JPH11157945A - Manufacturing method of ceramic electronic component and green sheet for dummy used therefor - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To improve the binder removal property in the production of ceramic electronic parts such as a ceramic multilayer substrate or a multilayer capacitor element produced by firing a ceramic green sheet having a built-in electrode at a low temperature. SOLUTION: Ceramic powder such as alumina which does not sinter a green sheet for a glass ceramic substrate including an electrode such as Cu at the sintering temperature of the glass ceramic, and BaO _2.
Sandwiched by a green sheet for dummy made of an oxide powder to be an oxidizing agent, etc., pressure bonding, integrated binder removal, firing,
After sintering, the dummy green sheet portion is removed. An appropriate amount of oxygen is supplied from the oxide powder during binder removal and firing, and the binder removal property is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component such as a ceramic multilayer substrate or a multilayer capacitor element, which is manufactured by firing a ceramic green sheet having a built-in electrode at a low temperature, and a dummy green used in the method. Regarding the sheet.

[0002]

2. Description of the Related Art Conventionally, as a method of manufacturing ceramic electronic parts such as ceramic wiring boards and multilayer capacitor elements, a ceramic green sheet containing a base paste of a base metal such as copper, nickel, tungsten or the like and incorporating these electrodes has been used. A method of firing a molded body in a non-oxidizing atmosphere is known. In this method, the material cost is low due to the use of the base metal, and the obtained electronic components are also excellent in the electrical characteristics.However, in order to prevent oxidation of the base metal, it is necessary to perform firing in a non-oxidizing atmosphere, The organic binder, which is one component of the green sheet molded product, cannot be sufficiently decomposed at the time of firing and remains as carbon.Insufficient sintering, lower insulation electric resistance, lower capacitor capacitance, dielectric loss There is a problem that electric characteristics are deteriorated typified by an increase in the electric field. In order to prevent this, conventionally, a binder which can be easily scattered in an inert atmosphere has been developed (JP-A-2-35790, JP-A-9-142941, etc.) or a peroxide for supplying oxygen (registered Japanese Patent No. 172570)
4) Alternatively, a steam debinder capable of suppressing the oxidation of the base metal within an allowable range (JP-A-63-292692, JP-A-64-8479)
2, JP-A-8-186053, etc.) have been studied, but these techniques are each based on the dielectric properties such as insufficient binder removal property, change of main composition due to addition, and dielectric constant accompanying the addition. , Sinterability is impaired, and the oxidation process of the base metal is complicated.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a green sheet used in the manufacture of ceramic electronic products such as ceramic wiring boards or multilayer capacitor elements.
It is an object of the present invention to improve the debinding property and sinterability, and to improve the adhesiveness to electrodes, to reduce the resistance of the conductor wiring, and to improve the dielectric characteristics in the obtained electronic ceramic component.

[0004]

According to the present invention, there is provided a ceramic green sheet for a substrate comprising ceramic powder and / or glass powder and an organic binder. Unsintered ceramic powder that is laminated and sandwiched by ceramic sheets (dummy green sheets) that do not sinter at the sintering temperature (substrate sintering temperature) Is adopted. Since this method does not shrink during sintering and warpage is very small, it is a very effective method for a mounting wiring board or the like that requires accurate wiring alignment.

[0005] The first and second inventions of the present application provide a ceramic sheet which is not sintered at the substrate sintering temperature by adding an oxide which can serve as an oxidizing agent capable of improving the debinding property in a non-oxidizing atmosphere. The present invention relates to a method of manufacturing a ceramic electronic component capable of improving the debinding property without supplying any suitable amount of oxygen during debinding and firing and without changing the composition of the low-temperature sintering substrate, and a dummy green sheet used in the method.

That is, in the method for producing a ceramic electronic component of the first invention of the present application, a green sheet for a substrate comprising a ceramic powder and / or a glass powder and an organic binder is formed, and an electrode or its electrode is formed inside and / or on the surface of the sheet. A precursor is formed, and on one or both surfaces of the substrate green sheet, a ceramic powder which does not sinter at a predetermined substrate sintering temperature of the substrate green sheet, an oxide powder serving as an oxidizing agent, and the same or different kinds of the above. A green sheet for dummy made of an organic binder is laminated, and the organic binder in these green sheets is decomposed and scattered by heat-treating a laminate made of these green sheets in a non-oxidizing atmosphere. At the predetermined substrate sintering temperature in a non-oxidizing atmosphere of, and after firing, one side of the sintered body and / or Removing the unsintered ceramic powder constitute the dummy green sheet adhered to both sides, characterized in that to obtain a sintered body. The dummy green sheet according to the second aspect of the present invention is characterized by comprising the ceramic powder, an oxide powder serving as an oxidizing agent, and an organic binder.

