JPH11162828A - Projection exposure apparatus and projection exposure method - Google Patents

Abstract

(57) Abstract: Provided are a projection exposure apparatus and a projection exposure method capable of improving an imaging characteristic by suppressing vibration generated by driving a mask stage and a photosensitive substrate stage. A step-and-scan projection exposure apparatus in which a reticle stage (1) and a wafer stage (2) are arranged on the same side with respect to a projection optical system (3) and have different positions in the Z-axis direction. Both stages 1 and 2 move synchronously between reticle M and wafer W at a speed ratio corresponding to
2 for driving each of the two stages,
And a vibration isolator 9 for attenuating vibrations caused by the drive of the second drive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a projection exposure apparatus used in a photolithography process for manufacturing various micro devices such as a semiconductor device, an image pickup device, a liquid crystal display device and a thin film magnetic head, and more particularly to a mask and a photosensitive substrate. The present invention relates to an anti-vibration structure suitable for a scanning type exposure apparatus for transferring a mask pattern onto a photosensitive substrate by moving the mask and the photosensitive substrate in synchronization with each other, and for preventing vibration accompanying movement of the stage of the mask and the photosensitive substrate.

[0002]

2. Description of the Related Art In a photolithography process of a semiconductor device, a pattern of a mask or a reticle is transferred onto a wafer or a glass plate (hereinafter also referred to as a photosensitive substrate) coated with a photoresist. As a projection exposure apparatus, a step-and-repeat type exposure apparatus (hereinafter, also referred to as a stepper) has been widely used. This step-and-repeat type exposure apparatus exposes a reticle pattern by projecting the pattern of the reticle onto each shot area of the wafer at once. When the exposure of one shot area is completed, the wafer is moved to the next shot area. This is a method in which an area is exposed and this is sequentially repeated.

Further, in order to enlarge the exposure range of the reticle pattern, the exposure light from the illumination system is limited to a slit shape (rectangular shape), and a part of the reticle pattern is reduced and projected onto a wafer using the slit light. In such a state, a step-and-scan type exposure apparatus for synchronously scanning a reticle and a wafer with respect to a projection optical system has also been developed. This step-and-scan exposure apparatus (hereinafter, also referred to as a scanning stepper) has the advantages of an aligner transfer method for transferring the entire pattern of the reticle onto the entire surface of the wafer at a single magnification by one scanning exposure, and the above-described stepper. It has the advantages of the transfer method.

In the former exposure apparatus of the batch exposure system such as a stepper, when the reticle pattern is transferred to each shot area of the photosensitive substrate, it is necessary to keep the reticle and the photosensitive substrate almost completely stationary. The base of the apparatus main body is installed on the floor via a vibration isolator so that vibration from the floor is not transmitted to the exposure apparatus main body as it is.

In the latter step-and-scan type exposure apparatus, it is necessary to move the reticle and the photosensitive substrate stably at a constant speed ratio during the exposure. It is installed on the floor via.

[0006]

However, in a projection exposure apparatus using a projection optical system in which the optical axis from the reticle to the photosensitive substrate is formed linearly, a reticle stage for holding the reticle generally has a projection. The substrate stage, which is arranged above the optical system and holds the photosensitive substrate, is arranged below the projection optical system. The reticle stage and the substrate stage are vertically separated from each other by 80 to 150 cm. In the apparatus, there is a problem that the entire apparatus is tilted due to the synchronous movement of the reticle stage and the substrate stage, and the columns and bases constituting the apparatus main body vibrate.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and a projection exposure apparatus capable of improving image forming characteristics by suppressing vibration generated by driving a reticle stage and a photosensitive substrate stage. And a projection exposure method.

[0008]

According to a first aspect of the present invention, there is provided a projection exposure apparatus for transferring a mask pattern onto a photosensitive substrate.
A projection optical system that projects an image of the pattern of the mask onto the photosensitive substrate, a first stage that holds the mask,
A second stage disposed on the first stage side with respect to the projection optical system and holding the photosensitive substrate such that a position in a first direction along an optical axis of the projection optical system is different from the mask; The first mask is moved so that the mask and the photosensitive substrate are synchronously moved at a speed ratio according to a magnification of a projection optical system.
A projection exposure apparatus, comprising: a driving device for driving the first and second stages, respectively; and a vibration isolator for attenuating vibration generated by driving the first and second stages.

In such a step-and-scan type exposure apparatus, a first stage for holding a mask and a second stage for holding a photosensitive substrate are synchronously moved by a driving device at a speed ratio corresponding to the magnification of the projection optical system. While transferring the mask pattern. If vibration occurs due to the driving of the first and second stages during this synchronous movement, it leads to deterioration of the imaging characteristics due to optical axis deviation and the like. However, in the projection exposure apparatus of the present invention, this is caused by driving of the first and second stages. Since the vibration isolating device for attenuating the vibration is provided, the vibration can be attenuated, and the deterioration of the imaging characteristics can be prevented.

Further, in the projection exposure apparatus of the present invention, the first stage for holding the mask and the second stage for holding the photosensitive substrate are arranged on the same side with respect to the projection optical system. Is lower in the vertical direction than an exposure apparatus using a conventional projection optical system. Thereby, the stability of the apparatus main body is enhanced, and the vibration itself generated by driving the first and second stages can be suppressed.

In addition, by suppressing the vibration, alignment (overlap) between the mask and the photosensitive substrate during scanning exposure is performed.
Accuracy can be improved and acceleration of the mask stage and substrate stage before scanning exposure can be increased,
The approaching (pre-scan) distance and time can be reduced, and the throughput can be improved. Note that the distance and time required for deceleration of each stage after scanning exposure can be similarly reduced.

Further, according to the projection exposure apparatus of the present invention, the first
Since the second stage and the second stage are arranged at different positions in the first direction, the movable area of the transfer device for loading / unloading the mask with respect to the first stage and the loading / unloading of the photosensitive substrate with respect to the second stage. And the movable area of the transfer device that performs the operation can be set to overlap in the first direction without interference between the transfer devices. Thus, the loading and unloading operations of the mask and the photosensitive substrate can be simultaneously performed with a reasonable operation, so that the throughput of the exposure process can be increased.

In the above invention, although not particularly limited,
The mask and the photosensitive substrate are respectively arranged in a second direction orthogonal to the first direction (a direction orthogonal to the pattern surface of the mask).
Moving in a direction (a direction parallel to the pattern surface of the mask), and the vibration isolator is orthogonal to the second direction due to a difference in the position of the mask and the photosensitive substrate in the first direction during the synchronous movement. To reduce the force generated in the direction of movement.

When the mask and the photosensitive substrate are moved along the second direction, a force (for example, a difference in height) between the mask and the photosensitive substrate in the first direction causes a force in a direction orthogonal to the second direction. Is generated, and the entire apparatus is twisted. In the projection exposure apparatus of the present invention, the force that leads to such a twist can be reduced by the vibration isolator.

