JPH11160863A - Photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a material with which a fine pattern can be formed on a substrate in good yield with good resolution while preventing halation of a substrate surface even on a substrate having high reflectance, suppressing widening of the pattern width and preventing decrease in adhesion property in the production process of a mask material for a printed circuit board, metal processing and sand blasting. SOLUTION: This compsn. contains an alkali-soluble polymer compd., ethylene type unsatd. addition polymerizable monomers and/or oligomers, photopolymn. initiator, and compd. preferably a quinophthalone dye having the absorption wavelength region of >=400 nm and <=450 nm, by >=0.01 wt.% and <=0.1 wt.%. A photosensitive resin laminated body is obtd. by successively depositing the compsn. above described and a protective layer on a supporting body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition and a photosensitive resin laminate using the same, and more particularly to an alkali developing method suitable for producing a printed circuit board, a mask for metal working and sandblasting. The present invention relates to a possible photosensitive resin composition and a photosensitive resin laminate using the same.

[0002]

2. Description of the Related Art Conventionally, a so-called dry film resist (hereinafter abbreviated as DFR) comprising a support layer and a photosensitive resin layer has been used as a resist for producing a mask material for producing a printed circuit board, metal working and sand blasting. Used. To make a printed circuit board or a mask material for metal working and sand blasting using this DFR,
DF using a laminator etc. on a printed circuit board such as a copper-clad laminate or a board made of metal, glass, ceramic, etc.
R is laminated and exposed through a pattern mask film etc.
After development, a resist pattern is formed on the substrate.

In recent years, with the increasing integration of printed circuit boards, higher definition of metal processing, and progress of sandblasting technology, it has been required to form a fine resist pattern with a resist on a substrate. However, when a resist pattern is formed on a substrate having a high light reflectance, such as an aluminum substrate or a silicon wafer, light transmitted through the resist and reflected on the substrate surface is scattered to unexposed portions (halation), resulting in a lower resolution. There has been such a problem that the pattern pattern becomes worse or the width of the resist pattern is increased with respect to the dimension of the pattern mask film.

On the other hand, when ribs for a plasma display panel (hereinafter abbreviated as PDP) are formed by sandblasting, the rib material may be white in order to increase the luminous efficiency of the PDP. When a mask for sandblasting is formed on a substrate using the white rib material using DFR, the halation on the substrate is large, so that the resolution is deteriorated and the width of the resist pattern is increased. Was occurring.

[0005] In order to solve the problems such as the deterioration of resolution due to halation and the widening of the resist pattern width, conventionally, a method of adding an antihalation agent, a light absorbing material, a dye, and the like to a photosensitive resin has been adopted. . For example, "Special Function Dyes -Technology and Market-" (published by CMC Co., Ltd., 1986, 1st edition) includes monoazo dyes, azomethine dyes, and naphthalimide dyes as dyes having absorption around 430 nm as an antihalation agent. It is stated that such is used. Also, Japanese Patent Application Laid-Open No. 52-58
Japanese Patent Application Laid-Open No. 603 discloses that a photolithography method enables fine pattern processing by adding 1 to 5% by weight of a light-absorbing material such as an organic dye to a photosensitive resin.

Further, the photosensitive resin composition for gravure plates disclosed in Japanese Patent Application Laid-Open No. 55-12953 is provided with an absorbent for absorbing light having a photosensitive characteristic wavelength with respect to the polyamide photosensitive resin, specifically, 280 nm to 430 nm. It has been disclosed that by adding 0.01 to 0.1% by weight of a dye exhibiting absorption, halation from the support can be prevented and a good image balance can be obtained.
It is disclosed that, by adding a specific ultraviolet absorber to the photosensitive resin composition of Japanese Patent Application Laid-Open Publication No. H11-209, the sensitivity and the residual film ratio are good and the light reflection from the substrate in i-line exposure is small.

