JPH0356295B2 - - Google Patents
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- Publication number
- JPH0356295B2 JPH0356295B2 JP61043859A JP4385986A JPH0356295B2 JP H0356295 B2 JPH0356295 B2 JP H0356295B2 JP 61043859 A JP61043859 A JP 61043859A JP 4385986 A JP4385986 A JP 4385986A JP H0356295 B2 JPH0356295 B2 JP H0356295B2
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- Prior art keywords
- based alloy
- precipitation
- strength
- strength copper
- rapidly solidified
- Prior art date
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Description
(産業上の利用分野)
本発明は導電ばね材料に好適な強度と導電性と
に優れた高強度銅基合金の製造方法に関するもの
である。
(従来の技術)
強度と導電性とに優れた導電ばね材料として代
表的なものは、JIS H3130に合金番号C1720とし
て定められている1.8%Be、0.25%Co、残部Cuの
析出硬化型の合金があるが、高価なBeを多量に
含有するために地合せ価格が極めて高くなるとい
う欠点があつた。一方、Cuをベースとし、B、
Si、P、Ge、Te等の半金属元素と、Be又はSと
を加えた合金を溶融状態から急冷凝固して粒度
0.5〜15μmの急冷凝固組織とすることにより導電
性、強度、硬度等を向上させるという新しい試み
が特公昭60−43895号公報に示されている。とこ
ろがこの合金は多量の半金属元素を含むために導
電性が悪いこと、硬度及び強度が不十分であるこ
と、伸びが小さく脆いため曲げ成形性に劣ること
等の理由から、導電ばね材料としては実用性に乏
しく従来の析出硬化型のCu−Be合金よりも劣る
ものであつた。
(発明が解決しようとする問題点)
本発明はこのような従来の問題点を解決し、
Beの含有率を低くして地合せ価格を安価なもの
とするとともに、急冷凝固法を利用して組織の微
細化を図り、しかも硬度、強度、導電性等の導電
ばね材に要求される特性を十分に満足することが
できる高強度銅基合金及びその製造方法を目的と
して完成されたものである。
(問題点を解決するための手段)
本願第1の発明は、Be0.15〜1.0%(重量%、
以下同じ)、Ni、Coの一方又は双方を合計量で
0.5〜6.0%、残部Cu及び不可避的不純物からな
り、Be:Ni+Coの原子比を1:0.8〜1.2とし、
かつ結晶粒径を0.2〜25μmとした急冷凝固組織中
に、加工による析出サイトを増加させ時効処理後
の析出物を均一微細に分散させてビツカース硬度
300以上、伸び3%以上の特性を持たせたことを
特徴とする高強度銅基合金を要旨とするものであ
る。
また本願第2の発明は、Be0.15〜1.0%、Ni、
Coの一方又は双方を合計量で0.5〜6.0%、残部Cu
及び不可避的不純物からなり、Be:Ni+Coの原
子比を1:0.8〜1.2とした合金を溶融状態から
500℃/秒以上の速度で急冷凝固して結晶粒度が
0.2〜25μmの急冷凝固組織としたのち、95%以下
の冷間加工を行い、更に時効析出処理により金属
間化合物を均一微細に析出させたことを特徴とす
る高強度銅基合金の製造方法を要旨とするもので
ある。
上記のような組成の合金は、第1図のCu−Be
−Ni系合金の3%Ni切断面平衡状態図に見られ
るように常温におけるBe、Niの固溶限が非常に
狭くなるので本来析出硬化性に優れた合金であ
る。しかしながら通常の溶解鋳造工程を経た材料
ではほとんどのBe、Niは析出物としてマトリツ
クスから排出された状態にあり、後に熱間加工や
焼鈍を行つても容易にはマトリツクス中に溶け込
まないので析出硬化性が不十分となる。また溶体
化処理も結晶粒の粗大化防止のためにあまり高温
では行えず、通常は900〜950℃で行われるが、こ
の程度の温度ではやはり析出物であるBeやNiは
完全にマトリツクス中に固溶されない。ところが
500℃/秒を越える高速急冷凝固に伴う非平衡凝
固の場合にはBe、Ni、Co等のマトリツクス中へ
の固溶度が大きくなり、その後の時効析出処理に
おける析出強化作用は著しいものとなる。また凝
固時に一度固溶されたBe、Ni、Co等は凝固後に
溶体化処理を行つた場合にも結晶粒成長を効果的
に抑制し、溶体化処理温度を上昇させても粒成長
を著しく抑制する特徴を持つ。
本発明は上記のような時効析出挙動を呈する銅
基合金を溶融状態から急冷凝固させることにより
平衡凝固によつては不可能な過剰量のBe、Ni、
Co等の溶質原子をマトリツクス中に固溶させた
極めて微細な急冷凝固組織を得たうえ、これに冷
間加工を加えて加工欠陥を金属組織中に生成さ
せ、更にこれを時効析出処理して多量の金属間化
合物を均一微細に析出させることにより硬度、強
度、曲げ成形性を高めることに成功したものであ
る。次に本発明の各構成要件について更に具体的
に説明する。
本発明の銅基合金中Beは析出硬化性を生ぜし
めるための基本的な元素であり、0.15%未満では
析出硬化性が不十分で機械的強度の向上が得られ