Although not particularly limited, more specifically, the vibration isolator substantially cancels the reaction force generated in the second direction at the time of the synchronous movement, so that a difference in position between the mask and the photosensitive substrate is obtained. The generated force orthogonal to the second direction can be reduced.

In the present invention, the installation position and specific configuration of the anti-vibration device are not particularly limited. For example, the anti-vibration device includes an apparatus main body including the projection optical system and the first and second stages. It is preferable to have an actuator disposed between the actuator and the installation surface. By providing the anti-vibration device between the apparatus main body and the installation surface, vibrations generated in the projection optical system and the first and second stages can be removed to the installation surface, that is, outside the projection optical system. It is possible to improve the imaging characteristics.

When the anti-vibration device is provided between the apparatus main body and the installation surface, there is no particular limitation, but a frame provided separately from the apparatus main body on the installation surface and to which the actuator is fixed is provided. Further, it may be provided. Since the frame is substantially outside the system of the projection optical system like the installation surface, vibrations generated in the projection optical system and the first and second stages can be removed outside the system, and the actuator can be easily installed. And various actuators can be applied.

In the present invention, although not particularly limited, the actuator is preferably any one of a linear motor actuator, a voice coil actuator, a pneumatic damper, and a mechanical damper, or a combination thereof. Since any of the actuators can remove the vibration of the apparatus main body from the installation surface in a mechanically non-contact state, there is no possibility that the operation of the actuator itself may cause the apparatus main body to vibrate.

In the present invention, although not particularly limited, a vibration detecting device for detecting a vibration of at least one of the first and second stages or a physical quantity equivalent thereto, and the vibration isolating device based on an output of the vibration detecting device. It is preferable that the apparatus further includes a control device for controlling the driving of the device.

Since the amount of vibration varies depending on the operation of the first and second stages, the amount of vibration generated by the operation of the first and second stages is detected by a vibration detecting device, and the control device is controlled based on the detected output. By controlling the anti-vibration device, an appropriate anti-vibration action according to the magnitude of the vibration amount can be exhibited.

(2) In the above invention, although not particularly limited, the projection optical system reduces and projects a partially inverted image of the pattern of the mask onto the photosensitive substrate, and the mask and the photosensitive substrate are connected to the first substrate. It is moved in the opposite direction along a second direction orthogonal to the direction.

When the mask and the photosensitive substrate are moved in the same direction in the second direction, the respective reaction forces generated in the main body of the apparatus are also generated in the same direction with respect to the direction orthogonal to the second direction. That is, the vibration generated in the apparatus main body acts in a direction that is further promoted. However, by moving the mask and the photosensitive substrate in the opposite direction along the second direction, each reaction force generated in the apparatus main body is generated in the opposite direction to the direction orthogonal to the second direction. At least a part of the vibration is offset, and at least a part of the vibration generated in the apparatus main body is self-damped. Incidentally, even if the mask and the photosensitive substrate are moved in the opposite direction along the second direction, the projection optical system projects a partially inverted image of the pattern of the mask onto the photosensitive substrate. Also, the pattern image is accurately transferred to the photosensitive substrate.

Although not particularly limited, when the mask and the photosensitive substrate, that is, the first and second stages are moved in opposite directions along the second direction, the mass ratio between the first stage and the second stage is changed. It is preferable that the magnification is approximately equal to the magnification of the projection optical system.

The mass of the first stage is Mr, its moving speed is Vr, the mass of the second stage is Mw, and its moving speed is Vr.
When the first stage and the second stage are moved in opposite directions along the second direction, the reaction force Fr generated by the movement of the first stage becomes Fr = Mr · Vr from the equation of motion.
Similarly, the reaction force Fw generated by the movement of the second stage is Fw = Mw · Vw. Therefore, the ratio of the two reaction forces Fr / Fw = (Mr / Mw) · (Vr / V
w), but the speed ratio Vr / V of the first and second stages
Since w is set to the reciprocal of the magnification of the projection optical system, if the mass ratio Mr / Mw of the first and second stages is made substantially equal to the magnification of the projection optical system, the reaction force by the first and second stages is obtained. The scalar value of the ratio Fr / Fw is substantially 1. As a result, the reaction force generated due to the movement of the first and second stages is almost canceled by the apparatus main body, and self-damps.

Even if the mass ratio does not coincide with the magnification, by adjusting the acceleration / deceleration of both stages before and after the scanning exposure, the two reaction forces are almost canceled out similarly.

In the present invention, although not particularly limited, the projection optical system can be configured as an optical system including a concave mirror and a plurality of mirrors. Further, the projection optical system can be configured as an optical system including a concave mirror, a beam splitter, and at least one mirror. By employing a so-called catadioptric projection optical system (catadioptic system), the first stage and the second stage can be arranged on the same side of the projection optical system.

(3) In the present invention, although not particularly limited, the vibration isolator may be a first actuator that applies a force in the first direction to a base on which the first and second stages are disposed. It is preferable to include

As described above, the vibration isolator according to the present invention attenuates the vibration generated by driving the first and second stages. Here, since the vibration caused by the driving of the first and second stages also acts in the first direction, the first actuator acts on the base in the first direction by applying a force to the base in the first direction. Vibration can be damped.

In this case, although not particularly limited, the apparatus further comprises a gantry for supporting the projection optical system, and a vibration isolation mechanism on which the base and the gantry are mounted, and the first actuator is mounted on the vibration isolation mechanism. It can be configured to be incorporated.

Further, the projection exposure apparatus of the present invention is characterized in that the first
A vibration isolation mechanism for mounting a base on which the second stage is disposed, and a frame provided on an installation surface of the vibration isolation mechanism, wherein the vibration isolation device is provided on the frame; It may be configured to include a second actuator that applies a force along the second direction to at least one of the stage, the second stage, and the base.

Further, the projection exposure apparatus of the present invention further comprises a gantry for supporting the projection optical system, wherein the first and the second
A base on which a stage is arranged is suspended from the gantry, and the vibration isolator includes the first stage, the second stage,
It may be configured to include a second actuator that applies a force in the second direction to at least one of the base and the gantry. The construction relationship between the gantry supporting the projection optical system and the base on which the first and second stages are arranged may be such that the base is suspended on the gantry,
A base may be provided on the base as described above.

In this case, although not particularly limited, the apparatus further includes a vibration isolation mechanism on which the gantry is mounted, and a frame provided on a mounting surface of the vibration isolation mechanism, and the second actuator is provided on the frame. Is preferred. Since the frame is substantially outside the system of the first and second stages similarly to the installation surface, vibrations generated in the first and second stages can be removed out of such a system, and the installation of the second actuator can be eliminated. It becomes easy and various actuators can be applied.

