JPH11150059A - Semiconductor device manufacturing method and apparatus, and projection exposure apparatus - Google Patents

Abstract

(57) [Summary] [Problems] Maintain high productivity, and even in the next generation,
An object of the present invention is to provide a method of manufacturing a semiconductor device, an apparatus thereof, and a projection exposure apparatus which do not increase the price of a wafer, change the dimensions of the apparatus, and do not cause deterioration in accuracy or the like. SOLUTION: A wafer, which is a cylindrical thin plate cut out from a silicon ingot, is cut into a size not more than 1.1 times the exposure area of a projection exposure optical system to obtain a square chip 1. The angular chip 1 contains several to several tens of semiconductor elements that will eventually be products. In the exposure step, there is a means capable of processing in units of square chips, and in steps other than the exposure step, for example, in the etching step,
It has a means for arranging the chips 1 in a horn shape on a tray and processing them collectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for manufacturing a semiconductor element or a liquid crystal display element and a projection exposure apparatus for manufacturing the element and the like, which aims at high-speed processing of a substrate such as a semiconductor wafer and improvement in productivity. is there.

[0002]

2. Description of the Related Art Conventionally, in order to manufacture a semiconductor element or the like, for example, a cylindrical thin wafer is cut out from a silicon ingot, and steps such as exposure, development, etching, doping, and vapor deposition are repeated several times. A plurality of semiconductor elements (chips) are formed thereon. Then, the wafer is cut, separated into chips, bonded for each chip, and molded to complete a semiconductor device.

In order to produce a next-generation semiconductor device having higher performance, high productivity is required while maintaining higher accuracy. As in the case of shifting from 150 mm to 200 mm, the wafer size was changed from the current 200 mm to 30 mm.
By shifting to 0 mm, the cost of the entire device manufacturing is being reduced.

[0004]

As described above, when the wafer size is increased, there are more problems than when the wafer is shifted to 200 mm. For example, a large-diameter wafer having a low defect density is more expensive than the area. On the other hand, the cost of wafers alone is increasing. However, they are trying to achieve cost effectiveness by improving the efficiency per chip of other manufacturing equipment. However, 400mm and 5
When the thickness is increased to 00 mm, the cost of the wafer is further increased, exceeding the efficiency of other devices, and there is a possibility that the cost merit may be lost as a whole of the device manufacturing.

[0005] The size of a manufacturing apparatus such as an exposure apparatus also increases in proportion to the wafer size. At present, the control unit and the like are arranged vertically to reduce the apparent footprint. However, even in this system, not all units can be arranged vertically, and there is a limit in trying to implement it forcibly, because accuracy is deteriorated and maintenance is deteriorated. 400mm or 500
The era of mm is expected to expand the equipment again.

From the viewpoint of accuracy, in the exposure apparatus, the factor of instability during processing was negligible at the time of 200 mm.
It is expected that 0 mm will lead to accuracy degradation. Also,
The mirror for measuring the position of the exposure stage is also far from the center of the wafer, and the situation of the center of exposure is monitored from a distance, so that the accuracy is easily deteriorated. 400m
After m, further deterioration in accuracy is expected.

[0007] From 200 mm to 300 mm, the weight of the exposure stage increases. For this reason, the stage speed is reduced, and as a result, productivity is reduced. Using ceramics etc. to improve the specific rigidity and make the speed the same, even if the accuracy and productivity equivalent to 200mm can be secured even at 300mm, after 400mm, higher production is maintained while maintaining higher accuracy. It is difficult to maintain sex.

As described above, at 300 mm, even if high productivity can be achieved by a method of increasing the wafer size, further enlargement of the wafer size causes an increase in the price of the wafer, enlargement of the apparatus size, deterioration of accuracy, and the like. And lose the merit.

The stage that is heavier due to the increase in wafer size has problems other than accuracy. In order to secure higher production (throughput) than before, the acceleration of the stage is in a direction of increasing. Due to the acceleration, the required driving force increases. Part of the generated force excites the factory floor. For example, if the stage becomes heavier by an area ratio of 200 mm to 300 mm and the acceleration is doubled, a force of 2.25 * 2 = 4.5 times is required. Naturally, the force for exciting the floor is also increased by 4.5 times. This force shakes other manufacturing equipment and degrades the performance of other equipment. This can be countered to some extent by increasing the rigidity of the building of the factory or the like, but as a result, there is a problem that the construction cost and the construction period of the factory are increased, which leads to an increase in the manufacturing cost of the semiconductor element.

