en) * | 2006-03-02 | 2007-09-13 | Sony Corp | Wiring board, wiring cable, electronic device and wiring connection method |
| US7872337B2 (en) * | 2005-04-28 | 2011-01-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate |
-
1997
- 1997-12-12 JP JP9362948A patent/JPH11177198A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6359997B2 (en) * | 1996-04-26 | 2002-03-19 | Harman Audio Electronic Systems Gmbh | Loudspeaker having radially magnetized magnetic ring |
| KR100395814B1 (en) * | 2000-11-14 | 2003-08-27 | 삼성에스디아이 주식회사 | An open-protected type flexible printed circuit |
| US7872337B2 (en) * | 2005-04-28 | 2011-01-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate |
| JP2007234915A (en) * | 2006-03-02 | 2007-09-13 | Sony Corp | Wiring board, wiring cable, electronic device and wiring connection method |
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