JPH11102507A - Magnetic head slider and method of manufacturing magnetic head slider - Google Patents

Abstract

(57) Abstract: A magnetic head slider capable of polishing a magnetic gap of the magnetic head slider with high accuracy and high productivity. A magnetic head slider (11) having a thin-film magnetic head (20) and a floating surface (12) floating through a gas film, and processing the floating surface (12) to form a magnetic gap (δ) having a predetermined depth. On the surface on which the head 20 is formed, the electric resistance changes in accordance with the depth of the magnetic gap δ, and the resistance curve intermittently has a singular point along the depth direction of the magnetic gap δ. The resistor 45 having the formed resistive film 46 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head slider and a method of manufacturing the magnetic head slider, which can set the magnetic gap with high precision when the magnetic gap is set by processing the air bearing surface.

[0002]

2. Description of the Related Art A hard disk drive incorporates a magnetic head for writing to and reading from a disk. The magnetic head needs to have a predetermined distance from the recording surface of the disk. For this reason, the magnetic head is attached to a magnetic head slider that floats via a gas film as the disk rotates.

FIGS. 23 and 24 show such a magnetic head slider. That is, the magnetic head slider 10 shown in FIG.
1, a flying surface 12 provided on the side of the slider body 11 facing the disk, a thin-film magnetic head 20 provided on an end surface orthogonal to the flying surface 12, and a magnetic head arm (not shown). And a mounting surface 13.

The floating surface 12 is provided with a flat portion 12a and a tapered portion 12b as a head surface.
The tapered portion 12b has a function of receiving an airflow with the rotation of the disk, causing the slider body 11 to fly in the direction of arrow F in the figure, and keeping the magnetic head 20 and the recording surface (not shown) of the disk at a fixed distance. ing.

As shown in FIG. 23, the magnetic head 20 includes a magnetic head main body 21 formed of a coil and the like, and a magnetic pole 22 provided on the upper side of the magnetic head main body 21 in the drawing. Since the performance of the magnetic head 20 is determined by the distance between the recording surface of the disk and the magnetic head main body 21 when the hard disk drive is operating, in order to obtain the predetermined performance, for example, the position indicated by a two-dot chain line P in FIG. , "The reference position"). Note that the distance δ from the flat portion 12a to the magnetic head main body 21 is referred to as depth (magnetic gap depth).

On the other hand, the flat portion 12a is usually polished by an abrasive material using a lapping machine or the like. Conventionally, when polishing the flat portion 12a, the magnetic head slider 10 is held on the lower surface of a holding jig disposed opposite to the upper surface of the lapping machine, and the flat portion 12a of the magnetic head slider is fixed on the lapping machine. Then, the polishing is performed by contacting with a predetermined pressure for a predetermined time, the polishing is interrupted several times in the middle, and the number of size monitoring markers is visually inspected to obtain a magnetic gap of a predetermined size.

[0007]

In the above-described method of manufacturing a magnetic head slider, when a size monitoring marker is used in order to obtain a magnetic gap having a predetermined size, there are the following problems. That is, since the limit of the interval between the markers for dimension monitoring is about 0.2 μm, the method of visually inspecting the number of markers has a limit in accuracy. In addition, since the polishing is interrupted several times during the inspection to perform the inspection, a long man-hour is required and the productivity is poor.

Accordingly, an object of the present invention is to provide a magnetic head slider and a method of manufacturing a magnetic head slider which can polish a magnetic gap of the magnetic head slider with high accuracy and high productivity.

[0009]

In order to solve the above-mentioned problems, the invention described in claim 1 has a floating surface which floats through a thin film magnetic head and a gas film, and this floating surface is processed. In the magnetic head slider in which a magnetic gap having a predetermined depth is formed, the electric resistance changes according to the depth of the magnetic gap on the surface on which the thin-film magnetic head is formed. A resistor having a resistive film formed so as to have a singular point intermittently along the depth direction of the magnetic gap is provided.

According to a second aspect of the present invention, in the first aspect of the present invention, the resistance film gradually becomes denser as an interval between singular points of the resistance value curve approaches a processing end point. It is formed to become.

According to a third aspect of the present invention, in the first aspect of the invention, the electric resistance of the resistor changes according to the depth of the magnetic gap, and the resistance value curve has the above-mentioned resistance value curve. An auxiliary resistance film formed intermittently along the depth direction of the magnetic gap and having an auxiliary singular point formed so as to be separated from the position of the singular point of the resistance film by a predetermined distance; .

According to a fourth aspect of the present invention, in the first aspect of the present invention, the resistive film is formed of the same material and in the same process as the thin film magnetic head.

According to a fifth aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and a magnetic gap having a predetermined depth is formed by processing the floating surface. A magnetic head layer provided with the thin-film magnetic head, and a magnetic head layer provided on the magnetic head layer;
A film-shaped resistor whose electric resistance value changes according to the depth of the magnetic gap, and a stacked arrangement of the magnetic head layer in a direction intersecting the depth direction of the magnetic gap and along the processing direction. And an insulator is formed at a position where the shield layer is laminated with the resistor.

According to a sixth aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and a magnetic gap having a predetermined depth is formed by processing the floating surface. A magnetic head layer provided with the thin-film magnetic head, and a magnetic head layer provided on the magnetic head layer;
A film-shaped resistor whose electric resistance value changes according to the depth of the magnetic gap, and a stacked arrangement of the magnetic head layer in a direction intersecting the depth direction of the magnetic gap and along the processing direction. The shield layer has a tip in the depth direction at a position of the predetermined depth of the magnetic gap.

According to a seventh aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and a magnetic gap having a predetermined depth is formed by processing the floating surface. A magnetic head layer provided with the thin-film magnetic head, and a magnetic head layer provided on the magnetic head layer;
A film-shaped resistor whose electric resistance value changes according to the depth of the magnetic gap, and a stacked arrangement of the magnetic head layer in a direction intersecting the depth direction of the magnetic gap and along the processing direction. And a lead connected to the resistor, and a tip of the lead in the depth direction is arranged at a position of the predetermined depth of the magnetic gap.