In the third and fourth inventions of the present application, the amount of the oxide serving as the oxidizing agent is set to 0.1 to 50% based on the total amount of the dummy green sheet, whereby an appropriate amount of oxygen is supplied to remove the oxygen. The present invention relates to a method of manufacturing a ceramic electronic component that improves binder properties and enables non-shrinkage sintering in a planar direction without warpage, and a dummy green sheet used in the method.

The fifth and sixth inventions of the present application are directed to a method of manufacturing a ceramic electronic component in which the binder is further improved by using a methacrylic acid-based acrylic resin as an organic binder contained in both the substrate and dummy green sheets. The present invention relates to a method and a dummy green sheet used for the method.

In the seventh and eighth inventions of the present application, the ceramic powder which does not sinter at the substrate sintering temperature is at least one kind of powder selected from silicon oxide, alumina, magnesia, hematite and boron nitride, thereby preventing warpage. The present invention relates to a method for producing a ceramic electronic component having excellent removability after sintering, and a dummy green sheet used for the method.

In the ninth and tenth inventions of the present application, the oxide powder as the oxidizing agent is at least one selected from the group consisting of lead dioxide, manganese dioxide, barium peroxide, calcium peroxide, strontium peroxide and zinc peroxide. The present invention relates to a method for manufacturing a ceramic electronic component that improves the debinding property by effectively supplying an appropriate amount of oxygen in an inert atmosphere by using a kind of oxide, and a dummy green sheet used therefor.

[0011] The eleventh and twelfth inventions of the present application relate to a method of manufacturing a ceramic electronic component which realizes a low resistance of a conductor wiring by using copper as the electrode, and a dummy green sheet used therefor.

[0012]

FIG. 1 is a flow sheet showing a process for manufacturing a non-shrinkable ceramic substrate according to an embodiment of the present invention. In the present embodiment, as shown in FIG.
A green sheet for a substrate is sandwiched between dummy sheets for plane restraint (a green sheet for a dummy), and a process is performed in which thermocompression bonding, binder removal, and sintering are performed, and then the sheet is removed. By adding an oxidizing agent capable of supplying an appropriate amount of oxygen to the dummy green sheet during debinding, the debinding property of the green sheet can be improved without changing the main composition of the substrate at all. Hereinafter, the configuration requirements in the embodiment of the present invention will be described.

As the built-in electrode used in the present invention, a metal foil containing Cu, Ni, Cr, or the like as a main component can be used in order to utilize a planar non-shrinkage method. Or,
Using a base metal conductor paste mainly composed of Cu, Ni, Cr, etc. as an electrode precursor, printing, laminating, and integrally firing in a non-oxidizing atmosphere to obtain a target built-in wiring board or multilayer capacitor element, etc. Form. An electrode such as Ag or Ag-Pd which does not oxidize even under sintering in the air may be partially included.

An electrically insulating glass powder is used as a glass powder as a component constituting the green sheet for a substrate used in the present invention, and is sintered at a temperature lower than the melting point of the electrode material to be fired at the same time. More preferably, a crystalline glass that crystallizes by firing is used, but the composition of the glass is not particularly limited.

The ceramic powder, which is another component of the green sheet for a substrate, functions as a filler, and is made of an inorganic dielectric substrate material or a capacitor material having a high dielectric constant, for example, alumina, zirconia, silica, mullite. , Cordierite, magnesia and the like, and ferroelectric materials such as lead-based composite perovskite, barium titanate and strontium titanate.

Regarding the organic binder which is another component constituting the green sheet for a substrate, the thermal decomposition temperature is relatively high in ethyl cellulose, polyvinyl alcohol (PVA) and polyvinyl butyral (PVB) which have been widely used in the past. Therefore, an acrylic resin which is unsuitable and has a low thermal decomposition temperature is desirable. However, if the acrylic resin is not a methacrylic acid-based one, it is difficult to decompose the monomer at a low temperature. Therefore, in order to remove the binder in a non-oxidizing atmosphere, this system is preferable.

