JPH10511817A - 有機及び無機パシベーション層からなる画像センサ - Google Patents
有機及び無機パシベーション層からなる画像センサInfo
- Publication number
- JPH10511817A JPH10511817A JP9514877A JP51487797A JPH10511817A JP H10511817 A JPH10511817 A JP H10511817A JP 9514877 A JP9514877 A JP 9514877A JP 51487797 A JP51487797 A JP 51487797A JP H10511817 A JPH10511817 A JP H10511817A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- image detector
- photosensitive element
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002161 passivation Methods 0.000 title 1
- 230000004888 barrier function Effects 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 239000004642 Polyimide Substances 0.000 claims abstract description 7
- 238000002955 isolation Methods 0.000 claims abstract description 7
- 229920001721 polyimide Polymers 0.000 claims abstract description 7
- 230000005670 electromagnetic radiation Effects 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 4
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 7
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000006731 degradation reaction Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000009897 systematic effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of Radiation (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 複数のスイッチング素子を担持する基板と、基板の上に配置され実質的に スイッチング素子を覆う絶縁分離層とからなり、感光性素子は夫々のスイッチン グ素子に関連し、各感光性素子は第1及び第2の電極からなり、各感光性素子の 第1の電極は関連するスイッチング素子の第1の電極に結合される画像検出器で あって、 絶縁障壁層は絶縁分離層の上に配置され、感光性素子は絶縁障壁層の上に配置 される画像検出器。 2. 絶縁障壁層は、窒素ケイ素の層からなる請求項1記載の画像検出器。 3. 絶縁分離層は、ポリイミドの層からなる請求項1又は2記載の画像検出器 。 4. 感光性素子の第1の電極は、絶縁分離層の中に画成されたチャネルの中に 配置された導電性の部材によって、関連するスイッチング素子の第1の電極に結 合される請求項1乃至3のうちいずれか1項記載の画像検出器。 5. 感光性素子は、感光性素子の行及び列のマトリックスで配置されている請 求項1乃至4のうちいずれか1項記載の画像検出器。 6. スイッチング素子は、薄膜トランジスタからなる請求項1乃至5のうちい ずれか1項記載の画像検出器。 7. 薄膜トランジスタは第1及び第2のチャネル電極及びゲート電極からなり 、第1のチャネル電極は夫々の感光性素子の第1の電 極に結合されるスイッチング素子の第1の電極からなり、各感光性素子の第2の 電極は共通端子に接続され、感光性素子列に関連するスイッチング素子の第2の チャネル電極は共に夫々の列電極に接続され、感光性素子行に関連するスイッチ ング素子のゲート電極は共に夫々の行電極に接続される請求項5又は6記載の画 像センサ。 8. スイッチング素子は、ダイオードからなる請求項1乃至5のうちいずれか 1項記載の画像検出器。 9. 第1の範囲の波長を有する電磁放射線を、感光性素子によって検出可能な 第2の範囲の波長を有する電磁放射線へ変換するエネルギー変換層が設けられて いる請求項1乃至8のうちいずれか1項記載の画像検出器。 10. エネルギー変換層は蛍光層からなる請求項9記載の画像検出器。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9520791.6A GB9520791D0 (en) | 1995-10-13 | 1995-10-13 | Image sensor |
| GB9520791.6 | 1995-10-13 | ||
| PCT/IB1996/001066 WO1997014186A1 (en) | 1995-10-13 | 1996-10-10 | Image sensor comprising organic and inorganic passivation layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10511817A true JPH10511817A (ja) | 1998-11-10 |
Family
ID=10782129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9514877A Withdrawn JPH10511817A (ja) | 1995-10-13 | 1996-10-10 | 有機及び無機パシベーション層からなる画像センサ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6034725A (ja) |
| EP (1) | EP0797845B1 (ja) |
| JP (1) | JPH10511817A (ja) |
| DE (1) | DE69628137T2 (ja) |
| GB (1) | GB9520791D0 (ja) |
| WO (1) | WO1997014186A1 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007101256A (ja) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | X線撮像装置及びx線ct装置 |
| JP2008537774A (ja) * | 2005-02-28 | 2008-09-25 | アドバンスト フューエル リサーチ、インク. | 放射線を検出する機器および方法 |
| US8368027B2 (en) | 2008-07-01 | 2013-02-05 | Canon Kabushiki Kaisha | Radiation detection apparatus and radiographic imaging system |
| WO2016002611A1 (ja) * | 2014-06-30 | 2016-01-07 | シャープ株式会社 | X線撮像システム |
| JP2016015485A (ja) * | 2014-06-11 | 2016-01-28 | 株式会社半導体エネルギー研究所 | 撮像装置 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4035194B2 (ja) | 1996-03-13 | 2008-01-16 | キヤノン株式会社 | X線検出装置及びx線検出システム |
| JPH11307756A (ja) * | 1998-02-20 | 1999-11-05 | Canon Inc | 光電変換装置および放射線読取装置 |
| JPH11331703A (ja) * | 1998-03-20 | 1999-11-30 | Toshiba Corp | 撮像装置 |
| DE19927694C1 (de) * | 1999-06-17 | 2000-11-02 | Lutz Fink | Halbleitersensor mit einer Pixelstruktur |
| US20020121605A1 (en) * | 1999-06-17 | 2002-09-05 | Lutz Fink | Semiconductor sensor and method for its wiring |
| US6288435B1 (en) * | 1999-12-28 | 2001-09-11 | Xerox Corporation | Continuous amorphous silicon layer sensors using doped poly-silicon back contact |
