JPH11176889A - Detecting defective pieces in TAB tape - Google Patents

Abstract

(57) [Summary] [PROBLEMS] The tact time of TAB tape processing is short, there is no tape warpage or tape strength reduction even in a multi-cavity structure, and a dedicated defective piece detection sensor is not required.
It is an object of the present invention to provide a method for detecting a defective piece in a TAB tape. When a defective piece (2a) is detected by a defect inspection before processing of a TAB tape, the defective piece (2) is attached to the position recognition lead (11) as an object that prevents recognition of the defective piece or a colored sheet (13). Add paint 14,
During processing of the TAB tape, the position recognition site is imaged by an image recognition device to detect a defective piece, and when the position recognition lead 11 is recognized, the position of the piece 2 is recognized. If the lead 11 cannot be recognized, it is determined that the piece is a defective piece, and the object to be processed is advanced to the next piece.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape, and more particularly to a TAB tape in which a plurality of pieces are arranged in a row in a width direction.
The present invention relates to a method for detecting a defective piece useful for a B tape.

[0002]

2. Description of the Related Art Conventionally, various semiconductor packages using a TAB tape have been proposed. When performing assembling processing of these packages, for example, die attach or bonding, an assembling apparatus having an alignment mechanism based on image recognition is often used because high positional accuracy is required.

[0003] Since a TAB tape is a continuous film medium, a part of the TAB tape may include defective pieces such as bent or discolored leads. Therefore, when processing the TAB tape continuously, a hole is formed as a defective mark on a part of the defective piece found in the inspection before the process or on the end of the tape corresponding to one end of the row to which the defective piece belongs. Is opened, and it is read by a sensor of the processing device to detect a defective piece.

FIG. 6 shows a multi-piece TAB tape in which a plurality of pieces 2 (here, 2a to 2d) are arranged in one row in the width direction of the TAB tape 1. Reference numeral 3 denotes a perforation hole provided in the edge of the tape along the longitudinal direction.

FIG. 7 shows the configuration of each of the pieces 2a to 2d. Each of the pieces 2a to 2d has a device hole 4 provided at the center of the piece area and a device hole 4 as shown in the drawing.
And a wiring pattern 8 including an inner lead 6 and an outer lead 7. Further, a tape punching section 9 is provided on each of the edges on the side orthogonal to the tape advancing direction, and a tape punching section 10 is provided on each of the upstream and downstream edges in the tape advancing direction. Reference numeral 11 denotes a position recognition lead for performing position recognition.
, That is, four in total.

In this multi-piece TAB tape 1, in FIG. 6, since one piece 2a in one row is a defective piece, a hole as a defective mark (defective detection hole) is provided at the end of the tape in that row. 20 shows a case where the shutter 20 is opened.

FIG. 7 shows a case where a hole (defective detection hole) 20 as a defective mark is formed in a part of the defective piece 2a.

FIG. 8 shows an example in which the position recognition lead 11 for position recognition is cut off in the middle and treated as a defective mark in order to indicate that the piece is a defective piece 2a.

[0009]

However, in the conventional method of forming a hole as a defective mark at the end of a TAB tape (FIG. 6), a method of arranging a plurality of pieces in a width direction of the tape and taking a plurality of pieces is used. However, there is a problem in that the pieces 2a to 2d in all of the one row are determined to be defective, and the yield is reduced.

On the other hand, in the method of making a hole in a part of the defective piece 2a (FIG. 7), in the case of a TAB tape of plural pieces,
The tape may warp or break due to a decrease in strength. Also, the number of read sensors required is the same as the number of pieces 2a to 2d for one row. Further, since the defective piece detection by the defect detection hole 20 and the position recognition by the position recognition lead 11 are performed separately, the tact time (process time) increases, which is not preferable.

[0011] As shown in FIG.
There is a method of cutting the tape, however, in the case of a plurality of pieces, there is a problem in that the tape strength is reduced and the tape is warped.

Accordingly, an object of the present invention is to solve the above-mentioned problems, to shorten the takt time of TAB tape processing, and to prevent tape warping and tape strength reduction even in a multi-cavity structure.
Also, without the need for a dedicated defective piece detection sensor, TA
It is an object of the present invention to provide a method capable of detecting a defective piece in a B tape.

[0013]

Means for Solving the Problems In order to achieve the above object, the present invention is configured as follows.

(1) A method for detecting a defective piece in a TAB tape in which a plurality of pieces are arranged in a tape and each piece has a position recognition part for recognizing the position of the piece in an image. In the above, when a defective piece is detected by the defect inspection before processing the TAB tape, an object that prevents recognition is added to the position recognition part of the defective piece, and the defective piece is detected at the time of processing the TAB tape. In order to perform the above, the position recognition part is imaged by an image recognition device, and when the position recognition part can be recognized, the position of the piece is recognized thereby, and it is recognized that there is an object in the position recognition part that hinders the recognition. In this case, it is determined that the piece is a defective piece.