In the production method of the present invention, a slurry containing these components is prepared, and a green sheet for a substrate is formed from the slurry. Examples of the solvent for preparing the slurry include toluene, xylene, benzene, acetone, methyl ethyl ketone, and the like. Organic solvents such as butyl acetate and ethyl acetate,
Alcoholic solvents such as methyl alcohol, ethyl alcohol, isopropyl alcohol, n-butyl alcohol,
Water and their mixed solvents are mentioned. In addition, a plasticizer is usually used for preparing the slurry, and examples thereof include dioctyl phthalate (DOP), dibutyl phthalate (DBP), and butylbenzyl phthalate (BBP).

When water is used as the solvent, it is necessary to add a dispersing agent to form a sheet slurry. However, dispersants are generally less thermally decomposable than acrylic resins, and it is necessary to consider water as a solvent if the binder removal property is prioritized.

If necessary, a thickener for adjusting the viscosity of the slurry and an antifoaming agent for removing bubbles generated during the preparation of the slurry may be used.

The green sheet for the substrate is prepared by using the slurry and forming a green sheet having a predetermined thickness by a doctor blade method, a casting method or the like.

An electrode of a metal foil or an electrode precursor as described above is formed on the inside and / or surface of the formed green sheet for a substrate.

Here, in the present invention, as shown in FIG. 1, a method of sintering the sheet constituting the above-mentioned substrate without shrinking in the planar direction is employed, thereby realizing more precise wiring design and improvement of binder removal property. Is done.

Simply, a predetermined base metal paste is printed on a green sheet for a substrate, laminated and thermocompression-bonded, and the binder is removed and integrally fired in a non-oxidizing atmosphere to produce a wiring substrate, a multilayer capacitor element and the like. Even though, by selecting a binder having good thermal decomposability, a sintered element in which the residual carbon is largely reduced can be obtained, but the sintering is basically insufficient or the insulation electric resistance is poor. , A decrease in capacitance of the capacitor, a decrease in electrical characteristics represented by an increase in dielectric loss, and the like.

In order to improve this defect, in the present invention, a green sheet (dummy green sheet) composed of a ceramic powder as a filler that does not sinter at the substrate sintering temperature and an oxide powder as an oxidizing agent is prepared. Then, the green sheet laminate is laminated on both sides of the substrate green sheet laminate, and the sandwiched green sheet laminate is debindered and integrally fired in a non-oxidizing atmosphere.

First, as the oxide powder serving as the oxidizing agent, which is a component of the dummy green sheet, an oxide that easily releases oxygen due to a change in the oxygen coordination number during binder removal and firing is preferable. Furthermore, the difference in the temperature at which oxygen is released in a non-oxidizing atmosphere greatly affects the effect of scattering the organic binder. Among them, lead dioxide, trilead tetroxide, barium peroxide, manganese dioxide, calcium peroxide, strontium peroxide, zinc peroxide had clear effects, and silver oxide, cobalt tetroxide, etc. had little effect. It is considered that when silver oxide was used, the release temperature of oxygen was too low, so that the influence on the binder removal property was minute.

The amount of the oxide powder to be used as the oxidizing agent is appropriately determined depending on the kind of the organic binder and the amount of the organic binder. Generally, the amount is 0.1 based on the total amount of the dummy green sheet. Preferably, it is added at a rate of about 50% by weight.

If the amount of the oxidizing agent is less than 0.1% by weight, the green sheet molded body constituting the substrate becomes insufficient in the debinding property and the like.
If the oxidizing agent is added in excess of wt%, problems such as warpage of the sintered body after firing occur.

Next, it is optimal in view of contamination and the like that the ceramic powder of the filler serving as the base of the dummy sheet for restraining the plane (green sheet for dummy) is the same as the ceramic powder of the filler constituting the substrate. However, basically, any filler may be used as long as it has a coefficient of thermal expansion that is not extremely different from the coefficient of thermal expansion of the substrate. For example, in the case of a glass-ceramic substrate having a filler composed of neodymium oxide, titanium oxide, and silicon oxide, the coefficient of thermal expansion is as large as 99 × 10 ⁻⁷ / ° C., and therefore, for a dummy having a structure in which an oxidizing agent is added to alumina, for example. When a green sheet is used, peeling and cracking tend to occur during firing. Therefore, it is desirable to use a green sheet for dummy made of magnesia or barium titanate having a relatively large coefficient of thermal expansion containing an oxidizing agent, since neither peeling nor cracking occurs. On the other hand, for a substrate having a small coefficient of thermal expansion, a dummy green sheet obtained by adding an oxidizing agent to silicon oxide powder is effective. Further, if the film is sandwiched between, for example, a barium peroxide sheet composed of only an oxidizing agent and fired, peeling occurs and the dummy green sheet itself is destroyed.
This is presumably because the barium peroxide sheet has no strength as a filler at the firing temperature.

