JPH039890A - Ic card - Google Patents

Abstract

PURPOSE:To prevent a whitening phenomenon even when extreme bending deformation is generated by inserting an IC module in the insertion part of the first sheet member and forming an unconnected part to a superposed part when the second sheet is connected in a superposed state. CONSTITUTION:Both of the first and second sheet members 17, 18 are composed of a hard vinyl chloride resin and superposed one upon another to be thermally welded. A polyethylene terephthalate sheet 22 having a shape and size almost equal to or larger than those of an IC module 15 is sandwiched between the sheet members 17, 18 to the IC module 15 to be welded thereto. The PET sheet 22 is not thermally welded to hard vinyl chloride resin to form an unconnected part 22a. By this PET sheet, a slip becomes easy to generate between the sheet members 17, 18 and the concn. of stress can be prevented. Even when a whitening phenomenon is generated in the sheet member 17 in which the IC module 15 is inserted, it can he prevented that said phenomenon propagates to the sheet member 18 because the unconnected part 22a is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an IC card with an IC chip inserted or built therein.

(Prior Art) In recent years, the development of IC cards into which an IC chip such as a microcomputer or memory is inserted or built-in has been progressing.

This IC card has a larger storage capacity than the conventional magnetic stripe card, and can store a lot of information on the IC card side, and has a key power section and calculation function. There are some that have

Such an IC card is configured, for example, as shown in FIG. 3, and has an IC module 2 inserted therein.

The part surrounded by the strip-shaped broken line shown in the figure is the magnetic stripe a, which is formed on the opposite side to the side on which the IC module 2 is provided. The above IC module 2 is the fourth
It is constructed as shown in FIG. 5 and FIG.

The IC module 2 is configured as described below. A printed circuit board film made by laminating copper foil on a glass epoxy film board 3 is etched to obtain a desired pattern, and then nickel and gold plating is performed to form a wiring pattern 4 and through holes 5. The wiring pattern 4 formed on the front and back sides of the substrate is electrically connected, and the IC chip 6 is die-bonded to a predetermined position of the electric circuit pattern 4. The electrodes on the IC chip 3 and the circuit pattern 4 are connected by wire bonding, and a botting frame 7 made of a material such as glass epoxy is bonded to the glass epoxy film substrate 3 so as to surround the IC chip 6. has been done.

Then, it is molded by pouring epoxy resin into the botting frame 7.

The IC module 2 configured in this manner is inserted into the IC card 1 described below. A desired pattern 9 is printed on the front and back sides of a center core 8 made of opalescent hard vinyl chloride with a thickness of 0.561 by offset printing or silk screen printing, and an oversheet 10 made of transparent vinyl chloride with a thickness of 0.1 ms is overlaid on the front and back sides. By combining them together and laminating them, a hard vinyl chloride laminate with a thickness of 0.76 m5 is constructed.

This hard vinyl chloride laminate is punched out using a cutting die having a predetermined size to obtain a card base material 1a.

Then, the IC module 2 is attached to this card base material 1a.
When the IC module 2 and the card base material 1a are inserted, the planar dimensions of the IC module 2 and the card base material 1a are the same or larger by about 0.5 ms,
And the thickness is equivalent to the thickness of Ic module 2 or 0.05
An insertion portion 11 for the IC module 2 is formed by cutting a deep recess of approximately a+g using an end mill or engraving machine.

The IC card 1, which is formed by inserting the IC module 2 into the card base material 1a formed in this manner, is always carried by the user and is required to be rigid enough to withstand long-term carrying. be.

However, the bending force A as shown in FIG.

When B and C are added, the rigidity of the part where the IC module 2 is inserted is high, and stress is applied to the part of the IC card 1 that corresponds to the edge part of the IC module 2 (such as the part indicated by the dashed line in the figure). concentration occurs.

Then, a whitening phenomenon may occur, and the aesthetic appearance of the IC card 1 may deteriorate.

Second, the card base material 1a is made of a material on which characters can be clearly and easily engraved in order to emboss the name of the individual using the IC card 1, the user's exclusive registration number, etc. Needs to be manufactured.

