JPH11121569A - Burn-in device - Google Patents

Abstract

(57) Abstract: An electric signal output from a drive circuit for driving a plurality of semiconductor integrated circuit elements on a semiconductor wafer is prevented from being degraded. A cassette support plate (2) having an upper connector (17B) paired with a lower connector (17A) at a position facing a lower connector (17A) above a cassette auxiliary board (16).
1 is provided. On both sides of the cassette support plate 21, through holes are provided which penetrate vertically through the support surface of the cassette support plate 21, and the support rods 22 pass through the through holes, and the lower connector 17A and the upper connector 17B Are provided. On the opposite side of the cassette support plate 21 from the upper connector 17B, a detaching means 24 for detaching the upper connector 17B and the lower connector 17A is provided.
On the upper side of 4, a driver board 26 electrically connected to the upper connector 17B is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a burn-in apparatus used for simultaneously inspecting a plurality of integrated circuits of chips formed on a semiconductor wafer in a wafer state.

[0002]

2. Description of the Related Art In recent years, there has been remarkable progress in miniaturization and price reduction of electronic equipment equipped with a semiconductor integrated circuit device, and accordingly, demands for miniaturization and price reduction of the semiconductor integrated circuit device have increased. ing.

Normally, in a semiconductor integrated circuit device, after a semiconductor chip and a lead frame are electrically connected by bonding wires, the semiconductor chip is supplied in a state of being sealed with resin or ceramics, and is mounted on a printed circuit board. You. However, due to a demand for miniaturization of electronic equipment, a method of directly mounting a semiconductor integrated circuit device in a state of being cut out from a semiconductor (hereinafter, the semiconductor integrated circuit device in this state is referred to as a bare chip or simply a chip) on a circuit board. It has been desired to supply bare chips with guaranteed quality at a low price.

In order to guarantee the quality of bare chips, it is necessary to burn in the semiconductor integrated circuit device in a wafer state.

[0005] However, burn-in performed collectively in a semiconductor wafer state (hereinafter, referred to as wafer burn-in) is very complicated in handling semiconductor wafers, and cannot meet the demand for cost reduction. In addition, since it takes a lot of time to burn-in by dividing a plurality of bare chips formed on one semiconductor wafer one by one or several times many times, it is not possible in terms of time and cost. Therefore, it is required that all bare chips be simultaneously burned in a wafer state at the same time.

Here, a burn-in device capable of performing a wafer burn-in disclosed in Japanese Patent Application Laid-Open No. Hei 8-5666 will be described.

FIG. 6 shows an overview of a conventional wafer burn-in apparatus. As shown in FIG. 6, a wafer burn-in apparatus 100 includes a wafer tray 101 and a probe card 102.
And a vacuum pump 111 for maintaining a reduced pressure state of the wafer cassette 103, and a plurality of semiconductor wafers formed on the semiconductor wafers held in the wafer cassette 103. And a drive circuit 112 for electrically driving each of the semiconductor integrated circuit elements.

[0008]

However, in the conventional wafer burn-in apparatus, various electric signals output from the drive circuit 112 cause signal deterioration such as dullness (rounding) of waveforms, overshoot and undershoot. There is a problem that it is easy to cause.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned conventional problems and to prevent signal deterioration from occurring in an electric signal output from a drive circuit for driving a plurality of semiconductor integrated circuit elements on a semiconductor wafer.

[0010]

In order to achieve the above object, a burn-in apparatus according to the present invention comprises a wafer tray for holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed, and a wafer holding surface of the wafer tray. A probe card having a probe terminal at a position corresponding to each electrode of the plurality of semiconductor integrated circuit elements, and an external electrode provided at the probe card and applying an electric signal to the probe terminal. A burn-in device for inspecting electrical characteristics of a plurality of semiconductor integrated circuit elements collectively at a wafer level using a wafer cassette. A drive circuit electrically connected to the semiconductor wafer and driving a plurality of semiconductor integrated circuit elements on the semiconductor wafer And a section, driving circuit section is provided on the front and back side of the wafer cassette.

According to the burn-in apparatus of the present invention, there is provided a drive circuit section for driving a plurality of semiconductor integrated circuit elements on a semiconductor wafer, and the drive circuit section is provided on the front and back sides of the wafer cassette. The distance between the drive circuit unit and the wafer cassette is shorter than when the unit is disposed behind the wafer cassette.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows the appearance of a burn-in device according to an embodiment of the present invention. As shown in FIG. 1, the burn-in apparatus 1 is provided with a control unit 2 for performing transmission / reception of inspection data, temperature control, and the like on the right side of the front side of the apparatus, and a plurality of wafer cassettes 4 on the left side. A cassette storage unit 3 having an opening 3a for insertion in a cassette unit is provided.

