JPH11168278A5 - - Google Patents
Info
- Publication number
- JPH11168278A5 JPH11168278A5 JP1997334403A JP33440397A JPH11168278A5 JP H11168278 A5 JPH11168278 A5 JP H11168278A5 JP 1997334403 A JP1997334403 A JP 1997334403A JP 33440397 A JP33440397 A JP 33440397A JP H11168278 A5 JPH11168278 A5 JP H11168278A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- film containing
- containing copper
- conductive film
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
【０００５】
【発明が解決しようとする課題】
上述した従来技術のうち、セラミック多層基板の内部に、銀を主成分とする導体を形成し、表面に銅を主成分とする導体パターンを、厚膜印刷法の適用により形成する技術には、前述したような利点があるけれども、次のような解決しなければならない問題点も抱えている。
[0005]
[Problem to be solved by the invention]
Of the above-mentioned conventional technologies, the technology of forming a conductor mainly composed of silver inside a ceramic multilayer substrate and forming a conductor pattern mainly composed of copper on the surface by applying a thick film printing method has the advantages described above, but also has the following problems that must be solved.
Claims (1)
前記別の導体パターンは、銅を主成分とする導体膜でなる電子部品。 8. The electronic component according to claim 7 ,
The other conductive pattern is an electronic component made of a conductive film containing copper as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33440397A JP3998079B2 (en) | 1997-12-04 | 1997-12-04 | Electronic component and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33440397A JP3998079B2 (en) | 1997-12-04 | 1997-12-04 | Electronic component and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11168278A JPH11168278A (en) | 1999-06-22 |
| JPH11168278A5 true JPH11168278A5 (en) | 2005-07-21 |
| JP3998079B2 JP3998079B2 (en) | 2007-10-24 |
Family
ID=18276985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33440397A Expired - Lifetime JP3998079B2 (en) | 1997-12-04 | 1997-12-04 | Electronic component and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3998079B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006302972A (en) * | 2005-04-15 | 2006-11-02 | Alps Electric Co Ltd | Wiring board and manufacturing method thereof |
-
1997
- 1997-12-04 JP JP33440397A patent/JP3998079B2/en not_active Expired - Lifetime
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