(Problem to be Solved by the Invention) When a strong bending force is applied to an IC card, since the part where the IC module is installed has high rigidity, a whitening phenomenon occurs in the part corresponding to the edge of the IC module, causing the IC card to deteriorate. There was a durability problem in that the aesthetic appearance of the product deteriorated.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an IC card that can prevent the whitening phenomenon even if it is subjected to extreme bending deformation.

[Structure of the invention]

<: Means and operation for solving Sta) An insertion part is formed in the first sheet member, an IC module is inserted into the insertion part, and a second sheet member is formed on the other side of the first sheet member. By stacking and bonding the sheet members to form a center core, and forming a non-bonding portion at the overlapping portion of the first sheet member and second sheet member corresponding to the IC module, the IC card is curved. In this case, slippage occurs between the first sheet member and the second sheet member corresponding to the IC module, and the first sheet member due to the rigidity of the IC module
And stress concentration on the second sheet member can be reduced.

(Example) A first example of the present invention will be described with reference to FIG. IC module 15 inserted into IC card 1 of this embodiment
is as explained below. The basic structure of the IC module 15 shown in FIG. 2 is the same as that of the conventional example described above, in which a wiring pattern is formed on a glass epoxy film substrate, and through holes are formed on the front and back surfaces of the substrate. The butter is electrically connected, and the IC chip is die-bonded to a predetermined position of this electric circuit pattern. The electrodes on the IC chip and the circuit pattern are connected by wire bonding, and a botting frame made of a material such as glass epoxy is bonded to the glass epoxy film substrate so as to surround the IC chip. Then, it is molded by pouring epoxy resin into the potting frame.

The center core 16 of the IC card 1 is composed of two sheet members, of which the first sheet member 17 forms the front side of the center core 16, and the second sheet member 1
8 forms the back side. An insertion portion 15a for inserting the IC module 15 is formed on the front side of the first card board 1a. The insertion portion 15a is formed by cutting a recessed portion approximately equal to the thickness of the IC module 15 using an end mill or engraving machine.

The IC module 15 is adhesively bonded to the thus formed insertion portion 15a using an adhesive. Here, the adhesive may be an elastic adhesive that remains elastic even after adhesion, or an adhesive such as double-sided tape.

Both the first and second sheet members 17,18 are made of rigid vinyl chloride (PVC).

These sheet members 1a and lb are made of opalescent hard vinyl chloride, and include a first sheet member 17 and a second sheet member 18.
are placed on top of each other and heat welded.

Here, between the first and second sheet members 17 and 18 corresponding to the IC module 15, polyethylene terephthalate (hereinafter referred to as PET) is made of ) The sheet 22 is sandwiched and welded. This P
The ET sheet 22 is connected to the first and second sheet members 17
．． The hard vinyl chloride forming the part 18 is a soft resin that is not heat-welded 2, and forms the non-bonding part 22a.

Since the portion where the IC module 15 is provided has higher rigidity than other portions, stress concentration on the sheet members 1a and lb was significant at the edges of the IC module 15, but as described above, By forming the portion 22a, slippage is likely to occur between the first sheet member 17 and the second sheet member 18, and concentration of stress can be prevented.

Moreover, since the first sheet member 17 and the second sheet member 18 are separated, even if a whitening phenomenon occurs in the first sheet member 17 into which the IC module 15 is inserted, the non-coupled portion 22a is formed, it is possible to prevent the whitening phenomenon from propagating to the second sheet member 18. In other words, conventionally it consisted of continuous sheet members that were completely connected, but in this structure, an IC is placed inside the insertion section.
When the edges of the module 15 hit and a whitening phenomenon occurred, the whitening would easily propagate to the back side. can prevent the spread of

Each part of the IC card 1 is configured as follows.

A desired pattern 24 is printed on the front and back sides of the center core 23 made up of the first sheet member 17 and the second sheet member 18 by offset printing or silk screen printing, and oversheets 25 and 26 made of transparent vinyl chloride are stacked on the front and back sides. By combining them together and laminating them, a hard vinyl chloride laminate is constructed.

With the above configuration, it is possible to reduce the occurrence of the whitening phenomenon of the second sheet member 18 when the IC card 1 is curved and deformed.