In the present invention, the illumination optical system is not particularly limited, but is further provided with an illumination optical system disposed on the opposite side of the projection optical system with respect to the base and for irradiating a part of the mask with illumination light. Is preferred.

(4) To achieve the above object, according to a second aspect of the present invention, in a projection exposure apparatus for transferring a pattern of a mask onto a photosensitive substrate, an image of the pattern of the mask is placed on the photosensitive substrate. A projection optical system for projecting thereon, a first stage for holding the mask, and a position in a first direction along an optical axis of the projection optical system, which is disposed on the first stage side with respect to the projection optical system. A second stage for holding the photosensitive substrate differently from the mask, a vibration isolator disposed between an apparatus main body including the projection optical system, the first and second stages, and an installation surface thereof; And a projection exposure apparatus provided with:

The present invention is not limited to the above-described step-and-scan exposure apparatus, but can be applied to, for example, a step-and-repeat exposure apparatus. That is, when the pattern of the mask is collectively exposed to one shot area of the photosensitive substrate, the second stage is moved to perform exposure of the next shot area.
Although vibration occurs in the apparatus main body due to the movement of the stage, since the vibration isolator is disposed between the apparatus main body and its installation surface, it is possible to remove the vibration generated in the apparatus main body to the installation surface. it can.

(5) To achieve the above object, according to a third aspect of the present invention, there is provided a projection exposure method for transferring a mask pattern onto a photosensitive substrate via a projection optical system.
The mask is arranged on an object plane of the projection optical system, and is set on the object plane side with respect to the projection optical system, and a position in a first direction along an optical axis of the projection optical system is different from the object plane. Disposing the photosensitive substrate on an image plane, and moving the mask and the photosensitive substrate along a second direction orthogonal to the first direction at a speed ratio according to a magnification of the projection optical system, Attenuating vibrations caused by the movement of the mask and the photosensitive substrate.

In the so-called step-and-scan exposure method, the mask pattern is transferred while the mask and the photosensitive substrate are synchronously moved at a speed ratio corresponding to the magnification of the projection optical system. When vibration occurs due to the movement of the mask and the photosensitive substrate during the synchronous movement, the imaging characteristics are degraded due to optical axis shift and the like. However, in the projection exposure method of the present invention, the vibration caused by the movement of the mask and the photosensitive substrate is attenuated. With the steps, such vibrations can be attenuated, and deterioration of the imaging characteristics can be prevented.

In the projection exposure method of the present invention, since the mask and the photosensitive substrate are set on the same side with respect to the projection optical system, the main body of the exposure apparatus to which the projection exposure method of the present invention is applied. Is vertically lower than that of an exposure apparatus using a conventional linear projection optical system. Thereby, the stability of the apparatus main body is enhanced, so that the vibration itself caused by the movement of the mask and the photosensitive substrate can be suppressed.

Further, by suppressing the vibration, alignment (overlap) between the mask and the photosensitive substrate during the scanning exposure is performed.
Accuracy can be improved and acceleration of the mask stage and substrate stage before scanning exposure can be increased,
The approaching (pre-scan) distance and time can be reduced, and the throughput can be improved. Note that the distance and time required for deceleration of each stage after scanning exposure can be similarly reduced.

Further, in the projection exposure method of the present invention, since the mask and the photosensitive substrate are arranged at different positions in the first direction, the movable area of the transport device for loading and unloading the mask and the photosensitive substrate The movable area of the transfer device for carrying in and out can be set so as to overlap in the first direction without interference between the two transfer devices. Thus, the loading and unloading operations of the mask and the photosensitive substrate can be simultaneously performed with a reasonable operation, so that the throughput of the exposure process can be increased.

[0041]

Embodiments of the present invention will be described below with reference to the drawings. First Embodiment FIG. 1 is a sectional view showing an embodiment of a projection exposure apparatus of the present invention.
FIG. 2 is a cross-sectional view showing an embodiment of the actuator according to the present invention, FIG. 3 is a cross-sectional view showing another embodiment of the actuator according to the present invention, and FIG.

The projection exposure apparatus of the present embodiment is a so-called step-and-scan type projection exposure apparatus, in which four anti-vibration pads 14 (two in FIG. 1) are placed on a catch pallet 5 as a substantial installation surface. The base 6 is installed via only the illustrated). The anti-vibration pads 14 are respectively arranged near the four corners of the base 6 and are not limited.
For example, a pneumatic damper or a mechanical damper having a compression coil spring in a damping liquid is used. When a pneumatic damper is used, the height of the vibration isolating pad 14 can be adjusted by air pressure, so that it can also be used as a vertical movement mechanism in addition to the vibration isolating function.

A reticle stage (first stage) 1 for holding a reticle M and a wafer stage (second stage) 2 for holding a wafer W as a photosensitive substrate are set on the base 6. The projection optical system 3 is provided via a column 7 fixed above.

The wafer stage 2 is arranged on the reticle stage 1 side with respect to the projection optical system 3, and in FIG. 1, a pedestal 6A is provided on a base 6, and the reticle stage 1 is arranged on the pedestal 6A. Have been. Therefore, the reticle M and the wafer W can move two-dimensionally in planes where the positions along the optical axes AX1 and AX3 of the projection optical system 3 (vertical direction in FIG. 1) are different from each other.

Although not shown in detail, the reticle stage 1 is mounted on a guide extending on the base 6 in the Y direction via an air bearing, and is fixed on the base 6 in the Y direction by a linear motor. It can move (scan) at speed,
Further, a mechanism is provided that can adjust the position of the reticle M in the X direction, the Y direction, and the rotation direction (θ direction).

This means that the position of the reticle stage 1 in the X and Y directions is always about 0.001 μm by a movable mirror attached to the reticle stage 1 and a laser interferometer fixed to a column (not shown). By measuring the rotation angle of the reticle stage 1 and sending these measured values to the control unit of the stage driving device 10 to control the linear motor on the base 6 according to the measured values, The constant-speed movement and positioning of the mask stage 1 are executed.

On the other hand, the wafer W to which the reticle pattern is transferred is held on a sample stage via a wafer holder, though not shown in detail, and the sample stage is mounted on the wafer stage 2. The wafer stage 2 is mounted on a guide on a base 6 via an air bearing. The wafer stage 2 is configured to be capable of scanning and stepping at a constant speed in the -Y direction by a linear motor on the base 6 and stepping in the X direction. Further, in the wafer stage 2, a Z stage mechanism for moving the sample table in a predetermined range in the Z direction and a tilt mechanism (leveling mechanism) for adjusting the inclination angle of the sample table are incorporated.

These are a moving mirror fixed to the sample stage,
The position of the sample stage in the X and Y directions is always 0.001 μm by a laser interferometer fixed to a column (not shown).
In addition to measuring with a resolution of the order, the rotation angle of the sample stage is also measured, and these measured values are sent to the control unit of the stage driving device 10 to control the linear motor for driving the wafer stage 2 according to the measured values. Thereby, constant-speed movement, stepping, positioning, and the like of the wafer stage 2 are performed.

