JPH111589A - Resin composition and heat-resistant tray for ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin composition excellent in balance among electroconductivity, molding processability and heat and heat aging resistances and further shape stability at high temperatures and to provide a heat-resistant tray for IC molded by using the resin composition. SOLUTION: This resin composition contains (C) 1-50 pts.wt. electroconductive carbon in an amount of 1-50 pts.wt. based on 100 pts.wt. mixture having a composition composed of (A) 1-99 wt.% styrene-based polymer having syndiotactic stereoregularity and (B) 99-1 wt.% one or more kinds of polymers other than the component A therein. The heat-resistant tray for IC is molded by using the resin composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a resin composition having an excellent balance of conductivity, moldability, heat resistance and heat aging resistance, and having excellent shape stability even in a process under a high temperature. It relates to a heat-resistant tray for IC.

[0002]

2. Description of the Related Art When an IC component absorbs moisture, when it is heated to 100.degree.
During heating, steam is generated inside, causing blisters or cracks and causing breakage. Therefore, baking is performed at a temperature of 100 ° C. or more. At this time, an IC tray made of a conductive material having a resistance of 108Ω or less is used to protect the IC.

Conventionally, this tray has been made of a polypropylene resin, an atactic three-dimensional polystyrene resin, or the like. Due to the problem, reuse from the conventional disposable is being promoted, and a higher temperature type is required. As a molding material for IC members, Japanese Patent Application Laid-Open No. 2-175754 discloses that a heat deformation temperature is 130 ° C.
As described above, the melt flow index was 3 g / 10 min (JI
S-K7210 compliant, 300 ° C, 10kg load) or more,
A molding material having a molded article having a surface resistance of 107Ω or less and containing at least 50% by weight of a polyphenylene ether resin has been proposed. Specifically, as means for satisfying these physical properties, two methods have been proposed in which an acid imide compound is added to a polyphenylene ether resin / conductive carbon system or a polyphenylene ether resin having a low intrinsic viscosity is used.

Japanese Patent Application Laid-Open No. 2-180958 discloses an IC for an IC molded from a resin composition obtained by adding an ABA ′ type hydrogenated block copolymer elastomer to a polyphenylene ether resin / conductive carbon system. Heat resistant trays have been proposed. However, these materials
The surface of heat aging at high temperature required for high temperature type 1C tray, peeling of molded products, etc. has not been sufficiently solved,
Also, the improvement of the fluidity is insufficient.

[0005] Japanese Patent Application Laid-Open No. 2-285302 has a similar proposal. On the other hand, JP-A-63-15262
No. 8 discloses a polyphenylene ether resin containing carbon-
In the presence of a compound having a carbon double bond, a method for producing a polyphenylene ether resin having an excellent color tone has been proposed by melt-kneading the glass transition temperature of the polyphenylene ether resin or higher in the absence of a radical generator. .

Further, Japanese Patent Publication No. 57-56941 discloses that the impact resistance can be improved by adding a hydrogenated styrene-butadiene-styrene block copolymer to a polyphenylene ether resin. However, the composition shown in this article has problems such as insufficient compatibility, a problem of peeling, and a decrease in fluidity.

Japanese Patent Application Laid-Open No. 2-276823 discloses a polyphenylene ether resin having a cyclized terminal group.
Further, a resin composition comprising this resin and a polystyrene resin has been proposed. Further, JP-A-4-288363
In JP-A-2003-189, conductive carbon was added to a composition comprising a polyphenylene ether resin having a cyclized terminal group, and a block copolymer consisting of two different types of vinyl aromatic compound polymer blocks and olefin compound polymer blocks. A heat-resistant tray material for IC and a heat-resistant tray for IC have been proposed.

However, even in these proposals,
Either the balance of conductivity, moldability, heat resistance, and heat aging properties required for IC heat resistant trays cannot be sufficiently satisfied, or even if they can be satisfied, shape stability in the process at high temperatures Is not satisfied.