In the above embodiment, the PET sheet 22 is used to form the non-bonded part 22a, but the invention is not limited to this, and by sandwiching it between the first and second sheet members 17 and 18, thermal welding can be achieved. Any sheet may be used as long as the first and second sheet members 17, 18 are not welded together even during processing.

A second embodiment of the present invention will be described below with reference to FIG. The IC module 15 inserted into the IC card 30 in this embodiment is the same as that described in the first embodiment, so the explanation will be omitted and only the main parts will be explained.

This IC card 30 has a center core 23 made up of two sheet members, of which the first sheet member 31 forms the front side of the IC card, and the second sheet member 32 forms the front side of the IC card 30. It forms the back side of.

The above-mentioned I
An insertion portion 15a for inserting the C module 15 is formed. The insertion portion 15a is formed by cutting the thickness of the IC module 15 and recesses such as gaps with an end mill or engraving machine.

The IC module 15 is connected to the insertion portion 15a formed in this manner by adhesive. Here, the adhesive may be an elastic adhesive or a pressure-sensitive adhesive such as a double-sided tape that remains elastic even after attachment.

The first and second sheet members 31, 32 are both made of hard vinyl chloride. These sheets, to members 3
1.32 is made of opalescent hard vinyl chloride, the first sheet member 31 and the second sheet member 32 are stacked on each other,
Bonded with adhesive.

Here, for example, the first
Sheet member 31. A paint that does not chemically react with hard vinyl chloride is printed on the shape and size of the IC module 15 and over areas such as the gaps or larger areas. That is, the first and second sheet members 31.3 correspond to the portion where the IC module 15 is provided.
? A non-bonded portion 31 is formed in which the two are not coupled to each other.

By forming the non-bonding portion 33 as described above, the first
Slippage is likely to occur between the sheet member 31 and the second sheet member 32, and concentration of stress can be prevented.

Further, since the first sheet member 31 and the second sheet member 32 are separated, even if a whitening phenomenon occurs in the first sheet member 31 into which the IC module 15 is inserted, the uncoupled portion 33 is formed, the second sheet member 3
Second, it is possible to prevent the whitening phenomenon from spreading. In other words,
Conventionally, it consisted of a continuous center core that was completely connected, but in a structure with such a non-combined part 33, if the edge of the IC module 15 hits the inside of the insertion part and a whitening phenomenon occurs, However, by forming the non-bonded portion 33, it is possible to prevent the whitening phenomenon from spreading to the back surface.

In this example, the first sheet member 31 was printed with a paint that does not chemically react with hard vinyl chloride, but the present invention is not limited to this, and the second sheet member 32 may be used.

[Effects of the Invention] The sheet member of the IC card is formed by overlapping and joining a first sheet member and a second sheet member, and the first and second sheet members are overlapped corresponding to the insertion portion of the IC module. By making the mating part a non-joining part, when the IC card is bent, slippage occurs between the first and second sheet members corresponding to the IC module, and stress concentration on a part is prevented. I can do it. Further, even if a whitening phenomenon occurs in the first sheet member having the IC module insertion portion, it is possible to prevent the whitening phenomenon from propagating to the second sheet member separated from the first sheet member. This reduces the occurrence of whitening phenomenon, prevents whitening phenomenon even if it is subjected to large deformation, and prevents the whitening phenomenon.
The beauty of the C card can be maintained.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of an IC card according to a first embodiment of the present invention, FIG. 2 is a side sectional view of an IC card according to a second embodiment of the present invention, and FIGS. 3 to 6 are conventional examples. , 3rd
The figure is a plan view of the IC card, and Figure 4 is the I in Figure 3.
5 is a sectional view of the IC module, and FIG. 6 is a sectional view of the IC card in a curved state. 1... IC card, 17... First sheet member, 1
8... Second sheet member, 15a... Insertion part, 15
...IC module, 2.2a...non-coupling part.

Claims (1)

[Claims] a first sheet member, an insertion portion formed on one side of the first sheet member, an IC module inserted into the insertion portion with the electronic signal contact surface facing outward; A second sheet member that is overlapped and coupled to the other side of the first sheet member.
An IC card comprising: a sheet member; and a non-coupling portion formed between the first sheet member and the second sheet member corresponding to the insertion portion of the IC module.