Incidentally, at the time of scanning exposure, an exposure start command is sent from the main controller (not shown) to the stage driving device 10, and in response, the stage driving device 10 controls the reticle M via the reticle stage 1. Scanning movement is performed at the speed Vm in the Y direction, and in synchronization with this,
The wafer W is moved in the −Y direction through the wafer stage 2 at a speed V.
Scan by w. At this time, when the projection magnification from the reticle M to the wafer W is β, that is, the projection magnification of the projection optical system 3 is β, the scanning speed Vw of the wafer W is β · V
m.

In the projection exposure apparatus of the present invention, the reticle M side is moved in the Y direction and the wafer W side is moved to -Y
Reticle M and wafer W
May be moved in the same Y direction or -Y direction.

In the projection exposure apparatus of this embodiment, the positions of the reticle stage 1 and the wafer stage 2 in the Z direction, that is, the heights are set to different heights. As shown in the plan view of FIG. 4, the projection exposure apparatus includes a transport device 21 for loading and unloading the reticle M,
A transfer device 22 for loading and unloading the wafer W is provided on the same side, and the reticle cassette MC and the reticle stage 1 can be moved by using a normal transfer arm or the like.
A loading / unloading operation is performed between the wafer cassette WC and the wafer stage 2. In this case, if the reticle stage 1 and the wafer stage 2 are set at the same height or at substantially the same height, the transfer arms of the two devices 21 and 22 may interfere with each other. The movable areas R1 and R2 of the two transfer arms are significantly reduced.

Therefore, if the height positions of the reticle stage 1 and the wafer stage 2 are changed, even if the movable regions R1 and R2 of both transfer arms are large enough to overlap each other, the two arms may interfere with each other. Disappears. This allows
Both the transfer devices 21 and 22 can operate without difficulty, and the loading and unloading operations of the reticle M and the wafer W can be performed simultaneously, and as a result, the throughput of the exposure process can be increased.

In this embodiment, in particular, the reticle stage 1
And the mass ratio of the wafer stage 2 to the magnification of the projection optical system 3. For example, if the magnification of the projection optical system 3 is 1/4, the mass of the reticle stage / the mass of the wafer stage ≒ 1/4.

This is for the following reason. That is, in the projection exposure apparatus of the present embodiment, the reticle stage 1 and the wafer stage 2 are moved in opposite directions along the ± Y direction (second direction).
The moving speed is Vr, the mass of the wafer stage 2 is Mw,
Assuming that the moving speed is Vw, the reaction force Fr generated by the movement (scan movement) of the reticle stage 1 is given by

## EQU1 ## Similarly, the reaction force Fw generated by the movement (scan movement) of the wafer stage 2 is Fr = Mr · Vr.

## EQU2 ## Fw = Mw.Vw. Therefore, the ratio of both reaction forces is

## EQU3 ## Fr / Fw = (Mr / Mw). (Vr / Vw) where the speed ratio Vr / Vw of the reticle stage 1 and the wafer stage 2 is set to the reciprocal of the magnification of the projection optical system 3. Therefore, if the mass ratio Mr / Mw of the reticle stage 1 and the wafer stage 2 is made substantially equal to the magnification of the projection optical system 3, the scalar value of the reaction force ratio Fr / Fw of these stages 1 and 2 becomes approximately 1. Becomes Therefore, the reaction force generated due to the movement of the reticle stage 1 and the wafer stage 2 is almost canceled in the apparatus main body, and self-damps.

The illumination optical system 4 is provided from below the catch pallet 5 through the base 6. This is because the illumination optical system 4 does not need to be arranged in a clean room, and if an unnecessary device space is secured in the clean room, the facility cost for constructing the clean room is increased. At least, the light source of the illumination optical system 4 is arranged below the catch pallet 5, that is, under the floor outside the clean room. For this reason, the entire illumination optical system 4 may be arranged under the floor outside the clean room. However, in the present invention, the arrangement structure of the illumination optical system 4 is not limited at all, and the entire illumination optical system 4 may be provided on the catch pallet 5.

The illumination optical system 4 is arranged at the lower part of the apparatus opposite to the projection optical system 3 with respect to the reticle M, and scans the rectangular pattern area of the reticle M in the scanning direction (-Y direction) during scanning exposure. Irradiation light having an intensity distribution extending in a slit shape (rectangular shape) in a direction (± X direction) orthogonal to the above. The irradiation area on the reticle M of the slit-shaped illumination light linear in the ± X direction is located at the center of the circular visual field on the object plane perpendicular to the horizontal optical axis of the projection optical system 3 and has a predetermined reduction magnification. Through the β (for example, １ ／) projection optical system 3, an image of a part of the pattern of the reticle M in the irradiation area is projected onto the wafer W with a resolution of, for example, 0.35 μm or less. As the projection optical system 3, one that projects an inverted image of a pattern (for example, a circuit pattern) formed on the pattern surface of the reticle M onto the wafer W is used.

The projection optical system 3 according to the present embodiment is composed of four mechanical parts of a first objective part A, an optical axis bending part B, an optical axis deflection part C, and a second objective part D. A concave mirror 33 is disposed at the optical axis bending portion B.

The first objective section A provided immediately above the reticle M has a lens group 31 fixed inside a lens barrel. Further, on this lens group 31, a lens group 3 of the optical axis bending section B is sandwiched by a small mirror of an optical axis deflection section C described later.
2 and the concave mirror 33 described above are provided. The first objective section A and the optical axis bending section B are coaxial, and the optical axis AX1 is perpendicular to the pattern surface of the reticle M.

The optical axis deflecting section C is provided with a small mirror 34 having a reflecting surface inclined at approximately 45 ° in the −Y direction with respect to the optical axis AX1 at a position decentered in the −Y direction from the optical axis AX1. ing. A lens group 35 and a beam splitter 36 are arranged in this order from the small mirror 34 in the −Y direction. The optical axis AX2 of the optical axis deflector C is
The optical axis A is orthogonal to the optical axis AX1, and the reflection surface of the beam splitter 36 is orthogonal to the reflection surface of the small mirror 34.
It is inclined at approximately 45 ° with respect to X2.

The optical axis AX2 is set to the beam splitter 36.
A lens group 37 that constitutes the second objective section D is provided in the direction of the bending, and the bottom surface of the lens group 37 faces the surface of the wafer W. The optical axis A of the second objective section D
X3 is the optical axis AX1 of the first objective section A and the optical axis bending section B.
, And orthogonal to the optical axis AX2 of the optical axis deflecting unit C.