However, simply adding the above-mentioned conventional dyes, dyes, antihalation agents and light-absorbing materials to the photosensitive resin composition of the present invention suppresses the resolution and the width of the resist pattern. It was insufficient to obtain a resist pattern width faithful to the dimensions of the pattern mask film. In addition, if the addition amount is increased to obtain sufficient resolution and suppression of thickening of the resist pattern width,
Although the resolution is certainly improved, there is a problem that the adhesion between the substrate and the resist pattern is deteriorated.

In particular, when a rib for a PDP is formed by a sand blast method, the adhesion between the rib substrate and the resist pattern is hardly obtained as compared with a metal substrate. However, there is a problem that it is extremely difficult to achieve a sufficient resolution and adhesion at the same time.

[0009]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and is effective in preventing halation. In particular, it is possible to suppress an increase in the width of a resist pattern while maintaining adhesion, An object of the present invention is to provide a photosensitive resin composition capable of obtaining a sufficient resolution.

[0010]

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that
It has been found that the above-mentioned problems can be solved by using a photosensitive resin composition containing a compound having an absorption wavelength region of 0 nm or less and a photosensitive resin laminate using the same.

That is, the first invention of the present application relates to a photosensitive resin composition containing an alkali-soluble polymer compound, (ii) an ethylenically unsaturated addition-polymerizable monomer and / or oligomer, and (iii) a photopolymerization initiator. And (iv) 40
A photosensitive resin composition comprising a compound having an absorption wavelength range of 0 nm or more and 450 nm or less in an amount of 0.01% by weight or more and 0.1% by weight or less.

The second invention of the present application is the photosensitive resin composition according to the first invention, wherein the compound (iv) is a quinophthalone dye. The third invention of the present application is a photosensitive resin laminate having a photosensitive resin layer (B) made of the photosensitive resin composition of the first invention or the second invention on a support (A).

Hereinafter, the present invention will be described in detail using a resist for producing a mask material for sandblasting as a specific example. Examples of the alkali-soluble polymer compound of the component (i) of the present invention include a carboxylic acid-containing vinyl copolymer and a carboxylic acid-containing cellulose. The carboxylic acid-containing vinyl copolymer refers to at least one first monomer selected from α, β-unsaturated carboxylic acids and an alkyl (meth)
Acrylates, hydroxyalkyl (meth) acrylates, (meth) acrylamides and compounds in which hydrogen on the nitrogen has been replaced with alkyl or alkoxy groups, styrene and styrene derivatives, (meth) acrylonitrile, and glycidyl (meth) acrylate It is a compound obtained by vinyl copolymerizing at least one selected second monomer.

Specific examples of the first monomer used in the carboxylic acid-containing vinyl copolymer include acrylic acid, methacrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid and maleic acid half ester. And each may be used alone or in combination of two or more. The proportion of the first monomer in the carboxylic acid-containing vinyl copolymer is 15 to 40% by weight, preferably 20 to 35% by weight. If the proportion is less than 15% by weight, development with an alkaline aqueous solution becomes difficult. If the proportion exceeds 40% by weight, it becomes insoluble in the solvent during the polymerization, so that the synthesis becomes difficult.

Specific examples of the second monomer used in the carboxylic acid-containing vinyl copolymer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and cyclohexyl (meth). Acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, polyethylene glycol mono (meth) ) Acrylate, polypropylene glycol mono (meth) acrylate,

(Meth) acrylamide, N-methylolacrylamide, N-butoxymethylacrylamide,
Styrene, α-methylstyrene, p-methylstyrene,
Examples thereof include p-chlorostyrene, (meth) acrylonitrile, and glycidyl (meth) acrylate, which may be used alone or in combination of two or more. The proportion of the second monomer in the carboxylic acid-containing vinyl copolymer is 60 to 85% by weight, preferably 65 to 80% by weight.

The weight average molecular weight of the carboxylic acid-containing vinyl copolymer ranges from 20,000 to 300,000, preferably from 30,000 to 150,000. The weight average molecular weight in this case is GPC
It is the weight average molecular weight in terms of polystyrene by the method. If the weight average molecular weight is less than 20,000, the strength of the cured film will be low. When the weight average molecular weight exceeds 300,000, the viscosity of the photosensitive resin composition becomes too high, and the coatability is lowered.