[0009]

DISCLOSURE OF THE INVENTION The present invention relates to a resin composition having an excellent balance of conductivity, moldability, heat resistance, and heat aging resistance, and having excellent shape stability even in a process under a high temperature. It is an object of the present invention to provide a heat-resistant tray for IC using the same.

[0010]

SUMMARY OF THE INVENTION In view of the above situation, the present inventors have found that the present invention has an excellent balance between conductivity, moldability, heat resistance, and heat aging resistance, and has been used in a process performed at a high temperature. As a result of intensive studies on a resin composition having excellent shape stability, the present invention has been achieved. That is, the present invention provides (A) 1 to 99% by weight of a styrene polymer having syndiotactic stereoregularity, and
(B) For 100 parts by weight of a mixture of 99 to 1% by weight of one or more polymers other than the component (A),
(C) The present invention relates to a resin composition containing 1 to 50 parts by weight of conductive carbon and a heat-resistant tray for IC molded using the same.

Hereinafter, the present invention will be described in detail. The (A) styrenic polymer having syndiotactic stereoregularity (hereinafter also referred to as syndiotactic polystyrene) used in the present invention has a phenyl group or a substituent on a main chain formed from carbon-carbon bonds. A phenyl group having a three-dimensional structure alternately located in the opposite direction,
The tacticity is quantified by nuclear magnetic resonance (13C-NMR) using isotope carbon. 13C-NM
Tacticity measured by the R method can be represented by the existence ratio of a plurality of continuous structural units, for example, a dyad for two, a triad for three, and a pentad for five.

The syndiotactic polystyrene referred to in the present invention is generally a racemic pentad having a syndiotacticity of 50% or more, preferably 80% or more, more preferably 90% or more of the following general formula (I):

[0013]

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(Wherein R is a substituent containing at least one of a hydrogen atom, a halogen atom or a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a selenium atom, a silicon atom and a tin atom) , M represents an integer of 1 to 3. However, when m is plural, each R may be the same or different.) Or a polymer of an aromatic vinyl compound represented by It is a combined hydrogenated polymer.

Preferred aromatic vinyl compounds used herein include styrene, α-methylstyrene, methylstyrene, ethylstyrene, isopropylstyrene, tertiary butylstyrene, phenylstyrene, vinylstyrene, chlorostyrene, bromostyrene, and fluorostyrene. Styrene, chloromethylstyrene, methoxystyrene,
There are ethoxystyrene and the like, which are used alone or in combination of two or more. Among these, more preferred aromatic vinyl compounds include styrene, p-methylstyrene,
m-methylstyrene, p-tert-butylstyrene, p-chlorostyrene, m-chlorostyrene and p-fluorostyrene.

The molecular weight of the syndiotactic polystyrene is not particularly limited.
The weight average molecular weight is 10,000 or more, preferably 50,
000 or more. Here, the weight average molecular weight is 10,000.
If it is less than 00, the thermal properties and mechanical properties of the obtained molded article tend to decrease. Furthermore, there is no restriction on the molecular weight distribution, and various types can be applied.

Such syndiotactic polystyrene can be produced, for example, with reference to the technique disclosed in Japanese Patent Application Laid-Open No. 63-268709.
That is, it can be produced by polymerizing a styrenic monomer in an inert hydrocarbon solvent or in the absence of a solvent, using alumoxane which is a condensation compound of a titanium compound and water with a trialkylaluminum as a catalyst. .

Further, the syndiotactic polystyrene may be modified with a polar group-containing modifying agent. The modifier having a polar group is not particularly limited, and the polar group is not particularly limited. As the polar group, for example, acid hydride, carbonyl group,
Acid anhydrides, acid amides, carboxylic esters, acid azides,
Examples include a sulfone group, a nitrile group, a cyano group, an isocyanate ester, an amino group, a hydroxyl group, an imide group, a thiol group, an oxazoline group, and an epoxy group. Particularly preferred polar groups are an acid anhydride and an epoxy group, and the acid anhydride is particularly preferably a maleic anhydride group.