Next, as the organic binder to be contained in the dummy green sheet, the same organic binder as described for the substrate green sheet can be used.

Alternatively, the dummy green sheet is prepared from a slurry in the same manner as the substrate green sheet. In this case, the same solvent and plasticizer as described above are used, and if necessary, a thickener is also used. And an antifoaming agent can also be used.

Here, in the dummy sheet for restraining in the plane direction (green sheet for dummy), for example, a binder and a plasticizer are added to the green sheet for the substrate in order to provide adhesiveness at the time of lamination and consistency at the time of sintering. It is desirable to use the same one.

The thickness of the planar restraining dummy sheet (dummy green sheet) basically depends on the thickness of the substrate green sheet to be sandwiched. When the thickness is, for example, 400 to 500 μm, the thickness is desirably 100 to 300 μm. Therefore, even when the thickness of the substrate green sheet is different from this, it is considered that the ratio substantially follows this ratio.

As described above, the dummy green sheet is formed by the doctor blade method or the casting method, similarly to the substrate green sheet.

Next, dummy green sheets are laminated on both sides of the substrate green sheet. The lamination is performed by, for example, thermocompression bonding. In FIG. 1, the dummy green sheets are laminated on both sides of the substrate green sheet. Alternatively, the dummy green sheets may be laminated on one side of the substrate green sheet.

Next, the binder removal process to be performed after the lamination is selected from a nitrogen gas, a hydrogen gas, and water vapor in a non-oxidizing atmosphere, for example, in a nitrogen gas, a mixed gas obtained by mixing 100 ppm or less of oxygen into the nitrogen gas. This is carried out in a mixed gas with a mixed gas and a mixed gas composed of a nitrogen gas and a carbon dioxide gas. The heating rate is preferably a relatively low rate of about 50 ° C./hr. However, if the temperature is increased over time even in a temperature range in which the organic binder scatters intensively, the remaining temperature range is 200 ° C./hr or more. The rate of temperature rise during firing may be used. By the binder removal process, the organic binder in the substrate green sheet and the dummy green sheet is decomposed and scattered.

The firing process performed after the binder removal process is performed in a non-oxidizing atmosphere, for example, in a nitrogen gas, or a mixed gas in which 100 ppm or less of oxygen is mixed in a nitrogen gas. The firing temperature is 900 to 950 ° C. or less when the internal electrode is Cu, and 120 ° C. when the internal electrode is Ni.
Perform at about 0 ° C or lower. After firing, the plane restraining dummy sheet can be completely removed by rubbing or the like.

[0037]

Hereinafter, the present invention will be described with reference to specific examples. <Example 1> As a starting material constituting a substrate, a filler was aluminum oxide (Al ₂ O ₃ ) powder as a reagent, and a glass was composed of SiO ₂ , CaO, MgO, PbO and B ₂ O ₃ , The weight ratio is 55 wt%, 45 respectively.
100 g was weighed so as to be wt%, and 20 g of the binder shown in Table 1, 2.5 g of butylbenzyl phthalate as a plasticizer, and 30 g of toluene as a solvent were combined into 10 m.
The slurry was mixed for 20 hours in a ball mill using mφ zirconia balls. After defoaming the slurry, a sheet having a thickness of 200 μm was formed on a base film having a surface subjected to a release treatment by a doctor blade method.

Next, copper and glass powder were prepared as raw materials for the conductor paste. To these powders, a methacrylic acid-based acrylic resin as an organic binder and an appropriate amount of terpineol as a solvent were added, and the mixture was sufficiently mixed and kneaded with three rolls to prepare an inner layer wiring conductor paste and a via conductor paste.

Next, a via hole having a diameter of 0.15 mm is punched in a predetermined portion of the green sheet by punching, and the via hole is filled with a conductor paste for via. A wiring pattern was formed in the same manner, and four layers of each sheet were laminated.

On the other hand, a starting material constituting the plane restraining dummy sheet is a reagent aluminum oxide (Al ₂ O ₃ ).
100 g of powder, 5 g of various oxidizing powders shown in Table 1 were weighed, 20 g of a binder shown in Table 1, 2.5 g of butylbenzyl phthalate as a plasticizer, and 30 g of toluene as a solvent were combined into a ball mill using a 10 mmφ zirconia ball. For 20 hours. After defoaming the slurry, a sheet having a thickness of 200 μm was formed on a base film having a surface subjected to a release treatment by a doctor blade method.