ず、逆に1.0%を越えると地合せ価格が上昇して
本発明の目的が達成されなくなるとともに、急冷
凝固法によつて全体がマトリツクス中に固溶でき
なくなり、含有量増加に見合つた合金特性向上効
果が得られないので0.15〜1.0%の範囲とするも
ので、特に0.4〜0.8%の範囲が最適である。次に
Ni及びCoもBeと同様に析出硬化性を付与するた
めの元素であつて、その合計量が0.5%未満では
析出硬化性が不十分であり、6.0%を越えると急
冷凝固時にマトリツクス中に固溶できない部分が
生ずるうえ導電率を悪化させるので0.5〜6.0%と
することが必要で、特に2.0〜5.0%の範囲が好ま
しいものである。これらのNiとCoはいずれか一
方又は双方を上記の範囲内で用いればよい。Be
とNi+Coは強化に寄与する金属間化合物の化学
量論的組成に近付けるため、原子比を1:0.8〜
1.2の範囲とする。これにより金属間化合物を無
駄なく一斉に生じさせることができる。
このような合金は溶融状態から例えば回転ロー
ラ間に流し込む等の方法によつて500℃/秒を越
す高速度で瞬時に冷却固化される。このような急
冷凝固の結果、結晶粒度が0.2〜25μmの微細な急
冷凝固組織が得られるとともに、前述したとおり
Be、Ni、Co等の元素は平衡冷却によつては到底
固溶できない多くの分量がマトリツクス中に固溶
し、強化に寄与しない粗大析出物をほとんど生じ
ない。本発明においてはこの組織に圧延等により
95%以下の冷間加工を加えて組織内に加工欠陥を
生成させ、更に必要に応じて550〜1000℃の溶体
化処理と80%以下の冷間加工とを加えたのち、
250〜500℃で時効析出処理を行う。これらの処理
によつて急冷凝固組織中に加工による析出サイト
が増加してBe、Ni、Coの金属間化合物が均一微
細に析出し、後の実施例のデータにも示すとおり
材料の硬度がビツカース硬度で300以上、伸び3
%以上となるほか、引張強度、曲げ加工性等が著
しく向上する。特に本発明においては急冷凝固法
により過剰量のBe、Ni又はCo元素をマトリツク
ス中に所定の原子比となるように固溶させてある
ため、時効析出処理により短時間で均一かつ微細
な金属間化合物が一斉に析出することとなり、硬
度、伸び、強度、曲げ加工性等を著しく向上させ
ることができる。また本発明においては溶体化処
理を行つた場合にも、急冷凝固法により固溶され
たBe、Ni又はCoが結晶粒成長を効果的に抑制
し、最終組織の粒度は25μmを越えることはな
い。
なお、冷間加工の程度を95%以下としたのは、
組織中に加工欠陥を十分に生じさせるために必要
なためであり、また結晶粒度を0.2〜2.5μmとし
たのは、0.2μm未満の結晶を生じさせることは困
難であり、逆に25μmを越えると延性や曲げ成形
性が低下するからである。更に、得られた合金の
ビツカース硬度を300以上、伸びを3%以上と限
定したのは、特に導電ばね材料として好ましい範
囲を明確化したものである。
このように本発明の合金は低ベリリウムである
にもかかわらず硬度、伸び、強度に優れ、しかも
組織が緻密であるため延性及び曲げ成形性に優れ
るうえ、導電性を阻害する元素や粗大析出物をほ
とんど含まないので導電ばね材料として好適な高
い導電性を有するものである。
(実施例)
第1表に示されるNo.1〜No.15の種々の組成の合
金を高速で回転するローラ間に噴き出し、500
℃/秒以上の速度で溶融状態から急冷凝固して厚
さ0.31mmの薄板を作成した。これを第1表中に
a、b、c、d等の記号で示す処理工程により処
理したうえでビツカース硬さ、引張強度、伸び、
導電率を測定し同表に記した。また第2表は合金
組成が本発明の範囲を外れた合金(No.1〜7)及
び通常工程品(No.8〜9)、特公昭60−43895号の
範囲内の合金(No.10〜12)につき、第1表に示し
たと同様の測定値を示したものである。なお、a
〜gの記号で示した処理工程の内容は第3表にま
とめて示した。
(Industrial Application Field) The present invention relates to a method for manufacturing a high-strength copper-based alloy having excellent strength and conductivity and suitable for use as a conductive spring material. (Prior art) A typical conductive spring material with excellent strength and conductivity is a precipitation hardening alloy of 1.8% Be, 0.25% Co, and the balance Cu specified as alloy number C1720 in JIS H3130. However, it has the disadvantage that the combined price is extremely high because it contains a large amount of expensive Be. On the other hand, based on Cu, B,
An alloy containing metalloid elements such as Si, P, Ge, Te, etc. and Be or S is rapidly solidified from a molten state to obtain particle size.