As the one or more kinds of polymers other than the components (B) and (A) used in the present invention, one or more kinds can be selected from all kinds of thermoplastic resins and elastomers as long as the object of the present invention is not impaired. . As a thermoplastic resin,
There is no particular limitation. Styrene polymers such as styrene polymers having an atactic three-dimensional structure, styrene polymers having an isotactic three-dimensional structure, acrylonitrile-styrene copolymer (AS resin), and acrylonitrile-butadiene-styrene copolymer (ABS resin) Copolymers, polyphenylene ether, polycarbonate, polysulfone, polyether polymers such as polyethersulfone, polyethylene terephthalate, polyester polymers such as polybutylene terephthalate, polyamide, polyphenylene sulfide, condensation polymers such as polyoxymethylene, Acrylic polymers such as polyacrylic acid, polyacrylate and polymethyl methacrylate, polyethylene, polypropylene, polybutene, poly-4-methylpentene-1, ethylene-propylene Polyolefin polymers such as polymers, or polyvinyl chloride, polyvinylidene chloride, polyvinyl fluoride, and the like halogen-containing vinyl compounds such as polyvinylidene fluoride.

Further, these thermoplastic resins may be modified by a modifier having a polar group. The modifier having a polar group is not particularly limited, and the polar group is not particularly limited. As a polar group,
For example, acid hydride, carbonyl group, acid anhydride, acid amide, carboxylic acid ester, acid azide, sulfone group, nitrile group, cyano group, isocyanate ester, amino group, hydroxyl group, imide group, thiol group, oxazoline group, epoxy And the like. Particularly preferred polar groups are an acid anhydride and an epoxy group, and the acid anhydride is particularly preferably a maleic anhydride group.

The elastomer is not particularly limited.
Styrene butadiene copolymer elastomer (SBR),
Styrene-butadiene-styrene copolymer elastomer (SBS), styrene-butadiene-styrene block copolymer elastomer (SEBS) partially or entirely hydrogenated in butadiene portion, styrene-isoprene block copolymer elastomer (SIR) , Styrene-isoprene-styrene block copolymer elastomer (S
IS), styrene-isoprene-styrene block copolymer elastomer (SEPS) partially or entirely hydrogenated with butadiene portion, acrylonitrile-butadiene-styrene copolymer elastomer (ABS rubber), acrylonitrile-alkyl acrylate-butadiene-
Styrene-based elastomers such as styrene copolymer elastomer (ABS rubber), methyl methacrylate-alkyl acrylate-styrene copolymer elastomer (MAS rubber), methyl methacrylate-alkyl acrylate-butadiene-styrene copolymer elastomer (MABS rubber) , Ethylene, propylene, 1-butene, olefin elastomers composed of mutual copolymers of α-olefins such as 1-hexene, natural rubber, polyamide elastomer, polybutadiene, polysulfide rubber, thiochol rubber, acrylic rubber, urethane rubber, silicone rubber, Examples include epichlorohydrin rubber, polyether / ester rubber, polyester / ester rubber, and the like.

Further, these elastomers may be modified by a modifier having a polar group. The modifier having a polar group is not particularly limited, and the polar group is not particularly limited. As a polar group,
For example, acid hydride, carbonyl group, acid anhydride, acid amide, carboxylic acid ester, acid azide, sulfone group, nitrile group, cyano group, isocyanate ester, amino group, hydroxyl group, imide group, thiol group, oxazoline group, epoxy And the like. Particularly preferred polar groups are an acid anhydride and an epoxy group, and the acid anhydride is particularly preferably a maleic anhydride group.