[0015] When detecting a defective piece at the time of processing the TAB tape, the defective piece is detected simultaneously with the position recognition by the image recognition device. As described above, by performing the defective piece detection and the position recognition at the same time in one recognition operation, it is possible to omit the defect detection time for a good piece. Therefore, in the present invention, TA
The recognition device for position recognition provided in the B tape processing device detects a defective piece when there is an object that interferes with normal recognition, thereby shortening the tact time.

[0016] Further, since a hole is not made in the tape for detecting a defective piece, and an object that prevents recognition is added only to the defective piece, it is clarified that the piece is a defective piece. Warpage and a decrease in mechanical strength can be prevented.

When performing position recognition at a plurality of locations,
An object that hinders recognition may be given only to the first position recognition part, but may be given to another place or a plurality of places as needed.

(2) In the invention according to claim 2, the TAB tape has a plurality of pieces arranged in a line in a tape width direction.
Each piece has a plurality of TAB tapes each having a position recognition portion for image recognition of the piece position. The present invention is intended to prevent warpage of the TAB tape and a decrease in tape strength by changing from a conventionally used method of perforating a defective piece to a method of providing an object that hinders recognition, This has a particularly remarkable effect in the case of taking plural pieces.

(3) In the invention according to claim 3, when it is recognized that there is an object which hinders the recognition in the position recognition part, it is determined that the piece is a defective piece, and the object to be processed is advanced to the next piece. Things. It is desirable that the specific means be set on software so that when a defective piece is detected, the processing target is advanced to the next piece.

(4) According to a fourth aspect of the present invention, a paper sheet with an adhesive is used as the object that hinders the recognition. The paper piece with the adhesive may be attached to the position recognition part of the defective piece, which is easy to handle, and the defective piece can be easily marked.

(5) The invention according to claim 5 uses a colored paint as the object that hinders the recognition. The colored paint may be applied to the position recognition part of the defective piece and colored, and the marking on the defective piece can be easily performed.

(6) According to the invention of claim 6, the position recognition portion is specifically exposed to a tape punching portion provided on the downstream side and / or the upstream side in the tape advancing direction of each piece. Lead.

According to this embodiment, the existing lead on the TAB tape can be used as the position recognition lead.
In addition, the position recognition part is at least one on the downstream side and / or the upstream side in the tape advancing direction of each piece.
It may be provided at a location, but it is advantageous to provide the one location downstream of each piece in the tape advancing direction, since it is detected at the first location in the tape feed direction.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. TAB tape 1 shown in Fig. 2
Is a multiple-piece TAB tape having the same configuration as that already described with reference to FIG. 6, in which a plurality of pieces 2 (2a to 2d) are arranged in one row in the tape width direction. Figure 1 shows one of them
Shows the composition of two pieces, device hole 4
And an outer lead hole 5 provided before and after the device hole 4, and a wiring pattern 8 including an inner lead 6 and an outer lead 7. Further, a tape punching section 9 is provided on each of the edges on the side orthogonal to the tape advancing direction, and a tape punching section 10 is provided on each of the upstream and downstream edges in the tape advancing direction. At both ends of each of the tape punching sections 10, two L-shaped position recognition leads 11 are provided as position recognition portions for performing position recognition, that is, a total of four leads.

In this multi-piece TAB tape 1, in FIG. 1, one piece 2a in one row 2a to 2d is a defective piece due to the occurrence of lead bending 12, so that the position recognition lead 11 As an object that hinders recognition, a piece of paper 13 with an adhesive is stuck, and the position recognition lead 11 is covered so that image recognition cannot be performed. FIG. 3 shows a first recognition lead to which a piece of paper has been attached.

As described above, a plurality of pieces 2 are arranged in one row in the tape width direction of the TAB tape 1, and each piece 2
A method of detecting a defective piece in a TAB tape having a position recognition lead 11 as a position recognition portion for image recognition of a piece position is performed as follows.

When the defective piece 2a is detected by the defect inspection before processing the TAB tape, at least one, preferably four of the position recognition leads 11 are provided for the defective piece. A paper piece 13 (FIG. 3) or a colored paint 14 (FIG. 5) with an adhesive is added to the first position recognition lead 11a located on the foremost side in the feeding direction, as an object that prevents recognition by the image recognition device. I do. In the former case, the position recognition lead 11 is covered with a paper sheet 13 so that image recognition cannot be performed. In the latter case, the surface of the position recognition lead 11 is colored with a color that cannot be image-recognized, for example, a black paint 14.