In this case, the slit-shaped illumination area on the reticle M by the illumination light is set at a position decentered in the + Y direction from the optical axis AX1, and the illumination light passing through the illumination area (hereinafter also referred to as an image forming light flux). ) Enters the optical axis bending portion B via the lens group 31 of the first objective portion A. Optical axis bending part B
Is incident on the concave mirror 33 through the lens group 32.
The imaging light flux reflected and condensed by the concave mirror 33 passes through the lens group 32 again, and is deflected in the −Y direction by the small mirror 34 of the optical axis deflecting unit C.

In the optical axis deflecting unit C, the image forming light beam reflected by the small mirror 34 passes through a lens group 35 and enters a beam splitter 36. With the beam splitter 36-
The imaging light beam deflected in the Z direction is directed to the second objective section D,
In the second objective section D, a reduced inverted image of the pattern of the illumination area on the reticle M is formed in the exposure area on the wafer W by passing through the lens group 37. The projection optical system 3 in FIG. 1 is a catadioptric system, and forms a reduced inverted image on the object plane side of the projection optical system 3.

In particular, in the projection exposure apparatus of this embodiment, the catch pallet 5 is provided with the frames 8, 8 and these frames 8A, 8B and the reticle stage 1
Actuators (second actuators) 9A and 9B are provided between the wafer stage 2 and the wafer stage 2, respectively.

The details of the actuators 9A and 9B are shown in FIG.
A is representatively shown of an actuator 9A provided between the actuator 9A. ), The stator 91 fixed to the frame 8A
And a so-called voice coil actuator comprising a mover 92 fixed to the wafer stage 2.
In response to a command signal from the control device 11, the vibration generated in the ± Y direction of the wafer stage 2 is absorbed. As shown in FIG. 2, the stator 91 of the actuator 9 </ b> A
1 is formed of a magnetized body having an S-pole cylindrical shaft 912 formed therearound. The mover 92 includes an inner cylinder 921 loosely fitted on the shaft 911 of the stator 91 with a gap, a coil 923 wound around the outer periphery of the inner cylinder, and an outer cylinder 922 covering the coil 923. By adjusting the current flowing through the coil 923 by the control device 11, a force is generated between the stator 91 and the mover 92 in a direction parallel to the axis 911 (± Y direction in a projection exposure apparatus). Note that the configuration of the actuator 9B is the same as that of the actuator 9A, and a description thereof will be omitted.

The actuators 9A and 9B according to the present invention
Is not limited to the voice coil actuator shown in FIG. 2, and for example, an actuator 9C shown in FIG. 3 can also be used. Another example of the actuator shown in the figure includes a stator 91 fixed to the frame 8A and a mover 92 fixed to the wafer stage 2, and the stator 91 is an arm member 913 fixed to the frame 8A. Are provided with a magnetic material 914. On the other hand, the armature 924 is fixed to the arm 924 fixed to the wafer stage 2 so as to sandwich the magnetic body 914 therebetween.
25 are provided on the outer periphery of the inner cylinder 925, respectively.
26 is wound. Also in this case, by adjusting the current flowing through each coil 926 of the mover 92 by the control device 11, the balance of the attraction force between the stator 91 and the mover 92 is changed, and the direction shown in FIG. A force is generated in the ± Y direction in the device.

The actuators 9A and 9B according to the present invention
In addition to the embodiments shown in FIGS. 2 and 3, a linear motor actuator, a pneumatic damper, a mechanical damper, and the like can be used. Alternatively, these actuators can be used in combination in series or in parallel. Since the vibrations of the stages 1 and 2 can be removed to the frames 8A and 8B in a state where they are not in mechanical contact with each other, the actuators 9A and 9B themselves include the actuators 9A and 9C shown in FIGS. Is excellent in that there is no possibility that vibrations will be applied to the stages 1 and 2 by the above operation.

In the projection exposure apparatus of the present embodiment, when the vibrations generated on the reticle stage 1 and the wafer stage 2 are absorbed by using the actuators 9A and 9B, the vibrations generated on the reticle stage 1 and the wafer stage 2 are detected. Sensor (vibration detection device) 1 for
2 and 13 are provided on the respective stages 1 and 2, and the output from the acceleration sensor is sent to the control device 11. It should be noted that the vibration detecting device for detecting the vibration generated on the reticle stage 1 and the wafer stage 2 is not limited to the acceleration sensor.

Next, the operation will be described. First, the wafer stage 2 is driven to position the first shot area on the wafer W at a predetermined approach (acceleration) start position, and the reticle stage 1 is returned to a predetermined reset position (acceleration start position).

Next, a command is given to the stage driving device 10 to drive the reticle stage 1 and the wafer stage 2,
The exposure of the shot area starts. In the case of the present embodiment, reticle stage 1 moves in the + Y direction, and wafer stage 2 moves in the -Y direction. Regarding the moving speed ratio at this time, if the projection magnification of the projection optical system 3 is １ ／, the moving speed of the wafer stage is set to １ ／ times the moving speed of the reticle stage 1.

Further, the slit-shaped illumination area on the reticle M by the illumination light is set at a position decentered in the + Y direction from the optical axis AX1, and the illumination light passing through the illumination area is transmitted to the lens group of the first objective section A. The light enters the bent portion B of the optical axis through 31. The image forming light beam incident on the optical axis bending portion B is
Then, the imaging light flux reflected and condensed by the concave mirror 33 passes through the lens group 32 again, and is deflected in the −Y direction by the small mirror 34 of the optical axis deflector C. In the optical axis deflecting unit C, the image forming light beam reflected by the small mirror 34 passes through the lens group 35 and passes through the beam splitter 36
Incident on. The imaging light flux deflected in the −Z direction by the beam splitter 36 is directed to the second objective section D, and passes through the lens group 37 in the second objective section D, so that the reticle M is exposed to the exposure area on the wafer W. A reduced inverted image of the pattern in the illumination area is formed.

When the exposure of one shot area on the wafer W is completed in this way, a command is given to the stage driving device 10 to drive the wafer stage 2 and the wafer W next to the exposed shot area on the wafer W is exposed. The second shot area is positioned at the acceleration start position. Then, the reticle stage 1 is moved in the opposite direction (+ Y direction) to the previous exposure to start exposure of the shot area. In this case, the wafer stage 2 moves in the −Y direction by 1 / speed of the speed of the reticle stage 1.
It is moved at a speed of 4. Thereafter, similarly, the exposure of the shot area of the wafer W is performed by the step-and-scan method.

In such an exposure step, the reticle stage 1 and the wafer stage 2 scan and move in the ± Y direction, particularly during the exposure, so that the reaction force generated in the Y direction is almost cancelled, but this synchronous movement is not effective. Vibration occurs due to the reaction force during deceleration. This vibration appears in the entire apparatus as a twist generated in the ± Z-axis direction, particularly when the height position of the reticle stage 1 and the wafer stage 2 is changed and set as in this embodiment.

