JPH11138814A - Inkjet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink-jet recording head which can be improved in maintenance efficiency, prevent electric and structural failures, and has high printing quality and reliability. SOLUTION: The ink-jet recording head has a plurality of recording element units 6a, 6b, 6c, a supporting member 7 holding and fixing recording element substrates 1a, 1b, 1c, supporting plates having openings for connection of the recording element substrates to the supporting member and interposed between wiring boards of the recording element units 6a, 6b, 6c and the supporting member thereby holding and fixing the wiring boards, and recessed parts filling a sealing resin in the periphery of the wiring boards to fill the sealing resin to the supporting plates. The plurality of recording element units comprise recording element substrates 1a, 1b, 1c having feed openings to feed a recording liquid to recording elements, and wiring boards 4a, 4b, 4c each having an opening through which the recording element substrate is incorporated, and connected to the recording element substrate thereby applying an electric pulse to discharge the recording liquid to the recording element substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head mounted on an ink jet recording apparatus for performing recording by discharging a recording liquid onto recording paper.

[0002]

2. Description of the Related Art In general, an ink jet recording apparatus is a recording apparatus which performs recording by discharging a recording liquid onto recording paper from a discharge port, and ink jet recording for forming a recording liquid discharged from a discharge port. It comprises a head and a supply system for supplying a recording liquid to the ink jet recording head. The above-described inkjet recording device is a recording device of a so-called non-impact recording method, and has a feature that high-speed recording and recording on various recording media are possible, and that almost no noise occurs during recording. , Printers, word processors, facsimile machines, copiers, etc.

[0003] As a typical recording method using an ink jet recording apparatus, there is a method using an electrothermal conversion element. In this method, an electrothermal conversion element is provided in a pressurizing chamber provided near a discharge port. A recording liquid is ejected from a minute ejection port using a pressure of bubbles (boiling) by applying an electric pulse serving as a recording signal to the recording liquid, thereby performing recording on recording paper. In the above-described recording liquid discharge method, a method of discharging the recording liquid in parallel to the substrate on which the electrothermal conversion elements are arranged (edge shooter) and a method of discharging the recording liquid on the substrate on which the electrothermal conversion elements are arranged are described. There is a method of ejecting the recording liquid vertically (side shooter).

FIG. 7 is a view showing a general printing element substrate, and FIG. 8 is a view showing a state in which the printing element substrate shown in FIG. 7 is connected to a wiring board. As shown in FIGS. 7 and 8, a plurality of ejection ports 2 having recording elements for ejecting a recording liquid are provided on one surface of the recording element substrate 1, and the recording liquid is supplied to the ejection ports 2 on the other surface. A supply port 3 for supplying is provided with an opening having a length substantially equal to the length of two rows of discharge ports, and a wiring for applying an electric pulse for discharging a recording liquid to the recording element substrate 1 is provided. The recording element unit 6 is formed by connecting the substrates 4 by TAB mounting technology or the like. The wiring of the wiring board 4 is provided on the back side. Further, a sealing resin A5 is applied to the recording element substrate 1 in order to protect lead wires for electrically connecting the recording element substrate 1 and the wiring substrate 4 from corrosion caused by a recording liquid or disconnection caused by an external force. Have been.

FIG. 9 shows the recording element unit 6 shown in FIG.
FIG. 10 is an exploded perspective view showing an example of a configuration of a conventional ink jet recording head provided with. FIG. 10 is a completed assembly view of the ink jet recording head shown in FIG. 9, (a) is an external perspective view, and (b) () Is a partially enlarged view of the AA section shown in (a). As shown in FIGS. 9 and 10, a plurality of recording element units 6 a to 6 c are
Resin A9, adhesive resin B10, adhesive resin C1
1, and on the side surface of the support member 7,
A wiring integrated board 12 for collecting electric signals for the plurality of wiring boards 4a to 4c is fixed and the plurality of wiring boards 4a to 4c are fixed.
c and is electrically connected. Then, as shown in FIG. 10B, the surface of the ink jet recording head on the recording liquid discharge side has openings of the support plate 8 and the recording element unit 6 and the periphery of the wiring board 4 (so that the support plate 8 is not exposed). Is filled with a sealing resin B13. Since the support plate 8 has a role as a heat radiating member for releasing the heat generated from the recording element substrate 1 when the recording liquid is discharged, a material having good heat radiation such as aluminum is generally used.