A new attempt to improve conductivity, strength, hardness, etc. by creating a rapidly solidified structure of 0.5 to 15 μm is disclosed in Japanese Patent Publication No. 43895/1983. However, this alloy is not suitable as a conductive spring material because it contains a large amount of semi-metallic elements, resulting in poor conductivity, insufficient hardness and strength, and low elongation and brittleness, resulting in poor bending formability. It lacked practicality and was inferior to conventional precipitation hardening type Cu-Be alloys. (Problems to be solved by the invention) The present invention solves these conventional problems,
In addition to lowering the Be content and lowering the formation price, the rapid solidification method is used to achieve a finer structure, and the properties required for conductive spring materials, such as hardness, strength, and conductivity. This was completed with the aim of creating a high-strength copper-based alloy and its manufacturing method that can fully satisfy the following requirements. (Means for solving the problem) The first invention of the present application has Be0.15 to 1.0% (weight%,
(same below), Ni, Co, or both in total amount
0.5 to 6.0%, the balance being Cu and unavoidable impurities, with an atomic ratio of Be:Ni+Co of 1:0.8 to 1.2,
In addition, in the rapidly solidified structure with a crystal grain size of 0.2 to 25 μm, the number of precipitation sites is increased by processing, and the precipitates after aging are uniformly and finely dispersed, resulting in a hardness of Bitkers hardness.
The gist is a high-strength copper-based alloy characterized by having properties of 300% or more and an elongation of 3% or more. In addition, the second invention of the present application has Be0.15 to 1.0%, Ni,
One or both of Co is 0.5 to 6.0% in total amount, the balance is Cu
and unavoidable impurities, and the atomic ratio of Be:Ni+Co is 1:0.8 to 1.2.
The crystal grain size is reduced by rapid solidification at a speed of 500℃/second or more.
A method for producing a high-strength copper-based alloy, which is characterized in that after forming a rapidly solidified structure of 0.2 to 25 μm, cold working is performed to 95% or less, and intermetallic compounds are uniformly and finely precipitated by aging precipitation treatment. This is a summary. The alloy with the above composition is Cu-Be shown in Figure 1.
