JPH0351964Y2 - - Google Patents
Info
- Publication number
- JPH0351964Y2 JPH0351964Y2 JP9542185U JP9542185U JPH0351964Y2 JP H0351964 Y2 JPH0351964 Y2 JP H0351964Y2 JP 9542185 U JP9542185 U JP 9542185U JP 9542185 U JP9542185 U JP 9542185U JP H0351964 Y2 JPH0351964 Y2 JP H0351964Y2
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- solid electrolytic
- electrolytic capacitor
- external terminal
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はヒユーズ付き固体電解コンデンサに関
し、特にヒユーズを固体電解コンデンサに内蔵さ
せた構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a solid electrolytic capacitor with a fuse, and particularly to a structure in which a fuse is built into the solid electrolytic capacitor.
一般に固体電解コンデンサは種々の電子回路に
使用されており、故障率は小さいが、万一故障が
起きた場合の故障モードは短絡故障が多く、大き
な短絡電流が流れると、コンデンサ素子が発熱し
焼損に至ることもある。この過度の短絡電流によ
る故障発生の際には、回路構成素子を保護するた
め、故障モードを短絡（シヨート）から開放（オ
ープン）にすることが必要であり一般にヒユーズ
を用いる手段が知られている。従来技術としては
例えば、特公昭58−21816号公報のようにヒユー
ズを内蔵させた固体電解コンデンサがある。
Generally, solid electrolytic capacitors are used in various electronic circuits, and their failure rate is low, but in the event of a failure, the failure mode is often short-circuit failure, and when a large short-circuit current flows, the capacitor element heats up and burns out. It may even lead to. When a failure occurs due to this excessive short-circuit current, it is necessary to change the failure mode from short to open in order to protect the circuit components, and a commonly known method is to use a fuse. . As an example of the prior art, there is a solid electrolytic capacitor with a built-in fuse as disclosed in Japanese Patent Publication No. 58-21816.
上述した従来のヒユーズ付き固体電解コンデン
サは第４図に示すようにコンデンサ素子１と陰極
外部端子４との間に金属板１０とヒユーズ７とを
接続している。
The conventional solid electrolytic capacitor with a fuse described above has a metal plate 10 and a fuse 7 connected between the capacitor element 1 and the cathode external terminal 4, as shown in FIG.
(イ) そのためコンデンサ素子１と陰極外部素子４
間の接続は三箇所となり、多大な接続工数を要
し、かつ接続面積が小さくなるため接続の信頼
性にも問題がある。(b) Therefore, capacitor element 1 and cathode external element 4
There are three connections between the two, which requires a large amount of connection work, and the connection area is small, so there is a problem with the reliability of the connection.
(ロ) またヒユーズ７は対向配設した断熱体１１間
の空洞部１２に位置し、かつ断熱体１１を陰極
外部端子４および金属板１０とで挾んではんだ
付けして気密状態を保持しているが、はんだ付
けの際のはんだの垂れ込み等により空洞部１２
がはんだで埋まつたり、はんだ量の不足により
気密性が得られず、後工程の樹脂外装の際に外
装樹脂９が入り込む、などの欠点がある。(b) The fuse 7 is located in the cavity 12 between the heat insulators 11 disposed facing each other, and the heat insulator 11 is sandwiched between the cathode external terminal 4 and the metal plate 10 and soldered to maintain an airtight state. However, due to solder dripping during soldering, etc., the cavity 12
There are drawbacks such as the solder being buried in the solder, airtightness not being achieved due to insufficient amount of solder, and the exterior resin 9 entering the resin exterior during the subsequent process.
〔問題点を解決するための手段〕
本考案のヒユーズ付き固体電解コンデンサは、
片面に帯状の絶縁体部を中間に配して対向配設し
た導電体層と、導電体層間を橋絡接続するヒユー
ズと、ヒユーズを絶縁性を有する弾性体で被着さ
せ、導電体層の一方にスルホールを設け裏面の導
電体層と接続させた両面印刷配線板を固体電解コ
ンデンサ素子と外部端子との間に介挿接続させ、
絶縁外装したことを特徴とする。[Means for solving the problem] The solid electrolytic capacitor with a fuse of the present invention is
A conductor layer is placed on one side facing each other with a band-shaped insulator in the middle, a fuse is used to bridge the conductor layers, and the fuse is covered with an insulating elastic material. A double-sided printed wiring board with through holes on one side and connected to the conductive layer on the back side is inserted and connected between the solid electrolytic capacitor element and the external terminal,
It is characterized by an insulating exterior.