[0006]

However, in the conventional ink jet recording head as described above,
In view of cost and flatness, the support plate 8 is punched out from a single flat plate by a required number of openings by press working. Therefore, the wiring board 4 adjacent to the wiring board 4
The depth of the concave portion filled with the sealing resin B13 is only equivalent to the thickness of the wiring board 4, and it is difficult to adjust the height of the coating device when applying the sealing resin B13. Further, since the application area of the sealing resin B13 is small, it is easily affected by the application amount of the adhesive resin C11. When the application amount of the adhesive resin C11 is small,
The sealing resin B13 penetrates into the gap between the wiring board 4 and the support plate 8, and the sealing resin B between the wiring board 4 and the adjacent wiring board 4
There is a possibility that the coating amount of No. 13 will be insufficient and the reliability of sealing will be reduced. When the amount of the adhesive resin C11 applied is large, the adhesive resin C11 protrudes around the wiring board 4, and the sealing resin B13 between the wiring board 4 and the adjacent wiring board 4 cannot be sufficiently sealed. In any case, when a sealing defect occurs, a metal material such as a wiring and a support plate (heat radiating plate) may be corroded by the recording liquid, thereby causing electrical and structural defects.

Accordingly, the present invention solves the above-mentioned problems of the prior art, and has a wide effective setting range for adjusting the height of the sealing resin around the wiring board, thereby improving maintainability. An object of the present invention is to provide an ink jet recording head having high printing quality and reliability by preventing electrical and structural defects by stable application or reliable sealing.

[0008]

In order to solve the above-mentioned problems, the present invention is characterized in that an ink jet recording head is constructed as follows. That is, the ink jet recording head of the present invention includes a plurality of recording elements for discharging a recording liquid, is provided on a surface opposite to a surface on which the recording elements are provided, and applies the recording liquid to the recording elements. A recording element substrate having a supply port for supplying the recording element substrate; and an opening for incorporating the recording element substrate. The recording element substrate is connected to the recording element substrate to discharge the recording liquid to the recording element substrate. A plurality of recording element units comprising a wiring substrate for applying an electric pulse for performing, a support member for holding and fixing the recording element substrate, and an opening for the recording element substrate to contact with the support member, A wiring board for the recording element unit, and a support plate for holding and fixing the wiring board by being interposed between the support member, and a sealing resin is filled around the wiring board. In becomes the ink jet recording head, the supporting plate,
A recess for filling the sealing resin is provided. Further, the inkjet recording head according to the present invention is characterized in that the concave portion of the support plate is formed as a concave surface other than the surface of the support plate for holding and fixing the wiring board. Further, the inkjet recording head of the present invention is characterized in that the concave portion of the support plate is formed by laminating two types of plates. Further, the inkjet recording head according to the present invention is characterized in that the concave portion of the support plate is formed by a plurality of divided support plates. Further, the inkjet recording head according to the present invention is characterized in that the depression of the support plate reaches the lower part of the outer periphery of the wiring substrate. An ink jet recording head according to the present invention is characterized in that the sealing resin has water repellency.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, a recess for filling a sealing resin between a plurality of wiring boards is provided on a support plate.
Alternatively, with the configuration in which the concave portion is formed by the plurality of support plates, the effective setting range of the height adjustment of the application in the application device of the sealing resin B is widened, and the maintainability can be significantly improved. Further, the application amount of the sealing resin B is stabilized. In addition, by adopting a configuration in which the depression of the support plate reaches the lower part of the outer periphery of the wiring board, the adhesive resin C does not protrude around the wiring board, and the sealing resin B is reliably filled. In addition, by adopting a configuration in which the recess of the support plate reaches the lower part of the outer periphery of the wiring board, the sealing resin B wraps around to the back surface of the wiring board, and reliable sealing can be performed. According to the present invention, with such a configuration, corrosion of a metal material such as a wiring and a support plate (heat radiating plate) due to a recording liquid can be prevented, and an ink jet recording head having good electrical and structural characteristics can be provided.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. [Embodiment 1] FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG.
2A and 2B are completed views of the inkjet recording head shown in FIG. 1, wherein FIG. 1A is an external perspective view, and FIG.
FIG. 3C is a partially enlarged view of a support plate concave portion of A section, and FIG. 3C is a partially enlarged view of an end portion of the support plate of AA cross section shown in FIG. In this embodiment, as shown in FIGS. 1 and 2, a plurality of printing element substrates 1a to 1c each having a plurality of ejection ports 2 each having a printing element for discharging a printing liquid, and a printing element substrate 1a.
1c is provided with an opening for incorporating the recording element substrates 1a to 1c incorporated in the opening by TAB mounting or the like.
1c are connected to each of the printing element substrates 1a to 1c to send an electric signal for discharging the printing liquid to each of the printing element substrates 1a to 1c, and the printing element substrates 1a to 1c and the wiring boards 4a to 4c A sealing resin A5 for protecting the lead wires to be connected from corrosion due to a recording liquid or disconnection due to a force acting from the outside, and recording element substrates 1a to 1c.
Support member 7 for adhering and fixing the substrate with an adhesive resin A9
And a support plate having an opening for the recording element substrates 1a to 1c to contact with the support member 7 and a recess for filling the sealing resin B13, and for bonding and fixing the wiring substrates 4a to 4c with the adhesive resin C11. A14, an adhesive resin B10 for holding and fixing the support plate A14 to the support member 7, and wiring boards 4a to 4
and a wiring integrated board 12 that collects electric signals for c. Note that the concave portion of the support plate A14 reaches the lower part of the outer periphery of the wiring board 4.