FIG. 2 shows the configuration of the cassette main body housed in the wafer cassette 4. As shown in FIG. 2, a probe card 11 made of a glass substrate and having a multilayer wiring layer on the main surface is provided on the main surface at a position corresponding to each electrode for testing integrated circuit elements on a semiconductor wafer 12. A plurality of bumps serving as probe terminals are formed, and these bumps are electrically connected to external electrodes provided on a peripheral portion of the probe card 11 and one of the multilayer wiring layers. It is connected.

Using the probe card 11, a wafer
In order to perform burn-in, it is necessary to completely contact each bump of the probe card 11 with each electrode of the integrated circuit element formed on the semiconductor wafer 12. As a jig for this purpose, a wafer tray 13 made of metal such as aluminum and holding the semiconductor wafer 12 is provided.

On the periphery of the surface (= main surface) of the wafer tray 13 facing the main surface of the probe card 11, silicon rubber or the like for forming a closed space together with the main surface of the probe card 11 and the main surface of the wafer tray 13 is provided. The vacuum valve 1 is provided with a seal ring 14 made of
5 are provided.

FIG. 3 shows a burn-in device 1 according to this embodiment.
2 shows the front configuration of the vicinity of the opening 3a in the cassette storage section 3 of FIG. As shown in FIG. 3, the wafer cassette 4 includes a cassette main body including a probe card 11 and a wafer tray 13, and a rectangular cassette auxiliary substrate 16 for facilitating the transfer of the cassette main body. A lower connector 17A using a socket method is provided on the peripheral edge of the upper surface of the cassette auxiliary substrate 16, and the lower surface of the cassette auxiliary substrate 16 is in close contact with the surface (= back surface) opposite to the main surface of the probe card 11. The probe card 1
1 and is electrically connected.

A cassette support plate 21 provided with an upper connector 17B paired with the lower connector 17A is provided above the cassette auxiliary board 16 at a position facing the lower connector 17A. On both sides of the cassette support plate 21, through holes are provided which penetrate perpendicularly to the support surface of the cassette support plate 21, and support rods 22 are provided in the through holes so as to pass therethrough. Further, the through-hole is provided with a cylindrical member 23 that defines the position of the lower connector 17A and the upper connector 17B by sliding between the inner surface and the outer surface of the support rod 22.

Further, the wafer cassette 4 is bridged so that both side portions on the lower surface of the wafer cassette 4 are suspended on a suspension portion provided in a region between the upper connector 17B and the cylindrical member 23 on the lower surface of the cassette support plate 21. Supported.

On the opposite side of the cassette support plate 21 from the upper connector 17B, for example, a motor section 24a and a motor section 24a for detaching the upper connector 17B and the lower connector 17A of the cassette auxiliary board 16 are attached.
a rotary shaft 24b, a female screw portion 24c for converting the rotary motion of the rotary shaft into a linear motion using a male screw cut into the rotary shaft 24b, a detachable means 24 for raising and lowering the cassette support plate 21, and a lower portion. Connector 17A and upper connector 1
When removing 7B, for example, a motor portion 25a, and a female screw portion 25b that converts the rotational motion of the rotary shaft into a linear motion using a male screw cut on the rotary shaft of the motor portion 25a,
A center portion is fixed to the female screw portion 25b, and both ends have a crank shape. The lower connector 17A and the upper connector include a pressing portion 25c which presses the vicinity of the lower connector 17A of the cassette auxiliary board 16 using both ends. An attachment / detachment assisting means 25 for facilitating withdrawal from 17B is provided.

On the upper side of the motor section 24a of the attaching / detaching means 24 and the motor section 25a of the attaching / detaching auxiliary means 25, there is provided a driver board 26 mounted with a driving circuit electrically connected to the upper connector 17B. A temperature adjusting plate 28 for heating the wafer cassette 4 to a predetermined temperature is provided below the wafer cassette 4 above the substrate 27 held by the support rod 22.

As described above, according to the present embodiment, the cassette auxiliary substrate 16 of the wafer cassette 4 is electrically connected to each electrode of a plurality of semiconductor integrated circuit elements in the semiconductor wafer held on the wafer tray 13. A cassette support plate 2 provided with a lower connector 17A for suspending and supporting a cassette auxiliary substrate 16 of the wafer cassette 4.
1 is an upper connector 1 paired with the lower connector 17A.
7B is provided. In addition, these connectors 17
The automatic operation of the burn-in device becomes possible because it has the attaching / detaching means 24 and the attaching / detaching auxiliary means 25 capable of automatically attaching / detaching A / 17B.

Further, in the conventional driver board as shown in FIG. 6, the wafer cassette 103 and the driver board are connected to each other by interposing an extension board on the side of the rack 110 opposite to the opening of the wafer storage section. Although electrically connected, in the burn-in device of the present embodiment, a driver board 26 is provided above the wafer cassette 4, that is, on the front and back sides, and the driver board 26 is attached to the cassette auxiliary board 16. Since the lower connector 17A and the upper connector 17B of the cassette support plate 21 are electrically connected to each other, the wiring length of the signal line is shorter than that of the conventional driver board, so that the signal is output from the driver board 26 to the probe card 11. The various electrical signals that are produced include dullness, overshoot and Signal deterioration of the undershoot is less likely to occur. Therefore, a predetermined burn-in test can be reliably performed.