The component (B) is selected from one or more of these thermoplastic resins and elastomers, and is selected from at least one or more of styrene-based polymers, polyether-based polymers, and styrene-based elastomers. Preferably. Among the styrene-based polymers, a styrene-based polymer having an atactic three-dimensional structure (hereinafter, referred to as atactic polystyrene) is preferable. This atactic polystyrene, in the presence or absence of a rubbery polymer, solution polymerization, bulk polymerization, suspension polymerization,
The following general formula (II) obtained by a polymerization method such as bulk-suspension polymerization

[0024]

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(Wherein R represents a hydrogen atom, a halogen atom or a substituent containing at least one of a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a selenium atom, a silicon atom and a tin atom) , M represents an integer of 1 to 3. However, when m is plural, each R may be the same or different.) A polymer comprising one or more aromatic vinyl compounds Or copolymers with one or more other vinyl monomers copolymerizable with one or more aromatic vinyl compounds, hydrogenated polymers of these polymers, and mixtures thereof.

Preferred aromatic vinyl compounds used herein include styrene, α-methylstyrene, methylstyrene, ethylstyrene, isopropylstyrene, tertiary butylstyrene, phenylstyrene, vinylstyrene, chlorostyrene, bromostyrene, and fluorostyrene. Styrene, chloromethylstyrene, methoxystyrene,
There are ethoxystyrene and the like, which are used alone or in combination of two or more. Among these, more preferred aromatic vinyl compounds include styrene, p-methylstyrene,
m-methylstyrene, p-tert-butylstyrene, p-chlorostyrene, m-chlorostyrene and p-fluorostyrene.

Other copolymerizable vinyl monomers include:
Acrylonitrile, vinylcyan compounds such as methacrylonitrile, methyl acrylate, ethyl acrylate,
Propyl acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, octadecyl acrylate, phenyl acrylate, alkyl acrylates such as benzyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, Amyl methacrylate, hexyl methacrylate,
Octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, phenyl methacrylate, alkyl methacrylates such as benzyl methacrylate, maleimide, N-methylmaleimide, N-ethylmaleimide, N-butylmaleimide, N
Maleimide compounds such as -laurylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide and N- (p-bromophenyl) maleimide;

Examples of rubbery polymers include polybutadienes, styrene-butadiene copolymers, acrylonitrile-butadiene copolymers, diene rubbers such as polyisoprene, ethylene-α-olefin copolymers, ethylene-
α-olefin-polyene copolymer, non-diene rubber such as polyacrylate, styrene-butadiene block copolymer, hydrogenated styrene-butadiene block copolymer, ethylene-propylene elastomer, styrene-grafted ethylene-propylene elastomer, Examples include an ethylene-based ionomer resin and a hydrogenated styrene-isoprene block copolymer.

The molecular weight of the atactic polystyrene is not particularly limited, but generally has a weight average molecular weight of 10,000 or more, preferably 50,000 or more. Here, when the weight average molecular weight is less than 10,000, the thermal properties and mechanical properties of the obtained molded article tend to decrease. Furthermore, there is no restriction on the molecular weight distribution, and various types can be applied.

Preferred among the polyether polymers are polyphenylene ether polymers. As the polyphenylene ether polymer, the following general formula (III-a) or (III-b):

[0031]

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[0032]

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(Wherein R1, R2, R3, R4, R5
R6 is a monovalent residue such as an alkyl group having 1 to 4 carbon atoms, an aryl group, halogen, hydrogen and the like, and R5 and R6 are not simultaneously hydrogen. ) Is a repeating unit, and a homopolymer or a copolymer having a structural unit represented by the general formula (III-a) or (III-b) can be used.

A typical example of the homopolymer of the polyphenylene ether polymer is poly (2,6-dimethyl-1,1).
4-phenylene) ether, poly (2-methyl-6-ethyl1,4-phenylene) ether, poly (2,6-diethyl-1,4-phenylene) ether, poly (2-ethyl-6-n-propyl) -1,4-phenylene) ether, poly (2,6-di-n-propyl-1,4-phenylene) ether, poly (2-methyl-6-n-butyl-
1,4-phenylene) ether, poly (2-ethyl-6)
-Isopropyl-1,4-phenylene) ether, poly (2-methyl-6-chloroethyl-1,4-phenylene) ether, poly (2-methyl-6-hydroxyethyl-1,4-phenylene) ether, poly ( Homopolymers such as 2-methyl-6-chloroethyl-1,4-phenylene) ether are exemplified.