When the TAB tape 1 is processed, the position recognizing portion is imaged by the image recognizing device in order to detect the defective piece 2a, and when the position recognizing lead 11 can be recognized by the image recognizing device, the normal operation is performed. Assuming that the piece 2 is a piece, the position of the piece 2 is recognized to perform positioning. However, when the position recognition lead 11 cannot be recognized, it is determined that the piece is a defective piece, and the processing target is advanced to the next piece 2.

[0029]

EXAMPLE For the purpose of comparison, five TAB tapes each including a 4-piece 250-row piece 2 (FIG. 1) having no defect shown in FIG. 2 were prepared, and 10 pieces were arranged at exactly the same location 2a. The defective lead 12 caused a defect.

(Example 1) The above-mentioned TAB tape 1 was inspected for defects, and a piece of paper 13 with an adhesive was stuck on the first position recognition lead 11a of the defective piece 2a as shown in FIG. . 250 rows (1000 pieces) of adhesive chips were bonded to the TAB tape 1 by a die mounter. At this time, when the first position recognition lead 11a is read by the image recognition device for position recognition, the case where recognition is not possible is set as "detection of defective piece", and the processing target is moved to the next piece 2. Was set by software.

The processing time by the die mounter in Example 1 was 3972 seconds, and the yield was 99.9%.

(Embodiment 2) As shown in FIGS. 4 and 5, a black colored paint 14 for the first position recognition is used in place of the adhesive-attached paper piece 13 used as an object that hinders recognition in the first embodiment. The operation was performed under the same conditions except that the coating was performed on the leads 11a.

The processing time by the die mounter in Example 2 was 3974 seconds, and the yield was 99.9%.

(Comparative Example 1) The above-mentioned TAB tape 1 was inspected for defects, and a defect detection hole 20 having a diameter of 3 mm was punched at the end in the width direction of the row where the defective pieces 2a exist as shown in FIG. Was. 250 rows (1000 pieces) of adhesive chips were bonded to the TAB tape 1 by a die mounter. At this time, the case of hole detection by the photoelectric sensor was set to "detection of defective piece", and the setting was made by software to move the processing target to the next row.

The processing time by the die mounter in Comparative Example 1 was 3906 seconds, and the yield was 96.4%. Thus, the yield was lower than in Examples 1 and 2.

(Comparative Example 2) The above-mentioned defect inspection of the TAB tape 1 was conducted, and a defect detection hole 20 having a diameter of 3 mm was punched at the center of the defective piece 2a as shown in FIG. A chip with adhesive is attached to this TAB tape by a die mounter for 250 minutes.
Rows (1000 pieces) were bonded. At this time, the case of hole detection by the photoelectric sensor was set as "detection of defective piece", and the setting was made by software to move the processing target to the next piece.

The processing time by the die mounter in Comparative Example 2 was 4160 seconds, and the yield was 99.9%. In Comparative Example 2, the yield is the same as in Examples 1 and 2, but the processing time is longer than 180 seconds and the efficiency is poor.

(Comparative Example 3) The above-described TAB tape 1 was inspected for defects, and the first position recognition lead 11a of the defective piece was cut as shown in FIG. The TAB tape 1 is provided with 250 rows (100
(0 piece). At this time, when the first position recognition lead 11a is read by the image recognition device for position recognition, the first position recognition lead 11a cannot be recognized.
Was set, and the software was set to move the processing target to the next piece.

In Comparative Example 3, warping occurred in a row where the pieces from which the position recognition leads had been pulled out, and the mounting position shifted in the neighboring pieces, so that the yield was 98.7%. The processing time by the die mounter was 3973 seconds. Thus, in Comparative Example 3, the TAB tape was warped, and the yield was reduced.

As described above, according to the present invention, it is clear that the processing time can be shortened without lowering the yield, and it can be said that it is extremely useful as a recognition method at the time of TAB tape assembly processing.

Although the preferred embodiment of the present invention has been described above, the present invention relates to a recognition method. If the apparatus performs recognition by image processing, for example, a bonding method other than the die mounter shown in the embodiment may be used. It can also be applied to devices and the like. Further, the material of the adhesive-attached paper piece may be any as long as it prevents recognition.
As long as the AB tape can be wound on a reel, plastic, metal foil, or the like can be used. Any colorant other than black used in the embodiment may be used as long as it prevents normal recognition.

In this embodiment, the case where the position cannot be recognized is detected as a defect. However, a system for recognizing the presence of a paper chip or a colored paint to be applied on software, that is, a normal recognition unit on software. It may be a method of judging whether it is a certain shape or a certain shape provided artificially.

In the present invention, if the color or shape of an object that hinders recognition is changed for each type of defect, the type of defect becomes clear, which is useful for failure analysis and the like.

[0044]

As described above, according to the present invention, the following excellent effects can be obtained.