According to the eighth aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and machining the floating surface to provide a magnetic gap having a predetermined depth. In the method, the electric resistance changes in accordance with the depth of the magnetic gap on the surface on which the thin-film magnetic head is formed, and the resistance curve intermittently identifies a singular point along the depth direction of the magnetic gap. A resistor having a resistive film formed so as to be provided is provided, and the air bearing surface is processed while measuring a change in the resistance value of the resistor.

According to a ninth aspect of the present invention, in the invention according to the eighth aspect, the resistive film is such that the position of the last singular point among the singular points corresponds to the processing end point of the processing. Is set to

The invention described in claim 10 is the eighth invention.
In the invention described in the above, the position of the final singular point of the resistive film is the final singular point based on the polishing time between the singular points with respect to the processing end point of the processing From the air bearing surface side by a dimension determined based on a required polishing time from when the workpiece reaches the processing end point.

[0019] The invention described in claim 11 is the eighth invention.
In the invention described in (1), the resistance value of the resistor is obtained by successively averaging the measured resistance value data.

The invention described in claim 12 is the eighth invention.
In the invention described in (1), in the resistive film, the processing end point of the processing is set apart from the position of the last singular point among the singular points on the air bearing surface side.

The invention described in claim 13 is the eighth invention.
In the invention described in (1), the resistance value of the resistor is excluded when the measured resistance value data is out of a predetermined allowable range from the resistance value curve.

The invention described in claim 14 is the eighth invention.
In the invention described in the above, the resistance value data at the processing end point is predicted based on a database that defines the relationship between the resistance value data at the processing end point corresponding to the resistance value data at the initial processing of the resistor, and the predicted value The resistance value data is corrected based on the error rate between the target value and the design value at the processing end point.

The invention described in claim 15 is the eighth invention.
In the invention described in the above, the resistance value data at the singular point of the resistor is compared with the resistance value at the singular point on the resistance curve, and the resistance value data at each of the singular points is corrected based on the error rate. I do.

The invention described in claim 16 is the eighth invention.
In the invention described in (1), the singular point is detected based on a differential value obtained by differentiating twice the resistance value data obtained from the resistor.

The invention described in claim 17 is the first invention.
In the invention described in 6, when the singular point corresponding to the singular point obtained based on the resistance value curve cannot be obtained near the position in the depth direction, the measured resistance value data is A point where the resistance value data is obtained when the design resistance value obtained based on the resistance value curve exceeds a predetermined value or more is defined as a singular point.

[0026] The invention described in claim 18 is the eighth invention.
In the invention described in (1), the resistor is formed such that the interval between the singular points of the resistance curve gradually becomes closer as the processing end point is approached.

According to a nineteenth aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and machining the floating surface to provide a magnetic gap having a predetermined depth. In the method, a film-shaped resistor whose electric resistance changes according to the depth of the magnetic gap is provided on the surface on which the thin-film magnetic head is formed, and the floating is performed while measuring the change in the resistance of the resistor. The surface was polished perpendicular to the thickness direction of the resistor and the lamination direction of the resistor and the surface.

According to a twentieth aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats via a thin film magnetic head and a gas film, and machining the floating surface to provide a magnetic gap having a predetermined depth. In the method, a resistor having a resistance film formed so that an electric resistance value changes according to the depth of the magnetic gap is provided on a surface on which the thin film magnetic head is formed, and the resistance value of the resistor is set to The air bearing surface was measured and processed based on the maximum value of the resistance value.

According to a twenty-first aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats through a thin film magnetic head and a gas film, and the floating surface is machined to provide a magnetic gap having a predetermined depth. In the method, a resistor having a resistive film formed so that the electric resistance increases as the depth of the magnetic gap increases is provided on the surface on which the thin-film magnetic head is formed, and A processing step of processing the floating surface while measuring a change in resistance value,
The processing step includes, when the resistance value decreases, a calculating step of calculating a predicted value of the resistance value based on an increase amount of the resistance value and a polishing time immediately before the resistance value decreases. I did it.

According to a twenty-second aspect of the present invention, there is provided a magnetic head slider having a floating surface which floats through a thin-film magnetic head and a gas film, and machining the floating surface to provide a magnetic gap having a predetermined depth. A magnetic head layer having a resistor formed so that an electric resistance value changes according to a depth of the thin film magnetic head and the magnetic gap; and a magnetic gap depth direction with respect to the magnetic head layer. In the direction crossing, and, provided with a conductive layer stacked and arranged along the processing direction, the tip of the conductive layer in the depth direction of the magnetic gap is disposed at a position of a predetermined depth of the magnetic gap, A processing step of processing the air bearing surface while measuring a change in the resistance value of the resistor; and in this processing step, the processing is stopped when the resistance value falls within a predetermined range with respect to the immediately preceding resistance value. It was to and a processing stop step of.

As a result of taking the above-described measures, the following operation occurs. In other words, according to the first aspect of the present invention, the electric resistance changes in accordance with the depth of the magnetic gap on the surface on which the thin-film magnetic head is formed, and the resistance curve changes in the depth direction of the magnetic gap. A resistor having a resistive film formed to have a singular point intermittently along is provided, so that detecting a singular point is affected by temperature changes and changes in the thickness of the resistive film. And the end point of machining is detected with high accuracy.

According to the second aspect of the present invention, the resistance film is formed so that the interval between the singular points of the resistance value curve becomes gradually closer as the processing end point is approached. Can be improved, and the processing end point can be detected with higher accuracy.

According to the third aspect of the present invention, the electric resistance of the resistor changes according to the depth of the magnetic gap.
An auxiliary resistance formed such that its resistance curve has an auxiliary singular point formed intermittently along the depth direction of the magnetic gap and at a predetermined interval from the position of the singular point of the resistive film. Since the film is provided, the number of occurrences of the singular point can be increased, and the processing end point can be detected with higher accuracy.

According to the fourth aspect of the present invention, since the resistive film is formed of the same material as the thin-film magnetic head in the same process, the displacement between the resistive film and the thin-film magnetic head in the manufacturing process is prevented. And highly accurate measurement can be performed.

In the invention described in claim 5, since the insulator is formed between the shield layer and the resistor, the resistor and the shield layer are not short-circuited. Therefore, it is possible to accurately measure the resistance value of the resistor.