Examples of the carboxylic acid-containing cellulose include cellulose acetate phthalate, hydroxyethyl carboxymethyl cellulose and the like.

The content of the alkali-soluble polymer is 10 to 70% by weight, preferably 20 to 65% by weight, more preferably 25 to 60% by weight based on the total weight of the photosensitive resin composition.
It is. If this amount is less than 10% by weight, the dispersibility in an alkali developing solution is reduced, and the developing time is significantly increased. If this amount exceeds 70% by weight, the photocuring of the photosensitive resin layer becomes insufficient, and the sandblast resistance decreases.

As the ethylenically unsaturated addition-polymerizable monomer and / or oligomer of the component (ii) of the present invention, known types of compounds can be used. For example, 2-hydroxy-3-phenoxypropyl acrylate, phenoxytetraethylene glycol acrylate, β-hydroxypropyl-β ′-(acryloyloxy) propyl phthalate, 1,4-tetramethylene glycol di (meth) acrylate, 1,6- Hexanediol di (meth) acrylate, 1,4-cyclohexanediol di (meth) acrylate, octapropylene glycol di (meth) acrylate, glycerol (meth) acrylate, 2-di (p-hydroxyphenyl) propane di (meth) acrylate, Glycerol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate,

Polyoxypropyltrimethylolpropane tri (meth) acrylate, polyoxyethyltrimethylolpropane tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropane triglycidyl Ether tri (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, diallyl phthalate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 4-normal octylphenoxypentapropylene glycol acrylate,

Bis (triethylene glycol methacrylate) nonapropylene glycol, bis (tetraethylene glycol methacrylate) polypropylene glycol, bis (triethylene glycol methacrylate) polypropylene glycol, bis (diethylene glycol acrylate) polypropylene glycol, 4-n-octylphenoxypentaethylene glycol Examples include tripropylene glycol acrylate, phenoxytetrapropylene glycol tetraethylene glycol acrylate, and compounds containing both an ethylene oxide chain and a propylene oxide chain in the molecule of a bisphenol A (meth) acrylate monomer.

Hexamethylene diisocyanate,
A urethane compound of a polyvalent isocyanate compound such as toluylene diisocyanate and a hydroxy acrylate compound such as 2-hydroxypropyl (meth) acrylate can also be used. The urethane compound in this case has a number average molecular weight of less than 1,500 in terms of polystyrene by GPC.

It is preferable to use a polyurethane prepolymer as the ethylenically unsaturated addition-polymerizable oligomer in order to provide sandblast resistance. The polyurethane prepolymer is obtained by reacting a compound having an active hydrogen-containing functional group and an ethylenically unsaturated bond with a terminal isocyanate group of a polyurethane derived from a polymer having a terminal hydroxyl group and a polyisocyanate.

The number average molecular weight of the polyurethane prepolymer is from 1,500 to 50,000. Here, the number average molecular weight is the number average molecular weight in terms of polystyrene by the GPC method. These ethylenically unsaturated addition-polymerizable monomers and / or oligomers may be used alone or in combination of two or more.

The content of the ethylenically unsaturated addition polymerizable monomer and / or oligomer of the component (ii) is 30 to 90% by weight based on the total weight of the photosensitive resin composition. 30
When the amount is less than 90% by weight, the photocuring of the photosensitive resin layer becomes insufficient, and when the amount is more than 90% by weight, the DFR is stored in a roll having a three-layer structure. The phenomenon is more likely to occur.

As the photopolymerization initiator of the component (iii) of the present invention, benzyl dimethyl ketal, benzyl diethyl ketal, benzyl dipropyl ketal, benzyl diphenyl ketal, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin phenyl Ether, thioxanthone, 2,4-
Dimethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2-fluorothioxanthone, 4-fluorothioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, 1-chloro -4-propoxythioxanthone,

Benzophenone, 4,4'-bis (dimethylamino) benzophenone [Michler's ketone], 4,
4'-bis (diethylamino) benzophenone, 2,2
Aromatic ketones such as -dimethoxy-2-phenylacetophenone; biimidazole compounds such as 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer; acridines such as 9-phenylacridine;

Α, α-dimethoxy-α-morpholino-methylthiophenylacetophenone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, phenylglycine, and 1-phenyl-1,2-propanedione-2-o-benzoyloxime Oxime esters, such as ethyl 2,2-dioxo-3-phenylpropionate-2- (o-benzoylcarbonyl) -oxime;
Examples thereof include p-dimethylaminobenzoic acid, p-diethylaminobenzoic acid, p-diisopropylaminobenzoic acid, esters of these alcohols, and p-hydroxybenzoic acid esters.