| US6300648B1 (en) * | 1999-12-28 | 2001-10-09 | Xerox Corporation | Continuous amorphous silicon layer sensors using sealed metal back contact |
| TW451447B (en) * | 1999-12-31 | 2001-08-21 | Samsung Electronics Co Ltd | Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same |
| EP1364405A4 (en) * | 2001-01-30 | 2008-12-24 | Ma Com Inc | HIGH VOLTAGE SEMICONDUCTOR DEVICE |
| US6607951B2 (en) * | 2001-06-26 | 2003-08-19 | United Microelectronics Corp. | Method for fabricating a CMOS image sensor |
| US6737626B1 (en) * | 2001-08-06 | 2004-05-18 | Pixim, Inc. | Image sensors with underlying and lateral insulator structures |
| FR2849272B1 (fr) * | 2002-12-19 | 2005-11-18 | Commissariat Energie Atomique | Dispositif de detection photo-electrique et notamment de rayonnement x ou y |
| TWI424574B (zh) * | 2009-07-28 | 2014-01-21 | Prime View Int Co Ltd | 數位x光探測面板及其製作方法 |
| KR101955336B1 (ko) * | 2012-03-13 | 2019-03-07 | 삼성전자주식회사 | 광 센싱 트랜지스터, 이의 제조방법 및 이를 채용한 디스플레이 패널 |
| US9520424B2 (en) * | 2012-10-29 | 2016-12-13 | Taiwan Semiconductor Manufacturing Company Limited | Black level correction (BLC) structure |
| CN105914216B (zh) * | 2016-05-05 | 2019-01-18 | 上海集成电路研发中心有限公司 | 一种图像传感器结构及其制作方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045057A (ja) * | 1983-08-23 | 1985-03-11 | Toshiba Corp | 固体撮像装置の製造方法 |
| JPS6218755A (ja) * | 1985-07-18 | 1987-01-27 | Toshiba Corp | 固体撮像装置 |
| JPH0785568B2 (ja) * | 1989-04-05 | 1995-09-13 | 富士ゼロックス株式会社 | 密着型イメージセンサ装置 |
| NL9100337A (nl) * | 1991-02-26 | 1992-09-16 | Philips Nv | Halfgeleiderinrichting. |
| JPH04317373A (ja) * | 1991-04-16 | 1992-11-09 | Semiconductor Energy Lab Co Ltd | 密着型イメージセンサ |
| JPH04317372A (ja) * | 1991-04-17 | 1992-11-09 | Nec Corp | 半導体記憶装置 |
| US5254480A (en) * | 1992-02-20 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Process for producing a large area solid state radiation detector |
| US5233181A (en) * | 1992-06-01 | 1993-08-03 | General Electric Company | Photosensitive element with two layer passivation coating |
| DE4227096A1 (de) * | 1992-08-17 | 1994-02-24 | Philips Patentverwaltung | Röntgenbilddetektor |
| US5399884A (en) * | 1993-11-10 | 1995-03-21 | General Electric Company | Radiation imager with single passivation dielectric for transistor and diode |
| US5619033A (en) * | 1995-06-07 | 1997-04-08 | Xerox Corporation | Layered solid state photodiode sensor array |
| US5859463A (en) * | 1996-12-23 | 1999-01-12 | General Electric Company | Photosensitive imager contact pad structure |
-
1995
- 1995-10-13 GB GBGB9520791.6A patent/GB9520791D0/en active Pending
-
1996
- 1996-10-10 WO PCT/IB1996/001066 patent/WO1997014186A1/en not_active Ceased
- 1996-10-10 JP JP9514877A patent/JPH10511817A/ja not_active Withdrawn
- 1996-10-10 DE DE69628137T patent/DE69628137T2/de not_active Expired - Lifetime
- 1996-10-10 EP EP96931929A patent/EP0797845B1/en not_active Expired - Lifetime
- 1996-10-15 US US08/731,623 patent/US6034725A/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008537774A (ja) * | 2005-02-28 | 2008-09-25 | アドバンスト フューエル リサーチ、インク. | 放射線を検出する機器および方法 |
| JP2007101256A (ja) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | X線撮像装置及びx線ct装置 |
| US8368027B2 (en) | 2008-07-01 | 2013-02-05 | Canon Kabushiki Kaisha | Radiation detection apparatus and radiographic imaging system |
| JP2016015485A (ja) * | 2014-06-11 | 2016-01-28 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| WO2016002611A1 (ja) * | 2014-06-30 | 2016-01-07 | シャープ株式会社 | X線撮像システム |
| US10330799B2 (en) | 2014-06-30 | 2019-06-25 | Sharp Kabushiki Kaisha | X-ray image pickup system |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9520791D0 (en) | 1995-12-13 |
| DE69628137D1 (de) | 2003-06-18 |
| US6034725A (en) | 2000-03-07 |
| EP0797845A1 (en) | 1997-10-01 |
| EP0797845B1 (en) | 2003-05-14 |
| WO1997014186A1 (en) | 1997-04-17 |
| DE69628137T2 (de) | 2004-01-15 |
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