These dummy green sheets were peeled off from the base film, laminated on both sides of the substrate sheet laminated body, and thermocompressed at 80 ° C. to obtain a laminated body. Since these laminates contain a base metal, oxygen 30
The binder was removed at 700 ° C. in a nitrogen atmosphere containing ppm, and baked at a temperature of 900 ° C. in a nitrogen gas containing 20 ppm of oxygen. The multilayer wiring board thus obtained was evaluated for insulation resistance, dielectric loss, and dielectric strength using the electrodes printed on both sides, and the results are shown in Table 1. In addition, the laminated body which does not contain an electrode was produced with the same specification, and the residual carbon amount was analyzed using the same.

[0042]

[Table 1]

As is clear from comparison with comparative samples No. 1 to No. 4, the amount of residual carbon can be suppressed to some extent by using an acrylic resin, but more effective by using a methacrylic acrylic resin. The residual carbon is reduced. The methacrylic acid acrylic resin used herein was Oricox 7025 (Kyoeisha Chemical Co., Ltd.) having a molecular weight of 2 × 10 ⁵ .

Next, as a result of the samples (No. 3, No. 5 to No. 11) in which various oxidizing agents were added to the dummy green sheet, the residual carbon was uniformly reduced as compared with the case where no additive was added. And the effect is recognized. Regarding the dielectric properties, the effect was remarkable when barium peroxide was added, and all the properties were good. Addition of MnO ₂ does not significantly reduce the amount of residual carbon, but has a clear effect on dielectric properties. This is considered to be due to the valence stability due to the addition of MnO ₂ . As can be seen from the sample of No. 11 to which Ag ₂ O was added, the oxidizing agent that releases oxygen at too low temperature has a small reduction amount of residual carbon, does not affect the improvement of the dielectric properties, and has a clear improvement. Was not found.

<Example 2> In the same manner as in (Example 1), a substrate green sheet and a restraining dummy sheet (dummy green sheet) having the composition shown in (Table 2) were prepared. In the same manner as in 1), firing was performed at 900 ° C., and various characteristics were evaluated. Furthermore, when the substrate composition was barium titanate + glass, and Ni was used for the electrode, firing was performed at 1200 ° C. in a nitrogen and hydrogen atmosphere. For comparison, the case where an oxidizing agent was directly added to the green sheet for substrate was also described, and compared with the case where the oxidizing agent was added to the green sheet for dummy.

[0046]

[Table 2]

No. 1 is a sample in which the oxidizing agent was added directly to the green sheet for the substrate instead of to the green sheet for the dummy, and the residual carbon was reduced by the effect of the oxidizing agent. However, in this case, since the oxidizing agent functions to inhibit sintering, the dielectric properties including the insulation resistance are rather deteriorated as compared with No. 2. As described above, the manufacturing method in which the oxidizing agent is added to the dummy green sheet can prevent such side effects due to the oxidizing agent.

No. 3 to No. 5 are cases where a material having a relatively large thermal expansion coefficient (99 × 10 ⁻⁷ / ° C.) is used as the substrate material. Alumina has a smaller coefficient of thermal expansion than this, and thus cracks and peels off after integral sintering, adversely affecting the wiring condition. On the other hand, when MgO having a relatively high coefficient of thermal expansion was used, the consistency after integral firing was good, and no problem occurred in the wiring. In addition, similarly, hematite (Fe ₂
O ₃ ) or barium titanate (BaTiO ₃ ) also has a large thermal expansion coefficient, so that Nd ₂ O ₃ + TiO ₂
The consistency with the system material was good. On the other hand, No. 9 is obtained by sandwiching a substrate material made of quartz and glass having a small low coefficient of thermal expansion with a sheet made of silicon oxide powder and an oxidizing agent and integrally firing the same, but the matching was good. In addition, in the case of this substrate material, good results have been obtained even by using a restraint sheet (dummy green sheet) in which an oxidizing agent is added to BN powder.

No. 10 is an example in which AlN was used as a filler for the dummy green sheet. However, the filler itself oxidized in a nitrogen-oxygen mixed gas atmosphere (Po ₂ = 20 ppm) and consequently deprived of oxygen. In addition, the binder removal property deteriorated.