Therefore, the present invention provides a semiconductor device which maintains high productivity, does not increase the price of a wafer, does not change the device dimensions, and further does not cause deterioration in accuracy or the like even in the next generation. It is an object to provide a manufacturing method, an apparatus therefor, and a projection exposure apparatus.

[0011]

According to the present invention, in order to solve the above-mentioned problems, a cylindrical thin wafer cut from a silicon ingot is further subjected to an exposure area of 1.1 times or less of a projection exposure optical system. After the wafer is cut (diced) to dimensions to form square chips, a photosensitive material is applied, and exposure and development are performed in the same manner as before. Then, processes such as etching, doping, and vapor deposition are performed, and the process returns to the exposure process again, and the same operation is repeated several times. The above-mentioned square chip contains several to several tens of semiconductor elements which are finally manufactured. The exposure device is
There is provided a unit capable of processing the above-mentioned square chips. In steps other than the exposure step, batch processing is more efficient than in the past, for example, in an etching step, squared chips can be collectively processed by arranging them on a tray or an adhesive tape as shown in FIGS. Have the means. After the above process is completed, the square chip on which the semiconductor element (chip) is formed is further cut into final product units, bonded and molded for each product chip, and the semiconductor element is completed.

In particular, in the projection exposure apparatus, the first means shown in FIG. 1 includes a photosensitive substrate supply / recovery section 3, a substrate coarse positioning section 4, and a substrate precision positioning section for processing the angular chips. 5, the exposure unit 6 is divided into four stations. Four stages 7 around this station,
8, 9, and 10 move. First, the photosensitive substrate 1 is supplied to the stage 7, and when the supply is completed, the stage 7 has a means capable of moving to the next station, that is, the substrate coarse positioning unit 4, and the stage 7 is located at the place where the stage 8 was.
Goes. The stage 8 can move to the position where the stage 9 was, and the stage 10 has means for moving to the position of the stage 7. As a result, one position shifts. The stage 10 that has arrived at the photosensitive substrate supply / recovery unit 3 receives a supply of a new photosensitive substrate. At the same time, the photosensitive substrate on the stage 7 is subjected to the substrate rough positioning by the substrate rough positioning unit 4.
When the operations of supplying the photosensitive substrate and performing the rough substrate alignment are completed, the stage is moved by one. Previous stage 1
A new photosensitive substrate is supplied to the stage 9 in the same manner as in step 0. At the same time, the photosensitive substrate on the stage 10 is subjected to a coarse substrate alignment operation, and the photosensitive substrate on the stage 7 is subjected to a substrate precise alignment operation. As described above, by means capable of always performing parallel processing at each of the stations where the projection exposure step is divided, when the processing is completed, the apparatus moves to the next step, the station. Then, the exposed photosensitive substrate is taken out at the station of the photosensitive substrate supply / recovery section 3, and at the same time, the projection exposure apparatus receives supply of a new photosensitive substrate. Focusing only on the station of the exposure unit 6, when the exposure is completed, the next stage moves with the positioned photosensitive substrate. Then, it is exposed immediately. The apparatus is provided with means capable of repeating stage movement, exposure, stage movement, and exposure and performing continuous operation without interruption.

FIG. 5 shows a second means according to the present invention. In the first means shown in FIG. 1, four stations are arranged on the circumference, but in the present means, they are arranged on a straight line. That is, the photosensitive substrate supply / recovery section 33, the substrate coarse positioning section 34, the substrate precision positioning section 35, and the exposure section 3
6 stations, along which there are four stages 37,38,39,40,
Further, since the stage that has been exposed by the exposure unit 36 cannot return to the station 33 immediately, the stage 41 is provided as an intermediate stage. The movement of the stage is basically the same as in FIG. Each station has means capable of performing parallel processing, and when processing is completed, each stage has means capable of moving to the next station. Focusing only on the station of the exposure unit 36, when the exposure is completed, the next stage moves with the positioned photosensitive substrate. Then, the exposure is performed immediately. Stage movement, exposure, stage movement, and exposure are repeated, and are means capable of continuous operation without interruption.