According to the sixth aspect of the present invention, the tip of the shield layer in the depth direction is arranged at a position of a predetermined depth of the magnetic gap. The layer and the resistor are short-circuited. For this reason, the resistance value falls within a predetermined range with respect to the immediately preceding resistance value, and the processing end point can be easily detected.

According to the invention described in claim 7, since the lead in the depth direction is disposed at a position of a predetermined depth of the magnetic gap, when the shield layer is exposed to the processing surface, the shield layer is formed. And the resistor are short-circuited. For this reason, the resistance value falls within a predetermined range with respect to the immediately preceding resistance value, and the processing end point can be easily detected.

According to the present invention, the electric resistance changes in accordance with the depth of the magnetic gap on the surface on which the thin-film magnetic head is formed, and the resistance curve changes along the depth direction of the magnetic gap. By providing a resistor having a resistive film that is formed to have a singular point intermittently and processing the air bearing surface while measuring the change in the resistance value of this resistor, by detecting the singular point, The processing end point can be detected without being affected by a change in resistance value caused by a change in temperature and a change in thickness of the resistive film.

According to the ninth aspect of the present invention, since the position of the last singular point of the resistive film is set so as to correspond to the processing end point of the processing, the final singular point is determined. By detecting, the processing end point can be easily detected.

According to the tenth aspect of the present invention, in the resistive film, the position of the last singular point among the singular points is set to be separated from the processing end point by a predetermined distance toward the air bearing surface. Calculate the time from the detection of a singular point to the end point of processing based on the polishing efficiency, and finish the processing while measuring the time. Can be calculated, and the processing time is determined based on the polishing efficiency obtained therefrom, so that the processing can be accurately finished at a desired processing end point. Therefore,
Even when polishing is performed at high speed, the processing end point is not excessively passed.

According to the eleventh aspect of the present invention, the resistance value of the resistor can be obtained by successively averaging the measured resistance value data. The influence of abnormal resistance value data such as a decrease in resistance value due to a short circuit can be eliminated.

According to the twelfth aspect of the present invention, in the resistive film, since the processing end point of the processing is set away from the air bearing surface side with respect to the position of the last singular point among the singular points, During the period from when the point is detected to when the polishing actually stops, the resistance value data can be obtained. Based on this resistance value data, the processing end point is detected with high accuracy, and the desired processing end point is accurately detected Processing can be terminated. Therefore, even when polishing is performed at a high speed, the processing end point is not excessively passed.

According to the thirteenth aspect of the present invention, the resistance value of the resistor is excluded if the measured resistance value data is out of a predetermined allowable range from the resistance value curve. The effect of abnormal resistance value data can be eliminated.

According to the fourteenth aspect of the present invention, the resistance value data at the machining end point is predicted based on a database that defines the relationship between the resistance value data at the machining end point corresponding to the resistance value data at the initial stage of machining of the resistor. The resistance value data is corrected based on the error rate between the expected value and the design value at the processing end point, so errors can be minimized and the processing end point can be detected with high accuracy. Becomes

According to the fifteenth aspect, the resistance value data at the singular point of the resistor is compared with the resistance value at the singular point on the resistance curve, and the resistance value at each singular point is determined based on the error rate. Since I am trying to correct the data,
The error can be minimized, and the processing end point can be detected with high accuracy.

According to the present invention, the singular point is detected based on the differential value obtained by differentiating the resistance value data obtained from the resistor twice, so that the singular point can be easily detected. be able to.

According to the seventeenth aspect, when the singular point corresponding to the singular point obtained based on the resistance value curve cannot be obtained near the position in the depth direction, the measured resistance value data is obtained. Since the point where the resistance data is obtained is a singular point when exceeds the design resistance value obtained based on the resistance value curve by a predetermined value or more, it is possible to eliminate measurement failure caused by abnormal polishing or the like. it can.

According to the eighteenth aspect of the present invention, since the resistor is formed so that the distance between the singular points of the resistance value curve gradually becomes closer as the processing end point is approached, the processing efficiency is improved. Can be improved, and the processing end point can be detected with higher accuracy.

According to the nineteenth aspect of the present invention, a film-shaped resistor whose electric resistance changes according to the depth of the magnetic gap is provided on the surface on which the thin-film magnetic head is formed, and the resistance of this resistor is The floating surface is polished perpendicularly to the thickness direction of the resistor and the lamination direction of the resistor and the surface while measuring the change of the resistance, so that microscopic short-circuit of the resistive film during polishing can be prevented. it can.

According to the twentieth aspect, even if the resistance value of the resistor is reduced for some reason, it can be controlled based on the maximum value of the resistance value.
It is possible to minimize a control abnormality that occurs with a decrease in the resistance value.

According to the twenty-first aspect of the present invention, even if the resistance of the resistor is reduced for some reason, the resistance is determined based on the increase in the resistance immediately before the resistance decreases and the polishing time. Since a predicted value can be calculated and controlled based on this predicted value, control abnormalities caused by a decrease in the resistance value can be minimized, and more accurate control can be performed. it can.

In the invention according to claim 22, when the conductive layer is exposed on the processing surface, the conductive layer and the resistor are short-circuited. For this reason, the resistance value is within a predetermined range with respect to the immediately preceding resistance value, and the processing end point can be easily detected and the processing can be stopped.

[0053]

FIG. 1 is a perspective view showing a magnetic head slider 10 according to a first embodiment of the present invention. FIG. 2 shows an apparatus 30 for manufacturing the magnetic head slider 10. This manufacturing apparatus 30 includes a disk-shaped lapping machine 31. A lower drive shaft 32 is provided at the center of the lower surface of the lapping machine 31, and the lower drive shaft 32 is rotatably driven by a lower drive source 33 via a drive belt 33a.

An abrasive 34 made of metal such as tin or other material is provided on the upper surface of the lapping machine 31.
The polishing liquid L is supplied to the upper surface by a nozzle body 35. Since the polishing liquid L does not contain water and is processed using a polishing liquid having a high specific resistance,
Microscopic short-circuit of the resistive film during polishing can be prevented.

A holding jig 36 is disposed on the upper surface of the lapping machine 31 so as to face the same. An upper drive shaft 37 is provided on the upper surface of the holding jig 36. The upper drive shaft 37 is rotatably driven by an upper drive source 39 via a drive belt 38. In addition, at least one of the lapping machine 31 and the holding jig 36 can be vertically displaced by a Z drive source (not shown).