- As seen in the equilibrium phase diagram of the 3% Ni cross section of the -Ni alloy, the solid solubility limit of Be and Ni at room temperature is extremely narrow, so it is an alloy that inherently has excellent precipitation hardenability. However, in materials that have gone through the normal melting and casting process, most of the Be and Ni are discharged from the matrix as precipitates, and do not easily dissolve into the matrix even after hot working or annealing, resulting in precipitation hardening. becomes insufficient. In addition, solution treatment cannot be carried out at very high temperatures in order to prevent grain coarsening, and is usually carried out at 900 to 950°C, but at this temperature, the precipitates Be and Ni are completely absorbed into the matrix. Not dissolved in solid solution. However
In the case of non-equilibrium solidification associated with rapid solidification at a rate exceeding 500℃/sec, the solid solubility of Be, Ni, Co, etc. in the matrix increases, and the precipitation strengthening effect in the subsequent aging precipitation treatment becomes significant. . In addition, Be, Ni, Co, etc., which are once dissolved as a solid solution during solidification, effectively suppress grain growth even when solution treatment is performed after solidification, and even if the solution treatment temperature is increased, grain growth is significantly suppressed. It has the characteristics of In the present invention, by rapidly cooling and solidifying a copper-based alloy exhibiting aging precipitation behavior as described above from a molten state, excessive amounts of Be, Ni,
After obtaining an extremely fine rapidly solidified structure in which solute atoms such as Co are dissolved in the matrix, cold working is performed to generate processing defects in the metal structure, and this is then subjected to aging precipitation treatment. By uniformly and finely precipitating a large amount of intermetallic compounds, we succeeded in increasing hardness, strength, and bending formability. Next, each component of the present invention will be explained in more detail. Be in the copper-based alloy of the present invention is a basic element for producing precipitation hardenability, and if it is less than 0.15%, the precipitation hardenability is insufficient and no improvement in mechanical strength can be obtained; If it exceeds the amount, the formation price will increase and the object of the present invention will not be achieved, and the whole will not be able to be solid-dissolved in the matrix by the rapid solidification method, and the effect of improving alloy properties commensurate with the increase in content will not be obtained. The content should be in the range of 0.15 to 1.0%, and the range of 0.4 to 0.8% is particularly optimal. next
Like Be, Ni and Co are elements that impart precipitation hardenability, and if the total amount is less than 0.5%, precipitation hardenability is insufficient, and if it exceeds 6.0%, they will solidify in the matrix during rapid solidification. Since some portions are not soluble and the conductivity is deteriorated, it is necessary to set the content to 0.5 to 6.0%, and a range of 2.0 to 5.0% is particularly preferable. Either or both of these Ni and Co may be used within the above range. Be
The atomic ratio of Ni+Co and Ni+Co is set at 1:0.8 to 1:0.8 to bring it closer to the stoichiometric composition of the intermetallic compound that contributes to strengthening.
The range shall be 1.2. This allows intermetallic compounds to be generated all at once without waste. Such an alloy is instantaneously cooled and solidified from a molten state at a high speed exceeding 500° C./second by, for example, being poured between rotating rollers. As a result of such rapid solidification, a fine rapidly solidified structure with a grain size of 0.2 to 25 μm is obtained, and as mentioned above,
A large amount of elements such as Be, Ni, and Co, which cannot be dissolved in solid form by equilibrium cooling, dissolves in solid solution in the matrix, and hardly any coarse precipitates that do not contribute to strengthening are generated. In the present invention, this structure is formed by rolling etc.
