JPH11150404A - Semiconductor mounting parts and mounting method - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a semiconductor mounting component capable of easily obtaining optimum electromagnetic coupling regardless of the type of a semiconductor chip and its RF characteristics. Another object is to provide such a mounting method. SOLUTION: A semiconductor mounting apparatus having a structure capable of adjusting a distance between an input / output electrode of a semiconductor chip, an I / O lead of a package, and a bonding component for electromagnetically coupling the both is used. It is possible to easily and optimally adjust the degree of electromagnetic coupling between the input / output electrodes of the semiconductor chip and the I / O leads of the package, and can be commonly applied to multiple types of semiconductor chips with different RF characteristics and shapes. Yes, cost, labor and time during production can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the mounting of microwave and millimeter wave semiconductor chips. In particular, it relates to electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package.

[0002]

2. Description of the Related Art Conventionally, in mounting a semiconductor chip,
As shown in FIG. 3, a semiconductor chip 13 is mounted on a mounting package 11 by a metal layer 12 such as AuSn, and then an RF pad 14 formed on the semiconductor chip 13 and an I The most common method is to join the / O lead 15 with a bonding wire 31 such as Au.

However, in this method, the semiconductor chip 13
When the operating frequency of the bonding wire 31 shifts from a microwave to a millimeter wave range (30 GHz or more), the inductance, capacitance, resistance, and the like of the bonding wire 31 increase, causing deterioration of the input / output characteristics. Therefore, a method of electromagnetically coupling the RF pad 14 and the I / O lead 15 in a non-contact manner has been devised as a mounting method particularly for millimeter waves. That is, as shown in FIG.
a and the ground electrode 16b
It is inserted between the pad 14 and the I / O lead 15, and the input / output electrode 16a and the RF pad 14
In this method, a certain interval A is provided between the / O lead 15 and electromagnetic coupling in a non-contact manner.

[0004]

In the above-described method of electromagnetically coupling in a non-contact manner, the input / output electrode 16a and the RF
The distance A between the pad 14 and the I / O lead 15 is important, and an error of only a few μm causes RF characteristic deterioration. Therefore, a high degree of dimensional accuracy is required at the time of manufacturing, and there is a problem that cost, time, and labor are required.

In mounting a plurality of types of semiconductor chips having different RF characteristics and shapes, a bonding projection 31 having a height corresponding to an optimum interval A is manufactured in order to obtain an optimum electromagnetic bonding. Alternatively, the joining part 16 having a shape adjusted to the optimum interval A is manufactured, and in this respect, there is a problem in that manufacturing time, time, and cost are required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor mounting device capable of easily obtaining optimum electromagnetic coupling regardless of the type of a semiconductor chip and its RF characteristics.
Another object is to provide such a mounting method.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor mounting component having a structure capable of adjusting the degree of electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package. It is characterized by the following.

Further, a semiconductor mounting component of the present invention has a joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package, and the input / output electrode and the I / O electrode. It has a structure capable of adjusting the distance between the lead and the joint component.

Further, a semiconductor mounting component according to the present invention includes a bonding component for performing electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package, and a mounting component for mounting the bonding component to a package. A package having a structure to which the attachment component can be attached, and wherein the attachment component has a structure capable of adjusting a distance between the input / output electrode and the I / O lead and the joining component. I do.

A semiconductor mounting component according to the present invention includes a joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package; a supporting component for supporting the joining component; A mounting component for mounting the joining component and the support component to a package; and a package having a structure to which the mounting component can be mounted, and wherein the mounting component includes the input / output electrode, the I / O lead, It is characterized in that it has a structure capable of adjusting the distance to the joint parts.

[0010] The semiconductor mounting component of the present invention is characterized in that it has a mounting component comprising a spring and an adjusting screw.

Further, the semiconductor mounting method of the present invention is characterized in that a semiconductor mounting component having a structure capable of adjusting the degree of electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package is used.

Further, the semiconductor mounting method of the present invention has a joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package, and the input / output electrode and the I / O electrode. It is characterized in that a semiconductor mounting component having a structure capable of adjusting a distance between a lead and the bonding component is used.

Further, according to the semiconductor mounting method of the present invention, a bonding component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package is mounted on a package using a mounting component, and the mounting is performed. Depending on the parts
The distance between the input / output electrode and the I / O lead and the joining component is adjusted.

Further, according to the semiconductor mounting method of the present invention, a bonding component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package is supported using a supporting component, and these are mounted on a mounting component. And the distance between the input / output electrode and the I / O lead and the joining component is adjusted by the attaching component.