As shown in FIG. 3, a plurality of, in this embodiment, three holders 41 are held at substantially the same intervals on the lower surface of the holding jig 36 by screws or bolts. The holder 41 has a rectangular parallelepiped shape, and a plurality of holding grooves 44 which are open on the lower surface and both side surfaces are formed on the lower surface side. The magnetic head slider 10 is joined to each holding groove 44 with the flying surface 12 facing downward. This magnetic head slider 10
Are provided to protrude from the holding groove 44.

As shown in FIG. 1, the magnetic head slider 1
A thin-film magnetic head 20 and an electrode pad 21 electrically connected to the magnetic head 20 are formed on an end surface substantially orthogonal to the floating surface 12 of the zero. Further, on at least one end face of the plurality of magnetic head sliders 10 where the electrode pads 21 are formed, the resistor 45 is formed at the same time when the magnetic head 20 is formed.

As shown in FIG. 4, the resistor 45 is provided with a resistance film 46 continuously formed at a predetermined length along the height direction of the magnetic head slider 10. Openings 47 a to 47 e extending in the depth direction of the depth are formed in the resistance film 46. The distance between the lower ends of these openings 47a to 47e is set to, for example, 1 μm. The processing end point P is formed so as to coincide with the lower end of the opening 47e of the resistance film 46.

Further, a pair of lead wires 48 for measuring the resistance value is formed integrally with the resistance film 46. Since the lower end of the lead wire 48 is separated from the polishing surface, the lead wire 48 does not short-circuit during polishing.

These resistance films 46 are simultaneously polished by polishing the air bearing surface 12. The resistance value measured between the pair of lead wires 48 continuously increases because the length dimension of the resistance film 46 is reduced by being polished from the lower end side. When the resistance value measured by the lead wire 48 reaches a predetermined value, it means that the polishing amount of the air bearing surface 12, that is, the magnetic gap has reached a predetermined depth. The change of the resistance value at this time is shown by a resistance value curve A in FIG. Where the rate of change of the resistance value curve A changes rapidly, that is, the singular points α1 to α1
α5 is generated when the lower ends of the openings 47a to 47e are removed. Note that the resistance value curve A is predetermined by a predetermined function y = f (x).

The resistance value of the resistance film 46 is measured by a measuring unit 55 such as a tester. The measurement value measured by the measurement unit 55 is input to the control unit 56. This control unit 5
6 stores the resistance value when the magnetic gap has reached a predetermined depth, that is, the above-described resistance value curve, and stores the resistance value curve and the measured resistance value (hereinafter, “resistance value data”).
Called. ) Is compared. On the other hand, singularities α1 to α5
Is detected, and when the singular point α5 is detected, the occurrence of the singularity is warned or the polishing by the lapping machine 31 is stopped.

The specific points α1 to α5 are specifically detected as follows. That is, in the resistance value curve A shown in FIG. 5, the rate of change rapidly changes at the singular points α1 to α5, so that once differentiation is performed, as shown in B in FIG.
A second derivative curve is obtained when the second derivative is performed, as shown by C in FIG. Here, the threshold value is, for example, −
When the differential value falls below the threshold value, it is detected as a singular point.

On the other hand, in the polishing process, the resistance value data indicates an abnormal value due to noise or short circuit, and the resistance value may not be measured accurately. Therefore, the resistance value data is corrected as follows.

That is, by performing averaging processing on the measured resistance value data, abnormal resistance value data due to some cause can be eliminated.

The case where the measured resistance value data is out of the predetermined error range from the resistance value curve is excluded, and the excluded resistance value data is calculated by interpolation. Specifically, the resistance data obtained so far is extrapolated by a curve obtained by least square approximation, or the resistance data obtained so far and the resistance data obtained after The obtained resistance value data is interpolated and interpolated by a curve obtained by least square approximation.

Further, the resistance value data at the initial processing of the resistor is compared with the resistance value at the initial processing on the resistance value curve, and the resistance value data is corrected based on the error rate.

In order to further improve the accuracy, the processing is completed based on a database defining the relationship between the resistance value data at the processing end point corresponding to the resistance value data at the initial processing of the resistor, for example, a curve D as shown in FIG. The resistance value data at the point may be predicted, the error rate between this value and the resistance value curve A may be calculated, and the resistance value data may be corrected.

The resistance data at the singular point of the resistor is compared with the resistance value at the singular point on the resistance curve.
The resistance value data at each singular point may be corrected based on the error rate.

In the polishing process, the resistance value data shows a behavior at a singular point due to a sudden change in the polishing efficiency, and an erroneous singular point may be detected. Eliminate points.

That is, when the polishing amount at the time when the singular point is detected has a large error from the polishing amount corresponding to the singular point in the resistance value curve, the singular point is excluded. Also, when the resistance value data at the time when the singular point is detected has a significant error from the design resistance value corresponding to the singular point in the resistance value curve, the singular point is also excluded.

On the contrary, when the singular point was not detected for some reason and the singular point corresponding to the singular point obtained based on the resistance value curve was not obtained near the position in the depth direction, the measurement was performed. A point where the resistance value data is obtained when the resistance value data exceeds a designed resistance value obtained based on the resistance value curve by a predetermined value or more is defined as a singular point.

The resistance value of each resistance film 46 changes according to the temperature. That is, in FIG. 8, a curve A1 indicated by a broken line above the curve A indicates a change in resistance value when the resistance film 46 rises by Δt degrees from a predetermined temperature indicating the resistance value of the curve A, and is indicated by a broken line below. Curve A2 shows Δ from a predetermined temperature.
The change of the resistance value when the temperature decreases by t degrees is shown.

Even in such a case, since the singular point α5 indicating the processing end point is hardly displaced, the processing end point can be accurately detected. That is, the control unit 56 counts singular points in the magnetic head slider 10 based on the resistance value of the resistance film 46 as the resistance body 45, so that a change in resistance value due to a temperature change of the resistance film 46 can be avoided. . Similarly, it is possible to avoid a change in the resistance value due to a change in the film thickness that occurs when the resistance film 46 is formed.