Examples of the polyphenylene ether copolymer include a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, a copolymer of o-cresol, and a copolymer of 2,3,6-trimethyl A polyphenylene ether copolymer mainly composed of a polyphenylene ether structure, such as a copolymer with phenol and o-cresol, is included.

In the polyphenylene ether-based polymer, various other phenylene ether units which have been proposed to be allowed to exist in the polyphenylene ether-based polymer without departing from the gist of the present invention are used. It may be included as a partial structure. Japanese Patent Application Laid-Open (JP-A) No. 63-3012 discloses an example in which coexistence in a small amount is proposed.
No. 22, a 2- (dialkylaminomethyl) -6-methylphenylene ether unit;
2- (N-alkyl-N-phenylaminomethyl) -6
-Methylphenylene ether unit and the like.
Also included are polyphenylene ether-based polymers having a small amount of diphenoquinone or the like bonded in the main chain.

Further, JP-A-2-276823,
JP-A-63-108059, JP-A-59-597
Also included are polyphenylene ethers modified with compounds having a carbon-carbon double bond described in JP-A No. 24 and the like. The molecular weight of the polyphenylene ether polymer is preferably in the range of 1,000 to 100,000 in number average molecular weight, and more preferably 6,000 to 60,000.
000.

As the styrene-based elastomer, a block copolymer of a styrene-based compound and a conjugated diene is preferred. The general formula of these block copolymers is (A
-B) _{n + 1} , or A- (BA) _n , or B- (A
-B) The _one represented by _{n + 1} is most preferable (where A is a polymer block composed of a styrene compound, B is a conjugated diene polymer block, n is an integer of 1 to 20, The ratio of the A block to the whole molecule is 1 to 50% by weight.) The average molecular weight of these copolymers is 1
0.00-1,000,000, preferably 30,0
00 to 500,000. Specific examples of these styrene-based elastomers, styrene-butadiene random copolymer, styrene-isoprene random copolymer,
Styrene-butadiene-styrene triblock copolymer, styrene-isoprene-styrene triblock copolymer, styrene-isoprene radial block copolymer terminated with polystyrene block, styrene-butadiene multi-block copolymer, styrene-isoprene multi-block Examples include styrene-conjugated diene block copolymers such as block copolymers, and products obtained by hydrogenating them.

The conductive carbon (C) used in the present invention comprises:
It is used for the purpose of dispersing in the composition to impart conductivity and greatly reducing the surface resistance of the resin molded article, and acetylene black, furnace black and the like can be used. Specific examples of furnace black include Ketjen Black EC and EC600JD (manufactured by Akzo),
Asahi HS-500 (made by Asahi Carbon Co., Ltd.), Palkan XC72
(Manufactured by CABOT).

The amount of the component (A) is 99 to 1% by weight, preferably 90 to 10% by weight, more preferably 80 to 20% by weight in the mixture comprising the components (A) and (B).
% By weight. More than 99% by weight or 1% by weight
If it is less than the above, the balance of various properties required for the IC tray is inferior. The amount of the component (B) is 1 to 99% by weight in the mixture of the components (A) and (B).
Preferably 10 to 90% by weight, more preferably 20 to 90% by weight.
80% by weight. Less than 1% by weight or 99
If the content is more than 10% by weight, the balance of various physical properties required for the IC tray is inferior.