However, in the projection exposure apparatus of the present embodiment, the reticle stage 1 and the wafer stage 2 are provided with the acceleration sensors 12 and 13 respectively, and the respective stages 1 and 1 detected by the acceleration sensors 12 and 13 are provided.
An electric signal corresponding to the acceleration a of 2, that is, the force F serving as a vibration source is sent to the control device 11, and the control device 11
A current is caused to flow through the coils 923 of the actuators 9A and 9B so that a force F that cancels the detected force F is generated. Thus, a force that cancels the reaction force generated in each of the stages 1 and 2 is applied to each of the reticle stage 1 and the wafer stage 2 in the ± Y direction.
Such vibration can be attenuated, and deterioration of the imaging characteristics of the wafer W can be prevented.

Further, in the projection exposure apparatus of this embodiment, since the reticle stage 1 and the wafer stage 2 are provided below the projection optical system 3, from the viewpoint of the overall structure of the projection exposure apparatus, the apparatus main body section Is inherently lower than that of an exposure apparatus using a conventional linear projection optical system. Thereby, the stability of the apparatus main body is enhanced, and the vibration itself caused by driving the reticle stage 1 and the wafer stage 2 can be suppressed.

As described above, in the projection exposure apparatus of this embodiment, the reticle stage 1 and the wafer stage 2
Are moved in the directions opposite to each other in the ± Y direction, and the mass ratio between the reticle stage 1 and the wafer stage 2 is
Since the magnification is made substantially equal to the magnification of the projection optical system 3, firstly, the vibration is self-attenuated by the canceling effect due to the backward movement, and secondly, the reaction by the stages 1 and 2 is determined from the equation of motion theory. The scalar value of the force ratio becomes substantially 1, and the reaction force generated by the movement of the reticle stage 1 and the wafer stage 2 is almost canceled in the apparatus main body, and self-damping occurs.

In the projection exposure apparatus of this embodiment, since the height positions of the reticle stage 1 and the wafer stage 2 are changed, the work of exchanging the reticle M and the wafer W can be performed smoothly and simultaneously. The process throughput will be improved.

Second Embodiment FIG. 5 is a sectional view showing a second embodiment of the projection exposure apparatus according to the present invention, and the same reference numerals are given to members common to the first embodiment. The projection exposure apparatus of the present embodiment differs from the projection exposure apparatus of the first embodiment in that an actuator (first actuator) 15 is added between the catch pallet 5 and the base 6 in parallel with the anti-vibration pad 14. Are different. Accordingly, an acceleration sensor 16 for controlling the actuator 15 is provided on the base 6.

The actuator 15 is, for example, a base 6
Are provided in the vicinity of the four corners and in the vicinity of the anti-vibration pad 14. As with the actuators 9A and 9B, the voice coil actuator, the linear motor actuator,
A pneumatic damper, a mechanical damper, or a combination of these in parallel or in series can be used.
In the embodiment shown in the figure, the voice coil actuator shown in FIG. 2 is used as the actuator 15, and the stator 151 is fixed to the catch pallet 5 and the mover 152 is fixed to the back surface of the base 6. Then, the output information of the acceleration sensor 16 provided on the surface of the base 6 is taken into the control device 11, and a current flows from the control device 11 to the coil of the mover 152 so as to cancel the vibration of the base 6 in the ± Z directions. .

As described above, when the reticle stage 1 and the wafer stage 2 are scanned and moved, the vibrations appear as torsion in the entire projection exposure apparatus as described above, and the reaction force acts in the ± Z direction. Therefore, this can be absorbed by the actuator 15 and released to the catch pallet 5. In addition, such an actuator 1
5 not only attenuates the vibration caused by the scanning movement of the reticle stage 1 and the wafer stage 2 but also reduces the generally occurring vibration in the ± Z direction.

The actuator 15 is connected to the vibration isolating pad 1
4 may be incorporated. If at least two actuators 15 are provided, the actuator 9 in FIG.
A and 9B need not be provided.

Third Embodiment FIG. 6 is a sectional view showing a third embodiment of the projection exposure apparatus according to the present invention, and the same reference numerals are given to members common to the first embodiment. The projection exposure apparatus of the present embodiment is different from the projection exposure apparatus of the first embodiment in that the base 6 supporting the reticle stage 1 and the wafer stage 2 is
Column 7 supporting projection optical system 3 by frame 6B
The difference is that this column 7 is installed on the catch pallet 5 via a vibration isolating pad 14.

That is, in the first embodiment described above, the reticle stage 1 and the wafer stage 2 are installed on the base 6, and the projection optical system 3 is installed on the base 6 via the column 7. In this embodiment,
This support structure is reversed. However, the actuators 9A and 9B for attenuating the forces in the ± Y direction of the reticle stage 1 and the wafer stage 2 are respectively provided for the frames 8A and 8B separately provided on the catch pallet 5 and for the reticle stage 1 and the wafer stage 2. The points provided between them are the same.

In this case, the catch pallet 5 and the column 7
(Or the base 6), the actuator 15 added in the second embodiment may be further provided.

In this embodiment in which the support structure of the base 6 and the column 7 is reversed, during the exposure,
The acceleration a of each of the stages 1 and 2 detected by the acceleration sensors 12 and 13, in other words, the force F serving as a vibration source
Is transmitted to the control device 11, and the control device 11 supplies current to the coils of the respective actuators 9A and 9B so that a force F that cancels the detected force F is generated. As a result, a force that cancels the reaction force generated in each of the stages 1 and 2 is applied to each of the reticle stage 1 and the wafer stage 2 in the ± Y direction. It is possible to prevent the deterioration of the imaging characteristics in W.

If the actuators 15 disclosed in the second embodiment are incorporated in the vibration isolating pad 14 or at least two actuators 15 are arranged between the catch pallet 5 and the base 6, the actuators 9A and 9B need not be provided. good.

Fourth Embodiment FIG. 7 is a sectional view showing a fourth embodiment of the projection exposure apparatus according to the present invention. The same reference numerals are given to members common to the first embodiment. The projection exposure apparatus of the present embodiment is different from the projection exposure apparatus of the first embodiment in the mounting positions of the actuators 9A and 9B.

That is, in this embodiment, not the reticle stage 1 and the wafer stage 2 but the base 6 on which these stages 1 and 2 are installed and the frames 8A and 8B provided on the catch pallet 5. , And respective actuators 9A and 9B are provided.
As in the first embodiment, the actuators 9A and 9B used here can be a voice coil actuator, a linear motor actuator, a pneumatic damper or a mechanical damper, or a combination of these in parallel or in series.

The actuator 15 added in the second embodiment may be further provided between the catch pallet 5 and the base 6.