Next, a procedure for manufacturing the magnetic head slider 10 by the manufacturing apparatus 30 will be described. First, the holder 41 holding the magnetic head slider 10 is attached to the holding jig 36.
And fixed to the lower surface of. Then, the magnetic head slider 1
The measurement part 5 is connected to a lead wire 48 of the resistance film 46 of the resistor 45 of zero.
5 while measuring these resistance values.
1 and the holding jig 36 are driven to rotate in a predetermined direction indicated by an arrow in FIG. 2 to bring the floating surface 12 of the magnetic head slider 10 into contact with the lapping board 31 at a predetermined pressure. Thereby, the flying surface 12 of the magnetic head slider 10 is polished.

The flying surface 12 is polished, and the resistance value of the resistor 45 changes as the processing proceeds. The change in the resistance value is continuously measured by the resistance film 46,
Detection of a singular point is performed as described above.

As described above, when the fifth singular point α5 is detected, the holding jig 36 is driven upward in the Z direction by the control signal from the control unit 56, and the polishing is completed. As a result, the magnetic gap depth of each magnetic head slider 10 held by the holder 41 attached to the lower surface of the holding jig 36 is set to a predetermined value.

As described above, the magnetic head slider 10
Singularities α1 to α5 according to the progress of the polishing of the air bearing surface 12
Is provided, and the end point of the polishing process is determined by measuring the resistance value of the resistor 45. Therefore, the magnetic gap depth of the magnetic head slider 10 is set with high accuracy. It becomes possible.

Further, the singular point α5 of the resistance value of the resistor 45
Is detected, an error due to a change in resistance value caused by a change in temperature or a change in film thickness can be eliminated, so that the end point of the polishing process can be determined with high accuracy.

Since the resistor 45 is formed of the same material as that of the magnetic head 20 in the same process, the displacement between the resistive film and the thin-film magnetic head in the manufacturing process can be prevented, and high precision can be achieved. A measurement can be made.

FIG. 9A shows a control system in the case where the correction is performed based on the resistance value curve at each singular point in the first embodiment described above. (B) of FIG.
It is a figure which shows the control system in the modification of. That is, as shown in FIG. 9C, for example, when the resistance value data up to the singular point α3 shows a tendency that the deviation amount is large near the middle between α2 and α4, the correction amount near the middle is increased to a larger value. By setting (foreseeing operation), the correction amount itself is reduced. For this reason, a pattern most suitable for the processing conditions at that time is provided in real time as correction data. In other words, it has the function of acting as a preview operation (feedforward compensation), and by reducing the amount of error to be corrected for each sampling time, the control time can be shortened and the singular point which is the end point of machining can be detected at high speed. Thus, high-speed and high-precision polishing can be realized.

In FIG. 9, A3 indicates a resistance value curve when this modification is applied, A4 indicates a resistance value curve when this modification is not applied, and τ3 and τ4 indicate respective correction amounts. ing.

FIGS. 10A and 10B show a second modification. In the resistance value curve D of the resistance film (not shown) in the present modification, singular points β1 to β6 are set,
The processing end point is set at a predetermined interval from the singular point β5. Note that a broken line A in FIG. 10A indicates a resistance value curve of the resistance film 46 described above.

The second modification has the following operation. That is, when the processing end point is made coincident with the singular point α5, the processing slightly proceeds from the detection of the singular point α5 to the end of the actual polishing processing. FIG. 10B illustrates this state. (B) Solid line E1 in FIG.
When the polishing is performed at a normal polishing rate, polishing processing can be stopped within an allowable range of an error from a target value of the processing end point.

On the other hand, when the polishing is performed at a high polishing rate as shown by the solid line E5, the polishing may not be stopped within an allowable range. Therefore, the singular point β5 is set in consideration of the polishing speed and the time from when the singular point β5 is detected to when the polishing actually stops, that is, the singular point β5 and the processing end point are determined based on the normal polishing efficiency. To set a predetermined distance apart.

Then, the resistance value data is continuously measured even after passing the singular point β5, and the polishing is terminated when the designed resistance value at the processing end point is reached. Thereby, it is possible to polish to the processing end point with high accuracy. Therefore, errors can be minimized even when high-speed polishing is performed.

FIG. 11 is a view showing a third modification. That is, the singular point β6 is not set in the resistance value curve D ′ of the resistance film (not shown) according to the present modification from the above-described second modification.

In this modification, the polishing time ω required for a predetermined interval at a normal polishing efficiency is calculated in advance, and the time from when the singular point β5 is reached is measured. I do. Thereby, it is possible to polish to the processing end point with high accuracy. Therefore, errors can be minimized even when high-speed polishing is performed.

FIGS. 12 and 13 are views for explaining the fourth modification. That is, the resistance film 46 is provided on the slider body 11 by being laminated on the shield film 50, the lead film 51, and the like. Therefore, FIG.
If the polishing is performed along the laminating direction of the shield film 50 and the lead film 51 as shown in (b), a short circuit may occur microscopically. For this reason, as shown in FIGS. 13C and 13D, polishing is performed in the laminating direction of the shield film 50 and the lead film 51 to prevent a short circuit that occurs microscopically. Generated noise can be prevented.

FIG. 14 is a diagram showing a fifth modification. As shown in FIG. 14A, the distances φ1 to φ4 between the lower ends of the openings 47a to 47e provided in the above-described resistance film 46 are equal to 1 μm, but as shown in FIG. Alternatively, the intervals # 1 to # 4 may be set so as to become narrower as they approach the processing end point side, that is, approach the opening 47e. As a result, the appearance intervals of the singular points become narrower, and more accurate polishing amount measurement can be performed.

FIG. 15 is a view showing a resistor 45A incorporated in a magnetic head slider according to the second embodiment of the present invention. The resistor 45A is different from the above-described resistor 45 in that an auxiliary resistance film 46A is formed together with the resistance film 46.

The auxiliary resistance film 46A has openings 49a-4
9c are provided, and each lower end is provided with the opening 47 described above.
It is set to be shifted from the lower ends of c to 47e by 0.5 μm. A lead wire 48 for measuring the resistance value is formed integrally with the auxiliary resistance film 46A. The resistance value of the auxiliary resistance film 46A is measured by a measuring unit 55A such as a tester. The measurement value measured by the measurement unit 55A is input to the control unit 56.