以下、本考案について図面を参照して説明す
る。
Hereinafter, the present invention will be explained with reference to the drawings.
第１図は本考案の一実施例の側断面図である。
例えばタンタルなどの弁作用金属の陽極体を陽極
酸化し、その上に二酸化マンガン層、カーボン
層、銀ベースト層を順次被着させ、最外層に陰極
部を有する固体電解コンデンサ素子（以後素子と
略称）１を形成する。この素子１に植立された陽
極リード２と直板状の陽極外部端子３を溶接等の
手段により接続する。次に断面段差状の陰極外部
端子４と後述するヒユーズ内蔵した両面印刷配線
板５をはんだ付け等により接続した後、両面印刷
配線板５と素子１の陰極部の一側面をはんだ付け
等により接続し、その後トランスフアモールド等
の手段によりエポキシ樹脂等の外装樹脂９で絶縁
外装し陽・陰極外部端子３，４を断面Ｌ字状に折
り曲げて成形し、ヒユーズ付き固体電解コンデン
サを形成する。 FIG. 1 is a side sectional view of an embodiment of the present invention.
For example, an anode body made of a valve metal such as tantalum is anodized, and a manganese dioxide layer, a carbon layer, and a silver base layer are sequentially deposited thereon to form a solid electrolytic capacitor element (hereinafter abbreviated as element) having a cathode part in the outermost layer. ) form 1. The anode lead 2 planted on this element 1 and the straight plate-shaped anode external terminal 3 are connected by means such as welding. Next, the cathode external terminal 4 having a stepped cross section and a double-sided printed wiring board 5 with a built-in fuse (described later) are connected by soldering or the like, and then the double-sided printed wiring board 5 and one side of the cathode part of the element 1 are connected by soldering or the like. Thereafter, it is insulated with an exterior resin 9 such as epoxy resin by transfer molding or the like, and the anode and cathode external terminals 3 and 4 are bent and molded into an L-shaped cross section to form a solid electrolytic capacitor with a fuse.
第２図、第３図は前述第１図のヒユーズを内蔵
した両面印刷配線板５と陰極外部端子４の構造お
よび製造工程を説明する斜視図である。 FIGS. 2 and 3 are perspective views illustrating the structure and manufacturing process of the double-sided printed wiring board 5 and the cathode external terminal 4 with built-in fuses shown in FIG. 1.
第２図に示す如くガラス−エポキシ材などから
なる基材の表裏両面に銅箔を張つた基板に、ドリ
ル等の穿孔具によりたとえば円形の孔を設けた後
銅めつきを施こし孔部の銅層により表裏両面の銅
箔を電気的に接続するスルホール６を設ける。次
にエツチング加工により一方の面（表面）に段差
状の銅箔除去パターン５ａを設け、他の面（裏
面）はスルホール６の周囲で陰極外部端子と接続
する部分５ｄを除き銅箔を除去した両面印刷配線
板５を形成する。次に両面印刷配線板５の表面側
の２分割された銅箔部５ｂ，５ｃとパラジウムで
外周面を覆つたアルミニウム細線などからなるヒ
ユーズ７をはんだ付けなどの手段により接続す
る。次に第３図に示す如く、シリコン樹脂等の弾
性を有する絶縁性樹脂８（以後、樹脂と称す）で
ヒユーズ７を覆うように被着させる。 As shown in Figure 2, a circular hole, for example, is made with a punching tool such as a drill in a substrate made of glass-epoxy material with copper foil on both sides, and then copper plating is applied to the hole. A through hole 6 is provided to electrically connect the copper foils on both the front and back surfaces using a copper layer. Next, a stepped copper foil removal pattern 5a was formed on one side (front side) by etching, and the copper foil was removed on the other side (back side) except for the part 5d connected to the cathode external terminal around the through hole 6. A double-sided printed wiring board 5 is formed. Next, the copper foil portions 5b and 5c divided into two on the front side of the double-sided printed wiring board 5 are connected to a fuse 7 made of a thin aluminum wire or the like whose outer circumferential surface is covered with palladium by means such as soldering. Next, as shown in FIG. 3, the fuse 7 is covered with an elastic insulating resin 8 (hereinafter referred to as resin) such as silicone resin.
次にこのヒユーズを付設した両面印刷配線板５
の裏面と陰極外部端子４を前述の如く接続する。 Next, double-sided printed wiring board 5 with this fuse attached.
Connect the back surface of the connector to the cathode external terminal 4 as described above.