(1) According to the first aspect of the present invention, T
When detecting a defective piece at the time of processing the AB tape, the defective piece is detected simultaneously with the position recognition by the image recognition device. Since the defective piece detection and the position recognition are performed simultaneously in one recognition operation, the defect detection time for a good piece can be omitted. Therefore, according to the present invention, the processing time can be reduced without lowering the yield.

Further, since only an object which hinders recognition is added only to a defective piece, and a hole is not made in the defective piece or the tape, the warpage and mechanical strength of the tape after the defective marking can be obtained even in a multi-piece structure. Drop can be prevented. In addition, the marking itself can be easily performed.

(2) In the invention according to claim 2, the TAB tape has a plurality of pieces arranged in a row in a tape width direction.
Each piece has a plurality of TAB tapes each having a position recognition portion for image recognition of the piece position. The effect of preventing the warpage of the TAB tape and a decrease in the strength of the tape is as described above.
This is particularly noticeable in the case of tape.

(3) In the invention according to claim 3, when it is recognized that there is an object that hinders the recognition in the position recognition part, it is determined that the object is a defective piece, and the object to be processed is advanced to the next piece. Therefore, the processing time can be reduced.

(4) The invention according to claim 4 uses a piece of paper with an adhesive as an object that obstructs the above recognition, and may be simply applied so as to cover the position recognition portion of the defective piece, and is easy to handle. In addition, marking on defective pieces can be easily performed.

(5) The invention of claim 5 uses a colored paint as the object that hinders the recognition, and it is sufficient to apply the coloring to the position recognition part of the defective piece, and to easily mark the defective piece. be able to.

(6) According to a sixth aspect of the present invention, the position recognizing portion is a position recognizing lead that is exposed at a tape punching portion provided on the downstream side and / or the upstream side in the tape advancing direction of each piece. T as a position recognition lead
Existing AB tapes can be used.

[Brief description of the drawings]

FIG. 1 is an enlarged view illustrating a defective piece in a TAB tape according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a TAB tape according to a first embodiment of the present invention.

FIG. 3 is a view showing a position recognition portion in the TAB tape of FIG. 2;

FIG. 4 is an enlarged view illustrating a defective piece in a TAB tape according to a second embodiment of the present invention.

FIG. 5 is a diagram showing an example in which colored paint is applied as a defective mark to a lead for recognizing the position of a piece in the TAB tape of FIG. 4;

FIG. 6 is a diagram showing an example in which a defect detection hole is provided in a conventional TAB tape.

FIG. 7 is a diagram showing an example in which a defective detection hole is provided in a defective piece as an example of a defective mark in a conventional TAB tape.

FIG. 8 is a diagram showing a form in which a position recognition lead is cut as an example of a defective mark in a conventional TAB tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TAB tape 2, 2a-2d piece 2a Defective piece 3 Perforation hole 4 Device hole 5 Outer lead hole 6 Inner lead 7 Outer lead 8 Wiring pattern 9, 10 Tape punching part 11 Position recognition lead 11a First position recognition Lead 12 Lead bending 13 Sheet of paper with adhesive 14 Colored paint 20 Failure detection hole

Claims (6)

[Claims] 1. A method for detecting a defective piece in a TAB tape, wherein a plurality of pieces are arranged in a tape, and each piece has a position recognition portion for recognizing the position of the piece, the defect inspection before processing the TAB tape. When a defective piece is detected, an object that prevents recognition is added to the position-recognition part of the defective piece, and the position-recognition part is image-recognized to detect the defective piece when processing the TAB tape. An image is taken by the device, and when the above-mentioned position recognition part can be recognized, the position of the piece is recognized thereby, and when it is recognized that there is an object that hinders the above-mentioned recognition in the above-mentioned position recognition part, it is determined to be a defective piece. A method for detecting a defective piece in a TAB tape. 2. The TAB tape according to claim 1, wherein a plurality of pieces are arranged in a row in a tape width direction, and each piece is a TAB tape having a position recognition part for recognizing a piece position in an image. The method for detecting a defective piece in a TAB tape according to claim 1. 3. The method according to claim 1, wherein when it is recognized that there is an object that hinders the recognition in the position recognition part, it is determined that the piece is a defective piece, and the processing target is advanced to the next piece. Or the method for detecting a defective piece in a TAB tape according to item 2. 4. The method for detecting a defective piece in a TAB tape according to claim 1, wherein a paper piece with an adhesive is used as the object that hinders the recognition. 5. The TAB according to claim 1, wherein a colored paint is used as the object that hinders the recognition.
How to detect bad pieces in tape. 6. The position recognizing lead according to claim 1, wherein the position recognizing portion is a position recognizing lead exposed at a tape punching portion provided on a downstream side and / or an upstream side of each piece in the tape advancing direction. The method for detecting a defective piece in a TAB tape according to 2, 3, 4, or 5.