In the measuring section 55, a resistance value curve as shown by F1 in FIG. 16 is obtained. In the measuring section 55A, F2 in FIG.
Are obtained, and singular points γ1 to γ3 appear. That is, by providing the resistive film 46 and the auxiliary resistive film 46A as the resistor 45A on the magnetic head slider 10, the appearance interval of the singular point in the control unit 56 becomes narrow, and the singular point can be detected with higher accuracy. And a highly accurate measurement of the amount of polishing can be performed.

FIG. 17 is a perspective view schematically showing a main part of a magnetic head slider 60 according to a third embodiment of the present invention. FIG. 18 is a perspective view showing a resistor 70 incorporated in the magnetic head slider 60. 4 is a graph showing a resistance value curve G showing a relationship between a polishing time and a resistance value. In these drawings, the same reference numerals are given to the same functional portions as those in FIG. 23 described above, and detailed description thereof will be omitted.

As shown in FIG. 17, the end surface side of the flying surface 12 of the magnetic head slider 60 has a substrate 61 made of Al ₂ O ₃ —TiC material, an undercoat 62 of Al ₂ O ₃ , a metal film and a permalloy. And a magnetic head layer 64 having a magnetic head 20 and a resistor 70 to be described later, and an insulating layer 65 made of an insulating film. In FIG. 17, reference numeral 12c denotes a polished surface to be polished by the lapping machine 31, and FIG.
The middle arrow J indicates the polishing direction (processing direction) by the lapping machine 31.
Is shown.

The resistor 70 is formed from a plurality of resistance films 71. Further, a pair of lead wires 72 for measuring the resistance value is formed integrally with the resistor 70. Since the tip 72a of the lead wire 72 is separated from the polishing surface 12c, the lead wire 72 does not short-circuit during polishing.

The resistor 70 is simultaneously polished by polishing the polished surface 12c. The resistance value measured between the pair of lead wires 72 continuously increases because the length of the resistance film 71 is reduced by being polished from the lower end side.
When the resistance value measured by the lead wire 72 reaches a predetermined value, the polishing amount of the air bearing surface 12, that is, the magnetic gap has reached a predetermined depth, and the polishing process is completed. The change of the resistance value at this time is shown by a resistance value curve G in FIG.

The resistance value of the resistor 70 is measured by a measuring unit 73 such as a tester. The measurement value measured by the measurement unit 73 is input to the control unit 74. This control unit 7
4 stores a resistance value when the magnetic gap has a predetermined depth, that is, a designed resistance value curve, and compares the designed resistance value curve with the measured resistance value. . Then, when the resistance value reaches a predetermined value, a warning is given to that effect or the polishing by the lapping machine 31 is stopped.

On the other hand, in the polishing process, there is a resistance value decrease section θ in which the resistance value is abnormally reduced due to noise or short circuit, and the resistance value cannot be measured accurately. That is, where the resistance value of the resistance curve G sharply decreases, the metal magnetic film of the shield layer 63 and the resistance film 71 generate polishing powder by polishing, and the polishing powder spreads, and the metal magnetic film of the shield layer 63 spreads. This is generated as a result of a short circuit with the resistance film 71.

In this case, in the resistance value decreasing section θ, the polishing surface 12c is regarded as if it has not been polished. Therefore, a control for further polishing that portion (for example, by increasing the rotation speed of the lapping machine 31, Lapping machine 31
Increases the load acting on the polishing surface 12c). However, since the part is originally polished normally, the part will be polished extra. Therefore, when the resistance value decrease phenomenon occurs, the following control is performed.

That is, since the resistance value of the resistor 70 increases monotonically as it is polished, the resistance value cannot be reduced in design. Therefore, FIG.
As shown by the middle broken line G1, the value immediately before the resistance value decreases, that is, the maximum resistance value so far is used for the control of the resistance value decrease section θ, thereby preventing the portion from being excessively polished.

Furthermore, in the method using the maximum value of the resistance value in this manner, in the resistance value decrease section θ, although the polishing is actually progressing and the resistance value of the resistor 70 increases, the resistance value increases. Since the value does not change, polishing is stopped. For this reason, it can be easily controlled, but is insufficient as an interpolation method.

Therefore, as shown by a broken line G2 in FIG. 18B, the polishing efficiency (load cell value, polishing time and resistance) is determined from the load cell value (load value) of the lapping machine 31 in a certain section immediately before the resistance value decrease section. (Estimated value obtained from the value), and the change amount of the resistance value in the resistance value decrease section θ is predicted based on the polishing efficiency. By performing control by interpolating the resistance reduction section with the predicted resistance value, the polishing surface 12c can be polished almost accurately even in the resistance reduction section θ.

Although the resistor 70 is used in the present embodiment, the resistor 70 may be applied to the resistors 45 and 45A.

FIG. 19 is a perspective view schematically showing a main part of a magnetic head slider 80 according to a fourth embodiment of the present invention. FIG. 20 is a longitudinal section showing a manufacturing process of the magnetic head slider 80. FIG. In these drawings, the same functional portions as those in FIG. 17 described above are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 19, the flying surface 12 of the magnetic head slider 80 is provided on the substrate 8 made of Al ₂ O ₃ —TiC material.
1, an undercoat 82 of Al ₂ O _3, a shield layer 83 made of a metal magnetic film, a magnetic head layer 84 having a magnetic head 20 and a resistor 70, and an insulating layer 85 made of an insulating film or the like. It is formed.

In the shield layer 83, an insulating film 86 made of alumina or the like is formed at a position where the resistor 70 is laminated.

The magnetic head slider 80 is formed by the steps shown in FIGS. That is, as shown in FIG. 20A, an undercoat 82 and a shield layer 83 are formed on a substrate 81. Next, as shown in FIG. 20B, the shield layer 83 is partially removed by etching. Then, an insulating film 86 is formed as shown in FIG. 20C, and flattened by CMP (chemical mechanical polishing) or the like as shown in FIG.
Then, as shown in FIG. 20E, the magnetic head 20 and the resistor 70 are formed.