この両面印刷配線５は表面にヒユーズ７をはん
だ付けなどの簡単な手段にて確実に取り付けるこ
とを容易にし、しかもヒユーズ７取付面である表
面において素子１とも接続することが可能とな
る。また裏面においても両面印刷配線板５の導電
体層５ｄと、陰極外部端子４とが、広面積で確実
に接続され、かつ、スルホール６を設けることに
より印刷配線板５の両面が接続され、従来の接続
面積の小さいものでは接続強度が小さい次点があ
つたのに対し、接続面積が広く得られしかもスル
ホール６にもはんだなどの接着材料が入り込み表
面のはんだなどと接続されより強い接続強度が得
られることになる。 This double-sided printed wiring 5 makes it easy to securely attach the fuse 7 to the surface by simple means such as soldering, and also allows connection to the element 1 on the surface where the fuse 7 is attached. Also, on the back side, the conductor layer 5d of the double-sided printed wiring board 5 and the cathode external terminal 4 are reliably connected over a wide area, and by providing the through holes 6, both sides of the printed wiring board 5 are connected, which is conventional. There was a runner-up with a small connection area and a low connection strength, but a large connection area was obtained, and the adhesive material such as solder entered the through hole 6 and was connected to the surface solder, resulting in a stronger connection strength. You will get it.
また弾性樹脂８はヒユーズ７に過電流が流れ発
熱する際の周囲への熱放散を防ぎ、かつ後工程の
モールド外装工程における外装樹脂９注入時の衝
撃からヒユーズ７を保護する。一方、ヒユーズの
溶断の際には、従来の弾性の低い樹脂でヒユーズ
が覆われている場合には、ヒユーズが溶けても周
囲が硬いためヒユーズの原型を保ち電気的な接続
を保持し続けるので溶断しない欠点があつた。 Moreover, the elastic resin 8 prevents heat dissipation to the surroundings when an overcurrent flows through the fuse 7 and generates heat, and also protects the fuse 7 from impact when the exterior resin 9 is injected in the subsequent mold exterior process. On the other hand, when a fuse blows out, if the fuse is covered with a conventional resin with low elasticity, even if the fuse melts, the surrounding area is hard, so the original shape of the fuse is maintained and the electrical connection is maintained. There was a drawback that it did not melt.
しかし、本考案では柔軟性のある弾性樹脂でヒ
ユーズの周囲が覆われているので、ヒユーズが溶
けるとヒユーズ自体の表面張力によりヒユーズは
球状に溶断して電気的な接続が分断される。従つ
て弾性樹脂８にはヒユーズの働きを妨害しない役
割を要する。 However, in the present invention, since the fuse is surrounded by a flexible elastic resin, when the fuse melts, the surface tension of the fuse itself causes the fuse to melt into a spherical shape, breaking the electrical connection. Therefore, the elastic resin 8 is required to have a role that does not interfere with the function of the fuse.
なお、本考案実施例ではヒユーズ７と印刷配線
板５との接続手段としてはんだ付けを用いたが、
溶接、ワイヤーボンデイング等の手段でもよい。 In addition, in the embodiment of the present invention, soldering was used as a means of connecting the fuse 7 and the printed wiring board 5.
Means such as welding and wire bonding may also be used.
またスルホールは一個に限定されるものではな
く複数個のスルホールを設けてもよい。 Further, the number of through holes is not limited to one, and a plurality of through holes may be provided.
以上説明したように本考案により次の効果があ
る。
As explained above, the present invention has the following effects.
(i) 接続工数が低減され、かつ接続部の面積が広
くなり接続の信頼性が向上する。(i) Connection man-hours are reduced, the area of the connection part is increased, and connection reliability is improved.
(ii) ヒユーズを溶断の妨害とならない弾性樹脂で
覆うことができるので外装樹脂からの保護が容
易となる。(ii) Since the fuse can be covered with an elastic resin that does not interfere with blowing, it is easy to protect it from the exterior resin.