In the present invention, the means for improving the productivity is to cut the photosensitive substrate to a size of 1.1 times or less the exposure area of the shadow exposure optical system without increasing the wafer size. . Therefore, the wafer before cutting is 300m
m or more, a conventional 200 mm wafer may be used, and since the wafer diameter is not increased, the defect density of the wafer does not increase. In addition, the thickness of the wafer required to prevent the deflection of the wafer under its own weight in the carrier or the like is not required, and the thickness can be reduced to the conventional value, and the wafer cost can be greatly reduced. On the other hand, a projection exposure apparatus is provided with a station capable of performing parallel processing even in the case of a cut photosensitive substrate in order to maintain productivity higher than before.
In the first means, the stations 3, 4, 5, 6 are formed in a cylindrical shape.
And stages 7, 8, 9, and 10 whose circumferences correspond to the stations are arranged. At each station, photosensitive substrate supply / collection, substrate coarse positioning, substrate precision positioning, and exposure are performed. Since they are operated in parallel, apparently, the conventional alignment and exchange time of the photosensitive substrate are eliminated, and it appears that only the exposure and the stage movement are always performed, thereby improving the throughput (productivity). Furthermore, the size of the moving photosensitive substrate is reduced to several tenths or less of the conventional size, the weight is reduced, and the stage stroke can be reduced. As a result, the moving load of the stage is reduced. Because the moving load has become lighter, it is possible to use the existing actuator to generate more acceleration than ever. Furthermore,
By reducing the weight, the natural frequency is increased, the control characteristics of the stage are improved, and the stage positioning time is shortened. As a result, the throughput is greatly improved.
In addition, because the weight of the stage can be reduced, the object can be moved with a small force, and the vibration force that vibrates the factory floor, which has been a problem in the past, becomes proportionally smaller, causing the other manufacturing equipment to shake. Without deteriorating the performance of other devices. As a result, it is not necessary to increase the rigidity of the building of the factory, the construction period of the factory can be shortened, the construction cost can be reduced, and finally, the manufacturing cost of the semiconductor element can be reduced.

For devices other than the exposure device, which are better processed simultaneously than divided processes, see FIGS.
By arranging them on a tray, processing can be performed as before. 300m tray size
If it is larger than m, the productivity is further improved.

In the second means, the stations are not arranged on a cylinder but arranged on a straight line. In the cylindrical arrangement, useless spaces are likely to be formed at the four corners, but by arranging them in a straight line, the size of the projection exposure apparatus can be further reduced. In general, in linear position measurement and rotational position measurement, linear movement is generally better, and thus it may be advantageous in terms of accuracy.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method and an apparatus for manufacturing a semiconductor device according to the present invention will be described below with reference to FIGS.

A wafer, which is a thin cylindrical plate cut out from a silicon ingot, is cut (diced) and is cut into a wafer shown in FIG.
A square chip 101 shown in FIG. Chip 101
Has two semiconductor elements 102 and 103 formed therein. The vertical and horizontal dimensions of the chip 101 are defined by the mathematical formula 1, and the thickness is 1.0 mm or less.

[0019]

## EQU1 ## Vertical dimension; (an integral multiple of the vertical dimension of the size of the completed semiconductor element) + (width required for dividing and cutting each semiconductor element) × (vertical number of semiconductor devices-1) ; (Integer multiple of horizontal dimension of completed semiconductor device)
+ (Width required for dividing and cutting each semiconductor element) ×
In this example, the semiconductor element 102 and the semiconductor element 10
3 are the same and have the same dimensions, and the vertical dimension β of the angular chip 101 is (twice the vertical dimension of the semiconductor element) + (the width required for dividing and cutting into semiconductor elements). The lateral dimension α is equal to the lateral dimension of the semiconductor element. The square chip 105 shown in FIG. 2B shows a case where three semiconductor elements are included. Also in this case, three times the vertical dimension of the semiconductor element 104 + the required cutting width * 2 is the vertical dimension of the square chip 105. The vertical dimension α and the horizontal dimension β are not only integral multiples of the semiconductor element, but also must be within the exposure range of the projection exposure apparatus. However, in order to prevent uneven coating of the photosensitive material and flare at the outermost peripheral edge portion of the exposure, a large value may be set in a range of 1.1 times or less of the exposure range. This portion has no function as a semiconductor element, and will be removed later. Useless parts increase the manufacturing cost, so it is natural to take them as small as possible. In this embodiment, the case where two and three semiconductor elements are arranged vertically is shown, but any number of semiconductor elements may be arranged vertically and horizontally as long as they are in a projection exposure range.