The amount of the component (C) is 1 to 50 parts by weight, preferably 3 to 40 parts by weight, more preferably 5 to 50 parts by weight, based on 100 parts by weight of the total of the components (A) and (B).
30 parts by weight. If the amount is less than 1 part by weight, there is no effect of blending the component (C), and if it exceeds 50 parts by weight, there is no effect corresponding to the amount, but rather the moldability of the obtained composition is impaired.

The resin composition of the present invention can be obtained by blending the component (C) with a mixture comprising the components (A) and (B) and melt-kneading the mixture. For the melt kneading, a known melt kneading apparatus such as a single screw extruder and a twin screw extruder can be used, but a vented twin screw extruder is preferable. The melt-kneading temperature when each component is melt-kneaded is usually from 270 to 37.
The temperature is set in the range of 0 ° C, preferably in the range of 280 to 330 ° C. When the melt-kneading temperature is lower than 270 ° C., the raw materials are insufficiently melted, so that a uniform composition may not be obtained. If the melt-kneading temperature is higher than 370 ° C., decomposition of the raw material tends to occur.

In the composition of the present invention, when components (A), (B) and (C) are melt-kneaded, other components such as inorganic fillers, pigments, dyes,
Heat stabilizers, antioxidants, weathering agents, nucleating agents, lubricants, antistatic agents, flame retardants, flame retardant auxiliaries and the like can be added. Various flame retardants are used, and there is no particular limitation.
Considering the kneading and molding temperatures, it is important that the process has excellent heat resistance, and an organic halogen-based flame retardant is particularly preferred. Examples of the halogen-based flame retardant include brominated polystyrene such as halogenated epoxy compound, pentabromobenzyl acrylate, halogenated amide compound, poly (dibromophenylene oxide), polytribromostyrene and polydibromostyrene, tetrabromobisphenol A, Tetrabromophthalic anhydride, hexabromobenzene, tribromophenyl allyl ether, pentabromotoluene, pentabromophenol, tribromophenyl-2,3-dibromo-propyl ether, tris (2,3-dibromopropyl) phosphate, tris (2 -Chloro-3-bromopropyl) phosphate, octabromodiphenyl ether, decabromodiphenyl ether, octabromobiphenyl, pentachloropentacyclodecane, hexa Lomocyclododecane, hexachlorobenzene, pentachlorotoluene, hexabromobiphenyl, decabromobiphenyl, tetrabromobutane, decabromodiphenyl ether, hexabromodiphenyl ether, ethylene-bis- (tetrabromophthalimide), tetrachlorobisphenol A, tetrabromobisphenol A , Tetrachlorobisphenol A
Alternatively, halogenated polycarbonate oligomers such as oligomers of tetrabromobisphenol A, brominated polycarbonate oligomers, polychlorostyrene, bis (tribromophenoxy) ethane and the like can be mentioned.

Among these, brominated polystyrene and poly (dibromophenylene oxide) are particularly preferred. The brominated polystyrene may be polydibromostyrene, polytribromostyrene or a copolymer thereof. Brominated polystyrene may be produced by brominating polystyrene or may be obtained by polymerizing brominated styrene. The bromine content of these flame retardants is preferably at least 50%.

When a flame retardant is blended, it is preferable to blend a flame retardant auxiliary. Here, there are various flame retardant assistants, and there is no particular limitation. For example, antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, metal antimony, antimony trichloride, antimony pentachloride , Antimony trisulfide, antimony pentasulfide and the like. In addition to these, zinc borate, barium metaborate, zirconium oxide, and the like can be given. Among these, antimony trioxide is particularly preferred.

The inorganic filler is not particularly limited, and may be any of fibrous, granular and powdery materials. Examples of the fibrous filler include, for example, glass fiber, carbon fiber, whisker, and the like, and the shape is a cloth shape, a mat shape,
There are a bundle cut shape, a short fiber, a filament shape, a whisker, and the like. In the case of a bundle cut shape, the length is 0.05 to 50.
mm and a fiber diameter of 5 to 20 μm are preferred.