第１図は本考案のヒユーズ付き固体電解コンデ
ンサの側断面図、第２図ａ，ｂは第１図本考案主
要部のヒユーズ付き両面印刷配線板の斜視図であ
り、ａは表面側、ｂは裏面側である。第３図は第
１図本考案のヒユーズ付き両面印刷配線板と陰極
外部端子の斜視図である。第４図は従来のヒユー
ズ付き固体電解コンデンサの側断面図である。
１……（固体電解コンデンサ）素子、２……陽
極体リード、３……陽極外部端子、４……陰極外
部端子、５……両面印刷配線板、６……スルホー
ル、７……ヒユーズ、８……弾性樹脂、９……外
装樹脂、１０……金属板、１１……断熱体、１２
……空洞部。
Figure 1 is a side cross-sectional view of a solid electrolytic capacitor with a fuse of the present invention, and Figures 2a and b are perspective views of the double-sided printed wiring board with a fuse, which is the main part of the present invention in Figure 1, where a is the front side and b is the front side. is on the back side. FIG. 3 is a perspective view of the fuse-equipped double-sided printed wiring board and cathode external terminal of the present invention shown in FIG. FIG. 4 is a side sectional view of a conventional solid electrolytic capacitor with a fuse. 1... (solid electrolytic capacitor) element, 2... anode body lead, 3... anode external terminal, 4... cathode external terminal, 5... double-sided printed wiring board, 6... through hole, 7... fuse, 8 ... Elastic resin, 9 ... Exterior resin, 10 ... Metal plate, 11 ... Heat insulator, 12
...Cavity part.
Claims (1)
した導電体層と、前記導電体層間を橋絡接続する
ヒユーズと、前記ヒユーズに絶縁性を有する弾性
体を被着させ、前記導電体層の一方にスルーホー
ルを設け裏面の導電体層と前記スルーホールの内
周面に形成された金属層を介して裏面の導電体層
と電気的に導通させた両面印刷配線板の前記導電
体層のひとつと固体電解コンデンサ素子の一方の
電極を接続し、さらに前記両面印刷配線板の前記
導体層のひとつと反対面側に位置する導電体層と
前記固体電解コンデンサ素子の一方の電極にヒユ
ーズを介して接続されるべき外部端子とを接続
し、かつ、他の外部端子と前記固体電解コンデン
サ素子の他方の電極とを接続して、絶縁外装した
ことを特徴とするヒユーズ付き固体電解コンデン
サ。 A conductor layer having a strip-shaped insulator disposed in the middle on one side and disposed facing each other, a fuse for bridging connection between the conductor layers, and an elastic body having an insulating property attached to the fuse; The conductive double-sided printed wiring board has a through hole in one of the body layers and is electrically connected to the conductive layer on the back side through a conductive layer on the back side and a metal layer formed on the inner peripheral surface of the through hole. one of the body layers and one electrode of the solid electrolytic capacitor element; A solid electrolytic capacitor with a fuse, characterized in that an external terminal to be connected via a fuse is connected, another external terminal is connected to the other electrode of the solid electrolytic capacitor element, and the solid electrolytic capacitor is coated with an insulating exterior. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9542185U JPH0351964Y2 (en) | 1985-06-24 | 1985-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9542185U JPH0351964Y2 (en) | 1985-06-24 | 1985-06-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624125U JPS624125U (en) | 1987-01-12 |
| JPH0351964Y2 true JPH0351964Y2 (en) | 1991-11-08 |
Family
ID=30654538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9542185U Expired JPH0351964Y2 (en) | 1985-06-24 | 1985-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351964Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9314368B2 (en) | 2010-01-25 | 2016-04-19 | Zeltiq Aesthetics, Inc. | Home-use applicators for non-invasively removing heat from subcutaneous lipid-rich cells via phase change coolants, and associates devices, systems and methods |
| US9375345B2 (en) | 2006-09-26 | 2016-06-28 | Zeltiq Aesthetics, Inc. | Cooling device having a plurality of controllable cooling elements to provide a predetermined cooling profile |
| US9408745B2 (en) | 2007-08-21 | 2016-08-09 | Zeltiq Aesthetics, Inc. | Monitoring the cooling of subcutaneous lipid-rich cells, such as the cooling of adipose tissue |
-
1985
- 1985-06-24 JP JP9542185U patent/JPH0351964Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9375345B2 (en) | 2006-09-26 | 2016-06-28 | Zeltiq Aesthetics, Inc. | Cooling device having a plurality of controllable cooling elements to provide a predetermined cooling profile |
| US9408745B2 (en) | 2007-08-21 | 2016-08-09 | Zeltiq Aesthetics, Inc. | Monitoring the cooling of subcutaneous lipid-rich cells, such as the cooling of adipose tissue |
| US9314368B2 (en) | 2010-01-25 | 2016-04-19 | Zeltiq Aesthetics, Inc. | Home-use applicators for non-invasively removing heat from subcutaneous lipid-rich cells via phase change coolants, and associates devices, systems and methods |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624125U (en) | 1987-01-12 |
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