The angular chip 1 thus formed
In steps 01 and 105, a photosensitive material is applied and exposure and development steps are performed as in the conventional case. Then, processes such as etching, doping, and vapor deposition are performed, and the process returns to the exposure process again, and the same operation is repeated several times. The projection exposure apparatus is provided with a unit capable of processing the above-mentioned square chips.
In steps other than the exposure step, batch processing is more efficient than in the past, for example, in an etching step, squared chips can be collectively processed by arranging them on a tray or an adhesive tape as shown in FIGS. It has become. After the above steps are completed, the square chip on which the semiconductor element (chip) is formed is further cut into final product units, bonded and molded for each product chip, and the semiconductor element is completed.

In the present embodiment, the shape may be described as a square chip, or may be a polygon or a circle inscribed in the range enclosed by the vertical and horizontal formulas. Depending on the shape of the completed semiconductor device,
There is no problem with triangles.

FIG. 3 shows a case where the angular chips 21 are arranged on a tray 22 in order to collectively process the angular chips. In the example of this figure, there are a total of 48 rows, 6 rows vertically and 8 rows horizontally. Reference numeral 25 indicates a cross section of the tray 22. In the drawing, the right-handed angular chip 24 is being set on the tray 25, and the remaining seven angular chips 26 are already set on the tray 25. Reference numeral 27 indicates a hole through which a driving unit for attaching and detaching the angular chip 26 to and from the tray 22 passes, and reference numeral 28 indicates a rod 28 which constitutes a part of the driving unit. A horn-shaped tip 24 is placed at the tip of a rod 28 with a hand (not shown). After this,
The rod 28 is lowered and placed on the tray 25. Tray 2
The depression 5 has almost the same size as the square chip, and is positioned when the square chip 24 lands on the tray 25. The depth of the depression is equal to or smaller than the thickness of the angular chip 24. When it is necessary to fix the angular chip 24 to the tray, it is held using negative pressure, static electricity, an adhesive, or the like (not shown). As another holding method, the outer periphery of the angular tip 24 may be mechanically clamped.

FIG. 4 shows another tray shape.
This is a means for making the present invention applicable without modifying a conventional apparatus for processing wafers. The outer shape of the tray 23 has the same outer shape as, for example, 12 inches. The cross-sectional shape is the same as in FIG.
It is set in the same way as in 2. Since the outer shape is the same as that of a 12-inch wafer, existing carriers for storing and transporting wafers can be used as they are. By adopting this tray, without changing existing equipment,
An efficient system can be provided. Completely, the tray need not conform to the values specified in the SEMI standard. Of course, any number may be used as long as the semiconductor manufacturing apparatus allows. However, in order to ensure the commonality between the devices, 2 mm or less is selected.

Further, even if it is necessary to increase the efficiency of batch processing by changing the size to 16 inches, it is only necessary to change the size of the tray, and it is not necessary to change the dimensions of the square chips. Naturally, there is no need to make the size of the ingot such as Si which is the base material for making the semiconductor element 16 inches,
Silicon manufacturing becomes easier.

Next, an embodiment of a projection exposure apparatus to which a rectangular chip as a photosensitive substrate according to the present invention is applied will be described based on an embodiment with reference to FIGS.

FIG. 1 shows a first means of a projection exposure apparatus capable of processing a photosensitive substrate formed into a square chip. Reference numeral 1 denotes a horn-shaped chip supplied in a state where a photosensitive material is applied, and reference numeral 2 denotes a chip which is exposed and collected by the present exposure apparatus. The exposure process was divided into four in order to carry out the exposure process. Photosensitive substrate supply / recovery, coarse substrate alignment, precise substrate alignment, and exposure. Stations 3, 4, which can process this process
5 and 6 are sequentially arranged in a cylindrical shape. Stages 7, 8,
9 and 10 are arranged. Each stage has the same function.