The content of the photopolymerization initiator (iii) is 0.01 to 20% by weight, preferably 1 to 10% by weight based on the total weight of the photosensitive resin composition. If this amount is 0.
If it is less than 01%, the sensitivity is not sufficient. This amount is 2
If the content is more than 0% by weight, the ultraviolet ray absorption rate becomes high, and the curing at the bottom of the photosensitive resin layer becomes insufficient.

The maximum absorption wavelength of the component (iv) of the present invention is 4
The compound having an absorption wavelength region of not less than 00 and not more than 450 nm is preferably a quinophthalone-based dye, such as Solvent Yellow 33. The compound having an absorption wavelength region of 400 nm or more and 450 nm or less of the component (iv) is 0.01% by weight or more and 0.1% by weight or less based on the total weight of the photosensitive resin composition.
% By weight or less. If this amount is 0.01% or less, sufficient effects are not seen in suppressing the resolution and the increase in the pattern width.
If the content is 0.1% by weight or more, the curing at the bottom of the photosensitive resin layer becomes insufficient, and the adhesiveness decreases.

Component (iii) which is particularly preferred in combination with component (iv) is 2- (o-chlorophenyl)-
A combination of 4,5-diphenylimidazolyl dimer and Michler's ketone or 4,4 ′-(diethylamino) benzophenone.

The photosensitive resin composition of the present invention may contain coloring substances such as dyes, dyes and pigments other than the component (iv) of the present invention. Examples of such coloring substances include fuchsin, phthalocyanine green, auramine base, chalcoxide green S, paramagenta, crystal violet, methyl orange, and nile blue 2
B, Victoria Blue, Malachite Green, Basic Blue 20, Diamond Green and the like.

It is preferable that the photosensitive resin composition of the present invention contains a radical polymerization inhibitor in order to improve the thermal stability and storage stability of the photosensitive resin composition. Such radical polymerization inhibitors include, for example, p-methoxyphenol, hydroquinone, pyrogallol, naphthylamine, t-butylcatechol, cuprous chloride, 2,6-di-
t-butyl-p-cresol, 2,2 ′ methylenebis (4-ethyl-6-t-butylphenol), 2,2 ′
-Methylenebis (4-methyl-6-t-butylphenol) and the like.

Further, the photosensitive resin composition of the present invention may contain a coloring dye which develops a color upon irradiation with light. As such a coloring dye, a combination of a leuco dye and a halogen compound is well known. Examples of the leuco dye include tris (4-dimethylamino-2-methylphenyl) methane [leuco crystal violet], tris (4-dimethylamino-2-methylphenyl) methane [leucomalachite green] and the like. On the other hand, as the halogen compound, amyl bromide, isoamyl bromide,
Isobutylene bromide, ethylene bromide, diphenylmethyl bromide, benzal bromide, methylene bromide, tribromomethylphenylsulfone, carbon tetrabromide, tris (2,3-dibromopropyl) phosphate, trichloroacetamide,
Examples thereof include amyl iodide, isobutyl iodide, 1,1,1-trichloro-2,2-bis (p-chlorophenyl) ethane, and hexachloroethane.

Further, the photosensitive resin composition of the present invention may contain additives such as a plasticizer, if necessary. Examples of such additives include phthalic acid esters such as diethyl phthalate, o-toluenesulfonic acid amide,
p-toluenesulfonic acid amide, tributyl citrate,
Examples thereof include triethyl citrate, triethyl acetyl citrate, tri-n-propyl acetyl citrate, tri-n-butyl acetyl citrate, and polypropylene glycol.

