JPH11130839A - Coating material for hydroid ic and production of insulation-treated hybrid ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating material for hybrid ICs capable of preventing cissings in a thin coating film and excellent in moisture resistance reliability, and to provide a method for producing insulation-treated hybrid ICs. SOLUTION: This coating material comprises (a) a bisphenol A-type epoxy resin, (b) a cresol novolac epoxy resin, (c) a phenol novolac resin, (d) a setting accelerator, (e) propylene glycol monomethyl ether, and (f) a silicone polyether copolymer or oligomer. The other objective method for producing insulation- treated hydroid ICs is to coat the surfaces of hybrid ICs with the coating material and then set them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating material for a hybrid IC, and more particularly to a coating material for a hybrid IC suitable for moisture proof and insulation, and a method for manufacturing a hybrid IC insulated using the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices used for consumer and industrial equipment have become smaller and thinner, hybrid ICs (integrated circuits) used for them have also become smaller and thinner. And high integration. In the conventional hybrid IC manufacturing method, after mounting ICs, transistors, capacitors, etc. on an alumina substrate on which circuits are printed by various methods, it is used for exterior to improve protection from external force and improve humidity resistance reliability. A method of coating with a resin has been adopted. As the exterior resin, powdered epoxy resin, liquid phenolic resin, liquid epoxy resin, etc. are used. For the powdered epoxy resin, the fluid immersion method is used, and for the liquid phenolic resin and the liquid epoxy resin, the dipping method is used.
After coating with C, a heat treatment is performed and the resin is cured.

[0003] Powdered epoxy resins have the characteristic that they can be mass-produced, but have the disadvantage that they are inferior to the more rigorous moisture resistance reliability (pressure cooker test) that has recently become more severe. On the other hand, liquid phenol resin and liquid epoxy resin show good results in the pressure cooker test, but because they contain a large amount of inorganic filler, they tend to settle during work, and the film thickness is as thick as 500 to 1000 μm. In addition, there is a disadvantage that it is difficult to reduce the thickness of the hybrid IC and the heat shock resistance is poor. Further, in order to reduce the thickness of the hybrid IC, coating with a liquid epoxy resin containing no filler is performed. However, recent VO
Since the hybrid IC is coated without cleaning treatment in accordance with Regulation C, cissing occurs in the coating film coated with the residual flux or the release agent adhering to the surface of the transfer-molded component, and the hybrid I
C has the drawback of being inferior in concealing properties and humidity resistance reliability.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned disadvantages of the conventional coating material for a hybrid IC, to prevent cissing of a coating film in a thin film, and to provide a hybrid IC excellent in moisture resistance reliability. It is an object of the present invention to provide a coating material for use and a method for producing an insulated hybrid IC.

[0005]

The present invention provides (a) a bisphenol A type epoxy resin, (b) a cresol novolak type epoxy resin, (c) a phenol novolak resin,
Hybrid IC containing (d) a curing accelerator, (e) propylene glycol monomethyl ether and (f) a silicone polyether copolymer or oligomer
The present invention relates to a coating material for use. The present invention also provides a hybrid I
The present invention relates to a method for manufacturing an insulated hybrid IC obtained by applying the coating material on the surface of C and curing the coating material.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The (a) bisphenol A type epoxy resin used in the present invention is an epoxy resin derived from bisphenol A and epichlorohydrin. These epoxy resins have an epoxy equivalent of 250 or more from the viewpoint of thermal shock resistance. Are preferred. This commercial product is Eika Shell E
P-1007 (epoxy equivalent 2000), EP-100
4 (epoxy equivalent: 950).

As the cresol novolak type epoxy resin (b) used in the present invention, an epoxy resin derived from cresol novolak resin and epichlorohydrin is used. As this commercial product, YD manufactured by Toto Kasei Co., Ltd.
CN-702 (epoxy equivalent 210), ESCN-195 (epoxy equivalent 220) manufactured by Sumitomo Chemical Co., Ltd., and the like. The compounding ratio of the cresol novolak type epoxy resin is preferably 5 to 55% by weight of the total epoxy resin, more preferably 8 to 40% by weight, and more preferably 1 to 40% by weight.
It is particularly preferred that the content be 0 to 30% by weight. If the blending ratio of the cresol novolac type epoxy resin is less than 5% by weight, heat resistance and moisture resistance reliability may be reduced, and if it exceeds 55% by weight, thermal shock resistance may be reduced.

As the phenol novolak resin (c) used in the present invention, a polycondensate of phenols and formaldehyde is used.
H-1 (hydroxyl equivalent: 106) manufactured by Nippon Kayaku Co., Ltd.
N (hydroxyl equivalent 106) and the like. This compounding amount is 1 g of epoxy group from the viewpoint of heat deterioration characteristics and strength.
It is preferable to be 0.7 to 1.3 mol with respect to the equivalent,
More preferably 0.8 to 1.2 mol, 0.8
It is particularly preferred that the amount be 5 to 1.1 mol.

The curing accelerator (d) used in the present invention includes imidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-4-methylimidazole,
-Imidazole such as benzyl-2-ethylimidazole and derivatives thereof, trisdimethylaminophenol,
Tertiary amines such as benzyldimethylamine are used. The mixing ratio of the curing accelerator is preferably from 0.3 to 25% by weight, more preferably from 1 to 20% by weight, and more preferably from 3 to 20% by weight, based on the balance between curability and stability. It is particularly preferred to be 15% by weight.