Although not shown, this stage measures the position with an interferometer or the like and can control the position.
Since the angular chip is much smaller than the conventional wafer, the mirror for measuring the position of the exposure center and the position of the exposure stage is also close to each other, and the effects of abbe error, thermal deformation and part deformation are reduced. The structure is difficult to receive, and the accuracy is improved. Also, stages 7, 8, 9, 1 for the square chip
The stroke of 0 may be at least twice as long as the tip. The stage becomes lighter and more compact because it is no longer necessary to move a conventional huge wafer. As a result, this stage with improved specific stiffness has the characteristics that, with existing technology, it is possible to achieve higher acceleration and higher speed than ever before, and the positioning settling time is shortened.

Next, the flow of processing of a square chip will be described. At station 3, which has the function of supplying and recovering photosensitive substrate,
The angular chip 1 is supplied from the outside and set on the chuck 11 of the stage 7. Next, the stage 7 moves to the next station 4. This station has the function of coarse substrate alignment. Here, a rough positioning operation is performed on the angular chip on the stage 7. At this time, at the same time, the stage 10 moves to the station 3 and a new angular chip is set on the chuck 14.
The remaining stages 8 and 9 also move to the next station.

When the above two processes are completed, the stage 7 moves to the next station 5. In this station 5, the angular chip on the chuck 11 roughly positioned in the station 4 is accurately positioned. This station measures only the amount of deviation,
When moving to the next exposure station 6, processing may be performed by changing the movement target value by the residual difference. As before,
The stage 10 moves to the station 4 and the chuck 14
The upper angular chip performs a rough positioning operation.
The stage 9 moves to the station 3 and sets a new angular chip on the chuck 13.

When the above three processes are completed, the stage 7 moves to the station 6. This station 6
Then, an exposure operation is performed. At the same time, stage 10
Moves to the station 5 and performs accurate positioning.
The stage 9 moves to the station 4 and performs a rough positioning operation. The stage 8 moves to the station 3 and sets a new angular chip on the chuck 12.

When the above four processes are completed, the stages 7, 8, 9, and 10 return to the initial positions shown in FIG. At the station 3, the angular chips are collected from the chuck 11 on the stage 7, and new angular chips are supplied to the chuck 11 in the same manner as at the beginning. The other stages also move to the next station, and in each station, coarse substrate alignment, precise substrate alignment, and exposure are performed simultaneously. At this point, the initially supplied angular chips are discharged, and one cycle is completed, but this cycle continues.
Each time the stage moves to the next station, new chips are supplied one after another, and chips whose exposure has been completed are continuously discharged.

Once the operation is started, it is possible to continue the operation without stopping except for stopping it for maintenance or the like. Even if a different shape of a square chip is fed in order to manufacture a different semiconductor element on the way, the apparatus is not stopped. That is, unlike the related art, in order to manufacture a different semiconductor element, it is not necessary to discharge all the previous semiconductor elements from the projection exposure apparatus. Naturally, the exchange of the original image (reticle) for manufacturing a different semiconductor element is also performed while the different semiconductor elements have finished processing in the precision alignment station 5 and are moving the stage to the exposure station 6. In this way, parallel processing can be performed so that apparently there is no operation other than exposure and step movement to the next station.

The stages 7, 8, 9, 10 of the present invention may operate independently, but when moving to an adjacent station, the stages can be mechanically connected and rotated. At this time, the rotation of the entire stage is controlled by the position of the stage moving from the precision alignment station 5 to the exposure station 6. During the movement of the station, the angular chip is positioned at 1 μm or less with respect to the target value. This degree of misalignment is negligible when compared to the accuracy required at other stations.
The deviation of 1 μm or less from the target value may be corrected by the exposure station itself, and there is no problem in accuracy. It is of course also possible to connect and move only when the station moves. In addition, it can operate independently on an integrated rotary stage.
Even with one stage, the same function can be performed.