Hereinafter, a first modification of the present embodiment will be described with reference to the drawings.

FIG. 4 shows a burn-in device 1 according to this embodiment.
2 shows the front configuration of the vicinity of the opening 3a in the cassette storage section 3 of FIG. 4, the same components as those shown in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted.

In the above-described embodiment, the electrical connection between the driver board 26 and the cassette auxiliary board 16 of the wafer cassette 4 is made by using a socket-type connector. The electrical connection between the driver board 26 and the cassette auxiliary board 16 is obtained by using the plurality of pogo pins 32 provided.

That is, external electrodes are provided in advance on the periphery of the upper surface of the cassette auxiliary substrate 16 and the pogo pins 3 are provided.
The electrical connection is obtained by pressing the tip against the external electrode using the elastic force of the spring loaded in the inside of the device 2.

According to this modification, the motor portion 24a, the rotary shaft 24b of the motor portion 24a, and the female screw portion 24c for converting the rotary motion of the rotary shaft into a linear motion by using a male screw cut on the rotary shaft 24b. In other words, the attachment / detachment means 24 for moving the cassette support plate 21 up and down does not require the attachment / detachment assisting means 25 for removing the lower connector 17A and the upper connector 17B.

As shown in the second modified example of FIG. 5, an external electrode is provided in advance on the peripheral edge of the lower surface of the cassette auxiliary substrate 16, and the tip of the pogo pin 32 is pressed against the external electrode to electrically connect the external electrode. You can also get a good connection.
In this case, the driver board 26 is provided on the lower surface side of the substrate 27 fixed to the support rod 22 to reduce the wiring length of the signal line.

[0030]

According to the burn-in device according to the present invention,
A drive circuit unit for driving a plurality of semiconductor integrated circuit elements in the semiconductor wafer, and the drive circuit unit is provided on the front and back sides of the wafer cassette, so that the drive circuit unit is arranged on the rear side of the wafer cassette As compared with the case, the distance between the drive circuit unit and the wafer cassette is reduced. For this reason, since the wiring length of the signal line connecting the drive circuit unit and the probe card of the wafer cassette is shortened, the electric signal output from the drive circuit unit to the probe card and the electric signal input from the probe card to the drive circuit unit are reduced. Signal deterioration such as dullness of the waveform, overshoot and undershoot is less likely to occur in the signal, and as a result, a predetermined inspection can be reliably performed.

[Brief description of the drawings]

FIG. 1 is an external view showing a burn-in device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a cassette main body housed in a wafer cassette to be put into a burn-in apparatus according to one embodiment of the present invention.

FIG. 3 is a front view showing the vicinity of an opening in a cassette storage section of the burn-in device according to the embodiment of the present invention.

FIG. 4 is a front view showing the vicinity of an opening in a cassette storage section of a burn-in device according to a first modification of the embodiment of the present invention.

FIG. 5 is a front view showing the vicinity of an opening in a cassette storage section of a burn-in device according to a second modification of the embodiment of the present invention.

FIG. 6 is a schematic view of a conventional wafer burn-in apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Burn-in apparatus 2 Control part 3 Cassette storage part 4 Wafer cassette 11 Probe card 12 Semiconductor wafer 13 Wafer tray 14 Seal ring 15 Vacuum valve 16 Cassette auxiliary board 17A Lower connector 17B Upper connector 21 Cassette support plate 22 Support rod 23 Cylindrical member 24 Detachment means 24a Motor part 24b Rotating shaft 24c Female screw part 25 Attaching and detaching auxiliary means 25a Motor part 25b Female screw part 25c Pressing part 26 Driver board (drive circuit part) 27 Substrate 28 Temperature adjustment plate 32 Pogo pin

Claims (1)

[Claims] 1. A wafer tray for holding a semiconductor wafer on which a plurality of semiconductor integrated circuit elements are formed, and provided so as to face a wafer holding surface of the wafer tray and corresponding to each electrode of the plurality of semiconductor integrated circuit elements. The electrical characteristics of the plurality of semiconductor integrated circuit devices are measured using a wafer card having a probe card having a probe terminal at a position where the probe card is provided, and an external electrode provided on the probe card and applying an electric signal to the probe terminal. A burn-in device for performing a batch inspection at a wafer level, wherein the burn-in device is electrically connected to a cassette storage unit that stores the wafer cassette and the external electrode in the wafer cassette, A driving circuit unit for driving the semiconductor integrated circuit device of the above, wherein the driving circuit unit is A burn-in device provided on the front and back sides of a wafer cassette.