The photosensitive resin composition of the present invention may be applied to a substrate in a liquid state using a bar coater, a roll coater, a spin coater or the like to form a photosensitive resin composition layer, depending on the purpose of use. The photosensitive resin layer (B) of the present invention and, if necessary, a protective layer (C) are sequentially laminated on a support (A) to form a photosensitive resin laminate, which is then used by laminating on a substrate. Can be.

The support (A) of the photosensitive resin laminate is a film for supporting the photosensitive resin layer of the present invention, and is preferably a transparent material that transmits active light. Examples of such a material include synthetic resin films such as polyethylene, polypropylene, polycarbonate, and polyethylene terephthalate having a thickness of about 10 to 100 μm, but polyethylene terephthalate having appropriate flexibility and strength is preferably used.

A protective layer (C) is laminated on the photosensitive resin laminate as required. In the adhesive strength between the photosensitive resin layer and the photosensitive resin layer, it is a necessary property for the protective layer that the adhesive strength between the photosensitive resin layer and the protective layer be sufficiently smaller than the adhesive strength between the photosensitive resin layer and the support. The protective layer can be easily peeled off. Examples of such a film include a polyethylene film and a polypropylene film.

A method of preparing a photosensitive resin laminate by sequentially laminating the support (A), the photosensitive resin layer (B), and the protective layer (C) can be performed by a conventionally known method. .
For example, the photosensitive resin composition used for the photosensitive resin layer (B) is mixed with a solvent for dissolving them to form a uniform solution, and is first coated on the support (A) using a bar coater or a roll coater. And dried, and the photosensitive resin layer (B) is laminated on the support. Next, by laminating the protective layer (C) on the photosensitive resin layer (B), a photosensitive resin laminate can be produced.

The production of a printed circuit board using the photosensitive resin laminate, and the production of a mask material for metal working and sand blasting can be carried out by known techniques. The method will be briefly described below. A laminating step in which the protective layer of the photosensitive resin laminate is peeled off and the substrate is adhered to the substrate using a hot roll laminator, and a photomask having a desired fine pattern is adhered to the support and exposed using an active ray source. A fine resist pattern can be formed on the substrate by performing the steps of dissolving and removing the unexposed portion of the photosensitive resin layer using an alkali developer after removing the support.

The actinic light source used in the exposure step includes a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, an ultraviolet fluorescent lamp, a carbon arc lamp, a xenon lamp, and the like. In order to obtain a finer resist pattern, it is more preferable to use a parallel light source. Examples of the alkali developing solution used in the developing step include an aqueous sodium carbonate solution and an aqueous surfactant solution.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below in more detail with reference to examples. The evaluation in Examples and Comparative Examples was performed by the following method. (1) Resolution The exposure was performed through a line pattern in which the width of the exposed part and the unexposed part at the time of exposure was 1: 1. Developing was performed for a developing time 1.5 times the minimum developing time, and the minimum mask width at which the cured resist lines were normally formed was defined as the resist line resolution. According to this resolution, ranking was performed as follows. 70 μm or less: ○ Over 70 μm and 100 μm or less: Δ Over 100 μm: ×

(2) Pattern Width Exposure was performed through a line pattern in which the width of the exposed portion and the unexposed portion during exposure was 1: 1. Develop with a development time 1.5 times the minimum development time, measure the resist pattern width with a mask line width of 100 μm, and calculate Δ (resist pattern width) −
(Mask line width) 算出 was calculated, and the following ranking was performed based on the calculated value. 5 μm or less: ○ More than 5 μm and 10 μm or less: Δ More than 10 μm: ×

(3) Adhesion The film was exposed to light through a line pattern in which the width of the exposed portion and the unexposed portion during exposure was 1: 100. 1. Minimum development time
The development was performed for five times the developing time, and the minimum mask width at which the cured resist line was normally formed was defined as the resist line adhesion value. The adhesion was ranked as follows. 50 μm or less: ○ Over 50 μm and 70 μm or less: Δ Over 70 μm: ×

[0046]

EXAMPLES Examples 1 and 2 and Comparative Examples 1 to 4 (Preparation of photosensitive resin laminate) A photosensitive resin composition having the composition shown in Table 1 was mixed, and a solution of the photosensitive resin composition having a thickness of 20 was obtained.
The resultant was uniformly coated on a μm polyethylene terephthalate film using a bar coater and dried in a drier at 90 ° C. for 4 minutes to form a photosensitive resin layer having a thickness of 40 μm. Next, a 30 μm-thick polyethylene film was laminated on the surface of the photosensitive resin layer to obtain a photosensitive resin laminate.