FIG. 5 shows a second means of a projection exposure apparatus capable of processing a photosensitive substrate formed into a square chip. Code 31
Reference numeral 32 denotes a horn-shaped chip supplied in a state where a photosensitive material is applied, and reference numeral 32 denotes a chip which is exposed and recovered by the present exposure apparatus. In this means, as in the first means, in order to carry out the exposure processing, it was divided into four steps of photosensitive substrate supply and recovery, coarse substrate alignment, precise substrate alignment, and exposure. Stations 33, 34, 35 and 36 which can process this step are arranged linearly. The stages 37, 38, 3 correspond to the stations arranged on this straight line.
9, 40 are arranged. Further, since the stage where the exposure is completed in the station 36 where the exposure operation is performed cannot immediately return to the station 33 having the function of supplying and recovering the photosensitive substrate, the stage 41 is provided as an intermediate stage. These five stages have the same function.

Next, the flow of processing of a square chip will be described. The movement of the stage is basically the same as in FIG. Each station has means capable of performing parallel processing, and when processing is completed, each stage has means capable of moving to the next station.

At the station 33 having the function of supplying and recovering the photosensitive substrate, the angular chip 31 is supplied from the outside and set on the chuck 42 of the stage 37. At this time, at the same time, the stage 41 is moving from the station 36 where the exposure operation is performed to the station 33 having the function of supplying and recovering the photosensitive substrate.

Next, the stage 37 moves to the next station 3
Move to 4. This station has the function of coarse substrate alignment. Here, a rough positioning operation is performed on the angular chip on the stage 37. Stage 41
Moves to the station 33 having the function of supplying and recovering the photosensitive substrate, and sets a new angular chip on the chuck 46. The stage 40 is moving to the station 33. The other stages 39 and 38 also move to the adjacent stations.

When the above two processes are completed, the stage 37 moves to the next station 35. In this station 35, the angular chip on the chuck 42 roughly positioned in the station 34 is accurately positioned. The stage 41 moves to the station 34, and the rectangular chips on the chuck 46 are roughly positioned. The stage 40 moves to the station 33 and sets a new angular chip on the chuck 45. The stage 39 is moving to the station 33.

After the above processing is completed, the stage 37 moves to the station 36. In this station 6, an exposure operation is performed. Stage 41 is station 3
Move to 5 for accurate positioning. The stage 40 moves to the station 34 and performs a rough positioning operation. The stage 39 moves to the station 33 and sets a new angular chip on the chuck 44. The stage 38 is moving to the station 33.

Next, the stage 37 is moving to the station 33. Stage 41 is station 3
Then, the process moves to Step 6 to expose the square chips. Stage 40
Moves to the station 35 for accurate positioning.
The stage 39 moves to the station 34 and performs a rough positioning operation. The stage 38 sets a new angular chip on the chuck 43.

When the above five processes are completed, the stages 37, 38, 39, 40 and 41 return to the initial positions shown in FIG. The station 33 collects the angular chips from the chuck 42 on the stage 37 and, as in the beginning,
A new angular tip is supplied to the chuck. The other stages also move to the next station, and in each station, the substrate coarse positioning unit, the substrate precision positioning unit, the exposure unit, and the photosensitive substrate supply / recovery unit are simultaneously moved to the respective stations. At this point, the initially supplied angular chips are discharged, and one cycle is completed, but this cycle continues as in the case of the first means. Each time the stage moves to the next station, new chips are supplied one after another, and chips whose exposure has been completed are continuously discharged.

By such a continuous operation + parallel processing,
The apparently unnecessary chip supply / recovery time and alignment time are eliminated, and the productivity can be improved at least 1.5 times or more.

Here, the stage on which the chuck holding the angular chip is mounted at each station is described as being moved to each station. However, if the relationship between the chuck and each stage is maintained, the chuck holding the chip may be moved. May move on each stage.