The (e) propylene glycol monomethyl ether used in the present invention is used as a solvent for the present coating material. This mixing ratio is 30 to 30% of the total weight of the coating material in terms of the viscosity of the coating material and the characteristics of the coating film.
It is preferably 80% by weight, more preferably 40 to 75% by weight, and particularly preferably 50 to 70% by weight.

The (f) silicone polyether copolymer or oligomer used in the present invention comprises:

Embedded image (Wherein, R is a monovalent hydrocarbon group having 1 to 20 carbon atoms, for example, an alkyl group such as a methyl group, an ethyl group, a hexyl group, an octyl group, an aryl group such as a phenyl group, a benzyl group, etc.) An alkenyl group such as an aralkyl group, a vinyl group, an allyl group, and a methallyl group; or a group in which hydrogen is substituted with a halogen in these groups; and R ′ has 1 to 8 carbon atoms such as a methyl group, an ethyl group, a hexyl group, and an octyl group. An alkyl group of
x represents an integer of 0 to 3) to a siloxane polymer or oligomer obtained by reacting a siloxane compound represented by the following formulas in the presence of water and an acidic catalyst:

Embedded image (Wherein, R ¹ is a divalent hydrocarbon group having 1 to 8 carbon atoms, for example, an alkylene group such as a methylene group, an ethylene group, a hexylene group, an octylene group, an arylene group such as a phenylene group, and cyclohexylene. A cycloalkylene group such as a group, R ² is a monovalent hydrocarbon group having 1 to 20 carbon atoms, for example, an alkyl group such as a methyl group, an ethyl group, a hexyl group, an octyl group; an aryl group such as a phenyl group; Or an alkenyl group such as an aralkyl group, a vinyl group, an allyl group, or a methallyl group, or a group in which hydrogen is substituted with a halogen in these groups). It is an oligomer.

The (f) silicone polyether copolymer or oligomer used in the present invention is used as an anti-cissing agent for coating materials. Commercially available products include Paintad A, Paintad Q and Paintad 57 manufactured by Dow Corning. The mixing ratio is preferably from 0.01 to 5% by weight of the total weight of the coating material, from the viewpoint of preventing cissing of the coating material, and from 0.1 to 5% by weight.
More preferably 3% by weight, 0.5 to 2% by weight
It is particularly preferred that

A coloring agent, a coupling agent, an antifoaming agent and a flame retardant can be added to the coating material of the present invention, if necessary. Using the coating material of the present invention to coat a hybrid IC by a generally known dipping method,
By performing the heat curing, an insulated hybrid IC can be manufactured.

[0014]

The present invention will be described below with reference to examples, but the present invention is not limited by these examples. Examples 1 and 2 and Comparative Examples 1 and 2 Materials having the composition and the amount (parts by weight) shown in Table 1 were dissolved in a glass flask at 70 to 100 ° C. for 3 to 4 hours to obtain a transparent resin composition. Obtained. After the exterior of the hybrid IC was coated by a dip method using the obtained resin composition, it was cured by heating at 120 ° C. for 1 hour and then at 150 ° C. for 2 hours. The properties of the obtained cured product were evaluated by the following methods. The results are shown in Table 2.

(1) Measurement of Film Thickness The difference in the thickness of the flat portion of the substrate of the hybrid IC before and after the exterior coating was measured, and the value obtained by dividing the thickness into two was defined as the film thickness on one side. (2) Humidity Reliability Test (Pressure Cooker Test) The hybrid IC after the exterior coating was left under steam at 121 ° C., 2 atm, and 100% RH, and the change of the print resistance was measured every hour. Those which changed by 1.5% or more were regarded as defective products, and the number of defective products every hour was examined. This test was performed on 20 test pieces. (3) Observation of presence or absence of cissing Using a hybrid IC substrate coated with a release agent,
After the outer coating, the presence or absence of repelling of the IC was observed.

[0016]

[Table 1]

* 1: Epi-bis epoxy resin manufactured by Yuka Shell Co., Ltd. * 2: Cresol novolak epoxy resin manufactured by Toto Chemical Co., Ltd. * 3: Phenol novolak resin manufactured by Meiwa Chemical Co., Ltd. * 4: Shikoku Chemical Co., Ltd. 1-cyanoethyl-2-ethyl-4
-Methylimidazole * 5: Propylene glycol monomethyl ether * 6: Shin-Etsu Chemical Co., Ltd., γ-glycidoxypropyltrimethoxysilane * 7: Dow Corning, silicone polyether copolymer * 8: Dow Corning, Silicone polyether copoly

[0018]

[Table 2]

Table 2 shows that when the coating materials of Examples 1 and 2 were used, even when coated with a thin film, the coating film had no repelling and was excellent in moisture resistance. In contrast,
When the coating materials of Comparative Examples 1 and 2 containing no silicone polyether copolymer were used, repelling of the coating film occurred, and the heat resistance was poor.

[0020]

As described above, the coating material of the hybrid IC of the present invention does not show repelling even when coated with a thin film and has excellent moisture resistance reliability. IC can be obtained.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/31

Claims (2)

[Claims] 1. A bisphenol A type epoxy resin, (b) a cresol novolak type epoxy resin,
(C) a phenol novolak resin, (d) a curing accelerator,
A coating material for a hybrid IC comprising (e) propylene glycol monomethyl ether and (f) a silicone polyether copolymer or oligomer. 2. A method for producing an insulated hybrid IC, wherein the coating material according to claim 1 is applied to the surface of the hybrid IC and cured.