As described above, the base 6 and the frames 8A, 8B
Also in this embodiment in which the actuators 9A and 9B are provided between the acceleration sensors 12 and 13 during the exposure.
Sends an electric signal corresponding to the acceleration a of each of the stages 1 and 2 detected in the above, in other words, a force F serving as a vibration source to the control device 11, and the control device 11 cancels the detected force F. An electric current is applied to the coils of the respective actuators 9A and 9B so that F occurs. As a result, the force for canceling the reaction force generated in each of the stages 1 and 2 is ± Y on the base 6 that supports not the reticle stage 1 and the wafer stage 2 but each of them.
Since the vibration is applied in the direction, such vibrations can be attenuated, and deterioration of the imaging characteristics of the wafer W can be prevented. Note that an actuator 9B may be provided between the gantry 6A and the frame 8B.

Each of the embodiments described above (FIGS. 1, 5 to 7)
In the above, the column 7 and the base 6 that hold the projection optical system 3 are mechanically connected. However, the column 7 and the base 6 may be supported by separate vibration-isolating pads. That is,
In the projection exposure apparatus shown in FIG. 6, instead of suspending the base 6 on the column 7 via the frame 6B, the column 7
May be provided separately from the anti-vibration pad 14 for supporting the base 6.

In each of the above-described embodiments, the reticle M and the wafer W are respectively moved in a plane (horizontal plane) perpendicular to the vertical direction (gravity direction). Further, the reticle M and the wafer W may be placed vertically and moved in a plane orthogonal to a horizontal plane. Alternatively, one of reticle M and wafer W may be moved in a horizontal plane, and the other of reticle M and wafer W may be moved in a plane orthogonal to the horizontal plane. That is, the relationship between the moving surface of the reticle M and the moving surface of the wafer W may be arbitrarily determined. In short, the base (mount) on which the reticle stage 1 is arranged and the base (mount) on which the wafer stage 2 is arranged are the same or different. Even if they are separate, it is only necessary that both are physically connected.

Further, the illumination optical system 4 shown in FIGS. 1 and 5 to 7 may be configured to be supported by an anti-vibration pad arranged on the catch pallet 5. Thereby, it is possible to prevent the vibration of the floor of the clean room where the projection exposure apparatus is installed from being transmitted to the illumination optical system 4. Further, the projection optical system 3 does not need to be a reduction optical system, and may be an equal magnification system or an enlargement system.

In each of the above embodiments, the mass ratio between the reticle stage 1 and the wafer stage 2 matches the magnification of the projection optical system 3 in order to cancel the reaction force generated in the moving direction during acceleration / deceleration. However, in reality, it is difficult to exactly match the mass ratio and the magnification.
Therefore, when the mass ratio does not match the magnification of the projection optical system 3, the acceleration / deceleration of at least one of the reticle stage 1 and the wafer stage 2 before and after the scanning exposure is adjusted, and the moving direction (Y direction). The reaction force related to the above may be almost offset.

Further, in each of the above-described embodiments, the reticle stage 1 and the wafer stage 2 and the frames 8A and 8B
The actuators 9A and 9B are provided one by one, but the number may be arbitrary. For example,
It is also possible to provide two actuators 9A and 9B, respectively, to generate a force that cancels a vibration that appears as a twist in the ± Y-axis direction in the orthogonal coordinate system XY during acceleration / deceleration.
At this time, for example, in the projection exposure apparatus of FIG. 1, the second actuator 9A may be arranged on the actuator 9A side with respect to the wafer stage 2, or the second actuator 9A may be opposed to the actuator 9A with the wafer stage 2 interposed therebetween.
May be arranged. Note that the directions of the forces generated by the two actuators 9A may be the same or opposite. However, when the directions are opposite, the two forces do not cancel each other, that is, the same direction. Make sure they do not interact on the line.

Although not shown in FIG. 1 and FIGS. 5 to 7, between the wafer stage 2 (or the base 6) and the catch pallet 5 (or the floor of the clean room), for example, the same configuration as the actuator 9A is provided. At least one actuator that generates a force in the X direction. The X-axis actuator is disposed between a frame provided separately from the base 6 on which the wafer stage 2 is disposed on the catch pallet 5 or the floor of a clean room, and the wafer stage 2 (or the base 6).

Here, when exposing the wafer W by, for example, a step-and-scan method, the wafer W is stepped in a direction (X direction) orthogonal to the scanning direction (Y direction) after the scanning exposure of one shot area is completed. However, the vibration of the apparatus main body can be reduced by generating the force for canceling the reaction force generated when the wafer stage 2 is accelerated or decelerated before and after the stepping operation by the X-axis actuator.

A plurality of reticle patterns drawn on the same reticle or a plurality of reticles are relatively moved with respect to the illumination light, and the images of the plurality of reticle patterns are joined and transferred onto wafer W to form one reticle. When performing a so-called stitching exposure for forming a large device pattern, the reticle stage 1 moves relative to the first reticle pattern with respect to the illumination light and then relative to the second reticle pattern with respect to the illumination light. Is stepped in a direction (X direction) orthogonal to the scanning direction.
Therefore, in the exposure apparatus that performs the stitching exposure, at least one of the reticle stages 1 (or the base 6) and the catch pallet 5 (or the floor) that generates a force in the X direction is provided between the reticle stage 1 (or the base 6) and the catch pallet 5 (or the floor). It is desirable to provide an X-axis actuator.

The illumination light for exposure used in the projection exposure apparatus (scanning stepper or the like) to which the present invention is applied is a bright line (for example, g
Line, i-line), KrF excimer laser (wavelength 248n)
m), ArF excimer laser (wavelength 193 nm), F2
Either an excimer laser (wavelength: 157 nm) or a harmonic such as a YAG laser may be used.

In a projection exposure apparatus using an F2 excimer laser, most of an illumination optical system and a plurality of refractive optical elements (lenses, etc.) constituting the projection optical system and a reticle are made of fluorite. All the air in the optical path of the projection optical system is replaced with helium.

Further, as illumination light for exposure, for example, 5
E having an oscillation spectrum at ~ 15 nm (soft X-ray region)
UV (Extreme Ultra Violet) light may be used. A projection exposure apparatus using EUV light defines an illumination area on a reflective mask in an arc slit shape and has a reduced projection optical system including only a plurality of reflective optical elements (mirrors). The reflection mask and the wafer are synchronously moved at a speed ratio according to the magnification of the system, and the pattern of the reflection mask is received and transferred onto the wafer.

The embodiments described above have been described in order to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

[0102]

As described above, according to the present invention, even if vibrations are caused by the movement of the mask and / or the photosensitive substrate, such vibrations can be attenuated, and deterioration of the imaging characteristics is prevented. be able to.

Further, according to the present invention, the position of the center of gravity of the main body of the exposure apparatus can be lowered in the vertical direction as compared with the conventional exposure apparatus using a linear projection optical system. The vibration itself caused by the movement of the mask and / or the photosensitive substrate can be suppressed.