On the other hand, as the granular or powdery filler, for example, talc, graphite, titanium dioxide, silica, mica, calcium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate, barium sulfate, calcium oxysulfate, oxide Examples include tin, alumina, kaolin, silicon carbide, metal powder, glass powder, glass flake, and glass beads.

Among these fillers, glass fillers, for example, glass powder, glass flake, glass beads, glass filament, glass fiber, glass lobing, and glass mat are particularly suitable. Further, as the above-mentioned filler, those subjected to a surface treatment with a coupling agent are preferable. The coupling agent used for the surface treatment is used to improve the adhesiveness between the filler and the resin, and is a so-called silane-based coupling agent, a titanium-based coupling agent, or any of conventionally known coupling agents. Any one can be selected and used. Among them, γ-aminopropyltrimethoxysilane, N-β- (aminomethyl) -γ-aminopropyltrimethoxysilane, γ-
Glycidoxypropyltrimethoxysilane, β- (3,
Preferred are aminosilanes such as 4-epoxycyclohexyl) ethyltrimethoxysilane, epoxysilane, and isopropyltri (N-amidoethyl, aminoethyl) titanate. The above-mentioned inorganic filler may be used alone or in combination of two or more.

Since the composition of the present invention is excellent in moldability,
Various molding methods such as a thermoforming method adopted for conventionally known molding, specifically, press molding, blow molding, injection molding,
Extrusion molding, vacuum molding, injection molding, casting molding, uniaxial stretching,
Although it can be easily processed into molded articles of various shapes by a method such as biaxial stretching, injection molding, press molding, blow molding and foam molding are particularly suitable.

There is no particular limitation on the method of forming the heat-resistant tray for IC, and a usual method using an injection molding machine or a method using a melt press is used. In addition, at the time of molding, the resin composition is melted at a temperature of 27
It is heated and melted in the range of 0 to 370 ° C, preferably in the range of 280 to 330 ° C. If the melting temperature is lower than 270 ° C., the composition may be insufficiently melted, and a molded article having uniform physical properties may not be obtained. If the melt-kneading temperature is higher than 370 ° C., the composition tends to decompose. The mold temperature may be 40 ° C or higher, preferably 70 ° C or higher,
More preferably, the temperature is 100 ° C. or higher.

[0051]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described more specifically below with reference to examples, but the present invention is not limited to these examples unless it exceeds the gist thereof.
Various physical properties used in Examples and Comparative Examples of the present invention were measured based on the following test methods.

(1) Heat Resistance A test piece was cut into a size of 5 mm × 5 mm × 2 mm, and the softening temperature was measured in accordance with JIS K7196. (2) Formability The melt flow rate was measured at 300 ° C. under a load of 2.18 kg.

(3) Conductivity The surface resistivity was measured according to ASTM D-257. (4) Thermal aging property After aging for 1 week in a hot air oven at 150 ° C,
A tensile test was performed to determine a tensile strength retention before and after aging.

(5) Shape stability at high temperature Twenty injection-molded 300 mm × 135 mm IC trays were stacked and quickly placed in a hot air oven at 130 ° C., taken out of the oven 10 minutes later, and removed at room temperature.
After standing for 0 minutes and cooling, the amount of gap between the trays (hereinafter referred to as "tray twist") was measured.

Further, (A) used in Examples of the present invention,
The following components were used as the components (B) and (C). (A) Syndiotactic polystyrene 1,2,4-trichlorobenzene as a solvent, 130 ° C
The weight average molecular weight measured by gel permeation chromatography was 310,000, and the weight average molecular weight /
The number average molecular weight is 2.6, and the syndiotacticity in racemic pentad by 13C-NMR analysis is 97%.
Is syndiotactic polystyrene.