In Nos. 6 to 8, BaNdTi was used as the basic composition of the substrate for the multilayer capacitor element, and Cu and Ni were used as the electrode materials. In the case of a Ni electrode,
The glass composition for firing at 1200 ° C. was selected to configure the substrate composition. In any of the electrodes, it was confirmed that good results were obtained by the non-shrinkage method in which an oxidizing agent was added to the dummy green sheet. However, in the case where barium peroxide as an oxidizing agent was added in a large amount of 60 wt% as in No. 7, a large warpage occurred in the integrated sintered body, which caused inconvenience as a substrate. No. 11 is a case where a sheet made of only an oxidizing agent is used for the dummy green sheet.
_Since it was not in the _two sheets, there was a problem that cracks and peeling occurred during integral firing. Thus, it was found that ceramic powder having a function as a filler such as alumina or MgO was required on the dummy green sheet side.

[0051]

As described above, the present invention provides a method for shrinking a glass-ceramic material in a planar direction by adding an oxidizing agent to the restraining dummy sheet (dummy green sheet) even in a reducing atmosphere. Debinding properties without impairing the properties of the glassera substrate material itself,
The dielectric properties can be improved. This allows
It can be integrally fired with a base metal electrode such as Cu, and is extremely useful for applications such as multilayer wiring boards and multilayer capacitor elements.

[Brief description of the drawings]

FIG. 1 is a flow sheet showing a production method of the present invention.

Claims (12)

[Claims] 1. A green sheet for a substrate comprising a ceramic powder and / or a glass powder and an organic binder is formed, and an electrode or a precursor thereof is formed inside and / or on the surface of the sheet. On one or both sides, a green sheet for dummy made of a ceramic powder that does not sinter at a predetermined substrate sintering temperature of the green sheet for a substrate, an oxide powder that is an oxidizing agent, and an organic binder of the same or different kind as described above is laminated. By heat-treating a laminate comprising these green sheets in a non-oxidizing atmosphere, the organic binder in these green sheets is decomposed and scattered, and thereafter, the predetermined substrate is fired in a similar non-oxidizing atmosphere. Firing at a sintering temperature, and after firing, forming the dummy green sheet adhered to one side and / or both sides of the sintered body. A method for producing a ceramic electronic component, characterized in that a sintered body is obtained by removing unsintered ceramic powder. 2. A dummy green sheet comprising the ceramic powder according to claim 1, an oxide powder serving as an oxidizing agent, and an organic binder. 3. The method for manufacturing a ceramic electronic component according to claim 1, wherein the oxide powder serving as the oxidizing agent is added to the dummy green sheet at a rate of 0.1 to 50% by weight. 4. The dummy green sheet according to claim 2, wherein the oxide powder serving as the oxidizing agent is added to the dummy green sheet at a ratio of 0.1 to 50% by weight. 5. The method for manufacturing a ceramic electronic component according to claim 1, wherein the organic binder is made of a methacrylic acrylic resin. 6. The dummy green sheet according to claim 2, wherein the organic binder is made of a methacrylic acrylic resin. 7. The ceramic powder which is not sintered at the substrate sintering temperature is at least one powder selected from silicon oxide, alumina, magnesia, hematite, barium titanate, and boron nitride. A method for manufacturing a ceramic electronic component according to any one of the preceding claims. 8. The ceramic powder that is not sintered at the substrate sintering temperature is at least one powder selected from silicon oxide, alumina, magnesia, hematite, barium titanate, and boron nitride. 6. The dummy green sheet according to any one of 6. 9. The oxide powder serving as the oxidizing agent is selected from the group consisting of lead dioxide, trilead tetroxide, dilead trioxide, manganese dioxide, barium peroxide, calcium peroxide, strontium peroxide, and zinc peroxide. The method for producing a ceramic electronic component according to claim 1, wherein the method is at least one selected oxide. 10. The oxide powder serving as the oxidizing agent is at least one oxide selected from the group consisting of lead dioxide, manganese dioxide, barium peroxide, calcium peroxide, strontium peroxide, and zinc peroxide. Claim 2,
9. The dummy green sheet according to any one of 4, 6, or 8 11. The electrode according to claim 1, 3, 5, 7, or 9, wherein said electrode or its precursor is composed of at least copper.
The method for producing a ceramic electronic component according to the above item. 12. The dummy green sheet according to claim 2, wherein the electrode or its precursor is composed of at least copper.