Hereinafter, a method of assembling the ink jet recording head configured as described above will be described. First,
Heating resistance layers and wiring etc. are patterned on the silicon wafer by photolithography technology.
The nozzle wall and the discharge port 2 are formed of a photosensitive resin,
Next, the recording liquid supply port 3 is formed by anisotropic etching, sandblasting or the like, and thereafter, the outer shape is formed by cutting, thereby forming the recording element substrates 1a to 1c. Next, the recording element substrates 1a to 1c are electrically connected to the wiring substrates 4a to 4c for receiving electric signals by a TAB mounting technique or the like, respectively, and the electric signals of the recording element substrates 1a to 1c used for the connection are used. A sealing resin A5 is applied to the input terminals and the lead wires on the wiring boards 4a to 4c side. Next, the support plate A14 having an opening and a recess formed by press working and cutting work is bonded and fixed to the support member 7 by the adhesive resin B10. Next, the recording element substrates 1a to
1c is bonded and fixed to the support member 7 by adhesive resins A9a to 9c, respectively, and the wiring boards 4a to 4c are fixed to the support plate A14 by adhesive resins C11a to 11c, respectively.
The recording element substrates 1a to 1c
Element unit 6a composed of and wiring boards 4a to 4c
6c are fixed to the structure of the ink jet recording head including the support member 7 and the support plate A14.

The wiring boards 4a to 4c and the integrated wiring board 12 are electrically connected, and the integrated wiring board 12 is held and fixed to the support member 7 by a method such as bonding or heat caulking. After that, the openings of the wiring boards 4a to 4c excluding the recording element substrates 1a to 1c and the recesses of the support plate A14 are filled with the sealing resin B13. In addition, in the support plate A14, an aluminum material is generally used in terms of cost, workability, heat conductivity, and the like. Therefore, in this embodiment, by providing a concave portion for filling the sealing resin B13 in the support plate A14, the effective setting range of the height adjustment of the application of the sealing resin B13 in the application device is expanded, and the maintenance is reduced. It will be easier. Further, by increasing the application area of the sealing resin B13, the influence of the penetration of the sealing resin B13 into the gap between the bonding portions of the wiring boards 4a to 4c and the support plate A14 is reduced, and the application is stabilized. . Then, by making the concave portion of the support plate A14 reach the lower part of the outer periphery of the wiring substrates 4a to 4c, the wiring substrate 4 of the adhesive resin C11 is formed.
Since the protrusion to the periphery of a to 4c is eliminated, and the sealing resin B13 goes around to the back surface of the wiring boards 4a to 4c, the sealing can be performed more reliably, and the wiring and the support plate (radiator plate)
Can be prevented from being corroded by the recording liquid. Also,
It is advantageous that the lower the viscosity of the sealing resin B13, the better the wraparound to the details and the flattening of the surface of the sealing resin B13, which can prevent the recording liquid from remaining. Further, as the sealing resin B13, a silicone resin, a urethane resin, an epoxy resin, or the like is used, but it is preferable to use a resin having water repellency to the recording liquid.