(B) Polymer other than the component (A) B-1: Weight average molecular weight measured by gel permeation chromatography at 40 ° C. using chloroform as a solvent at 270,000, weight average molecular weight / number average molecular weight Is atactic polystyrene which is polymerized by thermal polymerization, wherein is 2.2. B-2: Styrene-hydrogenated butadiene block copolymer elastomer (trade name: TUFTEC H1272, manufactured by Asahi Kasei Kogyo Co., Ltd.) B-3: Maleic anhydride-modified styrene-hydrogenated butadiene block copolymer elastomer (trade name: ToughTech)
M-1913, manufactured by Asahi Kasei Kogyo Co., Ltd.) B-4: 2,6 in the presence of dibutylamine according to the method described in U.S. Pat. No. 4,788,277.
-Xylene is oxidatively coupled and polymerized, η (sp
/C)=0.42 poly (2,6-dimethyl-1,1)
4-phenylene) ether.

B-5: Maleic anhydride-modified polyphenylene ether obtained by modifying B-4 with maleic anhydride. (C) Conductive carbon Ketjen Black EC600JD (Akzo, conductive carbon)

[0058]

Example 1 Components (A), (B) and (C) were dry-blended and adjusted in predetermined amounts shown in Table 1. this,
Co-rotating twin screw extruder with vent (40 mm inner diameter, L /
D = 46) and melt-kneaded at a barrel setting temperature of 300 ° C. to produce pellets. In addition, at the time of melt kneading, 0.1 parts by weight of (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite as an antioxidant and tetrakis [methylene-3- (3 ′, 5'-
Di-t-butyl-4'-hydroxyphenyl)].
1 part by weight, methylene bis (2,4-di-t-
0.5 parts by weight of sodium butylphenol) acid phosphate were added.

The obtained pellets were molded at a molding temperature of 300 ° C.
Injection molding at a mold temperature of 150 ° C, 100mm x 100m
m × 2 mm specimen and 300 mm × 135 mm I
C tray was obtained. Table 1 shows the measurement results.

[0060]

Examples 2 to 13 The same as Example 1 except that the compositions were as shown in Tables 1 and 2.

[0061]

Comparative Example 1 The composition was as shown in Table 3 and the molding temperature was 33
It is the same as Example 1 except that injection molding was performed at 0 ° C. and a mold temperature of 80 ° C.

[0062]

Comparative Example 2 Except that the composition was as shown in Table 3,
This is similar to the first embodiment.

[0063]

Comparative Example 3 The composition was as shown in Table 3, and the mixture was melt-kneaded at a barrel setting temperature of 230 ° C., pelletized, and formed at a molding temperature of 23 ° C.
It is the same as Example 1 except that injection molding was performed at 0 ° C. and a mold temperature of 50 ° C.

[0064]

Comparative Examples 4 to 6 Except that the composition was as shown in Table 3 and injection molding was performed at a molding temperature of 330 ° C. and a mold temperature of 80 ° C.
This is similar to the first embodiment.

[0065]

[Table 1]

[0066]

[Table 2]

[0067]

[Table 3]

[0068]

The resin composition and molded article of the present invention exhibit good moldability, heat resistance and heat aging properties, good electrical conductivity of 108Ω or less, and excellent shape stability at high temperatures. Therefore, it is useful as an IC tray material.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI C08L 101/00 B65D 85/38 R

Claims (4)

[Claims] (A) 1 to 99% by weight of a styrene polymer having syndiotactic stereoregularity, and
(B) For 100 parts by weight of a mixture of 99 to 1% by weight of one or more polymers other than the component (A),
(C) A resin composition containing 1 to 50 parts by weight of conductive carbon. 2. A heat-resistant tray for IC molded using the resin composition according to claim 1. 3. (A) 1 to 99% by weight of a styrene polymer having syndiotactic stereoregularity, and
(B) For 100 parts by weight of a mixture of 99 to 1% by weight of one or more polymers other than the component (A),
(C) A resin composition for an IC heat resistant tray containing 1 to 50 parts by weight of conductive carbon. 4. A heat-resistant IC tray formed using the resin composition for an IC heat-resistant tray according to claim 3.