As a result, there is no step between the magnetic head 20 and the resistor 70, and it is possible to accurately match the processing end points of the two.

When the flying surface 12 of the magnetic head slider 80 thus configured is polished, even if the shield layer 83 is microscopically short-circuited by polishing, the resistor 70
Since the insulating film 86 is formed at the position corresponding to
No short circuit occurs between the resistor 70 and the insulating film 86, and the resistance of the resistor 70 does not decrease. Therefore, accurate control can be performed.

FIG. 21 is a perspective view schematically showing a main part of a magnetic head slider 90 according to a fifth embodiment of the present invention. FIG. 22 is a perspective view of a resistor 70 incorporated in the magnetic head slider 90. It is a graph which shows the resistance value curve H which shows the relationship between a polishing amount and a resistance value.

As shown in FIG. 21, the flying surface 12 of the magnetic head slider 90 is provided on the substrate 9 made of Al ₂ O ₃ —TiC material.
1, an undercoat 92 of Al ₂ O _3, a shield layer 93 made of a metal magnetic film, a magnetic head layer 94 having a magnetic head 20 and a resistor 70, and an insulating layer 95 made of an insulating film. Is formed.

The shield layer 93 is composed of a metal magnetic film 93a and an insulating film 93b.
3c is formed so as to coincide with the processing end point. Similarly, the tip 72a of the lead 72 is formed so as to coincide with the processing end point.

In the magnetic head slider 90 configured as described above, the end point of the polishing process is detected as follows. That is, the resistance value of the resistor 70 is measured, for example, every one second. Since the resistance value of the resistor 70 does not cause a short circuit due to the presence of the insulating film 93b, it does not decrease before reaching the processing end point.

On the other hand, when the processing end point is reached, the tip 93c of the metal magnetic film 93a and the tip 72a of the lead 72 are exposed on the polished surface 12c, and as shown in FIG. The resistance value of 70 drops sharply. By detecting the decrease in the resistance value, it is determined that the processing end point has been reached, and the polishing is stopped.

Note that a slight decrease in the resistance value of the resistor 70 may occur even before the machining end point is reached.
It is detected that the machining end point has been reached as follows.

For example, the maximum value of the resistance value is 5
% Or a method in which the resistance value is differentiated twice and the point where the value becomes negative is used as the processing end point.

It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.

[0118]

According to the manufacturing method of the present invention, a magnetic head can be manufactured in a form closer to the design value. Further, by using the magnetic head of the present invention, it is possible to perform higher-density information recording at a lower error rate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a magnetic head slider according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of a magnetic head slider manufacturing apparatus for polishing a flying surface of the magnetic head slider.

FIG. 3 is a side view showing a main part of the magnetic head manufacturing apparatus.

FIG. 4 is an explanatory diagram of a resistor provided in the magnetic head slider.

FIG. 5 is a graph showing a resistance value curve showing a relationship between a polishing amount and a resistance value of a resistor incorporated in the magnetic head slider.

FIG. 6 is a graph showing the results obtained by differentiating the resistance value curve once and twice.

FIG. 7 is a graph showing the relationship between the resistance value at the beginning of processing and the resistance value at the end point of processing.

FIG. 8 is a graph showing the same resistance curve and a resistance curve when the temperature changes.

FIG. 9 is a diagram showing a first modification of the first embodiment.

FIG. 10 is a view showing a second modification of the first embodiment.

FIG. 11 is a diagram showing a third modification of the first embodiment.

FIG. 12 is a perspective view schematically showing a main part of the magnetic head slider.

FIG. 13 is a diagram showing a fourth modification of the first embodiment.

FIG. 14 is a view showing a fifth modification of the first embodiment.

FIG. 15 is a view showing a resistor incorporated in a magnetic head slider according to a second embodiment of the present invention.

FIG. 16 is a graph showing a resistance curve showing a relationship between a polishing amount and a resistance value of a resistor incorporated in the magnetic head slider.

FIG. 17 is a perspective view schematically showing a main part of a magnetic head slider according to a third embodiment of the invention.

FIG. 18 is a graph showing a resistance value curve showing a relationship between a polishing amount and a resistance value of a resistor incorporated in the magnetic head slider.

FIG. 19 is a perspective view schematically showing a main part of a magnetic head slider according to a fourth embodiment of the invention.

FIG. 20 is a longitudinal sectional view showing the manufacturing process of the magnetic head slider.

FIG. 21 is a perspective view schematically showing a main part of a magnetic head slider according to a fifth embodiment of the present invention.

FIG. 22 is a graph showing a resistance value curve showing a relationship between a polishing amount and a resistance value of a resistor incorporated in the magnetic head slider.

FIG. 23 is a perspective view showing a general magnetic head slider.

FIG. 24 is an enlarged perspective view showing a main part of the magnetic head slider.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Magnetic head slider 20 ... Thin film magnetic head 30 ... Manufacturing apparatus 45, 45A ... Resistor 46, 46A ... Resistive film 47a-47e, 49a-49c ... Opening 48 ... Lead wire

Claims (22)