Second Embodiment FIG. 3 is an exploded perspective view showing an ink jet recording head according to a second embodiment of the present invention, and FIG. 4 is a completed assembly view of the ink jet recording head shown in FIG. FIG. 2A is an external perspective view, and FIG. 2B is a partially enlarged view of a support plate concave portion along the line AA shown in FIG. In the present embodiment, as shown in FIG.
Type (support plate B-115 and support plate B-215a-15)
The concave portions are formed by laminating the plates of c). The support plate B-1 15 and the support plates B-2 15a to 15c are formed by pressing a flat plate of a support plate material by press working or the like and bonding them together. As a bonding method, there is a method such as bonding using an adhesive resin or ultrasonic welding. In the present embodiment configured as described above, the support plate B-115 and the support plate B-2 15a to 15c are different from the method of forming the opening and the recess at one time by pressing or cutting.
Can be easily finished to a high-precision plane. Therefore, the same effect as that of the first embodiment can be obtained, and the adhesion of the support plate B15 to the support member 7 and the support plate B1 of the wiring boards 4a to 4b can be achieved with high precision flatness.
5, the effect of penetration of the sealing resin B13 into the gap between the bonding portions of the wiring boards 4a to 4c and the support plate A14 is further reduced, and stable coating can be performed.

Third Embodiment FIG. 5 is an exploded perspective view showing an ink jet recording head according to a third embodiment of the present invention. FIG. 6 is a completed assembly view of the ink jet recording head shown in FIG. (a) is an external perspective view, (b) is a partially enlarged view of a support plate concave portion of AA cross section shown in (a),
(C) is a partial enlarged view of the end of the support plate in the AA cross section shown in (a). In this embodiment, as shown in FIG. 5, a plurality of divided support plates C16a to C16c are used to seal resin B13.
Are formed to fill the holes. In the present embodiment configured as described above, the support plates C16a to C16c
Since a flat plate made of a support plate material is formed by press working or the like, a highly accurate flat surface can be easily formed. Therefore, the same effect as in the second embodiment can be easily obtained. Also,
Since the shape is simple, it is advantageous in terms of assembling work, such as low cost, easy handling, and low deformation of the support plate.

[0015]

According to the present invention, as described above, the support plate is provided with the concave portion for filling the sealing resin, so that the height of the coating in the coating device for sealing resin for sealing the wiring board is improved. The effective setting range of the adjustment is widened, and the maintainability can be improved. Further, the application area of the sealing resin for sealing the wiring board to be filled is increased, so that the application amount can be stabilized. In the present invention,
By configuring the concave portion of the support plate to reach the lower portion of the outer periphery of the wiring board, the concave portion of the support plate can be extended to the lower portion of the outer portion of the wiring substrate, thereby preventing the adhesive resin C from protruding around the wiring substrate. In addition, the application of the sealing resin for sealing the wiring board can be stabilized. Also,
Since the sealing resin wraps around to the back surface of the wiring board, the sealing can be reliably performed, and the metal material such as the wiring and the support plate (heat radiating plate) can be reliably sealed. Further, in the present invention, by forming the concave portion of the support plate by laminating two types of plates or by forming a plurality of divided support plates, the support plate simply press-processes a flat plate of the support plate material. Thus, high-precision planarity can be obtained, the adhesion to the support member and the wiring board is good, and the application of the sealing resin can be stabilized. Also,
In the case where the concave portion of the support plate is formed by a plurality of divided support plates, the concave portion can be easily formed by the plurality of support plates having a simple shape. An effect equivalent to that of the configuration can be obtained. Further, in the present invention, by using a water-repellent resin as the sealing resin for sealing the wiring board, it is possible to reliably prevent the recording liquid from remaining in the application region of the sealing resin. it can.