After applying cold working of 95% or less to create processing defects in the structure, and further adding solution treatment at 550 to 1000°C and cold working of 80% or less as necessary,
Aging precipitation treatment is performed at 250-500℃. Through these treatments, the number of precipitation sites due to processing increases in the rapidly solidified structure, and the intermetallic compounds of Be, Ni, and Co precipitate uniformly and finely, and as shown in the data of the later examples, the hardness of the material increases. Hardness 300 or more, elongation 3
% or more, and tensile strength, bending workability, etc. are significantly improved. In particular, in the present invention, an excessive amount of Be, Ni, or Co is dissolved in the matrix at a predetermined atomic ratio using the rapid solidification method. The compounds precipitate all at once, making it possible to significantly improve hardness, elongation, strength, bending workability, etc. In addition, in the present invention, even when solution treatment is performed, Be, Ni, or Co dissolved in solid solution by the rapid solidification method effectively suppresses grain growth, and the grain size of the final structure does not exceed 25 μm. . In addition, the degree of cold working was set to 95% or less because
This is because it is necessary to sufficiently generate processing defects in the structure, and the reason why the crystal grain size is set to 0.2 to 2.5 μm is because it is difficult to generate crystals smaller than 0.2 μm, and conversely, it is difficult to generate crystals smaller than 25 μm. This is because ductility and bending formability decrease. Furthermore, the Vickers hardness of the obtained alloy was limited to 300 or more and the elongation was limited to 3% or more, in order to clarify the preferable range for a particularly conductive spring material. As described above, the alloy of the present invention has excellent hardness, elongation, and strength despite its low beryllium content, and has a dense structure that provides excellent ductility and bending formability. Since it contains almost no carbon, it has high conductivity and is suitable as a conductive spring material. (Example) Alloys of various compositions No. 1 to No. 15 shown in Table 1 were sprayed between rollers rotating at high speed, and
A thin plate with a thickness of 0.31 mm was produced by rapid solidification from a molten state at a rate of at least ℃/second. After processing this through the processing steps indicated by symbols a, b, c, d, etc. in Table 1, the Vickers hardness, tensile strength, elongation, etc.
The electrical conductivity was measured and recorded in the same table. Additionally, Table 2 shows alloys whose alloy compositions are outside the scope of the present invention (No. 1 to 7), ordinary process products (No. 8 to 9), and alloys within the range of Japanese Patent Publication No. 60-43895 (No. 10). -12), the same measured values as shown in Table 1 are shown. In addition, a
The contents of the treatment steps indicated by symbols ~g are summarized in Table 3.
【表】【table】
【表】【table】
【表】【table】
【表】【table】
【表】
(発明の効果)
本発明は以上の説明からも明らかなように、
Be含有量を低くして地合せ価格を引下げるとと
もに、急冷凝固と冷間加工と時効析出処理の組合
せにより硬度、強度、導電性、曲げ成形性等の導
電ばね材料に要求される諸特性をバランス良く向
上させることに成功したものであるから、従来の
Cu−Be合金及び従来の急冷凝固合金の問題点を
一掃したものとして、産業の発展に寄与するとこ
ろは極めて大きいものである。[Table] (Effects of the invention) As is clear from the above description, the present invention has the following effects:
In addition to lowering the formation price by lowering the Be content, the combination of rapid solidification, cold working, and aging precipitation treatment improves the various properties required for conductive spring materials such as hardness, strength, conductivity, and bending formability. Since it has been successfully improved in a well-balanced manner, it is better than the conventional
Since the problems of Cu-Be alloy and conventional rapidly solidified alloys have been eliminated, it will greatly contribute to the development of industry.
第1図はCu−Be−Ni系合金の3%Ni切断面平
衡状態図である。
FIG. 1 is an equilibrium phase diagram of a 3% Ni cut section of a Cu-Be-Ni alloy.