[0044]

As described above, according to the present invention, the semiconductor manufacturing process for single-wafer processing or batch processing can reduce the productivity by using trays even when the wafer size is required to be further increased. However, there is the same effect as increasing the apparent wafer size. Thereby, the production cost can be reduced. Also, the manufacture of the wafer itself, such as Si, which is the base material for making semiconductor elements,
Since the chips are square, a conventional ingot of, for example, 8 inches can be used without being affected by a change in wafer size. Therefore, it is possible to suppress an increase in the cost of manufacturing the wafer. Since the size of the ingot is not changed, it is possible to concentrate on the improvement of the defect density which determines the yield (price) of the wafer, and it is possible to supply a good quality base material. As the size of the wafer increases, the tendency to increase in thickness can also be prevented. As a result, it is possible to reduce the amount of expensive raw materials used, and not only to reduce costs, but also to reduce electric power and the like required during manufacturing.
It has the effect of achieving energy saving.

Further, the projection exposure apparatus to which the present invention can be applied always performs processing in units of chips even in the era of apparent wafer dimensions of 400 mm and 500 mm. There is an effect that the size of the device does not increase. Furthermore, in terms of precision, an exposure stage that only processes small chips is sufficient,
The mirror for measuring the position of the exposure stage is also close to the center of exposure, and the influence of disturbance such as temperature is reduced. Naturally, since this stage is small, the rigidity can be improved even with the same material as the conventional one. Thereby, it is possible to achieve high productivity while maintaining higher accuracy.

Further, since the stage is a small stage, the energy input thereto is small, and the recoil due to the movement of the stage is small. As a result, the amount of vibration applied to the factory floor is reduced, thereby eliminating the need for increasing the rigidity of the factory building required for 300 mm, reducing the factory construction cost, shortening the construction period, and improving the semiconductor device. Contributes to the reduction of manufacturing costs.

By processing for each chip according to the present invention, even in the next generation, high productivity equivalent to a large diameter is maintained without increasing the cost of the wafer, and there is no change in the dimensions of the apparatus. . This has the effect of reducing the manufacturing costs of the entire factory. Further, the projection exposure apparatus also has the effect of improving accuracy and productivity at the same time.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a first means of a projection exposure apparatus having a function capable of parallel processing of a photosensitive substrate obtained by cutting a wafer into square chips according to the present invention.

FIGS. 2A and 2B are plan views of a square chip, wherein FIG. 2A shows a case where two semiconductor elements are included, and FIG.

FIG. 3 is a schematic diagram showing a case where photosensitive substrates cut into square chips are arranged in a square tray for a batch processing apparatus, and FIG.
Is a plan view, and (b) is a front view thereof.

FIG. 4 is a schematic view showing a case where photosensitive substrates cut into square chips are arranged in a round tray for a batch processing apparatus.

FIG. 5 is a schematic view showing a second means of a projection exposure apparatus having a function capable of performing parallel processing on a photosensitive substrate obtained by cutting a wafer into square chips according to the present invention.

[Explanation of symbols]

 1, 2, 31, 32 Chip 3, 33 Photosensitive substrate supply / recovery section (station) 4, 34 Substrate coarse positioning section (station) 5, 35 Substrate precision positioning section (station) 6, 36 Exposure section (station) 7 -10, 37-41 Stage 11-14, 42-46 Chuck 21, 24, 26 Chip 22, 23 Tray (chip holding holder) 25 Cross section 27 Hole 28 Rod 101, 105 Chip 102-104 Semiconductor element

Claims (16)