[Brief description of the drawings]

FIG. 1 is a first embodiment of an ink jet recording head of the present invention.
FIG. 3 is an exploded perspective view showing the configuration of FIG.

FIGS. 2A and 2B are assembly completed views of the ink jet recording head shown in FIG. 1, wherein FIG. 2A is an external perspective view, FIG. 2B is a partially enlarged view of a support plate recess of AA cross section shown in FIG. (c) is a partially enlarged view of the end of the support plate in the AA section shown in (a).

FIG. 3 is a second embodiment of the ink jet recording head of the present invention.
FIG. 3 is an exploded perspective view showing the configuration of FIG.

FIGS. 4A and 4B are assembly views of the ink jet recording head shown in FIG. 3, wherein FIG. 4A is an external perspective view, and FIG. 4B is a partially enlarged view of a support plate recess of AA section shown in FIG. .

FIG. 5 is a third embodiment of the inkjet recording head of the present invention.
FIG. 3 is an exploded perspective view showing the configuration of FIG.

6A and 6B are assembly views of the ink jet recording head shown in FIG. 5, wherein FIG. 6A is an external perspective view, FIG. 6B is a partially enlarged view of a support plate recess of AA cross section shown in FIG. (c) is a partially enlarged view of the end of the support plate in the AA section shown in (a).

FIG. 7 is a view showing a general printing element substrate.

8 is a diagram showing a state in which the recording element substrate shown in FIG. 7 is connected to a wiring substrate.

9 is an exploded perspective view showing a configuration example of a conventional ink jet recording head provided with the recording element unit shown in FIG.

10A and 10B are assembly views of the ink jet recording head shown in FIG. 9, wherein FIG. 10A is an external perspective view, and FIG.
FIG. 3 is a partially enlarged view of an AA cross section shown in FIG.

[Explanation of symbols]

1, 1a, 1b, 1c: printing element substrate 2: discharge port 3: supply port 4, 4a, 4b, 4c: wiring substrate 5: sealing resin A 6, 6a, 6b, 6c: printing element unit 7: support member 8: Support plate 9, 9a, 9b, 9c: Adhesive resin A 10, 10a, 10b, 10c: Adhesive resin B 11, 11a, 11b, 11c: Adhesive resin C 12: Wiring integrated substrate 13: Sealing resin B 14: Support plate A 15, 15a, 15b, 15c: support plate B (support plate B-
1, support plate B-2) 16, 16a, 16b, 16c: support plate C

Claims (6)

[Claims] 1. A printing apparatus comprising: a plurality of printing elements for discharging a printing liquid; and a supply port for supplying the printing liquid to the printing elements, provided on a surface opposite to a surface on which the printing elements are provided. A recording element substrate, and an opening for incorporating the recording element substrate, and an electric pulse for discharging the recording liquid to the recording element substrate by being connected to the recording element substrate. A plurality of printing element units, each of which includes a wiring substrate to which the recording element substrate is applied; a support member that holds and fixes the printing element substrate; and an opening for the printing element substrate to contact with the support member. An ink jet recording head having a support plate for holding and fixing the wiring substrate by being interposed between the wiring substrate and the support member, and having a sealing resin filled around the wiring substrate; There are, the supporting plate, the ink jet recording head, wherein a recess for filling the sealing resin is provided. 2. The ink jet recording head according to claim 1, wherein the concave portion of the support plate is formed as a concave surface other than the surface of the support plate holding and fixing the wiring board. 3. The support plate according to claim 1, wherein the concave portion of the support plate is formed by laminating two types of plates.
3. The ink jet recording head according to item 1. 4. The ink jet recording head according to claim 1, wherein the concave portion of the support plate is formed by a plurality of divided support plates. 5. The ink jet recording head according to claim 1, wherein the recess of the support plate extends to a lower part of the outer periphery of the wiring board. 6. The ink jet recording head according to claim 1, wherein said sealing resin has water repellency.