Further, according to the present invention, since the first stage (mask) and the second stage (photosensitive substrate) are arranged at different positions in the first direction, the transfer device for loading / unloading the mask is provided. The movable region and the movable region of the transport device for loading and unloading the photosensitive substrate can be set so as to overlap in the first direction without interference between the transport devices. As a result, the loading and unloading operations of the mask and the photosensitive substrate can be simultaneously performed with a reasonable operation, and the throughput of the exposure process can be increased.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a projection exposure apparatus of the present invention.

FIG. 2 is a cross-sectional view showing an embodiment of the actuator according to the present invention.

FIG. 3 is a cross-sectional view showing another embodiment of the actuator according to the present invention.

FIG. 4 is a plan view of the first embodiment.

FIG. 5 is a sectional view showing a second embodiment of the projection exposure apparatus of the present invention.

FIG. 6 is a sectional view showing a third embodiment of the projection exposure apparatus of the present invention.

FIG. 7 is a sectional view showing a fourth embodiment of the projection exposure apparatus of the present invention.

[Explanation of symbols]

 M: reticle (mask) W: wafer (photosensitive substrate) AX1, AX2, AX3: optical axis 1: reticle stage (first stage) 2: wafer stage (second stage) 3: projection optical system 33: concave mirror 34: small size Mirror (mirror) 36 ... Beam splitter 4 ... Illumination optical system 5 ... Catch pallet (installation surface) 6 ... Base 7 ... Column 8A, 8B ... Frame 9A, 9B ... Actuator (second actuator) 10 ... Stage driving device 11 ... Control Devices 12, 13: Acceleration sensor (vibration detection device) 14: Anti-vibration pad (vibration isolation mechanism) 15: Actuator (first actuator) 16: Acceleration sensor

Claims (19)

[Claims] 1. A projection exposure apparatus for transferring a pattern of a mask onto a photosensitive substrate, a projection optical system for projecting an image of the pattern of the mask onto the photosensitive substrate, a first stage for holding the mask, A second stage disposed on the first stage side with respect to the projection optical system and holding the photosensitive substrate such that a position in a first direction along an optical axis of the projection optical system is different from the mask; A driving device for driving the first and second stages respectively so as to synchronously move the mask and the photosensitive substrate at a speed ratio according to a magnification of an optical system; and a vibration generated by driving the first and second stages. And a vibration isolating device for attenuating the light. 2. The mask and the photosensitive substrate are respectively moved along a second direction orthogonal to the first direction, and the vibration isolator moves the mask and the photosensitive substrate during the synchronous movement. 2. The projection exposure apparatus according to claim 1, wherein a force generated in a direction orthogonal to the second direction is reduced by a difference in position in the first direction. 3. The projection exposure apparatus according to claim 2, wherein the vibration isolator substantially cancels a reaction force generated in the second direction during the synchronous movement. 4. The image stabilizing device according to claim 1, further comprising an actuator disposed between an apparatus main body including the projection optical system and the first and second stages and an installation surface thereof. Item 4. The projection exposure apparatus according to Item 2 or 3. 5. The projection exposure apparatus according to claim 4, further comprising a frame provided on said installation surface separately from said apparatus main body and to which said actuator is fixed. 6. The projection exposure apparatus according to claim 4, wherein the actuator is any one of a linear motor actuator, a voice coil actuator, a pneumatic damper, and a mechanical damper, or a combination thereof. . 7. A vibration detecting device for detecting a vibration of at least one of the first and second stages or a physical quantity equivalent thereto, and a control device for driving and controlling the vibration isolating device based on an output of the vibration detecting device. The projection exposure apparatus according to claim 1, further comprising: 8. The projection optical system projects a partial inverted image of the pattern of the mask on the photosensitive substrate in a reduced size, and the mask and the photosensitive substrate are arranged along a second direction orthogonal to the first direction. 2. The projection exposure apparatus according to claim 1, wherein the projection exposure apparatus is moved in the opposite direction. 9. The projection exposure apparatus according to claim 8, wherein a mass ratio between the first stage and the second stage substantially matches a magnification of the projection optical system. 10. The projection exposure apparatus according to claim 1, wherein the projection optical system includes a concave mirror and a plurality of mirrors. 11. The projection exposure apparatus according to claim 1, wherein the projection optical system includes a concave mirror, a beam splitter, and at least one mirror. 12. The apparatus according to claim 1, wherein the vibration isolator includes a first actuator for applying a force in the first direction to a base on which the first and second stages are disposed. Or the projection exposure apparatus according to 2. 13. A gantry supporting the projection optical system, and a vibration isolation mechanism on which the base and the gantry are mounted, wherein the first actuator is incorporated in the vibration elimination mechanism. 13. The projection exposure apparatus according to claim 12, wherein: 14. An anti-vibration mechanism for mounting a base on which the first and second stages are arranged, and a frame provided on a surface on which the anti-vibration mechanism is installed. 3. The apparatus according to claim 1, further comprising a second actuator provided on the frame, the second actuator applying a force along at least one of the first stage, the second stage, and the base in the second direction. The projection exposure apparatus according to any one of claims 3 and 12. 15. A base for supporting the projection optical system, wherein a base on which the first and second stages are arranged is suspended from the base, and wherein the vibration isolator includes the first stage and the second stage. The apparatus according to claim 1, further comprising a second actuator that applies a force along at least one of the stage, the base, and the gantry in the second direction. Projection exposure equipment. 16. The apparatus according to claim 16, further comprising: a vibration isolation mechanism on which the gantry is mounted; and a frame provided on an installation surface of the vibration isolation mechanism, wherein the second actuator is provided on the frame. Item 16. A projection exposure apparatus according to Item 15. 17. An illumination optical system, further comprising an illumination optical system disposed on a side opposite to the projection optical system with respect to the base and for illuminating a part of the mask with illumination light.
The projection exposure apparatus according to any one of claims 1 to 16. 18. A projection exposure apparatus for transferring a pattern of a mask onto a photosensitive substrate, a projection optical system for projecting an image of the pattern of the mask onto the photosensitive substrate, a first stage for holding the mask, A second stage disposed on the first stage side with respect to the projection optical system and holding the photosensitive substrate such that a position in a first direction along an optical axis of the projection optical system is different from the mask; A projection exposure apparatus, comprising: an apparatus main body including an optical system and first and second stages; and a vibration isolator arranged between an installation surface thereof. 19. A projection exposure method for transferring a pattern of a mask onto a photosensitive substrate via a projection optical system, wherein the mask is arranged on an object plane of the projection optical system, and the object plane is positioned with respect to the projection optical system. Disposing the photosensitive substrate on an image plane different from the object plane in a first direction along the optical axis of the projection optical system, and a speed ratio according to a magnification of the projection optical system. Moving the mask and the photosensitive substrate along a second direction orthogonal to the first direction, and attenuating vibration caused by movement of the mask and the photosensitive substrate. Exposure method.