Claims (1)
Coの一方又は双方を合計量で0.5〜6.0%、残部Cu
及び不可避的不純物からなり、Be:Ni+Coの原
子比を1:0.8〜1.2とし、かつ結晶粒径を0.2〜
25μmとした急冷凝固組織中に、加工による析出
サイトを増加させ時効処理後の析出物を均一微細
に分散させてビツカース硬度300以上、伸び3%
以上の特性を持たせたことを特徴とする高強度銅
基合金。 2 Be、Ni、Coの含有量をBe0.4〜0.8%、Niと
Coの合計量を2.0〜5.0%とした特許請求の範囲第
1項記載の高強度銅基合金。 3 引張強度が100Kg/mm2以上、ビツカース硬度
が350以上である特許請求の範囲第1項記載の高
強度銅基合金。 4 Be0.15〜1.0%、Ni、Coの一方又は双方を合
計量で0.5〜6.0%、残部Cu及び不可避的不純物か
らなり、Be:Ni+Coの原子比を1:0.8〜1.2と
した合金を溶融状態から500℃/秒以上の速度で
急冷凝固して結晶粒度が0.2〜25μmの急冷凝固組
織としたのち、95%以下の冷間加工を行い、更に
時効析出処理により金属間化合物を均一微細に析
出させたことを特徴とする高強度銅基合金の製造
方法。 5 冷間加工ののち、550〜1000℃の焼鈍又は溶
体化処理と80%以下の冷間加工を行つたうえ250
〜550℃で時効析出処理を行う特許請求の範囲第
4項記載の高強度銅基合金の製造方法。[Claims] 1 Be 0.15 to 1.0% (weight%, same hereinafter), Ni,
One or both of Co is 0.5 to 6.0% in total amount, the balance is Cu
and unavoidable impurities, the atomic ratio of Be:Ni+Co is 1:0.8~1.2, and the crystal grain size is 0.2~
In the rapidly solidified structure of 25 μm, the number of precipitation sites is increased by processing, and the precipitates after aging are uniformly and finely dispersed, resulting in a Bitkers hardness of 300 or more and an elongation of 3%.
A high-strength copper-based alloy characterized by having the above properties. 2 The content of Be, Ni, and Co is 0.4% to 0.8%, Ni
The high-strength copper-based alloy according to claim 1, wherein the total amount of Co is 2.0 to 5.0%. 3. The high-strength copper-based alloy according to claim 1, which has a tensile strength of 100 Kg/mm 2 or more and a Vickers hardness of 350 or more. 4 Melt an alloy consisting of 0.15 to 1.0% Be, 0.5 to 6.0% in total of one or both of Ni and Co, and the balance Cu and unavoidable impurities, with an atomic ratio of Be:Ni+Co of 1:0.8 to 1.2. From the state, the material is rapidly solidified at a speed of 500°C/second or more to form a rapidly solidified structure with a grain size of 0.2 to 25 μm, then cold worked to 95% or less, and then subjected to aging precipitation treatment to make the intermetallic compounds uniform and fine. A method for producing a high-strength copper-based alloy characterized by precipitation. 5 After cold working, perform annealing or solution treatment at 550 to 1000℃ and cold working to 80% or less, and then 250
The method for producing a high-strength copper-based alloy according to claim 4, wherein the aging precipitation treatment is performed at ~550°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61043859A JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61043859A JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199743A JPS62199743A (en) | 1987-09-03 |
| JPH0356295B2 true JPH0356295B2 (en) | 1991-08-27 |
Family
ID=12675425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61043859A Granted JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199743A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013183610A1 (en) | 2012-06-04 | 2013-12-12 | 塩水港精糖株式会社 | D-glucaric acid-producing bacterium, and method for manufacturing d-glucaric acid |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5039478A (en) * | 1989-07-26 | 1991-08-13 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| US5017250A (en) * | 1989-07-26 | 1991-05-21 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| JP2599526B2 (en) * | 1992-02-03 | 1997-04-09 | 新日本製鐵株式会社 | Copper-iron-based metal sheet excellent in spring limit value and strength with small characteristic anisotropy and method for producing the same |
| EP1870480B1 (en) * | 2005-03-29 | 2012-08-29 | NGK Insulators, Ltd. | Method for producing beryllium-copper |
| US20080202643A1 (en) * | 2007-02-27 | 2008-08-28 | Fisk Alloy Wire, Inc. | Beryllium-copper conductor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551187A (en) * | 1984-06-08 | 1985-11-05 | Brush Wellman Inc. | Copper alloy |
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1986
- 1986-02-27 JP JP61043859A patent/JPS62199743A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013183610A1 (en) | 2012-06-04 | 2013-12-12 | 塩水港精糖株式会社 | D-glucaric acid-producing bacterium, and method for manufacturing d-glucaric acid |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199743A (en) | 1987-09-03 |
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