(Substrate to be processed) As a substrate to be processed for sandblasting, soda glass coated with glass paste and produced by the following method was used. On a soda glass, a white glass paste for plasma display (PLS-3551 manufactured by Nippon Electric Glass Co., Ltd.) is applied and dried on the soda glass using a screen printing method so that the dried thickness of the glass paste becomes 150 μm. A glass paste-coated soda glass was produced.

(Lamination) While peeling off the polyethylene film of the photosensitive resin laminate, the photosensitive resin laminate was laminated on a substrate to be processed at 105 ° C. using a hot roll laminator (“AL-70” manufactured by Asahi Kasei Kogyo). Air pressure is 3.5kg /
cm ² gauge, lamination speed 1.0m / min
And

(Exposure) The photosensitive resin layer was exposed at 150 mJ / cm ² by a super high pressure mercury lamp (HMW-801 manufactured by Oak Manufacturing Co., Ltd.) through a photomask required for evaluation. (Development) After peeling off the polyethylene terephthalate film, a 1% aqueous solution of sodium carbonate at 30 ° C. was sprayed for a predetermined time to dissolve and remove unexposed portions of the photosensitive resin layer.

Table 1 shows the compositions and results of Examples and Comparative Examples. The composition abbreviations shown in Table 1 are as follows. P-1: 35% methyl ethyl ketone solution of a copolymer having a composition of methacrylic acid / methyl methacrylate / acrylonitrile (weight ratio: 23/52/25) and having a weight average molecular weight of 130,000.

O-1: Urethane prepolymer A (Production of urethane prepolymer A) Poly (ethylene glycol adipate) diol (hydroxyl value 56.1) 20
0 parts by weight and dibutyltin dilaurate 0.01 as a catalyst
g in a reaction vessel and mixed well. After adding 23.0 parts by weight of m-xylylene diisocyanate and stirring well, the external temperature was raised from 40 ° C. to 80 ° C. and allowed to react for about 5 hours, followed by 2-hydroxyethyl acrylate (molecular weight 116 ) Was added and the mixture was stirred well.
When the reaction was completed for about 2 hours, the reaction was stopped to obtain a urethane prepolymer A. The number average molecular weight of urethane prepolymer A was 15,000.

M-1: Trimethylolpropane triacrylate I-1: Benzophenone I-2: Michler's ketone I-3: 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer D-1: Leuco crystal violet D-2: Diamond Green A-1: Solvent Yellow 33

[0053]

[Table 1]

[0054]

Industrial Applicability The photosensitive resin composition of the present invention and the photosensitive resin laminate using the same can be used for producing a printed circuit board, a masking material for metal working and sandblasting without lowering the adhesion. Halation on the surface is prevented, the width of the pattern is suppressed from increasing, the resolution is excellent, and a fine pattern can be formed on the substrate with high yield.

Claims (3)

[Claims] (1) an alkali-soluble polymer compound,
In a photosensitive resin composition containing (ii) an ethylenically unsaturated addition-polymerizable monomer and / or oligomer and (iii) a photopolymerization initiator, (iv) 400 nm or more and 450 nm or more.
A photosensitive resin composition comprising a compound having an absorption wavelength range of 0.01% by weight or more and 0.1% by weight or less. 2. The photosensitive resin composition according to claim 1, wherein the compound (iv) is a quinophthalone dye. 3. A photosensitive resin laminate having a photosensitive resin layer (B) comprising the photosensitive resin composition according to claim 1 on a support (A).