[Claims] 1. A method of manufacturing a semiconductor device, wherein a size of a photosensitive substrate is set to be 1.1 times or less an exposure area of a projection exposure optical system of a projection exposure apparatus, and a semiconductor device is manufactured in units of the photosensitive substrate. Method. 2. The method according to claim 1, wherein the size of the photosensitive substrate is an integral multiple of the size of the semiconductor device + the width required for dividing and cutting the semiconductor device × (the number of vertical or horizontal semiconductor devices−1), and the thickness is 1 2. The method for manufacturing a semiconductor device according to claim 1, wherein the thickness is not more than 0.0 mm. 3. The method of manufacturing a semiconductor device according to claim 2, wherein the shape of the photosensitive substrate is a polygon or a circle inscribed in the equation of claim 2. 4. The method of manufacturing a semiconductor device according to claim 1, wherein in the semiconductor manufacturing apparatus excluding the projection exposure apparatus, a plurality of the photosensitive substrates are arranged and processed collectively. 5. A projection exposure optical system for projecting a pattern formed on a first original onto a photosensitive substrate, and movable to a predetermined position of the projection optical system while holding the first original and the photosensitive substrate. A projection exposure apparatus having a function of processing a photosensitive substrate having a size of 1.1 times or less the exposure area of the projection exposure optical system. 6. The projection exposure apparatus includes a photosensitive substrate supply / recovery unit, a substrate coarse positioning unit, a substrate precision positioning unit, an exposure unit, and an exposure unit for continuously processing the photosensitive substrate. 6. The projection exposure apparatus according to claim 5, further comprising a stage capable of moving the photosensitive substrate to a next station when the processing is completed. 7. The projection exposure apparatus according to claim 6, wherein the photosensitive substrate supply / recovery section, the substrate coarse positioning section, the substrate precision positioning section, and the exposure section are processed in parallel. 8. At least four or more stages can operate independently, each stage is arranged on a circumference, and a first stage performs a photosensitive substrate supply / recovery process in a photosensitive substrate supply / recovery unit. The second stage performs the substrate coarse positioning process at the substrate coarse positioning unit, the third stage performs the substrate precision positioning process at the substrate precise positioning unit, the fourth stage performs the exposure process at the exposure unit, When the exposure is over, the first stage moves to the substrate coarse alignment section, the second stage moves to the substrate precision alignment section, the third stage moves to the exposure section, and the fourth stage moves again. 7. The projection exposure apparatus according to claim 6, wherein the cycle returns to the photosensitive substrate supply / recovery section, and the cycle is repeated. 9. At least five or more stages can be operated independently, and each stage is linearly arranged. In four stages, photosensitive substrate supply / recovery, substrate rough positioning,
Substrate precision alignment and exposure processing are performed, and the remaining stages are moving to the photosensitive substrate supply / recovery section. After exposure is completed, the stage moves to the next station and moves to the photosensitive substrate supply / recovery section. 7. The projection exposure apparatus according to claim 6, wherein the apparatus returns to the photosensitive substrate supply / recovery section again. 10. Even if there are four or more stages which can be operated independently for each of the four processes of photosensitive substrate supply / recovery, substrate coarse positioning, substrate fine positioning, and exposure, the stages are temporarily controlled so as not to interfere with each other. 7. The projection exposure apparatus according to claim 6, wherein the projection exposure apparatus can be moved like an integrated stage by being mechanically connected to the apparatus. 11. Four or more stages that can operate independently for each of the four processes of supplying and recovering the photosensitive substrate, rough substrate alignment, precise substrate alignment, and exposure, wherein the four stages can be moved simultaneously. 9. The projection exposure apparatus according to claim 8, further comprising a rotary stage. 12. After the first photosensitive substrate is processed,
When the second photosensitive substrate of a different semiconductor product or a different process is sent and the first original image needs to be exchanged, the exchange of the original image is performed while the second photosensitive substrate is sent from the substrate precision alignment unit to the exposure unit. Is performed, and for the first original exchange, the first
7. The projection exposure apparatus according to claim 6, wherein the photosensitive substrate is not entirely discharged from the stage. 13. The projection exposure apparatus according to claim 6, wherein only the photosensitive substrate or an integrated photosensitive substrate and photosensitive substrate holder may move instead of the stage that can move to the next station. 14. The apparatus according to claim 1, wherein the substrate coarse positioning unit and the substrate precision positioning unit or the photosensitive substrate supply / recovery unit and the substrate coarse positioning unit are combined into one station, so that the number of stages can be reduced by one. The projection exposure apparatus according to claim 6. 15. A semiconductor manufacturing apparatus except for the projection exposure apparatus according to claim 5, wherein a plurality of said photosensitive substrates are arranged in a chip holding holder and processed collectively. Manufacturing equipment. 16. The chip holding holder is circular or angular, has a concave for positioning a photosensitive substrate and a hole for attaching and detaching the photosensitive substrate, holds the photosensitive substrate by clamping force, and places the photosensitive substrate in a tray. The thickness is 2 when set to
16. The apparatus for manufacturing a semiconductor device according to claim 15, wherein the diameter is equal to or less than mm.