[Claims] 1. A magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, and wherein the floating surface is processed to form a magnetic gap having a predetermined depth, wherein the thin-film magnetic head is formed. The formed surface is formed such that the electric resistance value changes according to the depth of the magnetic gap, and the resistance value curve intermittently has a singular point along the depth direction of the magnetic gap. A magnetic head slider comprising a resistor having a resistive film. 2. The resistance film according to claim 1, wherein the resistance film is formed so that the interval between singular points of the resistance curve gradually becomes closer as the processing end point is approached. Magnetic head slider. 3. An electric resistance of the resistor changes in accordance with a depth of the magnetic gap, and a resistance curve of the resistor intermittently extends in a depth direction of the magnetic gap. 2. The magnetic head slider according to claim 1, further comprising an auxiliary resistance film formed to have an auxiliary singular point formed so as to be separated from the position of the singular point by a predetermined distance. 4. The magnetic head slider according to claim 1, wherein said resistive film is formed of the same material as said thin film magnetic head by the same process. 5. A magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, wherein the floating surface is processed to form a magnetic gap having a predetermined depth, wherein the thin-film magnetic head is provided. A magnetic head layer provided on the magnetic head layer; a film-shaped resistor provided on the magnetic head layer, the electric resistance value of which varies according to the depth of the magnetic gap; and a depth direction of the magnetic gap with respect to the magnetic head layer. A magnetic layer comprising: a shield layer laminated in a direction intersecting with and along the processing direction, wherein an insulator is formed at a position where the shield layer is laminated with the resistor. Slider. 6. A magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, wherein the floating surface is processed to form a magnetic gap of a predetermined depth, wherein the thin-film magnetic head is provided. A magnetic head layer provided on the magnetic head layer; a film-shaped resistor provided on the magnetic head layer, the electric resistance value of which varies according to the depth of the magnetic gap; and a depth direction of the magnetic gap with respect to the magnetic head layer. And a shield layer stacked and arranged along the processing direction. The shield layer has a tip in the depth direction at a position at the predetermined depth of the magnetic gap. A magnetic head slider characterized by the above-mentioned. 7. A magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, wherein the floating surface is processed to form a magnetic gap of a predetermined depth, wherein the thin-film magnetic head is provided. A magnetic head layer provided on the magnetic head layer; a film-shaped resistor provided on the magnetic head layer, the electric resistance value of which varies according to the depth of the magnetic gap; and a depth direction of the magnetic gap with respect to the magnetic head layer. And a lead connected to the resistor, wherein the tip of the lead in the depth direction has the predetermined length of the magnetic gap. A magnetic head slider which is arranged at a depth position. 8. A method of manufacturing a magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, and machining the floating surface to provide a magnetic gap having a predetermined depth. The resistance formed on the formed surface is such that the electric resistance value changes according to the depth of the magnetic gap, and the resistance value curve has a singular point intermittently along the depth direction of the magnetic gap. A method of manufacturing a magnetic head slider, comprising: providing a resistor having a film; and processing the floating surface while measuring a change in the resistance value of the resistor. 9. The magnetic head according to claim 8, wherein the resistive film is set so that the position of the last singular point among the singular points corresponds to the processing end point of the processing. Slider manufacturing method. 10. The resistive film according to claim 1, wherein the position of the last singular point among the singular points is determined from the final singular point based on the polishing time between the singular points with respect to the processing end point of the processing. 9. The method of manufacturing a magnetic head slider according to claim 8, wherein a dimension determined on the basis of a required polishing time until the processing end point is reached is set to be separated from the floating surface side. 11. The method according to claim 8, wherein the resistance value of the resistor is obtained by successively averaging the measured resistance value data. 12. The resistive film according to claim 1, wherein the processing end point of the processing is set apart from the position of the last singular point among the singular points on the air bearing surface side. 9. The method for manufacturing a magnetic head slider according to item 8. 13. The magnetic head slider according to claim 8, wherein the resistance value of the resistor is excluded when the measured resistance value data is out of a predetermined allowable range from the resistance value curve. Production method. 14. A resistance value data at a machining end point is predicted based on a database which defines a relationship between resistance value data at a machining end point corresponding to resistance value data at an initial stage of machining of the resistor, and the predicted value is compared with the predicted value. 9. The method of manufacturing a magnetic head slider according to claim 8, wherein the resistance value data is corrected based on an error rate from a design value at a processing end point. 15. The resistance value data at a singular point of the resistor is compared with the resistance value at a singular point on the resistance curve, and the resistance value data at each of the singular points is corrected based on the error rate. 9. The method of manufacturing a magnetic head slider according to claim 8, wherein: 16. The magnetic head slider according to claim 8, wherein the singular point is detected based on a differential value obtained by differentiating twice the resistance value data obtained from the resistor. Method. 17. When the singular point corresponding to the singular point obtained based on the resistance value curve is not obtained near the position in the depth direction, the measured resistance value data is converted to the resistance value curve. 17. The head slider manufacturing method according to claim 16, wherein a point where the resistance data is obtained when a design resistance value obtained on the basis of a predetermined value or more exceeds a predetermined value is defined as a singular point. 18. The resistor according to claim 8, wherein the distance between the singular points of the resistance value curve is gradually increased as approaching the processing end point. Magnetic head slider manufacturing method. 19. A method of manufacturing a magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, and processing the floating surface to provide a magnetic gap having a predetermined depth. A film-shaped resistor whose electric resistance changes according to the depth of the magnetic gap is provided on the formed surface, and while measuring the change in the resistance of the resistor, the floating surface is raised to a thickness of the resistor. A method of manufacturing a magnetic head slider, wherein the polishing is performed perpendicularly to a direction and a lamination direction of the resistor and the surface. 20. A method for manufacturing a magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, and processing the floating surface to provide a magnetic gap having a predetermined depth. A resistor having a resistance film is formed on the formed surface so that the electric resistance changes according to the depth of the magnetic gap, the resistance of the resistor is measured, and the resistance is measured. A method for manufacturing the magnetic head slider, wherein the flying surface is machined based on the maximum value of the slider. 21. A method for manufacturing a magnetic head slider having a thin-film magnetic head and a floating surface which floats via a gas film, and processing the floating surface to provide a magnetic gap having a predetermined depth. As the depth of the magnetic gap is increased on the formed surface, a resistor having a resistance film formed so that the electric resistance increases is provided, and a change in the resistance of the resistor is measured. A processing step of processing the air bearing surface; and in the processing step, when the resistance value decreases, the resistance value is predicted based on the amount of increase in the resistance value and the polishing time immediately before the resistance value decreases. And a calculating step for calculating a value. 22. A method of manufacturing a magnetic head slider having a thin-film magnetic head and a floating surface which floats through a gas film, and processing the floating surface to provide a magnetic gap having a predetermined depth. A magnetic head layer having a resistor formed so that an electric resistance value changes in accordance with the depth of the magnetic gap, in a direction intersecting the magnetic head layer in a depth direction of the magnetic gap, and A conductive layer stacked along a processing direction, a tip of the conductive layer in a depth direction of the magnetic gap is disposed at a position of a predetermined depth of the magnetic gap, and a change in a resistance value of the resistor is determined. A processing step of processing the floating surface while measuring; and a processing stop step of stopping the processing when the resistance value falls within a predetermined range with respect to the immediately preceding resistance value in the processing step. The magnetic head slider manufacturing method comprising Rukoto.