Further, the semiconductor mounting method of the present invention is characterized in that a mounting component comprising a spring and an adjusting screw is used.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention is shown in FIG. 1 and will be described below. Au on the package 11
A semiconductor chip 13 is mounted by a metal layer 12 such as Sn. The package 11 is provided with I / O leads 15 and the semiconductor chip 13 is provided with RF pads 14 so as to have substantially the same height. A joining component 16 for performing electromagnetic coupling is made of a resin such as epoxy, and Au, Al is provided on a surface facing the I / O lead 15 and the RF pad 14.
An input / output electrode 16a and a ground electrode 16b made of the same metal are formed. The ground electrode 16b is connected to the bonding component 16
Is connected to the metal support component 17 through a hole penetrated therethrough, or is integrated therewith. The support component 17 is attached to the package 11 by a metal adjusting screw 18, and a spring 19 is inserted between the support component 17 and the package 11. In the mounting apparatus having such a structure, the supporting screw 1 is operated by operating the adjusting screw 18.
7 and the joining part 16 can be moved up and down, and the distance A can be adjusted optimally. Further, even when the semiconductor chip 13 having completely different RF characteristics and shapes is mounted, the package 11 and the joining component 16 can be shared.

Another embodiment of the present invention is shown in FIG. 2 and described below. The semiconductor chip 13 is mounted on the package 11 via a bump receiving electrode 22 and a bump 21 by a flip chip method. Package 1
1 has an I / O lead 15 and a semiconductor chip 13 has an RF
The pads 14 are provided so as to have substantially the same height. A joining component 16 for performing electromagnetic coupling is made of a resin such as epoxy, and includes an I / O lead 15 and an RF pad 14.
The input / output electrode 1 made of a metal such as Au, Al
6a and a ground electrode 16b are formed. The ground electrode 16b is connected to the metal adjustment screw 18 through a hole penetrated through the joint component 16, or is integrated with the metal adjustment screw 18. The adjusting screw 18 is attached to the package 11, and a spring 19 is inserted between the adjusting screw 18 and the package 11. In the mounting device having such a structure, the supporting component 17 and the joining component 16 can be moved up and down by operating the joining component 16 or the adjusting screw 18, and the interval A can be adjusted optimally. Further, even when the semiconductor chip 13 having completely different RF characteristics and shapes is mounted, the package 11 and the joining component 16 can be shared.

[0018]

According to the present invention, it is possible to easily and optimally adjust the degree of electromagnetic coupling between the input / output electrodes of the semiconductor chip, the I / O leads of the package, and the joining components. In addition, it can be commonly applied to a plurality of types of semiconductor chips having different RF characteristics and shapes.
Time and effort can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing another embodiment of the present invention.

FIG. 3 is a sectional view showing a conventional technique.

FIG. 4 is a cross-sectional view showing another conventional technique.

DESCRIPTION OF SYMBOLS 11 Package 12 Metal layer 13 Semiconductor chip 14 RF pad 15 I / O lead 16 Bonding component 16a Input / output electrode 16b Ground electrode 17 Supporting component 18 Adjustment screw 19 Spring 21 Bump 22 Bump receiving electrode 31 Bonding wire 41 Joint protrusion

Claims (10)

[Claims] 1. A semiconductor mounting component having a structure capable of adjusting the degree of electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package. 2. A bonding component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package, and a distance between the input / output electrode and the I / O lead and the bonding component. The semiconductor mounting component according to claim 1, wherein the semiconductor mounting component has a structure capable of adjusting the height. 3. A joining component for performing electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package;
The package comprises a mounting component for mounting the bonding component to a package, and a package having a structure to which the mounting component can be mounted, and the mounting component is provided between the input / output electrode and the I / O lead and the bonding component. 2. The structure according to claim 1, wherein the distance is adjustable.
Or the semiconductor mounting component according to claim 2. 4. A joining component for performing electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package;
A support component for supporting the joining component, an attachment component for attaching the joining component and the support component to a package, and a package having a structure to which the attachment component can be attached, and wherein the attachment component is The semiconductor mounting component according to claim 1, wherein the input / output electrode and the I / O lead have a structure capable of adjusting a distance between the bonding component. 5. The semiconductor mounting component according to claim 1, further comprising a mounting component comprising a spring and an adjusting screw. 6. A semiconductor mounting method using a semiconductor mounting component having a structure capable of adjusting the degree of electromagnetic coupling between input / output electrodes of a semiconductor chip and I / O leads of a package. 7. A joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package, and a distance between the input / output electrode and the I / O lead and the joining component. 7. The semiconductor mounting method according to claim 6, wherein a semiconductor mounting component having a structure capable of adjusting the temperature is used. 8. A joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package is attached to the package using an attaching component, and the input / output electrode and the connecting portion are attached by the attaching component. 8. The semiconductor mounting method according to claim 6, wherein an interval between the I / O lead and the bonding component is adjusted. 9. A joining component for performing electromagnetic coupling between an input / output electrode of a semiconductor chip and an I / O lead of a package is supported using a supporting component, and these are attached to the package using an attaching component. Depending on the mounting parts,
The semiconductor mounting component according to claim 6, wherein a distance between the input / output electrode and the I / O lead and the joining component is adjusted. 10. The semiconductor mounting component according to claim 6, wherein a mounting component comprising a spring and an adjusting screw is used.